Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 601 - 650 out of 22,503

Document Document Title
WO/2015/156313A1
This plated steel sheet (1) comprises: a steel sheet (2); a pre-plating layer (3) that is arranged on at least one surface of the steel sheet (2) and contains Al, Cu, In, Zn, Sn, Sb or an arbitrary combination thereof; and a plating laye...  
WO/2015/157441A1
Examples of next-generation ionic liquids (IL)s have been synthesized and characterized to be used in a variety of applications including aluminum electrodeposition. These ILs are non-flammable and provide smooth deposition of metal, suc...  
WO/2015/151426A1
This invention is a semiconductor device that contains a semiconductor element. Said semiconductor device also contains an above-semiconductor-element metal pad and metal wiring, both of which are electrically connected to the semiconduc...  
WO/2015/151417A1
This invention is a semiconductor device that contains a semiconductor element. Said semiconductor device also contains an above-semiconductor-element metal pad and metal wiring, both of which are electrically connected to the semiconduc...  
WO/2015/151959A1
This terminal pair (1) is constituted in such a manner as to be used by bringing a first contact portion (3) provided on a first terminal (2) into contact with a second contact portion (5) provided on a second terminal (4). The first con...  
WO/2015/151935A1
The purpose of the present invention is to provide a copper foil with a carrier foil suitable for manufacturing a copper clad laminate for use in laser perforation processing. In order to achieve this purpose, provided is a copper foil w...  
WO/2015/151665A1
 Provided are a cylinder plating apparatus and method with which a constant distance can be maintained between a cylinder for processing and insoluble electrodes, regardless of the diameter of the cylinder for processing, and current d...  
WO/2015/137546A1
Provided are a capacitive metal porous body-forming apparatus and a capacitive metal porous body-forming method using the same. The capacitive metal porous body-forming apparatus according to one embodiment comprises: a transfer module f...  
WO/2014/134694A8
The present invention relates to a cylinder sleeve (10) for internal combustion engines, more concretely to a cylinder sleeve (10) inserted by casting into an engine block (8), wherein the circumferential outer surface (2) is provided wi...  
WO/2015/137442A1
In the present invention, a substrate treatment method includes: supplying an alignment solution to the entire surface of a substrate on which a plurality of semiconductor chips have been formed; arranging a counter substrate, in which a...  
WO/2015/091854A3
The invention relates to electrically conducting liquids based on diphosphonate complexes and to the use thereof in methods for electrolytically modifying the surface of a flat metal workpiece. The invention further relates to the flat m...  
WO/2015/131795A1
Disclosed in the present invention are a gold electroplating method and a hard gold preparation method. The hard gold preparation method comprises: electroplating a gold layer onto a core shaft formed of material having a low melting poi...  
WO/2015/133499A1
 An Sn-plated article obtained by performing Sn-plating on the surface of a substrate (10) comprising copper or a copper alloy, wherein a base layer (12) comprising Ni and/or a Cu-Ni alloy is formed on the surface of the substrate (10)...  
WO/2015/129108A1
Provided is a porous aluminum body, the skeleton of which has a hollow three-dimensional network structure, wherein the porous aluminum body has a microporous layer on the surfaces of the hollow portions of the skeleton. The microporous ...  
WO/2015/124393A1
A method of manufacturing an electrode (10, 20) for a surge arrester (100) or a surge arrester (100) is presented. The method comprises providing an electrochemical cell with an electrode body (1, 2) and an electrolyte solution which is ...  
WO/2015/125676A1
This wire rod (1) for a connector pin has a core material and an Sn plated film (3) that is formed on the surface of the core material (2) using electroplating. The core material (2) has a metal structure in which the core material conta...  
WO/2015/125927A1
This surface coating layer-equipped copper alloy plate strip is characterized in that: a copper alloy plate strip is used as a base metal and a surface coating layer comprising a Ni layer, a Cu-Sn alloy layer, and a Sn layer in this orde...  
WO/2015/105767A3
An electroplating system and method has a needle anode associated with an XYZ or multi-direction positioning device and is configured for plating internal surfaces of holes in metal products. The needle anode is positioned such that an i...  
WO/2015/050969A3
The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner t...  
WO2015122505A1
 Provided is a copper alloy sheet strip with a surface coating layer characterized in that: the copper alloy sheet strip serves as a base material, and an Ni layer having a thickness of 0.1 to 3.0 μm, a Cu-Sn alloy layer having a thic...  
WO/2015/122104A1
Provided is a method for producing core-shell catalyst particles which have high catalytic activity per unit mass of platinum. A method for producing core-shell catalyst particles, each of which comprises a core containing palladium and ...  
WO/2015/120828A1
The invention relates to a plug connector housing and/or an attachment housing, comprising at least one rivet pin that is used as a bearing pin or locking pin. The rivet pins are provided with a metal layer that reduces contact corrosion...  
WO/2015/118613A1
Provided are: an Ni ball having strong falling-impact resistance and capable of suppressing the occurrence of joining failures and the like; an Ni core ball; a solder joint; a solder paste; and a solder foam. An electronic component (60)...  
WO/2015/118611A1
Provided are: a Cu ball having strong falling-impact resistance and capable of suppressing the occurrence of joining failures and the like; a Cu core ball; a solder joint; a solder paste; and a solder foam. An electronic component (60) i...  
WO/2015/119010A1
A fixed contact (1) upon which a moving contact (9) slides comprises a base material (3) and a plating layer (5) (e.g., tin:Sn, etc.) that covers the base material (3). The base material (3) comprises a plate material of a copper or alum...  
WO/2015/118977A1
The purpose of the present invention is to provide an aluminum film manufacturing method and manufacturing device with which there is no intrusion of moisture or oxygen into a plating chamber. Provided is an aluminum film manufacturing m...  
WO/2015/118627A1
[Problem] To provide a high long-term reliability electrical contact material, and a manufacturing method thereof, which exhibits excellent abrasion resistance at sliding loads of 50gf or above, even high 100gf loads; which can be used i...  
WO/2015/114771A1
The present invention suppresses occurrences of soft errors while assuring alignment properties when mounting a Cu core ball on an electrode. A Cu core ball (11) is provided with a Cu ball (1) and a metal layer (2) that coats the surface...  
WO/2015/111533A1
Provided is an aluminum plating solution with a large current density region in which aluminum plating is possible and small solution resistance. An aluminum plating solution comprises: an aluminum halide; one or more species selected fr...  
WO/2015/111328A1
Provided is a steel sheet for a container, said steel sheet having an excellent appearance. The steel sheet for a container has: a plated steel sheet which is formed by covering at least one part of a surface of a steel sheet with a plat...  
WO/2015/107568A1
A resin mold, comprising a thermosetting resin substrate on which an inverted contact pin pattern is printed and a thermoplastic resin, is used to form a contact pin pattern in the resin mold, after which the thermoplastic resin is disso...  
WO/2015/107211A1
Method for producing a laterally structured layer, more particularly a phosphor lamina (1), comprising the following steps: - providing a carrier (2) having a first electrically conductive layer (21) at a carrier top side (20), - applyin...  
WO/2015/108191A1
Provided is a surface-treated copper foil having excellent fine wiring formability. This surface-treated copper foil is obtained by forming a surface treatment layer on a copper foil. In cases where this surface-treated copper foil is sp...  
WO/2015/104329A1
A sliding engine component comprising a substrate having a surface coated with first and second electroplated metallic layers, the first metallic layer being provided between the substrate and the second metallic layer, wherein the first...  
WO/2015/099452A1
The present invention relates to a copper metal film used as a seed layer for electrodeposition, in connection with formation of copper wiring for a semiconductor device, a method for manufacturing the same, and a method for forming copp...  
WO/2015/097979A1
To provide a semiconductor device that is equipped with wiring having sufficient oxidation resistance or migration resistance. This semiconductor device is equipped with: a first insulating film (121) that is formed on a semiconductor su...  
WO/2015/099010A1
 The present invention addresses the problem of providing a crucible for growing a sapphire single crystal, the crucible being optimized for obtaining a sapphire single crystal. This sapphire single-crystal growth crucible (1) has a cr...  
WO/2015/099156A1
The purpose of the present invention is to provide a composite metal foil for the production of a printed wiring board, which has a good balance among three characteristics, namely low thermal expansion properties better than those of co...  
WO/2015/097917A1
Provided are: a low-cost gold plating method having excellent anticorrosion properties; and an electronic component which is produced using this gold plating method. In this double gold plating method, a base gold plating layer (2) is fo...  
WO/2015/091219A1
The present invention is related to a device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition on a flat substrate to be treated, wherein t...  
WO/2015/092979A1
Provided are: a silver-plated member which exhibits excellent abrasion resistance, electrical conductivity, sliding properties, and low frictional properties, and which is suitable for inhibiting embrittlement of a silver plating layer; ...  
WO/2015/091863A1
The invention relates to a method for the electrolytic surface modification of a flat workpiece by the deposition of copper aggregates. The invention also relates to flat metal workpieces that can be produced using this method and to the...  
WO/2015/092978A1
Provided are: a silver-plated member which exhibits excellent abrasion resistance, electrical conductivity, sliding properties, and low frictional properties, and which is suitable for inhibiting embrittlement of a silver plating layer; ...  
WO/2015/087942A1
The present invention provides a treated surface copper foil, which adheres favorably to resin and achieves excellent visibility when observed through the resin. Provided is a treated surface copper foil in which respective surface treat...  
WO/2015/086180A1
The present invention relates to an electrolyte composition for depositing copper on metal substrates. The composition contains a combination of two aromatic amines and an electrochemically inert cation. This electrolyte makes it possibl...  
WO/2015/089245A1
A coating system for an aluminum component includes a substrate formed from an aluminum material, a zinc or zinc alloy sacrificial layer deposited on the substrate, and an aluminum coating deposited over the zinc or zinc alloy sacrificia...  
WO/2015/087551A1
A plating device (1) can electroplate an internal thread (20b) formed on a tube edge part (20a) of a steel pipe (20). The plating device (1) is equipped with a pipe inside sealing member (2), a cap (3), a drain port (3c), an opening (3b)...  
WO/2015/087941A1
Provided is a treated surface copper foil with excellent resin transparency after the copper foil has been removed by etching. For the treated surface copper foil, respective surface treatments have been performed on the two surfaces. Af...  
WO/2015/087624A1
This copper alloy for an electronic/electric device contains Mg in a range of 3.3-6.9 atomic%, with the remainder substantially being Cu and unavoidable impurities, and has a strength ratio (TSTD/TSLD) exceeding 1.02, with this strength ...  
WO/2015/083547A1
This electric contact (30) comprises a bulging contact (10) having a bulged shape, and a flat contact (20) having a plate-shape and electrically contacting the crest of the bulging contact (10). The bulging contact (10) has a silver-tin ...  

Matches 601 - 650 out of 22,503