Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 10,092

Document Document Title
WO/2019/176586A1
Provided is a current collecting member for a cylinder body plating apparatus, which is used at the base end of the spindle of a chuck cone, thereby making it possible to plate a sliding surface without oiling and to prevent efficiently ...  
WO/2019/175990A1
Provided is a plating device capable of appropriately measuring microthrowing power. A first plating device (1A) is provided with: a first positive electrode (12A) provided inside a first plating tank (11A); an insulating substrate (4), ...  
WO/2019/164920A1
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. An inert anode (or an auxiliary electrode that can act as inert anode when needed)...  
WO/2019/162026A1
A station (1) for the localised surface treatment of an industrial component (2) to be treated, comprising a system (6) for applying a vacuum in the treatment chamber (5) and the feed and drain circuit (22, 23) making it possible to feed...  
WO/2019/156514A1
A sulfur powder, a sulfur electrode, a battery comprising same, and a manufacturing method therefor are disclosed. The manufacturing method of a sulfur powder comprises the steps of: positioning an electrode plate connected to an anode o...  
WO/2019/152555A1
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...  
WO/2019/148107A1
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...  
WO/2019/138818A1
The electroplating device according to one embodiment of the present invention has: a mounting part 21 which, when mounted to a box-like object 13, forms a sealed space 22 together with the box-like object 13; a plating solution containe...  
WO/2019/132205A1
The purpose of the present invention is to provide an electroforming apparatus capable of manufacturing products which have uniform alloy components. One embodiment provides an electroforming apparatus comprising: a rotary cathode, forme...  
WO/2019/130859A1
Provided is a method for producing a photoelectric conversion element, which improves the production efficiency. The present invention is a method for producing a photoelectric conversion element that comprises a photoelectric conversion...  
WO/2019/133305A1
In one example, an electroplating system comprising a bath reservoir having a first inlet for feeding fresh electrolyte solution into the bath reservoir and a first outlet for bleeding used electrolyte solution out of the bath reservoir,...  
WO/2019/119820A1
Disclosed is an electroplating transmission system. The electroplating transmission system comprising: a fixed bracket; two steel wheels rotatably mounted on the fixed bracket; a conveyor belt made of an electrically conductive material,...  
WO/2019/119807A1
Disclosed is a coil-type vertical continuous electroplating production line, comprising a machine frame; an uncoiling mechanism, a process tank and a coiling mechanism successively provided on the machine frame; and a fixed portion and a...  
WO/2019/116633A1
This method for producing a porous metallic body comprises: a step for obtaining an electroconductive porous resin body having an electroconductive layer by making conductive the surface of a skeleton of a sheet-shaped porous resin body,...  
WO/2019/116632A1
This method for producing a porous metallic body comprises: a step for obtaining an electroconductive porous resin body having an electroconductive layer by making conductive the surface of a skeleton of a sheet-shaped porous resin body,...  
WO/2019/102867A1
An apparatus for producing a semiconductor device, which comprises: a substrate holding unit which holds a substrate; a treatment liquid supply unit which supplies a treatment liquid to the substrate that is held by the substrate holding...  
WO/2019/102866A1
An apparatus for producing a semiconductor device, which comprises: a substrate holding unit which holds a substrate; an electrolytic treatment unit which performs an electrolytic treatment on the substrate that is held by the substrate ...  
WO/2019/089282A1
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating s...  
WO/2019/088229A1
This electrolytically Sn-plated steel sheet is provided with: a base steel sheet; and an electrolytic Sn plating layer which is arranged on the base steel sheet and has an Sn layer and an alloy layer, while containing a specific componen...  
WO/2019/078063A1
A surface treatment device (1) comprising: a treatment tank (3-1) accommodating a treatment fluid; at least one positive electrode (20) disposed inside the treatment tank; at least one negative electrode rail (40–1); intermittent conve...  
WO/2019/078065A1
A surface treatment device (1) having: treatment tanks (3–1 – 3–n) that have arranged therein a plurality of nozzle tubes (60) that spray treatment fluid on to a plurality of workpieces (2) to be immersed in treatment fluid; and a ...  
WO/2019/079193A1
Various embodiments herein relate to methods and apparatus for electroplating material onto substrates. Often the substrate is a semiconductor substrate. Various techniques described herein utilize a number of different electroplating st...  
WO/2019/078064A1
A surface treatment device (1) having: a treatment tank (3–1) housing treatment fluid; at least one positive electrode (20) arranged inside the treatment tank; an N number (N being an integer of at least 2) of negative electrode rails ...  
WO/2019/063197A1
The present invention is related to a method for electrolytically depositing a zinc-nickel alloy layer on a substrate, wherein the method comprises an interrupting of the execution of the electrolytical deposition of a zinc-nickel alloy ...  
WO/2019/065095A1
Provided is a manufacturing method for a metal-filled microstructure for through-holes and an insulating base material that control against a through-hole being insufficiently metal-filled and hollow spaces forming when multiple through-...  
WO/2019/058860A1
Provided are a surface-treatment device and a surface-treatment method capable of improving surface-treatment quality when an object undergoes surface-treatment. The surface-treatment device is used to treat the surface of an object at l...  
WO/2019/055962A1
Various embodiments herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. The apparatus includes an ionically resistive element that separates the plating chamber into a cross flow manifold (a...  
WO/2019/054483A1
This hot-dip plated checkered plate has: a base material steel plate, an Ni plated layer, and a hot-dip plated layer, and has on the plate surface a projecting part and a flat part. The film thickness of the Ni plated layer of the projec...  
WO/2019/051138A1
A method is provided, including the following operations: depositing a ruthenium liner in a feature of a substrate; depositing a monolayer of zinc over the ruthenium liner; after depositing the monolayer of zinc, performing a thermal tre...  
WO/2019/036207A1
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein th...  
WO/2019/026578A1
The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties can be improved without increasing the co...  
WO/2019/027174A1
An embodiment of the present invention provides a copper foil, which comprises a copper layer having a matte surface and a shiny surface and an anti-rusting film disposed on the copper layer and has a residual stress of 0.5-25 Mpa based ...  
WO/2019/012416A1
Methods for recovering manganese etchant solutions are provided wherein a process solution used to rinse or neutralize a nonconductive substrate after etching the substrate is collected and evaporated to provide a concentrated process so...  
WO/2019/013002A1
[Problem] To provide a plating solution assessment method and plating solution assessment mechanism that have a simple configuration and make it possible to estimate the state of a plating solution and a coating while plating treatment i...  
WO/2019/003891A1
This substrate holder is for holding a substrate and comprises: a first holding member having a first opening part for exposing a first surface of the substrate; and a second holding member for holding the substrate by sandwiching the sa...  
WO/2019/006009A1
Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal d...  
WO/2018/236877A1
Methods of cleaning an electroplating device may include processing a substrate coupled with the electroplating device. The substrate may be coupled with a substrate holder of the electroplating device. The substrate holder may include a...  
WO/2018/225535A1
Transport jigs 30 and 30A have transport units 300, 320, 330 and a workpiece holding unit 500 for hanging from and supported by the transport unit. The workpiece holding unit has: a fixed member 510; two movable members 550 supported sli...  
WO/2018/221395A1
A surface treatment device 10 is provided with: a surface treatment tank 200 which contains a treatment liquid Q, and has an upper opening 200A; a transport jig 30 which includes a workpiece holding part 340 which holds a workpiece 20 in...  
WO/2018/211215A1
The invention relates to a method for filtering a platinum bath by electrodialysis, comprising consecutive steps of extracting fluid from the platinum bath (B) by means of an extraction current (10a); filtering the fluid extracted during...  
WO/2018/196346A1
A metal surface modification apparatus, comprising: a particle solution mixing and circulation system (2) used for providing nano particle solution to a workpiece; a rotating platform used for securing the workpiece and driving the workp...  
WO/2018/197227A1
The invention relates to a method for producing an electrode film, wherein an electrode strip (20) of high tensile strength is provided, which electrode strip contains an electrochemical active material, wherein the electrode strip (20) ...  
WO/2018/185144A1
The present invention refers to a controlled method for depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps (a) providing an aqueous deposition bath, wherein the bath comprises - triva...  
WO/2018/183451A1
A fluid sensing system (104) includes a microfluidic chip (114), multiple sensors (116), and a communication device (122). The microfluidic chip includes at least one microfluidic channel (120) extending a length through the microfluidic...  
WO/2018/171513A1
Disclosed are a barrel plating barrel, a barrel plating apparatus, a barrel plating system, and a barrel plating production line. Insofar as the barrel plating barrel is in a material-discharging state, workpieces being plated are paddle...  
WO/2018/164491A1
The present invention relates to a 3D printing device using selective electrochemical deposition, which can increase the rate of 3D printing of a metal product to be laminated on a substrate, by selectively electrodepositing a metal raw ...  
WO/2018/150632A1
[Problem] To provide a workpiece-washing system capable of achieving better water conservation than in the past. [Solution] This workpiece-washing system 10 is provided with: a water purification line 20 for purifying washing water that ...  
WO/2018/146041A1
The present invention relates to a method for electrodepositing zinc and zinc alloy coatings from an alkaline coating bath with reduced depletion of organic bath additives. This involves using as an anode an electrode which is insoluble ...  
WO/2018/142955A1
The electrolytic treatment device (1, 1A) pertaining to an embodiment of the present invention performs electrolytic treatment of a treatment substrate, and is provided with a substrate retaining part (10) and an electrolytic treatment p...  
WO/2018/030974A3
The present invention is a washing assembly (1) having at least one washing chamber (13) at which at least one sheet metal (4) passing through for producing copper-coated double-layer steel pipe. The washing assembly comprises at least o...  

Matches 1 - 50 out of 10,092