Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 501 - 550 out of 21,882

Document Document Title
WO/2015/099010A1
 The present invention addresses the problem of providing a crucible for growing a sapphire single crystal, the crucible being optimized for obtaining a sapphire single crystal. This sapphire single-crystal growth crucible (1) has a cr...  
WO/2015/099156A1
The purpose of the present invention is to provide a composite metal foil for the production of a printed wiring board, which has a good balance among three characteristics, namely low thermal expansion properties better than those of co...  
WO/2015/097917A1
Provided are: a low-cost gold plating method having excellent anticorrosion properties; and an electronic component which is produced using this gold plating method. In this double gold plating method, a base gold plating layer (2) is fo...  
WO/2015/091219A1
The present invention is related to a device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition on a flat substrate to be treated, wherein t...  
WO/2015/092979A1
Provided are: a silver-plated member which exhibits excellent abrasion resistance, electrical conductivity, sliding properties, and low frictional properties, and which is suitable for inhibiting embrittlement of a silver plating layer; ...  
WO/2015/091863A1
The invention relates to a method for the electrolytic surface modification of a flat workpiece by the deposition of copper aggregates. The invention also relates to flat metal workpieces that can be produced using this method and to the...  
WO/2015/092978A1
Provided are: a silver-plated member which exhibits excellent abrasion resistance, electrical conductivity, sliding properties, and low frictional properties, and which is suitable for inhibiting embrittlement of a silver plating layer; ...  
WO/2015/087942A1
The present invention provides a treated surface copper foil, which adheres favorably to resin and achieves excellent visibility when observed through the resin. Provided is a treated surface copper foil in which respective surface treat...  
WO/2015/086180A1
The present invention relates to an electrolyte composition for depositing copper on metal substrates. The composition contains a combination of two aromatic amines and an electrochemically inert cation. This electrolyte makes it possibl...  
WO/2015/089245A1
A coating system for an aluminum component includes a substrate formed from an aluminum material, a zinc or zinc alloy sacrificial layer deposited on the substrate, and an aluminum coating deposited over the zinc or zinc alloy sacrificia...  
WO/2015/087551A1
A plating device (1) can electroplate an internal thread (20b) formed on a tube edge part (20a) of a steel pipe (20). The plating device (1) is equipped with a pipe inside sealing member (2), a cap (3), a drain port (3c), an opening (3b)...  
WO/2015/087941A1
Provided is a treated surface copper foil with excellent resin transparency after the copper foil has been removed by etching. For the treated surface copper foil, respective surface treatments have been performed on the two surfaces. Af...  
WO/2015/087624A1
This copper alloy for an electronic/electric device contains Mg in a range of 3.3-6.9 atomic%, with the remainder substantially being Cu and unavoidable impurities, and has a strength ratio (TSTD/TSLD) exceeding 1.02, with this strength ...  
WO/2015/083547A1
This electric contact (30) comprises a bulging contact (10) having a bulged shape, and a flat contact (20) having a plate-shape and electrically contacting the crest of the bulging contact (10). The bulging contact (10) has a silver-tin ...  
WO/2015/080052A1
In order to provide a copper foil having an attached carrier foil, whereby the carrier foil can be easily peeled off a copper foil layer even when used during copper-clad laminate production using temperatures of at least 250°C, a coppe...  
WO/2015/080227A1
Provided is a copper foil with a carrier, which comprises an ultrathin copper layer having a surface with good circuit formation properties. This copper foil with a carrier sequentially comprises a carrier, an intermediate layer and an u...  
WO/2015/076685A1
A method of connecting optical fibers coated with conductive layer, preferably metalized, with metal elements, comprising the following stages: 1. preparing the electrolyte, 2. clearing the optical fiber surface and clearing the electrod...  
WO/2015/076180A1
Provided are: a roll with a pattern, which has excellent releasability of a photosensitive material during a photosensitive material releasing process during the production of this roll with a pattern and excellent releasability of a mat...  
WO/2015/068835A1
 The purpose of the present invention is to provide a silver coating material having exceptional wear resistance so that, even when the silver coating material is used as a movable contact and/or a fixed contact of a switch that is use...  
WO/2015/069626A1
Techniques disclosed herein include an electro-chemical deposition apparatus that provides an efficient circulation system, chemical management that provides reliable and uniform plating, and a configuration that provides short maintenan...  
WO/2015/068572A1
This substrate terminal (1) has: a base member (11) comprising a metal material; and a plating film (12) covering the surface of the base member (11). The plating film (12) is provided with an Sn matrix (120a) and an Sn-Pd alloy phase (1...  
WO/2015/068825A1
Electroplating is performed at a liquid temperature of 12-24°C and a current density of 3-8 A/dm2 in a silver plating solution containing 80-110 g/L of silver, 70-160 g/L of potassium cyanide, and 55-70 mg/L of selenium, the product of ...  
WO/2015/062163A1
A metal electrodeposition process for isolated blast protection aluminum alloy comprises the following steps: performing rolling, punching, shaping and winding, annealing treatment, slitting and rolling, lathing and expansion, folding an...  
WO/2015/058963A1
The method for copper electroplating according to the present invention comprises an aqueous acidic copper plating bath containing a leveler additive which forms copper trenches having a cross-sectional round shape under direct current p...  
WO/2015/060093A1
An aspect of the invention is a method for manufacturing a curved grating, comprising: a grating forming step for forming a grating area on one surface of a grating-forming base material, said grating area being an area wherein a plurali...  
WO/2015/060298A1
A method for plating a terminal member, which comprises adhering the terminal member to a jig and then supplying a plating solution to a terminal that is located at the tip of the terminal member through an opening formed on the jig to f...  
WO/2015/059857A1
This stainless steel foil for separators of solid polymer fuel cells is obtained by covering the surface of a base, which is formed of a stainless steel foil, with an Sn alloy layer coating film, while having a strike plating layer inter...  
WO/2015/055537A1
The invention relates to a method and to a device for galvanically coating in particular head-restraint bows (11) or head-restraint rods in successive treatment tanks (9) through which current for the electrolytic liquid bath flows, wher...  
WO/2015/007983A3
The invention concerns a method for producing a metal sublayer made from platinum on a metal substrate. Characteristically, the method comprises the following steps: a) providing a metal part forming the substrate (100), b) providing an ...  
WO/2015/049919A1
A drum electrode for a device that can plate a metal onto the surface of a long base material having electrical conductivity, said drum electrode comprising a power feeding layer, an insulating layer which covers the surface of the power...  
WO/2015/048516A1
Embodiments of the present invention include methods of disposing a metallic coating layer comprising a metal in an amorphous and/or fine grain microstructure over at least a portion of a surface of a pyrolytic graphite substrate, the me...  
WO/2015/045856A1
An electric contact material for a connector comprises: a base material (10) made from a metallic material; an alloy layer (2) of a ternary or higher system, which is formed on the base material (10), contains Sn and Cu, and additionally...  
WO/2014/079911A3
This invention relates to a method for electrodeposition of a chromium containing metal coating on an electrically conductive object from a trivalent chromium based electrolyte wherein the object acts as the cathode and wherein at least ...  
WO/2015/040998A1
The purpose of the present invention is to provide a copper foil that has better adhesiveness with an insulating resin substrate than an unroughened copper foil and has etchability as good as that of an unroughened copper foil. In order ...  
WO/2015/040420A1
A system for continuous circuit fabrication comprising means for storing and dispensing (74) the substrate (2), means for laminating (1) the substrate (2), means for printing (76) the substrate (2), means for optical inspection (4) of th...  
WO/2015/039152A1
The invention relates to a novel electrolyte bath having a Cu and Sn content, and a zinc content which is a maximum of 5 g/l, preferably a maximum 3 g/l, for the deposition of a white layer on metallic substrates, in particular jewelery ...  
WO/2015/037511A1
The present invention provides: a stacked body in which a porous metal layer (B) is formed upon a support body (A), and a metal layer (C) is formed upon the metal layer (B), said stacked body wherein pores in the metal layer (B) are fill...  
WO/2015/036150A1
The invention provides a method by which a steel component provided with a metallic coating which has good adhesion and provides protection from corrosion can be produced. The problem addressed by the invention is especially that of spec...  
WO/2014/146638A3
The invention relates to a method for improving the weldability of high-manganese-containing steel strips which contain (in % by weight) from 6 to 30% of manganese, up to 1% of carbon, up to 15% of aluminium, up to 6% of silicon, up to 6...  
WO/2015/035154A1
A method of forming a downhole tool comprises contacting at least one downhole structure comprising at least one metal material with a molten electrolyte comprising anhydrous sodium tetraborate. Electrical current is applied to at least ...  
WO/2015/035149A1
A method of forming a down-hole tool comprises contacting at least a portion of at least one down-hole structure comprising at least one ceramic-metal composite material with a molten electrolyte comprising sodium tetraborate. Electrical...  
WO/2015/029745A1
Provided are: a plated member and a plated terminal for a connector, each comprising a silver-tin alloy layer that covers the surface of a basis material and a silver cover layer that covers the surface of the silver-tin alloy layer and ...  
WO/2015/030323A1
The objective of the present invention is to provide: plated electric and electronic parts on which the surfaces of silver-plated layers are not discolored and damaged in an atmosphere containing sulfur as time passes or as the temperatu...  
WO/2015/030209A1
 Provided is a surface-treated metal material having excellent heat absorbancy and heat dissipation properties. The surface-treated metal material has a heat conductivity of 32W/(m•K) or above, and the color difference ΔL of the sur...  
WO/2014/108727A3
The subject matter invention is a passivation process against the nitriding process in the parts where the hardness, toughness and fatigue strength are not desired to be changed after the nitriding process of any injector component (10)....  
WO/2015/017957A1
A method for microvia filling by copper electroplating with a through-silicon via technology for a 3D copper interconnect at a high aspect ratio. The method comprises: step 1, formulating an electroplating liquid of a copper methyl sulph...  
WO/2015/017960A1
An additive for reducing voids after annealing of copper plating with through silicon via. The additive includes 0.05 - 1% by weight of one or more of quaternized polyethylene imine and derivatives thereof having different molecular weig...  
WO/2015/020916A1
Fracture-resistant and self-lubricating wear surfaces are provided. In an implementation, a machine surface that is subject to wear is coated with or is constructed of a metallic nanostructure to resist the wear and to provide fracture-r...  
WO/2015/017958A1
Disclosed are an additive C which is capable of changing the microvia-filling method by TSV copper electroplating, and an electroplating solution containing same. The additive C comprises by mass percentage: 5%-10% of one of a polyethyle...  
WO/2014/061983A9
An electrolytic copper foil of which the surface roughness of a precipitation surface, Rz, is less than 1.4 μm, the tensile strength after heat treatment is at least 40 kgf/mm2, and the elongation percentage is at least 4% is suggested....  

Matches 501 - 550 out of 21,882