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WO/2012/059300 |
The invention relates to a coating device for the galvanic coating of at least one object. The coating device has at least one vessel, in particular an electroplating reactor for receiving an electrolyte and at least one object. The vess...
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WO/2012/057242 |
[Problem] To provide a method that can: efficiently recover precious-metal ions from precious-metal-ion-containing plating wastewater discharged from a plating recovery tank and a plating cleaning tank; and minimize performance problems ...
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WO/2012/053887 |
An electrochemical system and process for producing nanoporous structures, said system comprising (among others) a power supply with a negative end and a positive end; a chamber for an electrolyte; two electrodes (one positive and one ne...
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WO/2012/052657 |
The invention relates to manufacturing a I-III-VI compound in the form of a thin film for use in photovoltaics, including the steps of: a) electrodepositing a thin-film structure, consisting of I and/or III elements, onto the surface of ...
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WO/2012/043514 |
Provided are a cylinder plating method and device with which it is possible to form a plating layer of uniform thickness using cylinder plating technology, and in addition to combine with plating technology that uses a divided insoluble ...
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WO/2012/043717 |
In order to address the problem of providing a novel method for forming an electric copper plating film with excellent adhesion on the surface of a rare earth permanent magnet, the method of the present invention is characterized by the ...
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WO/2012/036985 |
The current method and apparatus relate to treating a dispersion bath using an ion exchange resin and an optional pH adjustor and wherein the ion exchange resin and the optional pH adjustor maintain a pH of within +/- 2 of the initial pH...
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WO/2012/016478 |
A metallic nano-catalyst with an open surface structure and a preparing method and a system thereof are provided. The metallic nano-catalyst is a single metal nanoscale crystal, whose surface has high-density of step atoms or active site...
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WO/2012/016160 |
Nanostructured films including a plurality of nanowells, the nanowells having a pore at the top surface of the film, the pore defining a channel that extends downwardly towards the bottom surface of the film are provided. Also provided a...
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WO/2012/016160 |
Nanostructured films including a plurality of nanowells, the nanowells having a pore at the top surface of the film, the pore defining a channel that extends downwardly towards the bottom surface of the film are provided. Also provided a...
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WO/2012/014029 |
Process of electrodepositing a metal in a high aspect ratio via in a silicon substrate to form a through-silicon-via (TSV), utilizing an electrolytic bath including a redox mediator, in an electrolytic metal plating system including a ch...
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WO/2012/013362 |
The invention relates to a device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment. The device comprises a flow distributor body (1) which is disposed, with the front...
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WO/2012/011727 |
The present invention relates to an electroplating apparatus comprising: a plating vessel for accommodating an electrolyte containing ions of the metal to be plated; an electrolyte spraying part for receiving the electrolyte and spraying...
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WO/2012/011727 |
The present invention relates to an electroplating apparatus comprising: a plating vessel for accommodating an electrolyte containing ions of the metal to be plated; an electrolyte spraying part for receiving the electrolyte and spraying...
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WO/2012/007525 |
A chuck for holding a substrate or master electrode in an ECPR process is provided. The chuck comprises an interaction surface (101) for a master electrode or a substrate; and holding means for holding the substrate or master electrode o...
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WO/2012/007526 |
A device and method for electrochemical pattern replication, ECPR, is provided. The device comprises;a base;a bottom chuck on a X-Y-Theta stage;and a Z-stage with an attached top chuck, said chucks being configured to hold a master elect...
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WO/2011/149144 |
Provided is a dangler assembly for use in a plating barrel, which includes a wire, a connecting terminal electrically connected to a part at one end of the wire and an electrode terminal electrically connected to a part at the other end ...
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WO/2011/149047 |
Disclosed are a surface treatment bath capable of forming a surface treatment coating with excellent corrosion resistance by means of high-speed electrolytic processing, and an efficient method for manufacturing a surface-treated steel p...
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WO/2011/123896 |
A monitoring device comprising sensing means adapted to measure one or more operational parameters of at least one electrode in an electrowinning or electrorefining cell, transmission means adapted to transmit information about the one o...
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WO/2011/121240 |
Arranged in the bath (3) contained in a tank (2) are respectively an anodic electrode (5) and a cathodic electrode (6), which are connected to an electric current generator (4). Advantageously, said cathodic electrode (6) is composed of ...
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WO/2011/118596 |
Disclosed is an anodized alumina inspection device which comprises: a line shape illumination device (illumination means) (14) for emitting light onto the surface of anodized alumina that is formed on the surface of a mold (12) and that ...
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WO/2011/109020 |
Electrochemical nitridation of metals and the produced metals are disclosed. An exemplary method of electrochemical nitridation of metals comprises providing an electrochemical solution at low temperature. The method also comprises provi...
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WO/2011/085824 |
The invention refers to an air supply system (1) for a group of cells (4) arranged for dosing the individual air demand of each electrolytic cell (2) that must be fed to its electrolyte through a system of controlled air diffusion. It co...
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WO/2011/083878 |
A method for manufacturing tin electroplated steel plate is characterized in that in a quench process after a reflow process in a continuous tin electroplating line, the temperature of cooling water in a quench tank is controlled by intr...
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WO/2011/066824 |
The invention relates to the electrical contacting of band-shaped or plate-shaped material (1), which can be conveyed through an electroplating system on a transport track. The cathodically polarized contact means (6) are located, for ex...
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WO/2011/046783 |
Power pulsing, such as current pulsing, is used to control the structures of metals and alloys electrodeposited in non-aqueous electrolytes. Using waveforms containing different types of pulses: cathodic, off -time and anodic, internal m...
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WO/2011/042324 |
The invention relates to a method for producing metallised semiconductor substrates, in which a substrate is immersed in a coating bath, where it is coated in a preferably light-induced or light-assisted manner. The coated substrate is t...
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WO/2011/033303 |
Electrolytic process apparatus comprises a voltage source for electrically coupling to first and second electrodes, a detection circuit electrically coupled to the voltage source and a guard for providing a barrier between the first and ...
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WO/2011/033916 |
Disclosed is a film-forming method which comprises: a step in which a substrate is prepared by forming a Co film as a seed layer on the surface of the substrate; a step in which negative voltage is applied to the substrate in such a way ...
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WO/2011/031494 |
A discrete sacrificial zinc anode is fabricated from one or more slotted and slatted metal plates. The plates are fixed in a parallel planar configuration using conventional fasteners. One or more electrical connection wires are formed w...
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WO/2011/031494 |
A discrete sacrificial zinc anode is fabricated from one or more slotted and slatted metal plates. The plates are fixed in a parallel planar configuration using conventional fasteners. One or more electrical connection wires are formed w...
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WO/2011/030945 |
The present invention relates to an electrolytic bath which is configured so as to effectively electrodeposit recyclable valuable metals from electroplating waste water or waste water containing valuable metals to recover the same, and m...
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WO/2011/028476 |
The present disclosure generally relates to techniques for magnetic electro-plating or electro-deposition. Example methods may include utilizing a magnet during electro-deposition to modify kinetics of deposition of plating material on a...
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WO/2011/017197 |
The working electrode in the flow channel of a flow-through electrolytic detection cell is preconditioned by flowing a preconditioning electroplating solution with preconditioner species through the flow channel while applying a negative...
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WO/2011/017197 |
The working electrode in the flow channel of a flow-through electrolytic detection cell is preconditioned by flowing a preconditioning electroplating solution with preconditioner species through the flow channel while applying a negative...
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WO/2011/014897 |
The invention relates to a method for producing structured chromium layers, in particular for media contact surfaces, wherein the structural chromium layer is produced by electrodepositing chromium from an electrolyte onto a substrate. T...
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WO/2011/015559 |
The invention relates to a method for electrochemical processing of at least one workpiece, comprising at least the following steps: a) setting a first flow density (2) during a first phase (1) in an electrolyte, b) retaining the first f...
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WO/2011/008212 |
One embodiment of the present invention is a method of electroless deposition of cap layers for fabricating an integrated circuit. The method includes controlling the composition of an electroless deposition bath so as to substantially m...
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WO/2010/143623 |
A method for water and metal recovery from a plating wastewater resulting from washing is disclosed with which water and metals are efficiently recovered from the plating wastewater, the method comprising an iron insolubilization step in...
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WO/2010/133222 |
The invention relates to a method and a device for the electrochemical treatment of substrates in continuous installations or dip coating installations including the electric contacting of the material (1) on opposite edges by means of r...
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WO/2010/127094 |
Copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous s...
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WO/2010/127094 |
Copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous s...
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WO/2010/123333 |
The aim of the present invention is to provide a single tub-type washing apparatus capable of not only improving washing efficiency, but also of significantly reducing installation space by adopting a single washing tub instead of existi...
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WO/2010/123333 |
The aim of the present invention is to provide a single tub-type washing apparatus capable of not only improving washing efficiency, but also of significantly reducing installation space by adopting a single washing tub instead of existi...
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WO/2010/120158 |
The present invention relates to an electroplating apparatus which comprises: a plating vessel containing electrolyte solution; and a supply unit which is connected to the plating vessel and which sprays the electrolyte solution containi...
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WO/2010/119018 |
The present invention relates to a method for removing residue of a metallic salt-containing ionic fluid from a work piece, comprising the step of (a) treating at least part of the work piece surface with a treatment agent containing a m...
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WO/2010/120158 |
The present invention relates to an electroplating apparatus which comprises: a plating vessel containing electrolyte solution; and a supply unit which is connected to the plating vessel and which sprays the electrolyte solution containi...
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WO/2010/119575 |
Provided is a manufacturing method which gives Ag plating relatively inexpensively only to required portions of a surface-mounted LED lead frame. A manufacturing method for a surface-mounted LED lead frame provides a strip-form Ag plated...
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WO/2010/097345 |
The galvanization system comprises a galvanization bath (20), at least one product carrier (22) for accommodating or holding at least one object (24) and for introducing said object into the galvanization bath, at least one line (26) for...
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WO/2010/092579 |
A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.
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