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Matches 1 - 50 out of 12,431

Document Document Title
WO/2018/013874A1
The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the s...  
WO/2018/013850A2
Galvanic metal-water cells and methods of manufacturing positive electrodes to be used in said galvanic metal-water cells. The galvanic metal-water cells in accordance with various embodiments include a cathode that includes a layer comp...  
WO/2018/004152A1
The present invention relates to a surface-treated copper foil for a microcircuit and a method for manufacturing the same. Specifically, a method for surface-treating a copper foil for a microcircuit board according to the present invent...  
WO/2018/004151A1
The present invention relates to a surface-treated copper foil for a microcircuit board and a method for manufacturing the same and, more specifically, to a surface-treated copper foil for a microcircuit board and a method for manufactur...  
WO/2017/219797A1
The present invention relates to an electric copper plating liquid and an electric copper plating process thereof. The electric copper plating liquid comprises the following components: 20g/L to 240g/L of copper sulfate pentahydrate, 20 ...  
WO/2017/217387A1
According to the present invention, an electrodeposition article is formed with use of a tin or tin alloy plating bath which contains a predetermined branched polyoxyalkylene compound such as an alkylene oxide addition product of an alip...  
WO/2017/217234A1
[Problem] To provide a copper plating bath which contains a reduced amount of chlorine, considered to be attributable to wiring resistance, or is free of chlorine, without the need to highly purify copper sulfate. The copper plating bath...  
WO/2017/213353A1
A method for creating a hologram pattern, and a test specimen comprising a metal-plated layer having a hologram pattern on the surface thereof, according to the present invention, can have a hologram pattern formed on a metal-plated laye...  
WO/2017/210728A1
A method for preparing a palladium-gold alloy layer on a substrate by electrodepositing said coating surface with an aqueous electroplating solution comprising of an aqueous solution of a soluble palladium compound and a soluble gold com...  
WO/2017/201640A1
The present invention relates to the technical field of surface treatment of rollers. Disclosed is a method for electroplating a release liner roller. The method comprises the following processes: a pre-electroplating treatment process a...  
WO/2017/205473A1
A ternary zinc-nickel-iron alloy and aqueous alkaline electrolyte for electroplating the alloy includes zinc, nickel, and a complex of an iron salt.  
WO/2017/198722A1
The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating proce...  
WO/2017/199564A1
An aluminum alloy comprising 0.010 mass% to 8.0 mass% of at least one kind of additional element selected from a group consisting of Zr, Cu, Cr and Zn and comprising 0.01 mass% to 10.0 mass% of C.  
WO/2017/199835A1
The present invention addresses the problem of providing: an electrolytic nickel (alloy) plating solution which is able to fill micro holes or micro recesses 14 within an electronic circuit component with nickel or nickel alloy 18 withou...  
WO/2017/195191A1
This invention is related to a method for the preparation of halide perovskite or perovskite-related materials on a substrate and to optoelectronic devices and photovoltaic cells comprising the perovskites prepared by the methods of this...  
WO/2017/196069A1
The present invention relates to a microstructure and a manufacturing method therefor, the method comprising the steps of: (a) forming a water-soluble microstructure core on a substrate; and (b) forming a waterproof thin film on the wate...  
WO/2017/191240A1
The invention relates to a coating for metal surfaces of functional parts made of metal, preferably baking trays, and a method for producing a coating of this type, wherein at least one coating (2) with an alloy is galvanically applied t...  
WO/2017/192223A1
An article comprises a substrate, a coating disposed on a surface of the substrate. The coating comprises a carbon composite dispersed in one or more of the following: a polymer matrix; a metallic matrix; or a ceramic matrix. The carbon ...  
WO/2017/188601A1
The present invention relates to electrolytic copper foil for graphene and a method for producing the former, more specifically to electrolytic copper foil, for graphene, facilitating graphene synthesis due to the addition of nickel duri...  
WO/2017/188600A1
The present invention relates to electrolytic copper foil for graphene and a method for producing the former, more specifically to electrolytic copper foil for graphene capable of facilitating graphene formation due to prevention of surf...  
WO/2017/186917A1
The present invention provides magnetic and electrocatalytic, pseudo-ordered mesoporous alloy films as well as their use. Two different types of mesoporous alloy films have been provided by the invention: (1) non-noble metal + noble meta...  
WO/2017/182123A1
The invention relates to a method for coating an object (1), wherein a surface (3) of the object (1) is at least partially coated with a coating (4) which has a plurality of layers (5, 6, 7, 8, 9), wherein at least one layer (5, 6, 7, 8,...  
WO/2017/184380A1
An aqueous trivalent chromium electrolyte comprising trivalent chromium ions and amino acids that allow for producing a dark colored hue in the trivalent chromium coating which is plated on a substrate. The amino acids described herein c...  
WO/2017/182957A1
A phosphorus-cobalt-nickel alloy is described, and the use thereof in plating processes of non-precious metal objects with precious metals; said plating processes and the objects thus obtained are also described.  
WO/2017/175880A1
The present invention relates to a device for selectively plating only a part corresponding to a terminal part of a bus bar for connecting a plurality of cells arranged in a row in a secondary battery, wherein a first compartment of a pl...  
WO/2017/175428A1
The purpose of the present invention is to provide a hard gold plating solution by which deposition of gold at unwanted locations can be reliably suppressed. Provided is a hard gold plating solution which is for electroplating and which ...  
WO/2017/159324A1
Provided is a conductive material having a titanium film with an average film thickness of 1-300 µm on a surface of a substrate where at least the surface is conductive.  
WO/2017/159965A1
An organic additive for electrolytic copper plating according to one aspect of the present invention is added to a copper plating solution for forming a copper film on a substrate with a pattern formed thereon, in an electrolytic plating...  
WO/2017/153590A1
In order to provide a more reliable and cost-efficient way of producing lead-frames or lead- frames structures which expose treated silver surfaces as well as to provide surface mount electronic devices using such lead-frames or lead-fra...  
WO/2017/155711A1
The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide ont...  
WO/2017/155469A1
The present invention relate to a leadframe or flexible printed circuit (FPC) and a method of manufacturing a leadframe or FPC having a GAM value of greater than 2.0. The method comprises subjecting an electrolytically cleaned leadframe ...  
WO/2017/146465A1
Disclosed is a method for producing a catheter electrode, the method, which is a method for producing a catheter electrode by means of electroplating, comprising the steps of: attaching a wire part to an electroplating member, at least a...  
WO/2017/142208A1
The present invention relates to a concentration indicator of a metal component contained in a plating solution and a plating method using the same and, more specifically, as the concentration of a plating metal component to be plated is...  
WO/2017/142513A1
The disclosure relates to a method for the electrodeposition of at least one metal onto a surface of a conductive substrate. In some embodiments, the electrodeposition is conducted at a temperature from about 10°C to about 70°C, about ...  
WO/2017/139087A1
An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comp...  
WO/2017/133758A1
A metal lead frame (100) for an optoelectronic device (150) comprising three metal layers is disclosed. A first metal layer (110) comprises copper, a second metal layer (120) adjacent to the first metal layer comprises nickel and a third...  
WO/2017/130869A1
Provided is a blackening plating solution containing nickel ions, zinc ions, copper ions, amidosulfuric acid, and ammonia, wherein the concentration of the zinc ions is 0.34 g/l or more and the concentration of the copper ions is 0.20 g/...  
WO/2017/129583A1
An aqueous indium or indium alloy plating bath comprising - a source of indium ions, - an acid, - a source of halide ions, - a surfactant according to formula (I) wherein A is selected from branched or unbranched C10-C15-alkyl; B is sele...  
WO/2017/130865A1
Provided is a blackening plating solution containing nickel ions, copper ions, and a pH adjusting agent, wherein the pH adjusting agent is an alkali metal hydroxide.  
WO/2017/130866A1
Provided is a blackening plating solution containing nickel ions and copper ions, and having a pH value of 4.0-5.8, inclusive.  
WO/2017/132507A1
Embodiments of the present disclosure provide for methods of depositing material onto a substrate, systems for controlling the deposition of material onto a substrate, and the like.  
WO/2017/125330A1
The invention relates to, inter alia, a multi-layer system, particularly for an electrical contact element. The aim of the invention is to improve the friction corrosion resistance in a cost-effective way. To this end, the multi-layer sy...  
WO/2017/121591A1
The invention relates to magnesium (Mg) coordination compounds for use in an electrolyte for an electrochemical cell, in particular for use in magnesium batteries, and an electrolyte for an electrochemical cell comprising MG coordination...  
WO/2017/123034A1
Disclosed are a copper foil capable of securing a secondary battery having a high capacity retention rate, a method for manufacturing the same, an electrode comprising the same, and a secondary battery comprising the same. In the present...  
WO/2017/115701A1
This SnAg alloy plating liquid comprising a water-soluble tin compound and a water-soluble silver compound is characterized in comprising a specific sulfide compound in the range of 0.25 moles to 10 moles per 1 mole of silver in the wate...  
WO/2017/113439A1
Provided are a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive enables to electroplate holes on a substrate with good height uniformity within a feature and among features at...  
WO/2017/109834A1
Provided are: a chromium plating solution and electroplating method which allow for a plating process in which an increase in hexavalent chromium concentration at an anode is inhibited, and good chromium plating can be performed over a l...  
WO/2017/111434A1
The present invention relates to a Fe-Ni-P alloy multi-layer steel sheet and a manufacturing method therefor. An embodiment of the present invention provides a Fe-Ni alloy multi-layer steel sheet comprising: a Fe-Ni alloy layer comprisin...  
WO/2017/111455A1
The present invention relates to a zinc-based plated steel sheet having a post-treated coating formed thereon comprising: a steel sheet; a zinc plated layer formed on the steel sheet; and a post-treated coating formed on the plated layer...  
WO/2017/105160A3
The present invention relates to a composition for washing a pickled steel plate, a method for washing a pickled steel plate by using the same, and a steel plate obtained thereby and, more specifically, to a composition for washing a pic...  

Matches 1 - 50 out of 12,431