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WO/2019/058860A1 |
Provided are a surface-treatment device and a surface-treatment method capable of improving surface-treatment quality when an object undergoes surface-treatment. The surface-treatment device is used to treat the surface of an object at l...
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WO/2019/055962A1 |
Various embodiments herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. The apparatus includes an ionically resistive element that separates the plating chamber into a cross flow manifold (a...
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WO/2019/054483A1 |
This hot-dip plated checkered plate has: a base material steel plate, an Ni plated layer, and a hot-dip plated layer, and has on the plate surface a projecting part and a flat part. The film thickness of the Ni plated layer of the projec...
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WO/2019/051138A1 |
A method is provided, including the following operations: depositing a ruthenium liner in a feature of a substrate; depositing a monolayer of zinc over the ruthenium liner; after depositing the monolayer of zinc, performing a thermal tre...
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WO/2019/036207A1 |
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein th...
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WO/2019/026578A1 |
The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties can be improved without increasing the co...
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WO/2019/027174A1 |
An embodiment of the present invention provides a copper foil, which comprises a copper layer having a matte surface and a shiny surface and an anti-rusting film disposed on the copper layer and has a residual stress of 0.5-25 Mpa based ...
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WO/2019/012416A1 |
Methods for recovering manganese etchant solutions are provided wherein a process solution used to rinse or neutralize a nonconductive substrate after etching the substrate is collected and evaporated to provide a concentrated process so...
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WO/2019/013002A1 |
[Problem] To provide a plating solution assessment method and plating solution assessment mechanism that have a simple configuration and make it possible to estimate the state of a plating solution and a coating while plating treatment i...
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WO/2019/003891A1 |
This substrate holder is for holding a substrate and comprises: a first holding member having a first opening part for exposing a first surface of the substrate; and a second holding member for holding the substrate by sandwiching the sa...
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WO/2019/006009A1 |
Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal d...
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WO/2018/236877A1 |
Methods of cleaning an electroplating device may include processing a substrate coupled with the electroplating device. The substrate may be coupled with a substrate holder of the electroplating device. The substrate holder may include a...
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WO/2018/225535A1 |
Transport jigs 30 and 30A have transport units 300, 320, 330 and a workpiece holding unit 500 for hanging from and supported by the transport unit. The workpiece holding unit has: a fixed member 510; two movable members 550 supported sli...
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WO/2018/221395A1 |
A surface treatment device 10 is provided with: a surface treatment tank 200 which contains a treatment liquid Q, and has an upper opening 200A; a transport jig 30 which includes a workpiece holding part 340 which holds a workpiece 20 in...
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WO/2018/211215A1 |
The invention relates to a method for filtering a platinum bath by electrodialysis, comprising consecutive steps of extracting fluid from the platinum bath (B) by means of an extraction current (10a); filtering the fluid extracted during...
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WO/2018/196346A1 |
A metal surface modification apparatus, comprising: a particle solution mixing and circulation system (2) used for providing nano particle solution to a workpiece; a rotating platform used for securing the workpiece and driving the workp...
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WO/2018/197227A1 |
The invention relates to a method for producing an electrode film, wherein an electrode strip (20) of high tensile strength is provided, which electrode strip contains an electrochemical active material, wherein the electrode strip (20) ...
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WO/2018/185144A1 |
The present invention refers to a controlled method for depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps (a) providing an aqueous deposition bath, wherein the bath comprises - triva...
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WO/2018/183451A1 |
A fluid sensing system (104) includes a microfluidic chip (114), multiple sensors (116), and a communication device (122). The microfluidic chip includes at least one microfluidic channel (120) extending a length through the microfluidic...
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WO/2018/171513A1 |
Disclosed are a barrel plating barrel, a barrel plating apparatus, a barrel plating system, and a barrel plating production line. Insofar as the barrel plating barrel is in a material-discharging state, workpieces being plated are paddle...
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WO/2018/164491A1 |
The present invention relates to a 3D printing device using selective electrochemical deposition, which can increase the rate of 3D printing of a metal product to be laminated on a substrate, by selectively electrodepositing a metal raw ...
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WO/2018/150632A1 |
[Problem] To provide a workpiece-washing system capable of achieving better water conservation than in the past. [Solution] This workpiece-washing system 10 is provided with: a water purification line 20 for purifying washing water that ...
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WO/2018/146041A1 |
The present invention relates to a method for electrodepositing zinc and zinc alloy coatings from an alkaline coating bath with reduced depletion of organic bath additives. This involves using as an anode an electrode which is insoluble ...
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WO/2018/142955A1 |
The electrolytic treatment device (1, 1A) pertaining to an embodiment of the present invention performs electrolytic treatment of a treatment substrate, and is provided with a substrate retaining part (10) and an electrolytic treatment p...
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WO/2018/123059A1 |
Provided is a plating device which, during a haring cell test or the like, can prevent disorder in a current distribution and deviation in a pair of negative electrode potentials. This plating device (1) is provided with: a positive elec...
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WO/2018/125976A1 |
A process and a system for cleaning excess aluminum from coating baths, e.g. anodization bath solutions, so that they can be reused in an effective manner is provided. The process comprises first passing a portion of the anodization bath...
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WO/2018/109848A1 |
The purpose of the present invention is to provide an electroplating method for a metal fastener, the method enabling each element of a metal fastener to be easily plated with high uniformity. Provided is an electroplating method for a f...
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WO/2018/109983A1 |
Provided is an electroplating method with which a plating film having excellent uniformity and adhesion can be easily formed on an exposed surface of each element of a metal fastener even if the elements are not electrically connected to...
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WO/2018/109998A1 |
The purpose of the present invention is to provide an electroplating method for a metal fastener, the method enabling each element of a metal fastener to be easily plated with high uniformity. Provided is an electroplating method for a f...
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WO/2018/103621A1 |
An acid copper electroplating process using an insoluble anode and equipment therefor. In the process and the equipment, a separator (10) is used to separate electroplating solutions in a cathode region (1) and an anode region (2), to av...
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WO/2018/103793A1 |
The invention relates to a continuous separation installation (10; 20; 30; 50) for the galvanic deposition of a substance on objects (1), wherein said continuous separation installation (10; 20; 30; 50) comprises contacting devices (12; ...
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WO/2018/101076A1 |
The present invention relates to: a semiconductor device which enables deterioration in signal characteristics caused by generated parasitic capacitance to be inhibited by providing a configuration which is capable of achieving an electr...
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WO/2018/083496A1 |
Herein is disclosed, a method of plating an item with a first metal, the method comprising providing a plating solution comprising a liquid medium, a precursor species for forming a layer of the first metal on the items, and a plurality ...
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WO/2018/078243A1 |
The invention relates to a method for regenerating a platinum bath by flow reaction, comprising the following consecutive steps: drawing fluid from the platinum bath (B) via a drawing current (1); complexing platinum, by mixing the drawi...
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WO/2018/074883A1 |
An embodiment of the present invention provides a through-electrode filling method comprising: a step of immersing a through-electrode including a via in a copper plating solution having a leveler and a copper electrolyte; a first curren...
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WO/2018/074723A1 |
The present invention provides a method for manufacturing a functional electrode, which is an electrode for electrolysis or water treatment and, particularly, according to the present invention, the method for manufacturing a functional ...
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WO/2018/070188A1 |
This electrolytic treatment tool, which uses a treatment liquid supplied to a substrate to be processed and performs an electrolytic treatment on the substrate to be processed, has: a base body having a planar shape, a recessed part form...
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WO/2018/066315A1 |
Disclosed is an electrolytic treatment tool that subjects a substrate to be treated to an electrolytic treatment, the electrolytic treatment tool comprising: a flat-plate-shaped base body; an electrode provided to the base body; at least...
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WO/2018/066297A1 |
Disclosed is an electrolytic treatment tool that is used at the time of subjecting a substrate to be treated to an electrolytic treatment by using a treatment solution supplied to the substrate to be treated, the electrolytic treatment t...
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WO/2018/062259A1 |
A workpiece holding jig that has: a conductive frame-like member 630; a plurality of conductive first chuck members 610 that are supported on an upper frame member 631 and grip an upper side of a rectangular workpiece 20; a plurality of ...
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WO/2018/053158A1 |
Embodiments of the present disclosure include a system for depositing a layered nanolaminate alloy including a controller for an electrodeposition process that includes a waveform synthesizer circuit configured to generate a complex wave...
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WO/2018/028000A1 |
A device and method for multi-potential liquid-suction electrodeposition 3D printing. A workpiece is processed by means of constructing internal and external composite electrodes having different potentials. An external electrode (18) is...
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WO/2018/013874A1 |
The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the s...
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WO/2018/008261A1 |
[Problem] To limit adhesion of foreign matter stemming from plating liquid, metal stemming from the plated steel sheet and oxides of the metal to the surface of a conductor roll. [Solution] A surface treatment method for surface-treating...
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WO/2018/008343A1 |
An inspection apparatus, a plating apparatus, and an appearance inspection apparatus that are capable of automatically inspecting a substrate holder are provided. An inspection apparatus that includes an electric contact configured to co...
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WO/2018/003620A1 |
This method for producing a plated roll comprises: a smoothing step of smoothing the surface of a roll base material composed of a cylindrical carbon fiber reinforced plastic; a base plating step of performing metal plating on the roll b...
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WO/2018/005155A1 |
An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module...
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WO/2017/217216A1 |
To suppress variation in the thickness of a plating film formed by a plating treatment. A plating apparatus 100 is provided with a plating tank 10, and a plating unit 20 for carrying out electrolytic plating on an object to be plated 2. ...
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WO/2017/213021A1 |
The purpose of the present invention is to equalize the deposited amount of plating liquid remaining on a steel sheet between electroplating cells, thereby equalizing the thickness of final plating and achieving a surface appearance of f...
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WO/2017/212785A1 |
Provided are a plating apparatus and plating method with which the appropriate barrier membrane exchange time can be determined. The plating apparatus comprises: an anode tank for holding plating liquid and an insoluble anode; a cathode ...
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