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WO/2015/058963A1 |
The method for copper electroplating according to the present invention comprises an aqueous acidic copper plating bath containing a leveler additive which forms copper trenches having a cross-sectional round shape under direct current p...
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WO/2015/060093A1 |
An aspect of the invention is a method for manufacturing a curved grating, comprising: a grating forming step for forming a grating area on one surface of a grating-forming base material, said grating area being an area wherein a plurali...
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WO/2015/060298A1 |
A method for plating a terminal member, which comprises adhering the terminal member to a jig and then supplying a plating solution to a terminal that is located at the tip of the terminal member through an opening formed on the jig to f...
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WO/2015/059857A1 |
This stainless steel foil for separators of solid polymer fuel cells is obtained by covering the surface of a base, which is formed of a stainless steel foil, with an Sn alloy layer coating film, while having a strike plating layer inter...
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WO/2015/055537A1 |
The invention relates to a method and to a device for galvanically coating in particular head-restraint bows (11) or head-restraint rods in successive treatment tanks (9) through which current for the electrolytic liquid bath flows, wher...
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WO/2015/007983A3 |
The invention concerns a method for producing a metal sublayer made from platinum on a metal substrate. Characteristically, the method comprises the following steps: a) providing a metal part forming the substrate (100), b) providing an ...
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WO/2015/049919A1 |
A drum electrode for a device that can plate a metal onto the surface of a long base material having electrical conductivity, said drum electrode comprising a power feeding layer, an insulating layer which covers the surface of the power...
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WO/2015/048516A1 |
Embodiments of the present invention include methods of disposing a metallic coating layer comprising a metal in an amorphous and/or fine grain microstructure over at least a portion of a surface of a pyrolytic graphite substrate, the me...
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WO/2015/045856A1 |
An electric contact material for a connector comprises: a base material (10) made from a metallic material; an alloy layer (2) of a ternary or higher system, which is formed on the base material (10), contains Sn and Cu, and additionally...
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WO/2014/079911A3 |
This invention relates to a method for electrodeposition of a chromium containing metal coating on an electrically conductive object from a trivalent chromium based electrolyte wherein the object acts as the cathode and wherein at least ...
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WO/2015/040998A1 |
The purpose of the present invention is to provide a copper foil that has better adhesiveness with an insulating resin substrate than an unroughened copper foil and has etchability as good as that of an unroughened copper foil. In order ...
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WO/2015/040420A1 |
A system for continuous circuit fabrication comprising means for storing and dispensing (74) the substrate (2), means for laminating (1) the substrate (2), means for printing (76) the substrate (2), means for optical inspection (4) of th...
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WO/2015/039152A1 |
The invention relates to a novel electrolyte bath having a Cu and Sn content, and a zinc content which is a maximum of 5 g/l, preferably a maximum 3 g/l, for the deposition of a white layer on metallic substrates, in particular jewelery ...
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WO/2015/037511A1 |
The present invention provides: a stacked body in which a porous metal layer (B) is formed upon a support body (A), and a metal layer (C) is formed upon the metal layer (B), said stacked body wherein pores in the metal layer (B) are fill...
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WO/2015/036150A1 |
The invention provides a method by which a steel component provided with a metallic coating which has good adhesion and provides protection from corrosion can be produced. The problem addressed by the invention is especially that of spec...
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WO/2014/146638A3 |
The invention relates to a method for improving the weldability of high-manganese-containing steel strips which contain (in % by weight) from 6 to 30% of manganese, up to 1% of carbon, up to 15% of aluminium, up to 6% of silicon, up to 6...
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WO/2015/035154A1 |
A method of forming a downhole tool comprises contacting at least one downhole structure comprising at least one metal material with a molten electrolyte comprising anhydrous sodium tetraborate. Electrical current is applied to at least ...
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WO/2015/035149A1 |
A method of forming a down-hole tool comprises contacting at least a portion of at least one down-hole structure comprising at least one ceramic-metal composite material with a molten electrolyte comprising sodium tetraborate. Electrical...
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WO/2015/029745A1 |
Provided are: a plated member and a plated terminal for a connector, each comprising a silver-tin alloy layer that covers the surface of a basis material and a silver cover layer that covers the surface of the silver-tin alloy layer and ...
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WO/2015/030323A1 |
The objective of the present invention is to provide: plated electric and electronic parts on which the surfaces of silver-plated layers are not discolored and damaged in an atmosphere containing sulfur as time passes or as the temperatu...
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WO/2015/030209A1 |
Provided is a surface-treated metal material having excellent heat absorbancy and heat dissipation properties. The surface-treated metal material has a heat conductivity of 32W/(m•K) or above, and the color difference ΔL of the sur...
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WO/2014/108727A3 |
The subject matter invention is a passivation process against the nitriding process in the parts where the hardness, toughness and fatigue strength are not desired to be changed after the nitriding process of any injector component (10)....
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WO/2015/017957A1 |
A method for microvia filling by copper electroplating with a through-silicon via technology for a 3D copper interconnect at a high aspect ratio. The method comprises: step 1, formulating an electroplating liquid of a copper methyl sulph...
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WO/2015/017960A1 |
An additive for reducing voids after annealing of copper plating with through silicon via. The additive includes 0.05 - 1% by weight of one or more of quaternized polyethylene imine and derivatives thereof having different molecular weig...
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WO/2015/020916A1 |
Fracture-resistant and self-lubricating wear surfaces are provided. In an implementation, a machine surface that is subject to wear is coated with or is constructed of a metallic nanostructure to resist the wear and to provide fracture-r...
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WO/2015/017958A1 |
Disclosed are an additive C which is capable of changing the microvia-filling method by TSV copper electroplating, and an electroplating solution containing same. The additive C comprises by mass percentage: 5%-10% of one of a polyethyle...
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WO/2014/061983A9 |
An electrolytic copper foil of which the surface roughness of a precipitation surface, Rz, is less than 1.4 μm, the tensile strength after heat treatment is at least 40 kgf/mm2, and the elongation percentage is at least 4% is suggested....
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WO/2015/011130A1 |
This invention relates to an anode system for use in an electroplating cell for the coating of a moving metal strip and a method using said anode system.
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WO/2015/012376A1 |
Provided is a surface-treated copper foil with which very fine wiring can consistently be formed and which has high adhesiveness with respect to an electroless copper-plated film, it being possible to impart the profile shape of the s...
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WO/2015/013631A2 |
EC film stacks and different layers within the EC film stacks are disclosed. Methods of manufacturing these layers are also disclosed. In one embodiment, an EC layer comprises nanostructured EC layer. These layers may be manufactured by ...
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WO/2015/012327A1 |
Provided is a treated surface copper foil capable of rendering a post-copper foil removal substrate surface profile that achieves favorable electroless copper plating film adhesion strength while maintaining the ability to form microwiri...
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WO/2015/007307A1 |
Supporting tool (1) for supporting a substantially cylindrical part, like a landing gear rod or cylinder, said supporting tool comprising a metallic frame carrying at least one metallic ring (3) in electrical conductive relation with the...
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WO/2015/007924A1 |
The invention relates to a metallic substrate with ceramic coating obtained by means of plasma electrolytic oxidation, which is resistant to degradation owing to fretting corrosion of light metals and alloys thereof, in liquid state and/...
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WO/2014/181127A3 |
The present invention relates to the field of plating, including, but not limited to electroplating metallic articles, for example metallic discs that can be used as, or converted into, coins. Embodiments of the present invention describ...
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WO/2015/007384A1 |
The invention relates to a method for producing a magnetic functional layer (8, 16, 17) on a support substrate (5) by way of electrochemical deposition. The support substrate (5) in the form of a cathode (4) is arranged in an electrolyte...
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WO/2015/006479A1 |
Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric materi...
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WO/2015/006485A1 |
Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric materi...
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WO/2015/002838A1 |
Coated articles and methods for applying coatings including a layer comprising Rh and/or Ru are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high...
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WO/2015/002130A1 |
[Problem] To provide a metal foil for electromagnetic shielding which exhibits corrosion resistance superior to conventional Sn plating, an electromagnetic shielding member, and a shielded cable. [Solution] A metal foil for electromagnet...
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WO/2014/207975A1 |
Provided are: a plated material which has excellent abrasion resistance, electrical conductivity and sliding performance and low friction, and in which a plating layer does not undergo embrittlement properly; and a method for producing t...
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WO/2014/206705A1 |
The invention relates to a powder (10)-carrying component (11) as for example a pipe or a feed hopper, to which an adhesion-reducing layer (12) is applied, and to a method for producing same. According to the invention, plastic particles...
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WO/2014/206697A1 |
The invention relates to a tin coating (5) having a substantially equiaxial granular structure, a contact element having such a tin coating (5), and a method for applying such a tin coating (5). According to the invention, the tin coatin...
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WO/2014/208176A1 |
The purpose of the present invention is to provide, at a low price, a metal porous body usable for the electrode of a fuel cell, etc., as well as having exceptional corrosion resistance. The present invention provides a sheet-shaped meta...
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WO/2014/208204A1 |
The present invention addresses the problem that attempts to fill a via- or a through-hole using a conventional plating solution for tin or tin alloy plating are either unsatisfactory or, even when successful, extremely time-consuming...
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WO/2014/206395A1 |
The invention relates to a method for producing an electrical contact element, wherein the base of the contact element is formed by a metallic workpiece which runs through the following method steps in the listed sequence: degreasing, pr...
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WO/2014/203594A1 |
Provided is a porous metal body that excels in corrosion resistance in comparison to conventional porous metal bodies comprising nickel-tin binary alloys or nickel-chromium binary alloys. The porous metal body has a three-dimensional mes...
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WO/2014/202835A1 |
The invention concerns a method for manufacturing a copper product, wherein the copper product comprises a body made of copper; and the body is formed by electrolytically depositing copper.
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WO/2014/202587A1 |
The invention relates to a method for producing a product from rolled strip material, comprising the following steps: rolling a strip material made of sheet steel; creating a blank from the rolled material; shaping the blank into a shape...
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WO/2014/200106A1 |
Provided is a copper foil with carrier, having good visibility and working precision. The copper foil with carrier has, in order, a carrier, an intermediate layer, and an ultrathin copper layer. The color difference (ΔL) of the ultrathi...
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WO/2014/196576A1 |
Provided is a copper foil with a carrier, in which the peeling strength and the adhesive strength between an ultrathin copper layer and a resin base material is increased without causing the various other properties of the copper foil wi...
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