Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 10,294

Document Document Title
WO/2020/184289A1
This microporous plating solution, characterized by containing non-conductive particles and polyaluminum chloride, allows for easy preparation of positively charged nonconductive particles and is safe. Also, this method for performing mi...  
WO/2020/175352A1
A high-concentration aqueous tin sulfonate solution according to the present invention has a bivalent tin ion (Sn2+) concentration of 360 to 420 g/L, a tetravalent tin ion (Sn4+) concentration of 10 g/L or less, a free methanesulfonic ac...  
WO/2020/175934A1
An anodizing device is disclosed. The anodizing device according to an embodiment of the present invention may comprise: a base for supporting a product to be anodized, the product having a first bore for which an anodizing surface treat...  
WO/2020/168881A1
Disclosed are a device and a method for fine electrodeposition by means of a laser assisted flexible following tool electrode, which relate to the technical field of localized fine electrodeposition. The method comprises: enhancing local...  
WO/2020/158567A1
A workpiece-holding jig (30), which can hold a workpiece (20) having a surface to be processed and can electrically connect to a rectifier that controls voltage so as to conduct a constant current, wherein a conductive member that can el...  
WO/2020/158570A1
A workpiece holding jig (30), which holds a workpiece (20) having a surface to be processed so as to hang down and is capable of being electrically connected to a rectifier, comprises: a conductive upper clamping part (510) that clamps t...  
WO/2020/158568A1
A workpiece holding jig (30), which is capable of holding a workpiece having a surface to be processed and being electrically connected to a rectifier, comprises: at least one conductive support part (521, 522) that can conduct a current...  
WO/2020/158569A1
A workpiece holding jig (30), which holds a workpiece (20) so as to hang down and can electrically connect to a rectifier, comprises support parts (531, 532) that can conduct power in conjunction with the rectifier, and conductive clamps...  
WO/2020/152208A1
The present invention is related to a membrane anode system for electrolytic zinc-nickel alloy deposition, a method for electrolytic deposition of a zinc- nickel alloy layer on a substrate to be treated using a membrane anode system, and...  
WO/2020/138051A1
A plating solution purification filter according to one aspect of the present invention comprises a molded body that contains an adsorbent constituted by activated carbon and that has an iodine adsorption capacity per unit of mass of 930...  
WO/2020/138321A1
The present invention pertains to a metal sheet comprising a plurality of plated parts, a frame part, and a linking part linking the plated parts and the frame part, wherein the plurality of plated parts, the frame part, and the linking ...  
WO/2020/129145A1
[Problem] To provide a plating apparatus and plating method whereby plating treatment can be satisfactorily performed even when a long sheet as the material to be plated has a large electrical resistance, and also whereby adhesion of a m...  
WO/2020/120537A1
A method for depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps (a) providing an aqueous deposition bath with a pH in the range from 4.1 to 6.9, the bath comprising - trivalent chromi...  
WO/2020/114000A1
A water retaining device and a vertical electroplating device, comprising a fixing frame (2), a water blocking component (5), a gear set, a transmission shaft (4), a rotating component (3) and transmission guide rods (6); the fixing fram...  
WO/2020/099947A1
An electroplating device (1) and an electroplating method. The electroplating device (1) comprises a tank body (10), a carrying unit (11), and an anode unit (12). The tank body (10) stores an electroplating liquid (2). The carrying unit ...  
WO/2020/083414A1
The invention relates to a method for coating substrate surfaces with a metal or oxidic layer, wherein the coating bath has at least one component, the concentration of which changes in the course of the coating process and which is ther...  
WO/2020/078598A1
The subject matter of this invention is a method for the continuous electrolytic chromium plating of a metal strip (12) in an aqueous electrolyte (19) with trivalent chromium, wherein the trivalent chromium is fed to the electrolyte (19)...  
WO/2020/074541A1
Method for etching or plating a component, comprising the steps of: - etching or plating a component preliminary placed into an etching or plating tank, with a solution containing at least one transition metal, such as manganese, - prior...  
WO/2020/075173A1
The invention relates to a process and a system for 3-dimentional (3D) fabrication of sub-micron structures and is established by local electrochemical deposition methods.  
WO/2020/072783A1
A metallic electrode comprises an electroactive material comprising zinc, aluminum, lithium, magnesium, silver, brass, copper, stainless steel, nickel, selenium, or any combination thereof, and an additive comprising a metal selected fro...  
WO/2020/069631A1
A device for distributing electrolyte from the base of the cell comprising an inlet for the electrolyte via an elbow (1), a flexible tube (2), an inlet tube (4), a triple distributor (5), two lateral linear tubes (7) and a central linear...  
WO/2020/067622A1
Disclosed is a method comprising the steps of: preparing an electrolyte containing a metal oxide active material precursor; and forming a metal oxide coating layer by loading a titanium (Ti) substrate into the electrolyte, wherein the me...  
WO/2020/050024A1
In the present invention, an imaging unit (103) images the surface of a member being processed by a surface processing unit (102). A comparison unit (104) determines the correlation coefficient between a reference image stored by a stora...  
WO/2020/050009A1
The present invention relates to a substrate processing device for processing a substrate using a processing fluid. The substrate processing device according to an embodiment is provided with: a support unit which has a mounting surface ...  
WO/2020/042870A1
A production method for the electroplating solution or the electroplating supplement solution in an insoluble anode acid copper electroplating process, comprising the following steps: 1) providing an electrolytic cell and using an electr...  
WO/2020/039856A1
The present invention pertains to a copper oxide solid used for plating a substrate using an insoluble anode. The present invention further pertains to a method for producing the copper oxide solid. The present invention further pertains...  
WO/2020/032476A1
An electroplating system according to one embodiment of the present invention, which has a constant current control function and includes a reservoir having a plating solution received therein, may comprise: a power source; a positive el...  
WO/2020/026745A1
The stannous oxide is stannous oxide having an α-ray emission level of 0.002 cph/cm2 or less after being heated for six hours at 100°C in air. Tin containing lead as an impurity is dissolved in a sulfuric acid aqueous solution to prepa...  
WO/2020/025090A1
The invention relates to a flow generator (2a, 2b), which has an electrolyte feed device (12) for feeding an electrolyte (7), and an electrolyte distribution device (13). The invention also relates to a deposition device (1, 33, 35) havi...  
WO/2020/021782A1
A tin(II) oxide powder comprising tin(II) oxide and unavoidable impurities, wherein the content of tin(II) oxide is 99.9% by mass or more in terms of dried mass, the specific surface area is 0.1 to 1.0 m2/g, the TAP density is 2 to 4 g/c...  
WO/2020/015672A1
The present application provides an electroplating device and an electroplating apparatus. The electroplating device comprises a driving mechanism, a mounting part drivingly connected to the driving mechanism and made of a conductive mat...  
WO/2020/015674A1
A transmission structure and an electroplating device. The transmission structure comprises a linear track (11), a mounting member (15) for mounting a circuit board, and at least one roller (16) that is connected to the mounting member (...  
WO/2020/014423A1
Electroplating results can be improved by dynamically controlling the pressure in different parts of an electroplating apparatus. For example, a number of plating problems can be avoided by ensuring that the pressure in an anode chamber ...  
WO/2020/009161A1
Provided is a double-pipe-structure pressure contact roll having an outer tube member made from at least a carbon-fiber-reinforced resin, wherein the pressure contact roll is configured so that a metal plating layer is uniformly and firm...  
WO/2019/242034A1
Provided are a device and system for automatically controlling the thickness of an electroformed coating. The device comprises an electroforming cylinder (1), a rack-plating bracket (2), a controller (3) and a current detection unit (4)....  
WO/2019/214879A1
The invention relates to an electrode (10) for eloxing a component (50), in particular a component (50) of a vehicle brake system, comprising an electrolyte inlet (14) for feeding an electrolyte into the electrode (10), an inlet channel ...  
WO/2019/217673A1
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...  
WO/2019/216012A1
A printed wiring board according to an embodiment of the present disclosure comprises an insulating base film and a conductive pattern that is laminated upon at least one surface of the base film and that includes a plurality of parallel...  
WO/2019/212930A1
An electroplating apparatus includes an electrode at the bottom of a chamber, an ionically resistive element with through holes arranged horizontally at the top of the chamber, with a membrane in the middle. One or more panels extend ver...  
WO/2019/204513A1
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...  
WO/2019/191636A1
Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing ...  
WO/2019/178707A1
The invention relates to an electrochemical reactor for continuous copper electrodeposition at high current densities with copper sulfate electrolytes, which comprises devices and systems of functional means that are linked and operated ...  
WO/2019/181179A1
This plating treatment device forms a plating layer on the surface of an article to be plated by immersing the article to be plated in a plating liquid, the plating treatment device comprising: a plating tank for storing the plating liqu...  
WO/2019/176586A1
Provided is a current collecting member for a cylinder body plating apparatus, which is used at the base end of the spindle of a chuck cone, thereby making it possible to plate a sliding surface without oiling and to prevent efficiently ...  
WO/2019/175990A1
Provided is a plating device capable of appropriately measuring microthrowing power. A first plating device (1A) is provided with: a first positive electrode (12A) provided inside a first plating tank (11A); an insulating substrate (4), ...  
WO/2019/164920A1
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. An inert anode (or an auxiliary electrode that can act as inert anode when needed)...  
WO/2019/162026A1
A station (1) for the localised surface treatment of an industrial component (2) to be treated, comprising a system (6) for applying a vacuum in the treatment chamber (5) and the feed and drain circuit (22, 23) making it possible to feed...  
WO/2019/156514A1
A sulfur powder, a sulfur electrode, a battery comprising same, and a manufacturing method therefor are disclosed. The manufacturing method of a sulfur powder comprises the steps of: positioning an electrode plate connected to an anode o...  
WO/2019/152555A1
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...  
WO/2019/148107A1
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...  

Matches 1 - 50 out of 10,294