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Patent Searching and Data


Matches 601 - 650 out of 21,888

Document Document Title
WO/2014/144180A1
Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nan...  
WO/2014/134694A1
The present invention relates to a cylinder sleeve (10) for internal combustion engines, more concretely to a cylinder sleeve (10) inserted by casting into an engine block (8), wherein the circumferential outer surface (2) is provided wi...  
WO/2014/136763A1
The purpose of the present invention is to provide: a copper foil for laser processing which has excellent laser processability and from which a wiring pattern can be satisfactorily formed; a carrier-foil-supported copper foil for laser ...  
WO/2014/136785A1
Provided is a copper foil with an attached carrier, said copper foil being suitable for fine-pitch pattern formation. Said copper foil is provided with the following, in this order: a carrier, i.e. a support; an intermediate layer; and a...  
WO/2014/133164A1
The purpose of the present invention is to provide a copper foil for a printed circuit board, the copper foil having: a blackened surface capable of improving CCD visibility during terminal connection processing and precision of flexible...  
WO/2014/132947A1
A carrier foil, an ultrathin copper foil, and an ultrathin copper foil with a carrier in which a separation layer is formed between the carrier foil and the ultrathin copper foil, wherein the invention is characterized in that the separa...  
WO/2014/029667A3
The invention relates to a method for light entrapment in coating baths, in order thereby to deposit metal on a surface of a semiconductor component in a light-induced or light-supported manner. The method comprises at least the followin...  
WO/2014/129297A1
The purpose of the present invention is to provide a film mirror and a film mirror production method with which a film mirror having a high reflectance is obtained by using silver plating. This method for producing a film mirror involves...  
WO/2014/129222A1
Provided is a terminal in which loss of strength and loss of thickness of a welded area is suppressed and breakage during the swaging process is suppressed. This terminal comprises a connector section, a tubular pressure-bonded section, ...  
WO/2014/129221A1
Provided are: a metal member which has improved copper and copper alloy laser weldability, and a small heat-affected zone; a terminal and an electric wire connection structure formed using the metal member; and a method for manufacturing...  
WO/2014/128833A1
[Problem] To provide a copper foil for graphene production and a graphene production method using the copper foil, whereby it is possible to produce high-quality large-area graphene at a low cost. [Solution] A copper foil (10) for graphe...  
WO/2014/130452A1
The described embodiments relate generally to aluminum films and methods for forming aluminum films. Methods involve providing aluminum films having increased hardness. Methods involve using higher than conventional current densities dur...  
WO/2014/124793A1
The present invention relates to a method for producing high energy magnets comprising light and heavy rare earth metals, characterized in that at least one heavy rare earth metal is introduced into the permanent magnet from an ionic liq...  
WO/2014/125972A1
Provided are a continuous plating patterning roll, which solves the problem of side etching and has excellent insulating layer adhesiveness, and a manufacturing method therefor. The continuous plating patterning roll is configured so as ...  
WO/2014/123878A1
Provided in one embodiment is a filtering article, comprising: powders comprising bundles of nanotubes, each bundle comprising hollow titania nanotubes. Embodiments of the methods of making and using the filtering articles are also provi...  
WO/2014/115457A1
This sliding member comprises: a base; a hard chromium plating layer that is formed on the surface of the base and is mainly composed of chromium; and a hard carbon layer that is formed on the hard chromium plating layer and is mainly co...  
WO/2014/112298A1
Provided is a connector terminal with which the heat resistance is excellent and the formation of a high-hardness insulating film on an electrical contact outermost surface is avoided even in usage in a high-temperature environment; also...  
WO/2014/110958A1
A method and a system for producing an electrolytic copper foil by using reverse flow of a copper sulfate solution. The system comprises a cathode roller (1) and an anode groove (3). Upper end openings (3-1) of two sides of the anode gro...  
WO/2014/109396A1
Provided are a surface treated copper foil that even when employed in high-frequency circuit boards affords satisfactory reduction of transmission loss, a laminate board, a copper foil with a carrier, a printed wiring board, a printed ci...  
WO/2014/108756A1
A drill pipe tool joint comprising:a pin including a male threaded portion at an outer surface; and a box including a female threaded portion at an inner surface, the female threaded portion to be screwed and fastened to the male threade...  
WO/2014/109083A1
A copper ally for an electronic or electrical device, containing more than 2.0 to 36.5 mass% of Zn, 0.1 to 0.9 mass% of Sn, 0.05 to less than 1.0 mass% of Ni, 0.5 to less than 10 mass ppm of Fe, 0.001 to less than 0.10 mass% of Co, and 0...  
WO/2014/094998A1
The invention relates to an object (18) such as a wire which is electrolytically coated by dipping the object into an electrolyte tank (10) having an electrolyte (12), in which at least one soluble anode (14), which is connected to a pos...  
WO/2014/090125A1
Provided are a composition and a method for preparing a diamond wire saw using same. The composition comprises 85-95% by weight of ethyl α-cyanoacrylate, 3-8% by weight of a tackifier, 1-3% by weight of a stabilizer, and 2-4% by weight ...  
WO/2013/024305A3
A method of depositing an active material for a metal ion battery comprising the steps of: providing a conductive material in an electrodeposition bath wherein the electrodeposition bath contains an electrolyte comprising a source of the...  
WO/2014/088944A1
The present disclosure provides devices, systems and methods with applicability in the coating of surfaces, in particular three-dimensional surfaces, via anodization reactions. For example, the disclosed devices, systems and methods find...  
WO/2014/084304A1
The present invention is a manufacturing method for a semiconductor device, wherein a template, which has multiple flow paths for delivering a treatment liquid to a substrate, said substrate having multiple through-holes penetrating in t...  
WO/2014/080958A1
Provided is a copper foil having a carrier, endowed with high cohesive force between the carrier and an ultra-thin copper film prior to the step of lamination to an insulating substrate, the cohesion of the carrier and the ultra-thin cop...  
WO/2014/080765A1
The objective of the present invention is to obtain a substrate for flexible devices, which has good moisture barrier resistance and good adhesion of an insulating layer. A substrate (11) for flexible devices according to the present inv...  
WO/2014/081041A1
Provided are a surface-treated electrolytic copper foil, a laminate, and a printed circuit board with which increased fineness of pitch is possible and for which the reliability of resin adherence is excellent. A surface-treated electrol...  
WO/2014/079911A2
This invention relates to a method for electrodeposition of a chromium containing metal coating on an electrically conductive object from a trivalent chromium based electrolyte wherein the object acts as the cathode and wherein at least ...  
WO/2014/079910A1
The invention relates to a coated steel substrate for packaging applications, said substrate containing 1. a recrystallisation annealed single or double reduced packaging steel blackplate, or 2. a cold-rolled and recovery annealed blackp...  
WO/2014/080959A1
 Provided is a copper foil with carrier that is suitable for fine pitch formation. The copper foil with carrier is equipped with, in the following order, a carrier, a release layer, an ultra thin copper layer, and an optional resin lay...  
WO/2014/079909A1
The invention relates to a coated steel substrate for packaging applications, said substrate containing i). a conventional non-passivated electrolytic, optionally flowmelted, tinplate, or ii). a cold-rolled and recovery annealed electrol...  
WO/2014/076078A2
The device (1) according to the invention is suggested for gentle treatment of a flat material (B) to be treated with a treatment liquid (F). The device (1) has the following components: at least one treatment chamber (20), in which the ...  
WO/2014/073695A1
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, and a laminate using the same. A surface-treated copper foil in which the sk...  
WO/2014/073696A1
Provided are a surface-treated copper foil exhibiting excellent resin transparency after removal of the copper foil by etching, and a laminate using the same. A surface-treated copper foil, wherein when adhering the copper foil to both s...  
WO/2014/073692A1
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent visibility when seen through the resin, and a laminate using the same. A surface-treated copper foil having a color difference (ΔE*ab) ba...  
WO/2014/073694A1
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, a laminate using the same, a copper-clad laminate, a printed circuit board, ...  
WO/2014/073693A1
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent visibility when seen through the resin, and a laminate using the same. A surface-treated copper foil having a surface treatment performed ...  
WO/2014/067937A1
The invention relates to a method for manufacturing a strip made of aluminum or an aluminum alloy as well as to a coated aluminum or aluminum alloy strip, a formed metal part made of said aluminum or aluminum alloy strip as well as to an...  
WO/2014/065207A1
Provided is a mesh structure of one embodiment of the present invention that reinforces the connection portions of mesh and suppresses a deterioration in quality by using a plating film. This mesh structure comprises an insulation film f...  
WO/2014/065430A1
Provided is a copper foil with a carrier in which there are no limits to the types of ultra-thin copper layers and carriers, nor to the thicknesses of the copper layers and carriers, and in which warping of the copper foil is satisfactor...  
WO/2014/061352A1
Provided is a method for producing a metal plate having an alloy plating layer, which comprises a step wherein electroplating is carried out in a plating bath by having a metal strip continuously passed through the plating bath that is p...  
WO/2014/060333A1
The invention relates to an anodizing device for anodizing at least one internal surface element (22) of a metal tubular body (18) having an extension direction (24), comprising: an anodizing tank (10) for accommodating an electrolyte (1...  
WO/2014/061983A1
An electrolytic copper foil of which the surface roughness of a precipitation surface, Rz, is less than 1.4 μm, the tensile strength after heat treatment is at least 40 kgf/mm2, and the elongation percentage is at least 4% is suggested....  
WO/2014/057052A2
The present invention describes a method for manufacturing rotogravure cylinders with a cylinder base made of aluminum. The method involves the coating of the cylinder surface with high velocity spraying, the copper plating in an appropr...  
WO/2014/054189A1
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...  
WO/2014/054190A1
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...  
WO/2014/054817A1
[Problem] To provide at low cost and good producibility a silver reflection film, which has a high reflectance, the reflectance of which does not change easily even before and after heating, and which does not soften easily, and a light ...  
WO/2012/122300A3
Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodiz...  

Matches 601 - 650 out of 21,888