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WO/2017/204019A1 |
Provided are an electrolytic copper plating liquid evaluation system, an electrolytic copper plating liquid evaluation method, and an electrolytic copper plating liquid evaluation chip that are able to measure a concentration distributio...
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WO/2017/205182A1 |
A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to pr...
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WO/2017/201760A1 |
The presently claimed invention provides an electrochemical analytical apparatus for electrochemical bath analysis. The apparatus comprise a static electrode and a rotatable unit. As steady liquid flow can be generated on the electrolyti...
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WO/2017/198722A1 |
The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating proce...
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WO/2017/116599A9 |
Disclosed is a method of fabricating a battery or battery component having a solid state electrolyte. A scaffold is provided, the scaffold comprising: a dense central layer comprising a dense electrolyte material, the dense central layer...
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WO/2017/179416A1 |
Provided is a treated surface copper foil that, when used in SAP, is able to impart to a laminate body a surface profile that is not only excellent in plated circuit adhesiveness but also in etchability with respect to electroless copper...
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WO/2017/171282A1 |
The present invention relates to a metal part and a process chamber having the metal part and, more particularly, to a metal part and a process chamber provided with the same, the metal part enabling a process failure and a production yi...
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WO/2017/170510A1 |
The present invention relates to a plating method for selectively providing plating on a part of a conductor pattern (PT) formed with a conductor on the surface of a substrate (FS), while the substrate (FS) is being transferred in a long...
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WO/2017/167253A1 |
Disclosed is a method for acquiring a pattern plating parameter, comprising the following steps: acquiring the plating area of an SS surface, the plating area of a CS surface, the current setting density of the SS surface and the current...
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WO/2017/165338A1 |
An apparatus for consuming gases includes an electrochemical cell comprising a cathode, an anode, and an electrolyte. The cell is operable to produce an electrochemical reaction that forms on the cathode a reactive material comprising at...
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WO/2017/155313A1 |
An anodizing apparatus of the present invention comprises: a plurality of gripping members to which an object is coupled; a rotation unit to which the plurality of gripping members are coupled so as to be spaced apart from each other and...
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WO/2017/148119A1 |
A roughening solution electrolysis device, comprising a reaction cell and an electrolysis system. The reaction cell comprises a roughening solution. The electrolysis system comprises an isolating means, an electrolytic anode, and an elec...
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WO/2017/150666A1 |
Provided is an electroplating apparatus capable of suppressing occurrence of a non-plated region when forming an alloy plating layer on the surface of a thread of a steel pipe. An electroplating apparatus (10) includes: an electrode (1);...
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WO/2017/145492A1 |
[Problem] To apply a variety of potential difference patterns in Ni plating coatings more easily than in the prior art and provide a highly corrosion-resistant Ni plating coating. [Solution] In this method for producing a Ni plating coat...
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WO/2017/137584A1 |
The invention relates to a method for pre-treating surfaces of plastic parts for galvanic coating, the method comprising the steps: A) production of a plastic pre-treatment dip solution containing undissociated peroxymonosulfuric acid an...
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WO/2017/120003A1 |
In one embodiment, an electroplating cell for depositing a metal onto a surface of a substrate includes an electroplating chamber configured to receive an electrolyte containing metal ions and a substrate having a surface disposed to con...
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WO/2017/110765A1 |
A plating device (10) having a water tank (30) into which plating solution (22) is injected, a nozzle section (40) having a cylindrical nozzle (40a) as an anode disposed inside the water tank (30), a to-be-plated object (20) as a cathode...
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WO/2017/098994A1 |
Provided is a steel sheet for cans that has an excellent surface appearance. Also provided is a production method for the steel sheet for cans. The steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a c...
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WO/2017/098991A1 |
Provided is a steel sheet for cans that has excellent weldability and an excellent surface appearance. Also provided is a production method for the steel sheet for cans. The steel sheet for cans has, on the surface thereof, in order from...
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WO/2017/094568A1 |
This apparatus for manufacturing a semiconductor device comprises: a substrate holding part which holds a substrate; a processing liquid supply part which supplies a processing liquid to the substrate that is held by the substrate holdin...
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WO/2017/095930A1 |
An electrochemical deposition apparatus may include a support structure, a first electrode mount connected to the support structure, a second electrode mount connected to the support structure and a deposition chamber frame configured to...
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WO/2017/084837A1 |
The invention relates to a method for coating at least one piston groove (3) provided on a piston (2) with a protective coating (16), comprising the following steps: a) arranging the piston (2) with the piston groove (3) to be coated in ...
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WO/2017/086683A1 |
The present invention relates to an electro-deposition coating system having enhanced paint recovery efficiency, the system comprising: an electro-deposition tank in which paint is accommodated, and an object to be electro-deposition coa...
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WO/2017/086682A1 |
The present invention relates to an electro-deposition coating quality control method comprising the steps of: pre-treating by attaching Zr to an object to be electro-deposition coated; measuring the attachment amount of the Zr; determin...
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WO/2017/086063A1 |
Provided is a method for manufacturing a lead frame provided with a lead frame body and a plating film on the surface of the lead frame body. The manufacturing method has a plating step for disposing a first electrode connected to a pola...
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WO/2017/076456A1 |
The present invention relates to a method for the galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, characterized in that, before the galvanic application of the surf...
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WO/2017/070780A1 |
An electrolytic process, an electrolytic solution and electrolytic assembly are disclosed, for anodizing in one main step non-ferrous metallic parts, or their alloys to form a coating. The electrolytic solution is free of toxic or harmfu...
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WO/2017/056472A1 |
Provided is a scraper device for a crystallization tank, the device being able to precisely scrape off a crystallized substance (crystals) adhered to the inner surface of a crystallization tank, even if protrusions and recesses have form...
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WO/2017/053655A1 |
The invention relates to a method for the adjustment of the lightness L* of electrolytically deposited chromium-finishes on workpieces obtained by an electroplating bath comprising at least chromium(III)-ions and sulfur containing organi...
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WO/2017/039460A1 |
In example implementations, a method for plating a substrate with a metal matrix coating containing two metals is disclosed. In one example, the method includes providing a plating solution comprising ions of the two metals, wherein a fi...
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WO/2017/039068A1 |
Disclosed are: a metal wire surface treatment unit for treating the surface of a continuously transferred metal wire by passing the metal wire straight through a bath; and a metal wire anodizing device having metal wire surface treatment...
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WO/2017/031063A1 |
In electroplating apparatus, a paddle or agitator agitates electrolyte in a vessel to provide high velocity fluid flow at the surface of a wafer. The agitator is designed and/or moved to also selectively shield part of the wafer, for exa...
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WO/2017/026683A1 |
The present invention relates to a zinc flash plating solution which can provide a galvanized steel sheet having an excellent surface appearance, a method for manufacturing a galvanized steel sheet using the same, and a galvanized steel ...
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WO/2017/021489A1 |
This invention concerns a substrate holder reception apparatus (1) for clamping a substrate holder (11) in a substrate holder clamping direction (SHCD) in a predetermined position of the substrate holder (11) and releasing the substrate ...
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WO/2017/014944A1 |
An electroplating processor has a vessel holding an electrolyte. An inert anode in the vessel has an anode wire within an anode membrane tube. A head for holds a wafer in contact with the electrolyte in the vessel. The wafer is connected...
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WO/2017/001612A1 |
The present invention relates to an electrode structure which can detect the electric current and optionally activate alarm signals in electrolytic cells for the electrodeposition of non-ferrous metals, for example for electrowinning of ...
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WO/2016/181955A1 |
This method for producing chromium plated parts comprises immersing a plurality of workpieces in a chromium plating bath, and performing a plating treatment using a pulse current, to deposit, on the surface of the plurality of workpieces...
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WO/2016/183431A1 |
The inventive subject matter is directed to continuous electrochemical production of highly pure micro- or nanostructured lead that at least partially encloses the electroprocessing solvent and molecular hydrogen and optional guest compo...
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WO/2016/178372A1 |
The purpose of the present invention is to provide a product having excellent corrosion resistance and abrasion resistance. In order to achieve this purpose, the laminated body according to the present invention is characterized by compr...
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WO/2016/174705A1 |
Provided is a technique for managing a copper sulfate plating solution by objectively assessing the age of the copper sulfate plating solution, in place of conventional management of copper sulfate plating solutions in which the plating ...
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WO/2016/163049A1 |
A multilayer wiring board manufacturing method comprising: a step (1) of providing a through-hole opening penetrating through metal foil on both side of an insulating layer and through the insulating layer, a metal foil projection on bot...
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WO/2016/156067A1 |
The present invention is related to a flooding device for a horizontal gal¬ vanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated, wherein the flooding device comprises at least a fl...
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WO/2016/157251A1 |
[Problem] To reliably evaluate the degree of degassing of a processing liquid for processing a work object having a fine pattern comprising grooves or holes in the surface thereof, regardless of the type of gas and the like. [Solution] T...
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WO/2016/150793A2 |
The invention relates to an anode for use in electroplating applications for highly alkaline electroplating electrolytes based on sodium hydroxide for depositing zinc and zinc alloys onto steel substrates and die-cast zinc substrates.
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WO/2016/143714A1 |
The present invention addresses the problem of providing a plating apparatus and a plating method which allow suitable electrolytic plating to be applied even when an object to be plated has high electrical resistance. This problem can b...
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WO/2016/144439A1 |
The disclosure relates to a chamber component or a method for fabricating a chamber component for use in a plasma processing chamber apparatus. In one embodiment, a chamber component, for use in a plasma processing apparatus, includes an...
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WO/2016/120700A2 |
Method and plant for the continuous chrome plating of metal bars, tubular elements and similar, wherein the bar to be chromed it is made move forward fastly in a device of chrome plating without of tank of chrome plating comprising a plu...
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WO/2016/059833A1 |
The purpose of the present invention is to provide a copper-nickel alloy electroplating device that can stably form a copper and nickel plating film having a homogeneous composition on an object to be plated, and enables use of a plating...
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WO/2016/049588A1 |
[52] Various implementations of a method include receiving a measurement of an electrical current provided to a component undergoing electroplating, analyzing the current measurement, and adjusting the current based at least on the analy...
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WO/2016/044712A1 |
Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.
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