| Document |
Document Title |
|
WO/2023/232420A1 |
The present invention relates to a module kit for a chemical and/or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for a chemical and/or electrolytic surface treatment of substra...
|
|
WO/2023/234564A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively deposit metal raw materials on a substrate using electrochemical additive manufacturing (ECAM). In additio...
|
|
WO/2023/234565A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively build up layers of metal materials on a substrate by using electrochemical additive manufacturing (ECAM). ...
|
|
WO/2023/225279A1 |
Systems and methods for beneficially affecting the surface morphology of electrically conductive materials using electrochemistry are described. The systems and methods for beneficially affecting the surface morphology of electrically co...
|
|
WO/2023/223685A1 |
The present invention addresses the problem of providing a plating film manufacturing method that can provide excellent corrosion resistance to a plated product having a trivalent chromium plating film formed thereon, and that can form a...
|
|
WO/2023/225072A1 |
Described herein are systems, methods, and apparatus related to flow-assisted batteries. In one aspect, a battery includes an electrode, a cathode, and an electrolyte. The electrode comprises an electrically conductive material and serve...
|
|
WO/2023/219264A1 |
A method for manufacturing an electrolytic copper foil, according to one embodiment of the present invention, comprises the steps of: dissolving copper (Cu) and nickel (Ni) in sulfuric acid to prepare an electrolytic solution containing ...
|
|
WO/2023/217917A1 |
The present invention belongs to the field of catalytic chemistry, and more specifically to catalysed reduction chemical reactions, preferably of CO2 into small molecules. The present invention relates to a new catalyst compound comprisi...
|
|
WO/2023/219269A1 |
A method for controlling the properties of an electrolytic copper foil, according to one embodiment of the present invention, adds a glossiness control agent so as to adjust the glossiness of an electrolytic copper foil, and thus control...
|
|
WO/2023/214401A1 |
The present disclosure provides a catalyst, its preparation and uses thereof, the catalyst comprising a conductive substrate coated by at least two layers including a proximal layer and a distal layer wherein said proximal layer comprise...
|
|
WO/2023/214491A1 |
Provided is a convenient method for manufacturing electronic components with different base materials. This method for manufacturing an electronic component includes a preparation step, a plasma treatment step, a deposition step, and an ...
|
|
WO/2023/214366A1 |
The present invention relates to a method of removing and safe disposal of electrolyte from all types of spent lithium ion batteries in a commercially feasible manner. Electrolyte, lithium hexafluorophosphate (LiPF6) is highly soluble in...
|
|
WO/2023/210832A1 |
[Problem] Provided is a nickel-plated steel sheet in which a plating layer has adhesiveness to a substrate, which has adhesiveness to other members, and the total thickness of which, including the thickness of a roughened layer, is reduc...
|
|
WO/2023/210822A1 |
[Problem] The present invention addresses the problem of: suppressing the occurrence of a crack even in a state where a rolled surface-treated steel sheet is stretched, while maintaining the hardness of the surface of the rolled surface-...
|
|
WO/2023/210821A1 |
[Problem] To provide a surface-treated metal foil having a high yield strength and fatigue strength. [Solution] Provided is a surface-treated metal foil characterized by having a steel sheet and an iron-nickel alloy layer formed on at le...
|
|
WO/2023/201600A1 |
The present application provides a preparation method for an FeCoNiCuZn high entropy alloy and a FeCoNiCuZn high entropy alloy. In the method, an electroplating solution is electroplated by using electrodeposition to obtain the FeCoNiCuZ...
|
|
WO/2023/202267A1 |
The present application discloses a multi-metal compounding method for a polymeric fiber material and a multi-metal composite fiber. The method comprises: etching a polymeric fiber in an etching solution containing an oxidizing acid and ...
|
|
WO/2023/196489A1 |
Disclosed are novel electrolytes based on liquefied gas and high concentration of salt in liquefied gas electrolytes. Unlike common electrolytes, liquefied gas electrolytes utilize solvents which are gaseous under standard conditions. Th...
|
|
WO/2023/195251A1 |
The present invention provides a surface-treated steel sheet which can be produced without using hexavalent chromium, and which exhibits excellent film corrosion resistance, coating corrosion resistance, film wet adhesion, coating materi...
|
|
WO/2022/245576A9 |
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive c...
|
|
WO/2023/195252A1 |
The present invention provides a surface-treated steel sheet that can be produced without the use of hexavalent chromium and that has both excellent adhesiveness to a BPA-free coating material and BPA-free coating corrosion resistance. P...
|
|
WO/2023/195267A1 |
The present invention provides: a lead frame material which has improved resin adhesion in a high-temperature high-humidity environment, while being capable of preventing fall-off of particles during processing; and the like. A lead fr...
|
|
WO/2023/189566A1 |
Provided is a metal foil with a carrier that makes it possible to suppress the occurrence of breakage or cracking of the metal foil during handling. This metal foil with a carrier comprises a carrier, a release layer, and a metal foil in...
|
|
WO/2023/188637A1 |
The present invention provides: a silver-plated material wherein a silver plating film is not easily separated from a base plating film and exhibits excellent adhesion in a high-temperature high-humidity environment in cases where the si...
|
|
WO/2023/189537A1 |
The present invention provides a method for producing a trivalent chromium plated component (100) that is obtained by forming a trivalent chromium plating film (3) on a sliding component of a device in which a fluid is sealed, the method...
|
|
WO/2023/185350A1 |
The present application relates to the field of solar cells, and provides a method for forming a gate line electrode of a photovoltaic device and the photovoltaic device. The method for forming the gate line electrode of the photovoltaic...
|
|
WO/2023/190860A1 |
This surface-treated copper foil has one surface (A) and the other surface (B), wherein the surface (A) satisfies the following requirements (I) and (II). • Requirement (I): on the surface of the surface-treated copper foil, the mirr...
|
|
WO/2023/188446A1 |
[Problem] To provide a silver-plated material that not only has excellent wear resistance but can also keep the peeling resistance of a silver coating layer high, even when exposed to high-temperature/high-humidity environments. [Solutio...
|
|
WO/2023/190833A1 |
Provided is a surface-treated copper foil in which circuit workability is excellent and transmission loss and generation of foreign matter are less likely to occur. When the optical roughness of the surface (20a) of a surface treatment l...
|
|
WO/2023/189565A1 |
Provided is a carrier-attached metal foil in which the occurrence of fractures or cracks in the metal foil during handling thereof can be suppressed. The carrier-attached metal foil comprises a carrier, a release layer, and a metal foil ...
|
|
WO/2023/185546A1 |
Disclosed in the present invention is an electroplating apparatus, comprising: a film frame, the center of which is provided with a through hole; a conveying branch pipe extending from a side wall of the film frame through hole to the ed...
|
|
WO/2023/189419A1 |
This electrical contact material comprises: a conductive substrate; and a silver-containing layer which contains silver and is provided on at least a part of the surface of the conductive substrate, wherein the average CI value of the si...
|
|
WO/2023/189418A1 |
This electric contact material comprises an electroconductive substrate and a silver-containing layer that contains silver and is disposed at least on a portion of the surface of the electroconductive layer. In a cross section of the ele...
|
|
WO/2023/190805A1 |
The purpose of the present invention is to provide: a novel copper plating solution for PR pulse electrolysis; and a novel copper plating method by means of PR pulse electrolysis. The present invention provides a copper plating solution ...
|
|
WO/2023/189417A1 |
An electric contact material comprising: a conductive base material; and a silver-containing layer that contains silver and that is provided to at least a portion of the surface of the conductive base material, wherein, in a cross sectio...
|
|
WO/2023/190845A1 |
Provided are a copper foil having high adhesion to a coating film, and a light-shielding material having, in addition to excellent light shielding properties, high adhesion to a black coating film and a substrate. A copper foil (1) has, ...
|
|
WO/2023/179704A1 |
Provided are a copper plating additive composition, a copper plating solution, and a copper brush plating method using the same. The copper plating additive composition includes 1, 4-cyclohexanedione monoethylene acetal, potassium phthal...
|
|
WO/2023/183158A1 |
Methods and apparatus for electroplating a substrate incorporate aspects of digital lithography and feedback from electroplating processes to improve characteristics of plating material based on die patterns. In some embodiments, a metho...
|
|
WO/2023/181627A1 |
This structural body comprises a base material and a plating layer disposed on the base material, the plating layer having a porous structure on a surface thereof on the opposite side to the base material, the structural body satisfying ...
|
|
WO/2023/182177A1 |
The present invention provides a roughened copper foil which can have both high adhesion to a thermoplastic resin and excellent high-frequency characteristics at the same time. This roughened copper foil has a roughened surface on at lea...
|
|
WO/2023/182178A1 |
Provided is a roughened copper foil capable of achieving both high adhesiveness to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. The ...
|
|
WO/2023/178825A1 |
The present invention relates to a copper brush plating process for a plastic film. The process comprises: performing first copper plating treatment on a plastic film by using a physical vapor deposition method, so as to prepare a first ...
|
|
WO/2023/182176A1 |
Provided is a roughened copper foil capable of achieving both high adhesion to a thermoplastic resin and excellent high-frequency characteristics. The roughened copper foil has at least one roughened surface. The roughened surface has a ...
|
|
WO/2023/182179A1 |
Provided is a roughened copper foil capable of exhibiting both good adhesion to a thermoplastic resin and superior high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. The roughe...
|
|
WO/2023/182174A1 |
Provided is a roughened copper foil capable of achieving both high adhesion to a thermoplastic resin and excellent high-frequency characteristics. The roughened copper foil has at least one roughened surface. Provided is a roughened copp...
|
|
WO/2023/182259A1 |
Provided are: a terminal material configured to effectively reduce the surface friction from the perspective of a Cu-Sn alloy and Sn distributions within a coating layer containing the Cu-Sn alloy and Sn; and an electrical connection ter...
|
|
WO/2023/182175A1 |
Provided is a roughened copper foil capable of achieving both high adhesiveness to thermoplastic resins and excellent high-frequency characteristics. This roughened copper foil has a roughened surface on at least one side thereof. The ro...
|
|
WO/2023/179748A1 |
Disclosed are a cell electroplating method and apparatus, wherein: a flexible conductive piece is attached to a mask opening on a cell surface to be electroplated, so that the conductive piece forms a direct or indirect electrical connec...
|
|
WO/2023/175191A1 |
The invention relates to a method for producing a housing (1) for a sanitary fitting, having at least the following steps: a) producing the fitting housing (1) in an injection molding tool, a brush structure (3) being formed at least par...
|
|
WO/2023/174781A1 |
The invention relates to a multi-layer body, comprising (I) a carrier layer made of a special thermoplastic polycarbonate molding compound and (II) a metal layer which has one or more recesses. The invention also relates to a lighting or...
|
