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Patent Searching and Data


Matches 651 - 700 out of 21,923

Document Document Title
WO/2014/065430A1
Provided is a copper foil with a carrier in which there are no limits to the types of ultra-thin copper layers and carriers, nor to the thicknesses of the copper layers and carriers, and in which warping of the copper foil is satisfactor...  
WO/2014/061352A1
Provided is a method for producing a metal plate having an alloy plating layer, which comprises a step wherein electroplating is carried out in a plating bath by having a metal strip continuously passed through the plating bath that is p...  
WO/2014/060333A1
The invention relates to an anodizing device for anodizing at least one internal surface element (22) of a metal tubular body (18) having an extension direction (24), comprising: an anodizing tank (10) for accommodating an electrolyte (1...  
WO/2014/061983A1
An electrolytic copper foil of which the surface roughness of a precipitation surface, Rz, is less than 1.4 μm, the tensile strength after heat treatment is at least 40 kgf/mm2, and the elongation percentage is at least 4% is suggested....  
WO/2014/057052A2
The present invention describes a method for manufacturing rotogravure cylinders with a cylinder base made of aluminum. The method involves the coating of the cylinder surface with high velocity spraying, the copper plating in an appropr...  
WO/2014/054189A1
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...  
WO/2014/054190A1
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...  
WO/2014/054817A1
[Problem] To provide at low cost and good producibility a silver reflection film, which has a high reflectance, the reflectance of which does not change easily even before and after heating, and which does not soften easily, and a light ...  
WO/2012/122300A3
Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodiz...  
WO/2014/050772A1
A method for manufacturing a silver plating material that forms a surface layer comprising silver on the surface of a raw material or on the surface of a base layer formed on the raw material, wherein electroplating is performed in a sil...  
WO/2014/051123A1
A copper foil provided with surface-treated layers is characterized by being provided with a plurality of surface-treated layers comprising: a roughened layer which is formed upon a copper foil or a copper alloy foil as a result of rough...  
WO/2014/045704A1
The purpose of the present invention is to provide a connector terminal having a tin layer on the outermost surface and a material for the connector terminal, wherein independent of the details of the fine structure of the outermost surf...  
WO/2012/171856A3
The invention relates to a ruthenium electrolyte which is suitable for the deposition of decorative and industrial layers having a particular blackness. The invention further relates to the use of the electrolyte of the invention in a pr...  
WO/2014/042412A1
The present invention relates to a method for surface-treating copper foil, the method comprising the steps of: a) forming nodules on the copper foil surface; b) adding the copper foil, on which nodules have formed, into a plating soluti...  
WO/2014/042201A1
Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper l...  
WO/2014/038263A1
Provided is an aluminum plating apparatus which is capable of successfully forming an aluminum plating on the surface of a base even in the cases where the surface is provided with an insulating or poorly conductive metal oxide film or t...  
WO/2014/038716A1
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which yields superior resin transparency after the copper foil has been etched and removed. After surface-treated copper foil has been ...  
WO/2014/038718A1
Provided are surface-treated copper foil, a laminated board, a copper-clad laminated board, a printed circuit board and an electronic device using this surface-treated copper foil which bonds well to resin and yields superior resin trans...  
WO/2014/038717A1
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which bonds well to resin and yields superior resin transparency after the copper foil has been etched and removed. After surface-treat...  
WO/2014/032994A1
The invention relates to a method for producing a metal component of a fitting, in particular of a pull-out guide. Said method is characterized by the following steps: I. providing a metal component made of steel; II. pre-treating, in pa...  
WO/2014/034171A1
The present invention provides a plating pretreatment technique whereby, when a workpiece is plated with the surface to be plated facing downward, the effects of air bubbles, etc., on the fine vias or trenches formed in the surface to be...  
WO/2014/034300A1
Provided is a connector terminal which uses aluminum or an aluminum alloy as a base, and has a nickel layer and a tin layer that is arranged on the nickel layer. This connector terminal can be easily processed and is reduced in damage to...  
WO/2014/030461A1
Provided is a plated terminal for connectors, which has a tin plating layer that forms the outermost surface and a nickel base layer, and wherein increase of the contact resistance of the outermost surface due to growth of a plate-like t...  
WO/2014/024878A1
Provided is a metal foil with a carrier, wherein the peel strength between a metal foil and a plate-like carrier that is formed of a resin is adjusted. A metal foil with a carrier, which is composed of a plate-like carrier that is formed...  
WO/2014/025727A2
Generally stated, provided is a sealed laminated metal structure. This laminated metal structure has a metal layer, where the metal layer has a first surface and an opposite second surface. A material is laminated on each of the first an...  
WO/2014/024994A1
Provided is a copper foil with a carrier attached thereto, wherein the adhesive force between the carrier and an ultrathin copper layer is high before a step consisting of lamination to an insulating substrate but decreases after said st...  
WO/2014/021219A1
Provided is a connector terminal which uses aluminum or an aluminum alloy as a base material and has a nickel layer and a tin layer that is formed on the surface of the nickel layer. This connector terminal is free from an increase in th...  
WO/2014/017238A1
Provided are: a metal material for electronic components, which has low occurrence of whiskers, low adhesive wear properties and high durability; a connector terminal which uses the metal material for electronic components; a connector; ...  
WO/2014/017937A1
The present invention refers to an electrodeposition process of nickel-cobalt coatings (2), from aqueous solutions containing nickel and cobalt salts, by applying a pulsed waveform in the cathodic current range. It also refers to nickel-...  
WO/2014/007002A1
Provided is a surface treated steel plate for a battery container that has a nickel-cobalt alloy layer formed on the outermost surface of a surface that forms the inner surface of a battery container. The surface treated steel plate for ...  
WO/2014/007568A1
Provided is a nickel (Ni)-copper (Cu) plated high-carbon steel wire for springs. The Ni-Cu plated high-carbon steel wire includes a core wire that includes a high-carbon steel wire; and a Ni-plating layer and a Cu player which are sequen...  
WO/2014/007090A1
This electroplating device is equipped with: a pipe interior sealing mechanism that closes off an internal flow path on the inside of a steel pipe in the axial direction of the pipe; a cylindrical insoluble anode arranged so as to face a...  
WO/2014/007139A1
[Problem] To provide a pipe which has a heat-resistant corrosion-resistant multi-ply plating layer having excellent processability. [Solution] A pipe which is characterized by comprising a multi-ply plating layer that is composed of: a Z...  
WO/2014/007025A1
Provided is a surface-treated steel sheet for battery containers, which has an iron-nickel diffusion layer that is formed by performing a thermal diffusion treatment after forming a nickel plating layer on a steel sheet so that the nicke...  
WO/2014/006781A1
Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is lami...  
WO/2014/003145A1
An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal using said electronic component metal material, and a connector terminal, a connector and an electronic compone...  
WO/2014/003144A1
An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal, a connector and an electronic component using said electronic component metal material are provided. This elec...  
WO/2012/085682A8
A method for plating strips comprising: providing a strip (1) of material, providing a masking belt (18) comprising patterned windows, providing a tank (13) with a plating solution, generating a continuous movement in the cell of an asse...  
WO/2014/003147A1
An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal using said electronic component metal material, and a connector terminal, a connector and an electronic compone...  
WO/2013/187420A1
Provided is a surface-treated copper foil with which adhesion with a resin is good and transparency of the resin after the copper foil has been removed by etching is excellent. Also provided is a laminated sheet using the same. The surfa...  
WO/2013/182615A1
The invention relates to a method for the production of a part, comprising the following steps: a) deposition of a diffractive layer on a substrate; b) deposition of a first photosensitive resin layer on the diffractive layer; c) illumin...  
WO/2013/180027A1
[Problem] To provide a surface-treated steel sheet for a container, a method for manufacturing the same, an organic-resin-coated surface-treated steel sheet, and a metal can, the surface-treated steel sheet having excellent processing ad...  
WO/2013/176133A1
Provided are a surface-treated copper foil that adheres well to resins and imparts superior resin transparency after the copper foil is etched away, and a laminated board using the same. A surface-treated copper foil is bonded, from a si...  
WO/2013/176115A1
The purpose of the present invention is to provide a copper foil which is inexpensive and can have a sufficient level of tensile strength even after being subjected to a heat treatment. To achieve the purpose, a copper foil is provided, ...  
WO/2013/175591A1
[Problem] A plating structure which is not sulfurized even by a lapse of time or a temperature rise; a light-emitter support provided with a reflecting surface which has a plating structure with excellent sulfurization resistance; and a ...  
WO/2013/172155A1
Provided are: a metal coating film which has excellent solder joint characteristics and is not susceptible to the formation of Sn whiskers; and an electronic component which is provided with this metal coating film. A metal coating film ...  
WO/2013/166569A1
The present invention relates to a galvanisation process (1) that includes a residue purification step, with the aim of achieving many improvements and ease of use for the manufacturing and processing industry of metal wires (A) in gener...  
WO/2013/168646A1
Provided are: a surface-treated copper foil which can adhere satisfactorily to a resin and which has an advantage in that, when the foil has been removed by etching, the resulting resin exhibits high transparency; and a laminate using th...  
WO/2013/168764A1
The purpose of the present invention is to provide a plated terminal which is for use in a connector and requires less insertion force by reducing the coefficient of friction, and a terminal pair formed using such a plated terminal for a...  
WO/2013/161125A1
Provided is a plated terminal for connectors, said plated terminal having a tin plating layer with aluminum or an aluminum alloy as a base material, and suppressing connection reliability deterioration due to corrosion of the plating lay...  

Matches 651 - 700 out of 21,923