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Matches 1 - 50 out of 21,923

Document Document Title
WO/2019/212930A1
An electroplating apparatus includes an electrode at the bottom of a chamber, an ionically resistive element with through holes arranged horizontally at the top of the chamber, with a membrane in the middle. One or more panels extend ver...  
WO/2019/208522A1
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of this surface-treated copper foil 1 has an L* value of 44.0 to 84.0...  
WO/2019/208521A1
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of this surface-treated copper foil 1 has an Ni coating weight of 20 ...  
WO/2019/208525A1
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The root-mean-square slope R∆q of a roughness curve element of the first surface-treated layer 3 of t...  
WO/2019/208368A1
Provided is a surface-treated copper foil which has such fine wiring pattern processability that a fine wring pattern having an L & S value of 30/30 μm or less, for example, can be formed by a subtractive process having excellent proces...  
WO/2019/208520A1
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of this surface-treated copper foil 1 is such that an XPS depth profi...  
WO/2019/210264A1
Provided herein are apparatuses, systems, and methods for the electrodeposition of nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance, on a plurality of workpieces.  
WO/2019/201623A2
A cobalt electroplating composition comprising: (a) cobalt ions, (b) an ammonium compound of formula (NR1R2R3H+)nXn- wherein R1, R2, R3 are independently selected from H and linear or branched C1 to C6 alkyl, X is selected from an n vale...  
WO/2019/204512A1
Electroplating system seals may include an annular busbar characterized by an inner annular radius and an outer annular radius. The annular busbar may include a plurality of contact extensions. The seals may include an external seal memb...  
WO/2019/198369A1
[Problem] To provide a sliding member which is provided with an overlay that enables the achievement of good fatigue resistance, while preventing ply separation. [Solution] A sliding member which is provided with an overlay that is forme...  
WO/2019/198285A1
[Problem] To provide a sliding member equipped with an overlay such that good fatigue resistance can be achieved while preventing peeling between layers. [Solution] A sliding member is provided with an overlay formed of a Bi-Sb alloy fil...  
WO/2019/198820A1
This Ni diffusion plated steel sheet is provided with a base steel sheet and an Fe-Ni diffusion alloy plating layer which is positioned on at least one surface of the base steel sheet. The adhesion amount of Ni in the Fe-Ni diffusion all...  
WO/2019/198819A1
This Ni diffusion plated steel sheet is provided with a base steel sheet and an Fe-Ni diffusion alloy plating layer which is positioned on at least one surface of the base steel sheet. The adhesion amount of Ni in the Fe-Ni diffusion all...  
WO/2019/198337A1
[Problem] To provide a laminated electrolytic foil and a battery using the laminated electrolytic foil, said laminated electrolytic foil not only having sufficient strength to suppress the concern about breakage and tear during productio...  
WO/2019/199614A1
Void-free bottom-up fill of copper in features is achieved on non-copper liner layers. A non-copper liner layer has a higher resistivity than copper. An electroplating solution for plating copper on a non-copper liner layer includes a lo...  
WO/2019/193960A1
Provided is a plated wire rod having excellent salt water corrosion resistance, solder wettability, thermal peeling resistance, and fatigue resistance. A plated wire rod having a wire rod comprising aluminum or aluminum alloy, and a surf...  
WO/2019/190115A1
The present invention relates to an apparatus and a method for plating and, more specifically, to: an apparatus for performing uniform pattern plating on a substrate placed in a horizontal direction and a method therefor, and presents a ...  
WO/2019/185468A1
An aqueous composition comprising (a) metal ions comprising tin ions and silver ions and (b) at least one complexing agent of formula (C1) R1-X1-S-X21[D1-X22-]nS-X3-R2, (C2) R1-X1-S-X31-D2-[X32-S-]nX3-R2, (C3) R3-X1-S-X41-[D3-X42-]nS-X3-...  
WO/2019/189799A1
This tin-plated copper terminal material is obtained by laminating a nickel or nickel-alloy layer, a copper-tin alloy layer, and a tin layer, in this order, on a substrate made of copper or copper alloy, wherein: the tin layer has an ave...  
WO/2019/185357A1
A method for producing nanoporous films of semiconducting metal oxides comprising the steps of: preparing a solution containing a precursor of a semiconducting metal oxide; applying the solution on a substrate (22); forming a meniscus (2...  
WO/2019/191524A1
In one example, an electroplating system comprises a first bath reservoir, a second bath reservoir, a clamp, a first anode in the first bath reservoir, a second anode in the second bath reservoir, and a direct current power supply. The f...  
WO/2019/188712A1
Provided is a roughened copper foil having low-roughness suitable for forming a thin-wire circuit and capable, when used in an SAP method, of providing a layered body with a surface profile which allows for not only excellent etching pro...  
WO/2019/191636A1
Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing ...  
WO/2019/188837A1
Provided is a surface-treated copper foil which exhibits excellent adhesion to resin, chemical resistance, and heat resistance, is less likely to produce etching residue, and is thus capable of achieving improved reliability of adhesion ...  
WO/2019/191523A1
In one example, an electroplating system comprises a bath reservoir, a holding device, an anode, a direct current power supply, and a controller. The bath reservoir contains an electrolyte solution. The holding device holds a wafer subme...  
WO/2019/181906A1
Provided is a tin or tin-alloy plating solution containing (A) a soluble salt comprising a stannous salt, (B) an acid selected from among organic acids and inorganic acids, or a salt thereof, (C) a surfactant, (D) benzalacetone, and (E) ...  
WO/2019/179897A1
The present invention relates to a process for the fabrication of cobalt interconnections and to an electrolyte which enables the implementation thereof. The electrolyte which has a pH below 4.0 comprises cobalt ions, chloride ions and a...  
WO/2019/181088A1
In a used plating medium, a metal surface layer is dissociated from a core and dissolved with an acid to thereby give an aqueous mixed metal solution 13 containing Ni ions 9 and Sn ions 11. Then, the aqueous mixed metal solution 13 is pa...  
WO/2019/181924A1
A lead frame material of the present invention comprises an electrically conductive substrate and a roughened layer formed on at least one surface of the electrically conductive substrate. As viewed in a cross section of the lead frame m...  
WO/2019/181905A1
This tin or tin-alloy plating liquid comprises: (A) a soluble salt including at least a stannous salt; (B) an acid selected from among organic acids and inorganic aids, or a salt thereof; (C) a surfactant; (D) a leveling agent; and (E) a...  
WO/2019/181179A1
This plating treatment device forms a plating layer on the surface of an article to be plated by immersing the article to be plated in a plating liquid, the plating treatment device comprising: a plating tank for storing the plating liqu...  
WO/2019/176586A1
Provided is a current collecting member for a cylinder body plating apparatus, which is used at the base end of the spindle of a chuck cone, thereby making it possible to plate a sliding surface without oiling and to prevent efficiently ...  
WO/2019/175270A1
The present invention relates to electroplated products having a combination of layers used to provide a diffusion barrier layer under a precious metal top layer on a substrate comprising a copper based material and/or a copper based und...  
WO/2019/177281A1
The present invention relates to an electroplated bead wire having excellent oxidation resistance, of which the oxidation resistance and the aging adhesive strength with tire rubber are enhanced by formation of a copper- and cobalt-plate...  
WO/2019/173282A1
A floating metallized element assembly and method of manufacturing thereof are disclosed. The floating metallized element assembly includes a work piece of a plateable resin and a non-plateable resin including a front side and a back sid...  
WO/2019/164445A1
Method of manufacturing a spectrally selective surface. The method 200 comprises cleaning 202 an outside of a tubular substrate, e.g. by sonicating in acetone, polishing 204 the cleaned outside, and depositing 210 a Co-Cr coating on the ...  
WO/2019/163256A1
A porous metal body which has a three-dimensional network structure, and which is provided with a skeleton that forms the three-dimensional network structure and a cover layer that has fine pores and covers the skeleton. The three-dimens...  
WO/2019/164920A1
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. An inert anode (or an auxiliary electrode that can act as inert anode when needed)...  
WO/2019/159531A1
Provided is a tire having: a steel cord having a plated film; and a rubber covering said steel cord, wherein the plated film contains Cu and Zn, an adhesive layer containing Cu2S and CuS is provided on a side closer to the rubber than th...  
WO/2019/159794A1
[Problem] To provide: a surface-treated steel sheet for battery containers, which exhibits excellent processability, while maintaining the battery characteristics and liquid leakage resistance. [Solution] A surface-treated steel sheet fo...  
WO/2019/156007A1
Provided is a plating film that can exhibit a high gloss and a low contact resistance value. The plating film according to the present invention is a plating film that contains a noble metal matrix and nanodiamond particles dispersed in ...  
WO/2019/152555A1
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...  
WO/2019/151421A1
Provided is a plated layered body for an electromagnetic wave shield, the plated layered body comprising a cobalt plating layer and a nickel plated layer that is formed over the cobalt plating layer, and being configured such that: the r...  
WO/2019/151487A1
The present invention relates to a surface treatment device and a surface treatment method. Electrodes (30) of a surface treatment device (10) comprise a first electrode (36) and a second electrode (38). The first electrode (36) is inser...  
WO/2019/148107A1
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...  
WO/2019/138818A1
The electroplating device according to one embodiment of the present invention has: a mounting part 21 which, when mounted to a box-like object 13, forms a sealed space 22 together with the box-like object 13; a plating solution containe...  
WO/2019/137724A1
The present invention relates to ureylene additives, a method for their preparation, a use of said ureylene additives favorably as additive in metal or metal alloy deposition composition, preferably in a copper or copper alloy deposition...  
WO/2019/131092A1
Provided is a copper foil for heat dissipation having superior heat dissipation properties. The copper foil for heat dissipation has a copper foil base material and a plated layer on at least any one main surface of the copper foil base ...  
WO/2019/131093A1
Provided is a copper foil for heat dissipation, which has excellent heat dissipation characteristics. A copper foil for heat dissipation, which comprises a copper foil base material and a polymer film that is arranged on at least one mai...  
WO/2019/132288A1
Provided are an ultra-high strength high manganese zinc plated steel plate having excellent spot weldability and a method for manufacturing same. The present invention relates to an ultra-high strength high manganese zinc plated steel pl...  

Matches 1 - 50 out of 21,923