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WO/2023/083679A1 |
The invention relates to a method for producing a steel sheet for packages, comprising a two-layer recrystallization structure. The method has the following steps: • providing a cold-rolled steel sheet made of a steel with a carbon con...
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WO/2023/080675A1 |
A method for manufacturing a metal separator for a vehicle fuel cell according to an aspect of the present invention comprises the steps of: preparing a matrix; applying a platinum (Pt)-containing coating agent and an electrolyte to the ...
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WO/2023/080250A1 |
This acidic electrolytic copper plating liquid contains: a soluble copper salt; a specific azole compound that is a copper ion electrodeposition inhibitor and that has two or three nitrogen atoms in a five-membered ring; an acid; and wat...
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WO/2023/075196A1 |
Disclosed is an electrolytic copper foil for a current collector of a secondary battery. The present invention provides an electrolytic copper foil characterized in that the thickness ratio elongation at room temperature is 1.3 to 2.0 %/...
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WO/2023/074223A1 |
A copper-plated membrane having coarsened crystals can be obtained by a simple operation, by using a method for coarsening copper crystal grains in an object to be plated, said method being characterized by including: a step (a) in which...
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WO/2023/075197A1 |
An electrolytic copper foil for a secondary battery current collector is disclosed. The present invention relates to an electrolytic copper foil having a thickness elongation at room temperature of 1.3-2.0 %/μm and, in the XRD spectrum ...
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WO/2023/072902A1 |
The invention relates to a method of producing a steel wire for use in the reinforcement of rubber articles, the method comprising at least one step of electro-polishing a metal wire of diameter d1 by passing it continuously through a ba...
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WO/2023/073209A1 |
A method of manufacturing a component carrier (100), wherein the method comprises stamping a surface profile in a design layer (102), forming an electrically conductive seed layer (118) on the stamped design layer (102), forming a patter...
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WO/2023/060773A1 |
The present application relates to the technical field of circuit boards. Specifically disclosed are an electroplating method for a circuit board, and a circuit board. The electroplating method for a circuit board comprises: subjecting a...
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WO/2023/062778A1 |
Proposed is a pre-wet treatment method whereby a pre-wet treatment can be applied to a substrate effectively without affecting through-put. Also proposed is a pre-wet treatment method for subjecting a substrate to a pre-wet treatment t...
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WO/2023/061395A1 |
Disclosed is a tin-electroplated steel plate, comprising a tin-plated steel plate and a passivation film. The tin-plated steel plate comprises a steel substrate and a tin plating; the tin plating covers the surface of the steel substrate...
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WO/2023/057594A1 |
The present invention relates in particular to a threaded end 1, 2 of a tubular component for drilling and/or exploiting a hydrocarbon well, transporting oil and gas, transporting or storing hydrogen, carbon capture or geothermy, compris...
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WO/2023/051756A1 |
Disclosed in the present application are a polymer, a leveler and a preparation method therefor, an electroplating solution, and an electroplating method, belonging to the technical field of electroplating. The polymer comprises multiple...
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WO/2023/050980A1 |
The present invention relates to the field of electroplating gold on nickel plating, and disclosed are a plating solution for electroplating gold on nickel plating, a method for electroplating gold on nickel plating, and a gold-plated ar...
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WO/2023/054398A1 |
Provided is a roughened copper foil with which it is possible to obtain excellent transmission characteristics when used in a copper-clad laminate or a printed wiring board. This roughened copper foil has a roughened surface on at least ...
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WO/2023/052452A1 |
The invention relates to a piston ring for internal combustion engines, having a surface, comprising a wear protection layer made of iron or iron alloy applied onto the surface, wherein the wear protection layer has cracks, said cracks h...
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WO/2023/047854A1 |
Provided is a wire comprising a core wire and a coating layer position positioned at the outer circumference of the core wire, wherein: the core wire is substantially constituted by aluminum or an aluminum alloy; the coating layer is sub...
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WO/2023/041711A1 |
The present invention relates to a method for depositing a chromium layer on a surface. The present invention relates in particular to a method for depositing a chromium layer on a surface of a round-shaped substrate, the method comprisi...
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WO/2023/042867A1 |
Provided are: a rubber composite material which comprises a vulcanized rubber, a steel wire, a coating film layer that comes into contact with the steel wire and has a Zn mass ratio of more than 65 and up to 90 wherein the total mass of ...
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WO/2023/043216A1 |
The present invention relates to a high-strength steel sheet having excellent surface quality due to improved coatability thereof and a method for manufacturing same.
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WO/2023/040465A1 |
Disclosed is an electroplating apparatus, comprising a process chamber, a paddle board and a driving mechanism. The driving mechanism is used to drive the paddle board to move back and forth, so that the paddle board stirs an electroplat...
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WO/2023/040116A1 |
A circuit board processing method and a circuit board. The circuit board processing method comprises: performing preliminary processing on a circuit board to be processed; and electroplating said circuit board subjected to the preliminar...
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WO/2023/041670A1 |
The invention relates to a chromium coating further comprising indium, bismuth or antimony.
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WO/2023/035661A1 |
The present application provides an electrolytic copper foil and a preparation method therefor, a negative electrode plate, a secondary battery, a battery module, a battery pack, and an electric device. The method for preparing the elect...
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WO/2023/033038A1 |
A terminal material that has a plating film and that can be used as a terminal for electrical connection or as a contact element for a connector, the terminal material comprising: a base material made of copper or a copper alloy; and a p...
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WO/2023/029908A1 |
The present application discloses a composite copper foil structure, a preparation method therefor, a copper clad laminate, and a printed circuit board. The composite copper foil structure comprises a copper foil core layer and a shell l...
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WO/2023/033118A1 |
Provided is a surface-treated metal sheet for a battery. This surface-treated metal sheet for a battery is characterized in that the base material of the surface-treated metal sheet for a battery is an iron-based or nickel-based metal sh...
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WO/2023/028015A1 |
Exemplary methods of electroplating include contacting a patterned substrate with a plating bath in an electroplating chamber, where the pattern substrate includes at least one opening having a bottom surface and one or more sidewall sur...
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WO/2023/028090A1 |
Exemplary methods of electroplating may include providing a patterned substrate having at least one opening, where the opening includes one or more sidewalls and a bottom surface. The methods may also include plating a first portion of r...
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WO/2023/020300A1 |
Disclosed in the present invention are a method and a device for preparing a gradient plating by means of laser-assisted electrodeposition. The method comprises: subjecting a workpiece substrate to electrodeposition by means of a pulse l...
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WO/2023/015602A1 |
An in-situ synthesis method for a Ni-W-WC composite plating, the method comprising the following steps: immersing a carbon steel substrate to be plated into an electroplating solution for electroplating so as to obtain a Ni-W-C alloy pla...
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WO/2023/014524A1 |
A copper electrolyte comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electrolyte is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. T...
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WO/2023/013987A1 |
The present invention relates to a leveling agent and an electroplating composition including the same, and when a via hole of a glass substrate is plated with the electroplating composition according to the present invention, the inside...
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WO/2023/013054A1 |
A production method for a fastener chain (1) or fastener stringers (2a, 2b) comprising: a step for applying a voltage between at least one anode (20) and at least one cathode (10) at least partially immersed in an electrolyte solution in...
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WO/2023/008958A1 |
The present invention relates to a leveling agent and an electroplating composition comprising same, wherein when a via hole in a substrate is filled with the electroplating composition according to the present invention, the via hole ca...
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WO/2023/008963A1 |
The present invention relates to a leveling agent and an electroplating composition comprising same. When a via hole of a substrate is filled with the electroplating composition according to the present invention, the via hole can be fil...
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WO/2023/001696A1 |
The invention relates to a composite material having a chromium-containing top layer, comprising an adhesion-promoting layer located on a substrate and a chromium-containing top layer located on the adhesion-promoting layer, wherein: - t...
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WO/2023/286697A1 |
The present invention provides: a lead frame material which exhibits excellent adhesion to a resin even in the cases where the lead frame material is used in a high-temperature high-humidity environment for a long period of time, and whi...
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WO/2023/286604A1 |
According to the present invention, a control unit outputs control signals so as to control a plating-solution supply unit and an energizing unit and thus perform a first electrolytic plating treatment by electrifying a treatment surface...
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WO/2023/284918A2 |
The present invention relates to methods (100, 200) and devices (1, 1a) for enriching a substrate (2) with an alkali metal (3), in particular lithium, and to the use of a substrate (2) enriched in this way as an electrode in a battery, a...
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WO/2023/284431A1 |
The present invention relates to the field of special processing. Disclosed are a method and apparatus for implementing localized electrodeposition induced by using laser irradiation on the back of a thin-walled part. In the method, a pa...
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WO/2023/286692A1 |
According to the present invention, a protective film (50) is formed so as to cover a part of a surface electrode (40) and to extend beyond the surface electrode toward the outer edge of a semiconductor substrate (10); and the protective...
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WO/2023/281759A1 |
This surface-treated copper foil has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sku of 2.50-4.50 and an Str of 0.20-0.40.
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WO/2023/280263A1 |
Disclosed are a near-perfect light absorber and a universal preparation method therefor. The light absorber consists of a polymer film and a light dissipation layer; the polymer film and the light dissipation layer both have conical stru...
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WO/2023/281778A1 |
This surface-treated copper foil comprises a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The amount of change in Sk given by formula (1) for the surface-treatment layer is 0.180-0.600 µm....
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WO/2023/282386A1 |
A strain measuring sensor according to the present invention may comprise: a substrate layer formed of a flexible material; and a conductive thin-film layer provided on a surface of the substrate layer and having at least any one pattern...
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WO/2023/281777A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sk rate of change, represented by formula (1) below, of 23....
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WO/2023/281776A1 |
A surface-treated copper foil that has a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The amount of Vmp change, represented by formula (1), in the surface-treatment layer is 0.0010–0.0110...
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WO/2023/281775A1 |
This surface-treated copper foil has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Spk change amount represented by formula (1) below of 0.02 to 0.24 µm. ...
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WO/2023/281774A1 |
The present invention provides a surface-treated copper foil which comprises a copper foil and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has a change ratio of Vmc of ...
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