Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 451 - 500 out of 22,548

Document Document Title
WO/2017/070881A1
An anodized electroplated cosmetic structure and a method for making the same are provided, in which an aluminum layer (110) is deposited on a metal substrate (100), and, the aluminum layer deposited on the metal substrate is anodized. I...  
WO/2017/073147A1
Provided is a method for producing a glass plate having a film, in which a laminated film that is black when viewed from the glass-plate side and that is obtained by laminating a plurality of films is formed on the glass plate, wherein a...  
WO/2017/071817A1
The invention relates to an improved black chroming especially of automotive parts.  
WO/2017/068974A1
Provided are: a metal plate (1) that is for a terminal and that makes it possible to minimize cracks in a plating film occurring as a result of bending processing and the like; a terminal (2); and a terminal pair that has excellent wear ...  
WO/2017/067985A1
The present invention relates to an electrolyte containing suitable reducing agents for adjusting the composition of silver-palladium layers. Furthermore, these reducing agents contribute to improving the layer appearance and to increasi...  
WO/2017/067782A1
The invention relates to a method for producing a component (5) for a vehicle, having the following steps: -(A) providing a workpiece made of a heat-treatable steel material (2), said workpiece being provided with a zinc-containing coati...  
WO/2017/063768A1
The invention relates to a metallized plastic component (10), comprising a main body (20) composed of at least one light-transmissive plastic, to which there is applied a metal layer (30) into which at least one transilluminable structur...  
WO/2017/065242A1
Provided is a steel cord provided with a steel wire and a plating layer having Cu, Zn, and Co for covering the steel wire, the Cu and Zn being alloyed, and areas covered by Co and areas not covered by Co coexisting on the topmost surface...  
WO/2017/060216A1
The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process comprises the steps • i. providing a substrate having at least one metal or metal alloy su...  
WO/2017/061358A1
[Problem] To stably obtain a satin-like appearance with a small number of layers without using a satin Ni plating layer and using a ductile Cu plating layer. [Solution] A decorative component comprises: a base material 1; a first Cu plat...  
WO/2017/055553A1
The invention provides an electroplating bath for electrochemical deposition of a novel Cu-Sn-Zn-Pd alloy on a substrate. The novel alloy is characterized by exceptional corrosion resistance and the commonly used precious metal intermedi...  
WO/2017/056731A1
[Problem] To provide a conductive member capable of inhibiting increases in contact resistance, and a production method therefor. [Solution] The problem is solved by a conductive member characterized in that: a Ni plating layer 3 is prov...  
WO/2017/051905A1
To provide a metal foil such that a release layer is provided to the metal foil to allow the metal foil to be physically peeled from a resin substrate once the metal foil has been affixed to the resin substrate, thereby making it possibl...  
WO/2017/051897A1
Provided is a metal foil which is provided with a mold release layer, thereby enabling physical separation of a rein base in cases where the metal foil is bonded to the resin base, and which is removed at a low cost without deteriorating...  
WO/2017/045252A1
An electroplating device for a printed circuit board comprises a plating tank the middle part of which allows the printed circuit board (10) to pass through, anode plates (20) disposed at any one side or two sides of the printed circuit ...  
WO/2017/047320A1
This conductive member is composed of a conductive fabric containing warp and weft and a support body, has at least one linear bending part, and is provided with electrical conductivity across the linear bending part, the conductive memb...  
WO/2017/046831A1
[Problem] The purpose of the present invention is to provide an electroplating conductor roll with excellent high temperature abrasion resistance and corrosion resistance and excellent high temperature hardness. [Solution] An electroplat...  
WO/2017/042334A1
The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to ...  
WO/2017/041333A1
Provided is a plating process for a plating layer on a nail abutting seat component, wherein a Ni-PTFE plating layer is formed on the inner surface of the nail abutting seat component by direct plating. The plating process comprises the ...  
WO/2017/001283A3
The invention relates to a device (1) for producing a galvanized, thin strip-cast steel strip (12), comprising a pickling section (5), a re-rolling stand (6) and a galvanizing line (9). According to the invention, the galvanizing line (9...  
WO/2017/037040A1
The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electron...  
WO/2017/038413A1
A purpose of the present invention is to provide a method for manufacturing a composite material, said method allowing a metal and a fibrous carbon nanostructure to be sufficiently combined to produce a composite material with superior p...  
WO/2017/039402A1
Disclosed is a method for producing various alloy thin films having desired compositions and controlled nanoscale cracks therein by means of an ultrasonic pulse electroforming process. Said method comprises the steps of: forming multi-la...  
WO/2017/036561A1
An electrode device for electrochemical workpiece machining, for example an electropolishing or electroplating process, comprises an electrode and a power supply cable that is connected to the electrode and has an electrical conductor an...  
WO/2017/038048A1
A Sn-plated article on which a topmost layer (14) containing Sn is formed on the surface of a ground layer (12) composed of Ni formed on the surface of a substrate (10) composed of copper or a copper alloy, wherein the topmost layer (14)...  
WO/2017/038825A1
[Problem] To provide a Sn plating material capable of maintaining desired heat resistance and that does not crack during contact point formation even at a high temperature such as 175°C. [Solution] An Sn plating material (10) having a f...  
WO/2017/040054A1
An electroplating processor has a head including a wafer holder, with the head movable to position a wafer in the wafer holder into a vessel holding a first electrolyte and having one or more anodes. A thief electrode assembly may be pos...  
WO/2017/033784A1
This metal foil with a resin layer comprises a resin layer on at least one surface of a metal foil. The resin layer contains, per 100 parts by mass of a polyphenylene ether compound, from 50 parts by mass to 150 parts by mass (inclusive)...  
WO/2017/026683A1
The present invention relates to a zinc flash plating solution which can provide a galvanized steel sheet having an excellent surface appearance, a method for manufacturing a galvanized steel sheet using the same, and a galvanized steel ...  
WO/2017/026104A1
A metal plate which comprises a metallic base and a surface treatment coating film deposited over a surface of the base, with a strike plating layer interposed therebetween, wherein the degree of coverage of the base by the strike platin...  
WO/2017/026500A1
Provided is a surface-treated copper foil and the like suitable for use in a copper-clad laminate or a printed circuit board adapted for enhanced performance and functionality of information communication devices supporting higher freque...  
WO/2017/022953A1
In order to implement a kitchen container capable of performing induction heating, the present invention provides a method for manufacturing a kitchen container capable of performing induction heating, the method comprising: a first step...  
WO/2017/022991A1
The present invention relates to a method for joining superhard materials, the method comprising: a step for preparing an aqueous alloy plating solution comprising at least two kinds of metal salts including a first metal salt and a seco...  
WO/2017/019039A1
According to one example, forming a deposition layer on a magnesium alloy substrate and forming a cured coating on the deposition layer, where the cured coating is cured by ultra-violet radiation, heat at a cure temperature in a range fr...  
WO/2017/014439A1
The present invention provides a method of manufacturing a kitchen container capable of induction heating, the method comprising: a first step of providing a container body portion including ceramic or glass, by providing a container bod...  
WO/2017/013073A1
The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an alumin...  
WO/2017/014944A1
An electroplating processor has a vessel holding an electrolyte. An inert anode in the vessel has an anode wire within an anode membrane tube. A head for holds a wafer in contact with the electrolyte in the vessel. The wafer is connected...  
WO/2017/014605A1
The present invention is a bonding material or brazing alloy manufactured by a method comprising: a step for preparing an aqueous alloy plating solution containing two or more metal salts including a first metal salt and a second metal s...  
WO/2017/011761A1
Systems and methods for coating a metallic component are provided. In one embodiment, a metallic coating may be disposed in a plating bath comprising AlBr3. The metallic coating may be coupled with, or configured as, a working electrode....  
WO/2017/008956A1
The invention relates to a method for coating a wire, which is made of a metal 1 selected from the group consisting of copper, silver, gold, nickel, and alloys of one of said metals with at least one other metal, with a cladding layer wh...  
WO/2017/008790A1
The invention relates to a plastic component (10) for a motor vehicle, comprising a base body (1) made of a polymer material and at least one coating (2) arranged at least partially on the base body (1) for increasing a load-bearing capa...  
WO/2017/006739A1
Provided is a roughened copper foil with which both microcircuit formation (particularly circuit linearity) and close adhesion to resin can be achieved in processing of copper-clad laminates and manufacturing of printed wiring boards. Th...  
WO/2017/005284A1
The invention relates to a method for producing artificial copper patina on a gemstone setting. The patina is characterized by an appearance that corresponds to a natural aging progression. The invention also relates to products produced...  
WO/2017/006834A1
This steel plate for a case of a non-aqueous-electrolyte secondary cell is provided with: a steel plate; and a Ni-W-Fe alloy plated layer formed on the surface of the steel plate, the Ni-W-Fe alloy plated layer containing a Ni-W-Fe alloy...  
WO/2017/005285A1
The invention relates to a method for producing an artificial antique gold layer on a gemstone setting. The antique gold layer is characterized by an appearance that corresponds to a natural aging progression. The invention also relates ...  
WO/2017/005286A1
The invention relates to a method for producing an artificial antique ruthenium layer on a gemstone setting. The antique ruthenium layer is characterized by an appearance that corresponds to a natural aging progression. The invention als...  
WO/2017/001283A2
The invention relates to a device (1) for producing a galvanized, thin strip-cast steel strip (12), comprising a pickling section (5), a re-rolling stand (6) and a galvanizing line (9). According to the invention, the galvanizing line (9...  
WO/2017/004424A1
Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising submicron-sized electrical interconnect features. In the process, a metalizing substrate within the interconnect features is co...  
WO/2016/194738A1
[Problem] To provide an electrically conductive bar stock in which diffusion of the basic component into Sn is limited even after keeping at high temperature for a long period, and as a result, increases in contact resistance can be limi...  
WO/2016/194966A1
The present invention relates to a method for forming a metal layer on glass, said method including using an ion exchange reaction to form interspersed metal areas on the surface of the glass, and using plating to form the metal layer on...  

Matches 451 - 500 out of 22,548