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WO/2018/095133A1 |
A method of preparing an electroplating copper layer having a preferred growth orientation includes: providing an electroplating solution that includes 120 to 200 g /L of copper sulfate, 50 to 150 g /L of sulfuric acid, 100 to 1000 ppm o...
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WO/2018/087135A1 |
This invention relates to a method for electroplating an uncoated steel strip with a plating layer from a trivalent Cr-electrolyte, where the uncoated strip is subjected to a cleaning and pickling step prior to the plating process and th...
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WO/2018/083496A1 |
Herein is disclosed, a method of plating an item with a first metal, the method comprising providing a plating solution comprising a liquid medium, a precursor species for forming a layer of the first metal on the items, and a plurality ...
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WO/2018/084811A1 |
A method for producing a coated wire rope, the method comprising the steps of: guiding an element to a first wire coating device; applying a metal and metal coated grit to said element; guiding said element to a second wire coating devic...
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WO/2018/079253A1 |
The present invention provides: an electrical contact which is capable of achieving a good balance between low coefficient of friction and low contact resistance even after sliding; and a connector terminal pair and a connector pair, eac...
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WO/2018/074212A1 |
Provided is a threaded joint for a pipe having excellent seizing resistance and an excellent external appearance; also provided is a manufacturing method therefor. An embodiment of this threaded joint for a pipe is equipped with a pin (3...
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WO/2018/074883A1 |
An embodiment of the present invention provides a through-electrode filling method comprising: a step of immersing a through-electrode including a via in a copper plating solution having a leveler and a copper electrolyte; a first curren...
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WO/2018/074256A1 |
[Problem] To provide a conductive bar material which maintains low contact resistance in a high temperature environment and exhibits excellent heat resistance, while having excellently low insertion resistance. [Solution] A conductive ba...
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WO/2018/074255A1 |
Provided are a connection terminal and a method for producing the connection terminal, which make it possible to reduce the coefficient of friction and curb the changes over time at high temperatures, while also maintaining connection re...
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WO/2018/073011A1 |
A composition comprising metal ions and at least one compound of formula I (I) wherein X1 and X2 are independently selected from a chemical bond and straight chain or branched C1-C18 alkanediyl, which may optionally be interrupted by O, ...
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WO/2018/068971A1 |
The invention relates to a method for producing a light-guiding element (102). In this case, a light-guiding body (106) is coated at least in some sections with a light-permeable metal layer (108) by sputtering at least one metallic scat...
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WO/2018/070188A1 |
This electrolytic treatment tool, which uses a treatment liquid supplied to a substrate to be processed and performs an electrolytic treatment on the substrate to be processed, has: a base body having a planar shape, a recessed part form...
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WO/2018/066297A1 |
Disclosed is an electrolytic treatment tool that is used at the time of subjecting a substrate to be treated to an electrolytic treatment by using a treatment solution supplied to the substrate to be treated, the electrolytic treatment t...
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WO/2018/062341A1 |
The purpose of the present invention is to obtain: a steel sheet for a motorcycle fuel tank, the sheet being excellent in terms of press workability in a tank production process, seam weldability and corrosion resistance of the inner sur...
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WO/2018/061061A1 |
The purpose of the present invention is to obtain a fuel tank member which is excellent in terms of press workability in a tank production process, seam weldability and corrosion resistance of the inner surface of a tank, and which is su...
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WO/2018/057707A1 |
An electrolytic plating composition for superfilling submicron features in a semiconductor integrated circuit device and a method of using the same. The composition comprises (a) a source of copper ions to electrolytically deposit copper...
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WO/2018/057490A1 |
A process for electrodepositing a copper layer on a metalizing substrate is described. The metalizing substrate comprising a seminal conductive layer positioned on and in electrically conductive communication with a photovoltaic cell pan...
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WO/2018/056041A1 |
Provided are: a metal body which is suppressed in growth of whiskers on a metal plating layer; and a method for producing a metal body, wherein growth of whiskers is suppressed. A metal body according to the present invention is provided...
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WO/2018/056145A1 |
The present invention addresses the problem of the inability to form a uniform metal film due to weak adhesion of a deposition metal film making it impossible to obtain a uniform adhesive force, or due to partial aggregation of metal nan...
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WO/2018/051925A1 |
The purpose of the present invention is to provide a novel technique which enables a lithium ion secondary battery to have a higher capacity, while enabling the lithium ion secondary battery to exhibit sufficiently excellent cycle charac...
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WO/2018/052023A1 |
This zinc-nickel composite plating bath contains a zinc source, a nickel source, silicon dioxide particles (22) and an ammonium-based dispersant in such ranges that enable the achievement of a zinc-nickel composite plating film (10) wher...
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WO/2018/052009A1 |
Provided is a method for manufacturing a surface treatment steel sheet for a battery case, comprising forming a semi-gloss nickel plating layer by electroplating on at least the surface of a steel sheet that constitutes the outer surface...
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WO/2018/052724A1 |
A method of synthesizing high quality graphene for producing graphene particles and flakes is presented. The engineered qualities of the graphene include size, aspect ratio, edge definition, surface functionalization and controlling the ...
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WO/2018/048344A1 |
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1 ) silver in an amount in the range of from 99.99 ...
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WO/2018/049062A1 |
Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment a...
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WO/2018/048486A1 |
A coating system for a surface of a superalloy component is provided. The coating system includes a MCrAlY coating on the surface of the superalloy component, where M is Ni, Fe, Co, or a combination thereof. The MCrAlY coating generally ...
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WO/2018/047933A1 |
The purpose of the present invention is to provide a copper foil with which excellent adhesion, transmission characteristics, and heat resistance can be achieved and to provide a copper-clad laminate using the same. This copper foil is c...
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WO/2018/044930A1 |
A method creating a patterned film with cuprous oxide and light comprising the steps of electrodepositing copper from a solution onto a substrate; illuminating selected areas of said deposited copper with light having photon energies abo...
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WO/2018/033461A1 |
The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of For...
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WO/2018/029967A1 |
This electrode manufacturing method includes: a step in which a soluble salt of nickel, a soluble salt of iron, and aminocarboxylic acid are dissolved in water to prepare a plating solution; and a step in which a substrate is immersed in...
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WO/2018/019321A1 |
The invention relates to a heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions pre...
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WO/2018/022374A1 |
A method of applying a corrosion-resistant coating to a fastener including preheating an area of the fastener to be coated to elevate a temperature of the area and spraying the preheated area of the fastener with a molten or semi-molten ...
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WO/2018/020940A1 |
This laminate for see-through electrodes comprises a transparent base and a metal layer that is provided on at least one of both surfaces of the transparent base. The metal layer has a first surface that faces the transparent base and a ...
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WO/2018/015168A1 |
A composition comprising: (a) cobalt ions, and (b) an additive of formula (I) wherein R1 is selected from X-Y; R2 is selected from R1 and R3; X is selected from linear or branched C1 to C10 alkanediyl, linear or branched C2 to C10 alkene...
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WO/2018/017452A1 |
An apparatus for the electrodeposition of metals or metal alloys on semiconductor wafers is described. The apparatus includes plating cell, an anode disposed within the plating cell, a cathode comprising a semiconductor wafer positioned ...
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WO/2018/004151A1 |
The present invention relates to a surface-treated copper foil for a microcircuit board and a method for manufacturing the same and, more specifically, to a surface-treated copper foil for a microcircuit board and a method for manufactur...
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WO/2018/003620A1 |
This method for producing a plated roll comprises: a smoothing step of smoothing the surface of a roll base material composed of a cylindrical carbon fiber reinforced plastic; a base plating step of performing metal plating on the roll b...
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WO/2018/005155A1 |
An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module...
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WO/2018/003826A1 |
Provided is a carrier system capable of reliably carrying a substrate that is in a bent state. This carrier system is provided with an upper hand 237 on which a substrate WF is loaded. The upper hand 237 is provided with a base part 132 ...
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WO/2017/219797A1 |
The present invention relates to an electric copper plating liquid and an electric copper plating process thereof. The electric copper plating liquid comprises the following components: 20g/L to 240g/L of copper sulfate pentahydrate, 20 ...
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WO/2017/221485A1 |
[Problem]: To provide a copper-coated magnesium wire which meets the demand for a lightweight coil wire material, and a method of manufacturing the same. [Solution]: The abovementioned problem is solved by a copper-coated magnesium wire ...
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WO/2017/217387A1 |
According to the present invention, an electrodeposition article is formed with use of a tin or tin alloy plating bath which contains a predetermined branched polyoxyalkylene compound such as an alkylene oxide addition product of an alip...
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WO/2017/217234A1 |
[Problem] To provide a copper plating bath which contains a reduced amount of chlorine, considered to be attributable to wiring resistance, or is free of chlorine, without the need to highly purify copper sulfate. The copper plating bath...
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WO/2017/213021A1 |
The purpose of the present invention is to equalize the deposited amount of plating liquid remaining on a steel sheet between electroplating cells, thereby equalizing the thickness of final plating and achieving a surface appearance of f...
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WO/2017/206969A1 |
The invention relates to a device for chemically or electrochemically coating balls (1), comprising at least one spacing apparatus (2) for holding and spacing a plurality of balls (1) and a rotation apparatus (3) for holding and rotating...
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WO/2017/203668A1 |
This production method for a resin substrate with a plated coating includes: a step in which a surface treatment gas which includes at least fluorine gas is supplied to a resin substrate (20) that includes a reinforced fiber material (10...
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WO/2017/203767A1 |
This production method for a resin substrate with a coating includes: a step in which a surface treatment gas which includes at least fluorine gas is supplied to a resin substrate (20) that includes a reinforced fiber material (10), wher...
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WO/2017/205182A1 |
A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to pr...
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WO/2017/204246A1 |
In order to provide a soluble copper anode, an electrolytic copper plating device, an electrolytic copper plating method, and a method for preserving acidic electrolytic copper plating liquid that can stably suppress the generation of an...
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WO/2017/202587A1 |
The invention relates to a method and an installation for coating a scaled hot-rolled strip (10). The method comprises at least the following steps: (i) providing a hot-rolled strip (10) in the form of a hot-rolled preliminary strip, (ii...
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