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Matches 701 - 750 out of 22,444

Document Document Title
WO/2014/196576A1
Provided is a copper foil with a carrier, in which the peeling strength and the adhesive strength between an ultrathin copper layer and a resin base material is increased without causing the various other properties of the copper foil wi...  
WO/2014/196291A1
Provided is a noble metal-coated member having further improved corrosion resistance. The noble metal-coated member is characterized by comprising a member, a nickel-cobalt alloy layer containing cobalt in an amount of 0.5 to 99 mass% an...  
WO/2014/076078A3
The device (1) according to the invention is suggested for gentle treatment of a flat material (B) to be treated with a treatment liquid (F). The device (1) has the following components: at least one treatment chamber (20), in which the ...  
WO/2014/192811A1
Provided are a rubber composition having excellent initial adhesiveness and humid adhesiveness with metal, a rubber-metal composite body ideal for rubber products such as automobile tires and industrial belts that require strength, and a...  
WO/2014/192895A1
Provided is a copper foil for use in a semiadditive method which, when laminated on a resin substrate and etched on the entire surface, has excellent adhesive force between a plating film and the etching surface of the resin substrate on...  
WO/2014/187880A1
The invention relates to a coin-type product, in particular a coin, a coin blank, a medallion or a token, comprising a first outer layer (1) having a layer thickness (D1) and an electrical conductivity (σ1), and comprising a second oute...  
WO/2014/188897A1
 The substrate processing method according to the present invention for supplying a processing solution to a processing region of a substrate and performing predetermined processing using an ion to be processed in the processing soluti...  
WO/2014/057052A3
The present invention describes a method for manufacturing rotogravure cylinders with a cylinder base made of aluminum. The method involves the coating of the cylinder surface with high velocity spraying, the copper plating in an appropr...  
WO/2014/178259A1
 Provided is an electronic component that has an inexpensive structure and exhibits superior corrosion resistance even when exposed to a current of a four-gas mixture. An electronic component (10) is provided with at least a contact ...  
WO/2014/177563A1
The invention relates to an electrical contact element (1) having a connecting segment (5), which connecting segment is formed from a copper sheet (21) and has a coating (23), wherein the coating (23) comprises: a first layer (25, 39), w...  
WO/2014/167366A1
An electroplating rack for holding a plurality of sliding bearing shells whilst a coating is electroplated onto their concave inner surfaces, comprising an end bracket, wherein the end bracket comprises a liquid supply conduit for receiv...  
WO/2014/167201A1
A method and device for electrodeposition in cylindrical geometry. The invention relates to a method for electrochemically depositing a thin layer on a flexible substrate, comprising the following steps: -providing, in an electrolysis ba...  
WO/2014/037229A3
A device is designed for electroplating a material being treated (8) and has a hollow space (9) with an inner surface (51) to be coated. The device comprises a first frame part (11) with a first electrode (21) for holding and electricall...  
WO/2014/165867A1
Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used ...  
WO/2014/155331A1
An apparatus (10) for the surface electrolytic treatment in continuous of metal semi-finished products, in particular flat metal semi-finished products, comprising a containment tank (12) containing an electrolytic solution (SE) and insi...  
WO/2014/157193A1
[Problem] To provide a technology that can prevent a fatigue breakdown from propagating from a soft layer into a base layer. [Solution] This sliding member and slide bearing are provided with: base layer such that, in a matrix, soft part...  
WO/2014/156310A1
Provided are an apparatus and a method for forming a metal coating film, whereby it becomes possible to form a metal coating film having a desired film thickness on the surfaces of multiple bases continuously and it also becomes possible...  
WO/2014/157206A1
A method for manufacturing a multilayer wiring substrate, wherein an insulation layer and a metal foil in the top layer thereof are integrally layered on an inner-layer material in which wiring is formed, an opening for a via hole is pro...  
WO/2014/148200A1
Provided is a silver-plated material with excellent heat resistance, bending workability and abrasion resistance. In this silver-plated material which comprises a 10μm or thinner surface layer consisting of silver and formed on a materi...  
WO/2014/148201A1
Provided is a silver-plated material with excellent bending workability which comprises a foundation layer consisting of nickel and formed on a base material and which comprises a surface layer consisting of silver and formed on the surf...  
WO/2014/141071A1
The present invention refers to a method for the preparation of metal foams with coating of metal matrix and graphene by an electrodeposition process and to the high-performance metal foams obtainable with said method.  
WO/2014/142007A1
Provided is a method for forming conductive ultrafine patterns having excellent pattern cross-section shapes, by means of a technology that combines a printing process and a plating process. Further provided are: conductive ultrafine pat...  
WO/2014/144180A1
Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nan...  
WO/2014/134694A1
The present invention relates to a cylinder sleeve (10) for internal combustion engines, more concretely to a cylinder sleeve (10) inserted by casting into an engine block (8), wherein the circumferential outer surface (2) is provided wi...  
WO/2014/136763A1
The purpose of the present invention is to provide: a copper foil for laser processing which has excellent laser processability and from which a wiring pattern can be satisfactorily formed; a carrier-foil-supported copper foil for laser ...  
WO/2014/136785A1
Provided is a copper foil with an attached carrier, said copper foil being suitable for fine-pitch pattern formation. Said copper foil is provided with the following, in this order: a carrier, i.e. a support; an intermediate layer; and a...  
WO/2014/133164A1
The purpose of the present invention is to provide a copper foil for a printed circuit board, the copper foil having: a blackened surface capable of improving CCD visibility during terminal connection processing and precision of flexible...  
WO/2014/132947A1
A carrier foil, an ultrathin copper foil, and an ultrathin copper foil with a carrier in which a separation layer is formed between the carrier foil and the ultrathin copper foil, wherein the invention is characterized in that the separa...  
WO/2014/029667A3
The invention relates to a method for light entrapment in coating baths, in order thereby to deposit metal on a surface of a semiconductor component in a light-induced or light-supported manner. The method comprises at least the followin...  
WO/2014/129297A1
The purpose of the present invention is to provide a film mirror and a film mirror production method with which a film mirror having a high reflectance is obtained by using silver plating. This method for producing a film mirror involves...  
WO/2014/129222A1
Provided is a terminal in which loss of strength and loss of thickness of a welded area is suppressed and breakage during the swaging process is suppressed. This terminal comprises a connector section, a tubular pressure-bonded section, ...  
WO/2014/129221A1
Provided are: a metal member which has improved copper and copper alloy laser weldability, and a small heat-affected zone; a terminal and an electric wire connection structure formed using the metal member; and a method for manufacturing...  
WO/2014/128833A1
[Problem] To provide a copper foil for graphene production and a graphene production method using the copper foil, whereby it is possible to produce high-quality large-area graphene at a low cost. [Solution] A copper foil (10) for graphe...  
WO/2014/130452A1
The described embodiments relate generally to aluminum films and methods for forming aluminum films. Methods involve providing aluminum films having increased hardness. Methods involve using higher than conventional current densities dur...  
WO/2014/124793A1
The present invention relates to a method for producing high energy magnets comprising light and heavy rare earth metals, characterized in that at least one heavy rare earth metal is introduced into the permanent magnet from an ionic liq...  
WO/2014/125972A1
Provided are a continuous plating patterning roll, which solves the problem of side etching and has excellent insulating layer adhesiveness, and a manufacturing method therefor. The continuous plating patterning roll is configured so as ...  
WO/2014/123878A1
Provided in one embodiment is a filtering article, comprising: powders comprising bundles of nanotubes, each bundle comprising hollow titania nanotubes. Embodiments of the methods of making and using the filtering articles are also provi...  
WO/2014/115457A1
This sliding member comprises: a base; a hard chromium plating layer that is formed on the surface of the base and is mainly composed of chromium; and a hard carbon layer that is formed on the hard chromium plating layer and is mainly co...  
WO/2014/112298A1
Provided is a connector terminal with which the heat resistance is excellent and the formation of a high-hardness insulating film on an electrical contact outermost surface is avoided even in usage in a high-temperature environment; also...  
WO/2014/110958A1
A method and a system for producing an electrolytic copper foil by using reverse flow of a copper sulfate solution. The system comprises a cathode roller (1) and an anode groove (3). Upper end openings (3-1) of two sides of the anode gro...  
WO/2014/109396A1
Provided are a surface treated copper foil that even when employed in high-frequency circuit boards affords satisfactory reduction of transmission loss, a laminate board, a copper foil with a carrier, a printed wiring board, a printed ci...  
WO/2014/108756A1
A drill pipe tool joint comprising:a pin including a male threaded portion at an outer surface; and a box including a female threaded portion at an inner surface, the female threaded portion to be screwed and fastened to the male threade...  
WO/2014/109083A1
A copper ally for an electronic or electrical device, containing more than 2.0 to 36.5 mass% of Zn, 0.1 to 0.9 mass% of Sn, 0.05 to less than 1.0 mass% of Ni, 0.5 to less than 10 mass ppm of Fe, 0.001 to less than 0.10 mass% of Co, and 0...  
WO/2014/094998A1
The invention relates to an object (18) such as a wire which is electrolytically coated by dipping the object into an electrolyte tank (10) having an electrolyte (12), in which at least one soluble anode (14), which is connected to a pos...  
WO/2014/090125A1
Provided are a composition and a method for preparing a diamond wire saw using same. The composition comprises 85-95% by weight of ethyl α-cyanoacrylate, 3-8% by weight of a tackifier, 1-3% by weight of a stabilizer, and 2-4% by weight ...  
WO/2013/024305A3
A method of depositing an active material for a metal ion battery comprising the steps of: providing a conductive material in an electrodeposition bath wherein the electrodeposition bath contains an electrolyte comprising a source of the...  
WO/2014/088944A1
The present disclosure provides devices, systems and methods with applicability in the coating of surfaces, in particular three-dimensional surfaces, via anodization reactions. For example, the disclosed devices, systems and methods find...  
WO/2014/084304A1
The present invention is a manufacturing method for a semiconductor device, wherein a template, which has multiple flow paths for delivering a treatment liquid to a substrate, said substrate having multiple through-holes penetrating in t...  
WO/2014/080958A1
Provided is a copper foil having a carrier, endowed with high cohesive force between the carrier and an ultra-thin copper film prior to the step of lamination to an insulating substrate, the cohesion of the carrier and the ultra-thin cop...  
WO/2014/080765A1
The objective of the present invention is to obtain a substrate for flexible devices, which has good moisture barrier resistance and good adhesion of an insulating layer. A substrate (11) for flexible devices according to the present inv...  

Matches 701 - 750 out of 22,444