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Matches 1 - 50 out of 12,498

Document Document Title
WO/2018/066007A1
The present invention concerns a method to obtain the coloration on an object, the method comprising a processing phase of the object by galvanic deposition and a following phase of heat treatment which foresees the heating of the object...  
WO/2018/066398A1
The purpose of the present invention is to provide a satin nickel plating solution that enables satin nickel plating without resulting in poor appearance and does not require an activated carbon treatment for a long time. This nickel-pla...  
WO/2018/060779A1
The present disclosure discloses a coated steel comprising a steel substrate and a nickel-zinc coating on the steel substrate. The nickel-zinc coating forms an iron-nickel solid solution layer on steel substrate, a nickel layer on iron-n...  
WO/2018/057707A1
An electrolytic plating composition for superfilling submicron features in a semiconductor integrated circuit device and a method of using the same. The composition comprises (a) a source of copper ions to electrolytically deposit copper...  
WO/2018/057490A1
A process for electrodepositing a copper layer on a metalizing substrate is described. The metalizing substrate comprising a seminal conductive layer positioned on and in electrically conductive communication with a photovoltaic cell pan...  
WO/2018/057590A1
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a d...  
WO/2018/051925A1
The purpose of the present invention is to provide a novel technique which enables a lithium ion secondary battery to have a higher capacity, while enabling the lithium ion secondary battery to exhibit sufficiently excellent cycle charac...  
WO/2018/052023A1
This zinc-nickel composite plating bath contains a zinc source, a nickel source, silicon dioxide particles (22) and an ammonium-based dispersant in such ranges that enable the achievement of a zinc-nickel composite plating film (10) wher...  
WO/2018/053499A1
A process is provided comprising submerging a substrate in an electrochemical deposit bath having at least a metal salt and saccharin. In embodiments, the film is further treated with anodization, and in other cases chemical vapor deposi...  
WO/2018/048486A1
A coating system for a surface of a superalloy component is provided. The coating system includes a MCrAlY coating on the surface of the superalloy component, where M is Ni, Fe, Co, or a combination thereof. The MCrAlY coating generally ...  
WO/2018/033097A1
A nanocrystalline material based on a stainless steel surface. In percentage by weight, the nanocrystalline material comprises: 0 to 3% of carbon, 20% to 35% of oxygen, 40% to 53% of chromium, 10% to 35% of ferrum, 0 to 4% of molybdenum,...  
WO/2018/033098A1
An anti-coking nanomaterial based on a stainless steel surface. In percentage by weight, the nanomaterial comprises: 0 to 3% of carbon, 23% to 38% of oxygen, 38% to 53% of chromium, 10% to 35% of ferrum, 0 to 2% of molybdenum, 0 to 4% of...  
WO/2018/034511A1
The present invention relates to a method for fabricating grooves for silica fiber arrays by using C4F8 gas polymerization and, more particularly, to a method for fabricating grooves for silica fiber arrays, wherein a silica substrate is...  
WO/2018/033461A1
The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of For...  
WO/2018/029968A1
This electrode manufacturing method includes: a step in which a soluble salt of nickel, a soluble salt of iron, and aminocarboxylic acid are dissolved in water to prepare a plating solution; and a step in which a substrate is immersed in...  
WO/2018/029967A1
This electrode manufacturing method includes: a step in which a soluble salt of nickel, a soluble salt of iron, and aminocarboxylic acid are dissolved in water to prepare a plating solution; and a step in which a substrate is immersed in...  
WO/2018/024181A1
A method for preparing graphene foam metal for carrying a titanium dioxide-precious metal thin film. The method comprises: preparing an electrolyte containing titanium dioxide; cleaning to-be-electroplated foam metal whose surface is dep...  
WO/2018/018161A1
A method of electrochemical deposition of a metallic material onto a substrate is provided. The method includes providing an alkaline solution of hydroxide ions, immersing a metallic material precursor and the substrate into the alkaline...  
WO/2018/022374A1
A method of applying a corrosion-resistant coating to a fastener including preheating an area of the fastener to be coated to elevate a temperature of the area and spraying the preheated area of the fastener with a molten or semi-molten ...  
WO/2018/017755A1
Systems and methods for use in an in vitro diagnostics setting incorporating magnetic shielding to reduce exposure of any of samples, reactants, devices or people from exposure or prolonged exposure to magnetic or electromagnetic fields ...  
WO/2018/015168A1
A composition comprising: (a) cobalt ions, and (b) an additive of formula (I) wherein R1 is selected from X-Y; R2 is selected from R1 and R3; X is selected from linear or branched C1 to C10 alkanediyl, linear or branched C2 to C10 alkene...  
WO/2018/016772A1
The present invention relates to a multilayer-structure metal manufacturing method using a composite surface treatment method. A multilayer-structure metal manufacturing method using a composite surface treatment method according to the ...  
WO/2018/013874A1
The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the s...  
WO/2018/013850A2
Galvanic metal-water cells and methods of manufacturing positive electrodes to be used in said galvanic metal-water cells. The galvanic metal-water cells in accordance with various embodiments include a cathode that includes a layer comp...  
WO/2018/004152A1
The present invention relates to a surface-treated copper foil for a microcircuit and a method for manufacturing the same. Specifically, a method for surface-treating a copper foil for a microcircuit board according to the present invent...  
WO/2018/004151A1
The present invention relates to a surface-treated copper foil for a microcircuit board and a method for manufacturing the same and, more specifically, to a surface-treated copper foil for a microcircuit board and a method for manufactur...  
WO/2017/219797A1
The present invention relates to an electric copper plating liquid and an electric copper plating process thereof. The electric copper plating liquid comprises the following components: 20g/L to 240g/L of copper sulfate pentahydrate, 20 ...  
WO/2017/217387A1
According to the present invention, an electrodeposition article is formed with use of a tin or tin alloy plating bath which contains a predetermined branched polyoxyalkylene compound such as an alkylene oxide addition product of an alip...  
WO/2017/217234A1
[Problem] To provide a copper plating bath which contains a reduced amount of chlorine, considered to be attributable to wiring resistance, or is free of chlorine, without the need to highly purify copper sulfate. The copper plating bath...  
WO/2017/213353A1
A method for creating a hologram pattern, and a test specimen comprising a metal-plated layer having a hologram pattern on the surface thereof, according to the present invention, can have a hologram pattern formed on a metal-plated laye...  
WO/2017/210728A1
A method for preparing a palladium-gold alloy layer on a substrate by electrodepositing said coating surface with an aqueous electroplating solution comprising of an aqueous solution of a soluble palladium compound and a soluble gold com...  
WO/2017/201640A1
The present invention relates to the technical field of surface treatment of rollers. Disclosed is a method for electroplating a release liner roller. The method comprises the following processes: a pre-electroplating treatment process a...  
WO/2017/205473A1
A ternary zinc-nickel-iron alloy and aqueous alkaline electrolyte for electroplating the alloy includes zinc, nickel, and a complex of an iron salt.  
WO/2017/198722A1
The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating proce...  
WO/2017/199564A1
An aluminum alloy comprising 0.010 mass% to 8.0 mass% of at least one kind of additional element selected from a group consisting of Zr, Cu, Cr and Zn and comprising 0.01 mass% to 10.0 mass% of C.  
WO/2017/199835A1
The present invention addresses the problem of providing: an electrolytic nickel (alloy) plating solution which is able to fill micro holes or micro recesses 14 within an electronic circuit component with nickel or nickel alloy 18 withou...  
WO/2017/195191A1
This invention is related to a method for the preparation of halide perovskite or perovskite-related materials on a substrate and to optoelectronic devices and photovoltaic cells comprising the perovskites prepared by the methods of this...  
WO/2017/196069A1
The present invention relates to a microstructure and a manufacturing method therefor, the method comprising the steps of: (a) forming a water-soluble microstructure core on a substrate; and (b) forming a waterproof thin film on the wate...  
WO/2017/191240A1
The invention relates to a coating for metal surfaces of functional parts made of metal, preferably baking trays, and a method for producing a coating of this type, wherein at least one coating (2) with an alloy is galvanically applied t...  
WO/2017/192223A1
An article comprises a substrate, a coating disposed on a surface of the substrate. The coating comprises a carbon composite dispersed in one or more of the following: a polymer matrix; a metallic matrix; or a ceramic matrix. The carbon ...  
WO/2017/188601A1
The present invention relates to electrolytic copper foil for graphene and a method for producing the former, more specifically to electrolytic copper foil, for graphene, facilitating graphene synthesis due to the addition of nickel duri...  
WO/2017/188600A1
The present invention relates to electrolytic copper foil for graphene and a method for producing the former, more specifically to electrolytic copper foil for graphene capable of facilitating graphene formation due to prevention of surf...  
WO/2017/186917A1
The present invention provides magnetic and electrocatalytic, pseudo-ordered mesoporous alloy films as well as their use. Two different types of mesoporous alloy films have been provided by the invention: (1) non-noble metal + noble meta...  
WO/2017/182123A1
The invention relates to a method for coating an object (1), wherein a surface (3) of the object (1) is at least partially coated with a coating (4) which has a plurality of layers (5, 6, 7, 8, 9), wherein at least one layer (5, 6, 7, 8,...  
WO/2017/184380A1
An aqueous trivalent chromium electrolyte comprising trivalent chromium ions and amino acids that allow for producing a dark colored hue in the trivalent chromium coating which is plated on a substrate. The amino acids described herein c...  
WO/2017/182957A1
A phosphorus-cobalt-nickel alloy is described, and the use thereof in plating processes of non-precious metal objects with precious metals; said plating processes and the objects thus obtained are also described.  
WO/2017/175880A1
The present invention relates to a device for selectively plating only a part corresponding to a terminal part of a bus bar for connecting a plurality of cells arranged in a row in a secondary battery, wherein a first compartment of a pl...  
WO/2017/175428A1
The purpose of the present invention is to provide a hard gold plating solution by which deposition of gold at unwanted locations can be reliably suppressed. Provided is a hard gold plating solution which is for electroplating and which ...  
WO/2017/159324A1
Provided is a conductive material having a titanium film with an average film thickness of 1-300 ┬Ám on a surface of a substrate where at least the surface is conductive.  
WO/2017/159965A1
An organic additive for electrolytic copper plating according to one aspect of the present invention is added to a copper plating solution for forming a copper film on a substrate with a pattern formed thereon, in an electrolytic plating...  

Matches 1 - 50 out of 12,498