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Matches 1 - 50 out of 24,132

Document Document Title
WO/2018/225957A1
The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has an excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of ...  
WO/2018/225739A1
Provided are: a steel sheet for cans which exhibits excellent weldability; and a production method therefore. This steel sheet for cans has, provided to the surface of a steel sheet in order from the steel sheet side, a chromium metal la...  
WO/2018/226988A1
Features such as bumps, pillars and/or vias can be plated best using current with either a square wave or square wave with open circuit wave form. Using the square wave or square wave with open circuit wave forms of plating current, prod...  
WO/2018/225726A1
Provided are: a steel sheet for cans which exhibits excellent weldability; and a production method therefor. This steel sheet for cans has, provided to the surface of a steel sheet in order from the steel sheet side, a chromium metal lay...  
WO/2018/221089A1
The purpose of the present invention is to provide: a PCB terminal that has excellent abrasion resistance properties, electrical conductivity, slidability, and low frictional properties, and that enables reduction in the usage amount of ...  
WO/2018/220567A1
A coated metallic substrate and fabrication method The present invention relates to a coated metallic substrate comprising, at least; one layer of oxides, such layer being directly topped by an intermediate coating layer comprising Fe, N...  
WO/2018/221087A1
The present invention provides a PCB terminal that has excellent abrasion resistance properties, electrical conductivity, slidability, and low frictional properties and that enables reduction in the amount of gold used, which is expensiv...  
WO/2018/220411A1
The present invention relates to a coated metallic substrate comprising, at least; one layer of oxides, such layer being directly topped by an intermediate coating layer comprising Fe, Ni, Cr and Ti wherein the amount of Ti is above or e...  
WO/2018/216497A1
The present invention provides a threaded joint for pipes that has excellent misalignment resistance, high torque-on-shoulder resistance, and excellent corrosion resistance, and a method for producing the same. This threaded joint for pi...  
WO/2018/217701A1
A method for cleaning a surface of an aluminum or aluminum alloy body by immersing the surface in a basic aqueous electrolyte formed essentially from dissolved trisodium phosphate, flowing DC current through the electrolyte and the body ...  
WO/2018/216319A1
Provided is a method for producing a titanium-plated member, the method comprising: a step for preparing a substrate having a conductive surface; a step for immersing the substrate in a molten salt titanium-plating solution composition c...  
WO/2018/215057A1
The present invention relates to a method for production of a noble metal salt preparation, the noble metal salt preparation comprising at least one noble metal sulfonate and thiourea and the use for surface coating by electroplating or ...  
WO/2018/211951A1
Provided is a low-roughness roughened copper foil which is suitable for formation of a thin wire circuit, and which, when used in a SAP method, can impart, to a laminate, a surface profile that is excellent not only in etching property r...  
WO/2018/212174A1
Provided is a tin-plated copper terminal material having: a substrate of copper or copper alloy; an intermediate zinc layer of zinc alloy that is formed on top of the substrate and has a thickness of 0.10 μm to 5.00 μm; and a tin layer...  
WO/2018/211740A1
Provided is an aluminum plating film which consists chiefly of aluminum and which has, between coated surfaces at both ends in the thickness direction thereof, an interposition layer containing a metal that has a lower ionization tendenc...  
WO/2018/207786A1
An electrolytic copper foil having a glossy surface and a deposition surface. This electrolytic copper foil has a roughened layer on the glossy surface side thereof. The root mean square height Sq of the glossy surface is no more than 0....  
WO/2018/207788A1
An electrolytic copper foil having a surface treatment layer on the glossy surface side thereof. In this electrolytic copper foil, the root mean square height Sq of the surface of the surface treatment layer is no more than 0.550 µm and...  
WO/2018/207785A1
An electrolytic copper foil having a surface treatment layer on the glossy surface side thereof. In this electrolytic copper foil, the root mean square height Sq of the surface of the surface treatment layer is no more than 0.550 µm and...  
WO/2018/205307A1
The present invention provides a refractory metal or stainless steel having an electroplated layer on the surface thereof, comprising a substrate, and an electroplated layer formed on the surface of the substrate. The substrate comprises...  
WO/2018/203126A1
The present invention relates a method for the manufacture of a galvannealed steel sheet.  
WO/2018/203097A1
The present invention relates a method for the manufacture of a galvannealed steel sheet.  
WO/2018/198065A1
The present invention relates to a method for depositing a coating (1) of an item including a substrate (5) and, specifically, to a method for hardening a layer of gold forming a coating on the substrate, the method comprising the steps ...  
WO/2018/200990A1
Disclosed herein are articles having an edge that is partially, or entirely sealed with one or more coatings including a polymeric material. The article may include a coating selected so that one surface (e.g., a face surface) has a desi...  
WO/2018/199610A1
The present invention relates to a porous acupuncture needle and a manufacturing method therefor and, more specifically, to: a porous acupuncture needle plated with porous needle-integrated noble metal nanoparticles, obtained by manufact...  
WO/2018/198905A1
The purpose of the present invention is to eliminate adhesion defects caused by press joining of a copper foil with a resin, the copper foil subjected to a silane coupling treatment with an olefin-based silane coupling agent on a roughen...  
WO/2018/190202A1
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material (5) includes: a substrate (51) that includes one or mo...  
WO/2018/189901A1
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material 5 includes: a substrate 51 that includes one or more s...  
WO/2018/189916A1
This electroplating method includes: a stirring step in which a group of substrates (51) that have settled in an electrolytic solution in an electroplating tank (10) are made to flow in a circumferential direction along an inner wall (19...  
WO/2018/190839A1
The present subject matter relates to treating alloy substrates having oxidized layers. An anodized alloy substrate is contacted with an alkaline mixture including titanium to form a processed substrate. The anodized alloy substrate incl...  
WO/2018/190804A1
The present subject matter relates to polymer coating of a metal alloy substrate. The metal alloy substrate has an electrolytically deposited nano-ion polymer layer thereon. The nano-ion polymer layer is of a polyacrylic material or an e...  
WO/2018/185154A1
The present invention relates to a method for electrolytically depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps (a) providing an aqueous deposition bath with a pH in the range from ...  
WO/2018/180507A1
The present invention provides: a traverse coil of a copper or copper-alloy sheet that is unlikely to produce metallic powder as a result of friction with a tension pad; and a production method therefor. This copper or copper-alloy sheet...  
WO/2018/178390A1
The present invention relates to a method for increasing the corrosion resistance of a chrome‐plated substrate wherein at least one part of a chrome‐plated surface of a chrome-plated substrate is dipped into an electrolyte comprising...  
WO/2018/181399A1
This plated wire rod material (10) is provided with: a base material (1) that is formed of aluminum or an aluminum alloy; and a surface treatment film (2) that covers the base material (1) and comprises one or more metal layers. Among th...  
WO/2018/178022A1
The invention relates to a method for producing electrically conductive structures, preferably conducting track structures, by means of laser light on a non-conductive carrier material (LDS method), characterized in that a non-conductive...  
WO/2018/181950A1
Provided is a surface-treated metal plate provided with a metal plate and a nickel-cobalt binary alloy layer formed on the metal plate, wherein the nickel-cobalt binary alloy layer is provided with an oxide coating film having a thicknes...  
WO/2018/180868A1
In one aspect of this manufacturing method for an electronic component, a first metal layer is formed on a substrate, a second metal layer is formed on the first metal layer, a mask made of an organic resin layer is formed on the second ...  
WO/2018/179904A1
To provide a metalized film with which it is possible to form a flat and smooth thin copper film on a flat and smooth fluorine resin using a physical vapor deposition method and to ensure adhesion strength between the fluorine resin and ...  
WO/2018/181926A1
Provided is a metal oxide film-including alloy member with which it is possible to form a film with a simple method at low cost, and with which it is possible to suppress the volatilization of Cr, which causes degradation in fuel cells, ...  
WO/2018/181726A1
This surface-treated copper foil (11) has, at least on one surface of a copper foil substrate, a surface-treatment film including at least a roughened surface on which roughening particles (111) are formed. When a cross-section of the su...  
WO/2018/175975A1
Described herein are coated lift plungers, which have improved hardness, durability, and corrosion resistance, as well as methods of making, reworking, and using the same.  
WO/2018/171513A1
Disclosed are a barrel plating barrel, a barrel plating apparatus, a barrel plating system, and a barrel plating production line. Insofar as the barrel plating barrel is in a material-discharging state, workpieces being plated are paddle...  
WO/2018/173995A1
In order to provide a composite chrome plating film having excellent wear resistance and little aggression toward a mating material (sliding member), and a piston ring having the film, the present invention is configured so that hard par...  
WO/2018/166047A1
A method for electroplating a contact strip (100). The method comprises the following steps: dividing a contact strip (100) into a waste material region (A), a contact region (B), and a non-contact region (C) sequentially distributed fro...  
WO/2018/169250A1
A metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate having a thickness of 30µm or less and containing an alloy of nickel (Ni) and iron (Fe), and comprises: a first outer porti...  
WO/2018/168129A1
According to the present invention, plating is formed on one side of a negative electrode by: coating the one side of the negative electrode with a paste formed by mixing particles in a plating liquid; disposing, on one side of a positiv...  
WO/2018/169746A1
Layer-by-layer thickness control of an electroplated film can be achieved by using a cyclic deposition process. The cyclic process involves forming a layer (or partial layer) of hydrogen on a surface of the substrate, then displacing the...  
WO/2018/163541A1
The wire rod for an oblique-coil spring according to the present invention is provided with a core wire comprising steel having a pearlite structure, a copper plating layer comprising copper or a copper alloy covering the outer circumfer...  
WO/2018/165329A1
Methods and apparatus for electroplating substrates are described herein. In some cases, an ionically resistive element is positioned near the substrate, creating a cross flow manifold between the ionically resistive element and the subs...  
WO/2018/164491A1
The present invention relates to a 3D printing device using selective electrochemical deposition, which can increase the rate of 3D printing of a metal product to be laminated on a substrate, by selectively electrodepositing a metal raw ...  

Matches 1 - 50 out of 24,132