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Patent Searching and Data


Matches 701 - 750 out of 21,882

Document Document Title
WO/2013/127405A1
Coins consisting of a steel core and a nickel surface layer are internationally known, as are coins with a copper surface layer. In circulating coins, nickel remains shiny, while copper becomes dull and dark, whereby the coin loses aesth...  
WO/2013/129306A1
The present invention is an antidazzle film which comprises a transparent support and an antidazzle layer formed on the transparent support and has a total haze of 1% or less, said antidazzle film being characterized in that the antidazz...  
WO/2013/129484A1
The present invention is a method for manufacturing a mixed crystal. The mixed crystal includes either or both of a microcrystal containing selenium and a microcrystal containing sulfur, a microcrystal containing copper, a microcrystal c...  
WO/2013/129030A1
The present invention is a primer composition for electrolytic plating that is used when performing electrolytic plating. The purpose of the present invention is to provide a primer composition for electrolytic plating that is capable of...  
WO/2013/125076A1
A copper-clad two-layer material which comprises a polyimide film having a thickness of 12.5 µm or less and a copper layer with a thickness of 1-10 µm formed on one surface of the polyimide film by sputtering or electroplating, charact...  
WO/2013/118416A1
A copper foil with a carrier provided with a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer. The intermediate layer is configured by lami...  
WO/2013/117269A1
A process of sequentially plating a plurality of elongated metal members (100, 200) in two or more plating cells (102, 110, 116, 126) comprises the following steps: a) guiding the plurality of elongated metal members (100, 200) at a firs...  
WO/2013/115079A1
This terminal (10) has: a connecting part (11) conductively connected to the counterpart terminal; and a barrel part (14), which is crimped to the terminal of a wire (15) in continuation from the connecting part (11). The terminal (10) i...  
WO/2013/115382A1
Provided is a copper foil for a printed wiring board that enables circuits that are suitable for fine pitches and have a cross-sectional shape with small footings to be manufactured at satisfactory cost. A copper foil for a printed wirin...  
WO/2013/115138A1
Provided is a hot-working tool having superior seize resistance. The present embodiment of a hot-working tool is provided with a substrate and a plating film. The plating film is formed at the substrate surface. Furthermore, the plating ...  
WO/2013/115276A1
Provided are a press-fit terminal that exhibits high whisker resistance, requires a low insertion force, is unlikely to cause shaving of plating when inserting the press-fit terminal into a substrate, and has high heat resistance, and an...  
WO/2013/076277A3
The present invention concerns an electrode for oxygen evolution in electroplating plants comprising a valve metal substrate and an outer catalytic layer, the substrate consisting of a metal plate provided with slits of area ranging from...  
WO/2013/111625A1
Provided are an electronic part for which whisker-inhibiting ability in terms of whisker length is dramatically increased, and a manufacturing method therefor. An electronic part having an electronic part element on which external electr...  
WO/2013/108415A1
Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper film is removed by etching. The surface-treated copp...  
WO/2013/108414A1
Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper foil is removed by etching. In the surface-treated c...  
WO/2013/105420A1
Disclosed is a plating device (1) that has a plating tank (3) that retains a plating fluid (2) and carries out magnetic metal plating on a shaft shaped member (5) immersed in the plating fluid (2) as a negative electrode. The plating dev...  
WO/2013/099532A1
A method for producing a porous metal body, the method being characterized in comprising: a step for forming an electroconductive covering layer by applying a coating on at least a skeleton surface of a porous resin in the form of a thre...  
WO/2013/102031A1
An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having ...  
WO/2013/092312A1
The present invention relates to a cyanide-free, pyrophosphate-containing electrolyte and a process for the electrolytic deposition of a ternary alloy of the elements copper, tin and zinc. The electrolyte and the process are characterize...  
WO/2013/094766A1
A plated article comprising a multi-layer plating film formed on top of a conductive-metal substrate. Said plated article is characterized by having the following on top of the aforementioned substrate, in this order: a porous plating la...  
WO/2013/088647A1
This method for manufacturing a metal lattice comprises: forming a recess on a principal surface of a silicon substrate; forming a first insulating layer on the surface at the side at which the recess has been formed; removing the first ...  
WO/2013/084949A1
Disclosed are a grease filter which reduces apparent specific gravity to reduce the weight of the grease filter, and has sufficient bending strength and high oil removal performance, and a method for manufacturing same. The present inven...  
WO/2013/084429A1
This method for manufacturing a metal lattice comprises forming a depression in the principal face of a silicon substrate, forming a first insulation layer on the surface of the side on which the depression is formed, removing the first ...  
WO/2013/084929A1
Provided are: a processing unit that has a condenser and that is caused to be able condense and reuse as processing liquid a processing liquid that is in a mist state having been vaporized during platemaking processing at the processing ...  
WO/2013/083987A1
A method of manufacturing a sliding bearing comprising providing a substrate as a cathode in an electrolyte within which a hard particulate is suspended, and depositing a composite layer of hard particulate embedded in a metallic matrix ...  
WO/2013/081139A1
The purpose of the present invention is to provide an electrolysis copper alloy foil that has excellent laser workability properties and that after laser working can be etched at a uniform speed in the thickness direction. In the present...  
WO/2013/076277A2
The present invention concerns an electrode for oxygen evolution in electroplating plants comprising a valve metal substrate and an outer catalytic layer, the substrate consisting of a metal plate provided with slits of area ranging from...  
WO/2013/073452A1
Provided are: a method for manufacturing brass-plated steel wire, said method achieving both energy saving in the manufacturing process and improvement in the quality of brass-plated steel wire; and a brass-plated high-carbon steel wire ...  
WO/2013/073339A1
A treatment method for substrates that carries out prescribed treatment by supplying a treatment liquid to a region to be treated on the substrate surface has: an alignment liquid supply step that supplies an alignment liquid to an align...  
WO/2012/060914A3
An electrically conductive protective coating or film is provided over the surface of a reflective coating of a solar mirror by flowing or directing a cation containing liquid and an anion containing liquid onto the conductive surface. T...  
WO/2012/125053A4
A process for the selective electrochemical conversion of carbon dioxide into hydrocarbons, namely C2 hydrocarbons is presented. The process is carried out in an electrochemical cell where the cathode is a modified electrode with copper ...  
WO/2013/069689A1
A commutator material such that all or part of a conductive substrate is plated with silver or a silver alloy, and the silver or silver-alloy surface is further plated with gold or a gold alloy, the commutator material being characterize...  
WO/2013/065831A1
Provided is a roughened copper foil that has a black surface and good etching properties. This copper foil for a printed circuit has a non-black roughened layer and a nickel-tungsten alloy plating layer formed in this order on at least o...  
WO/2013/065713A1
Provided is a copper foil for a printing circuit in which after a first particle layer of copper is formed on the surface of a copper foil, a second particle layer of a ternary alloy comprising copper, cobalt and nickel is formed on top ...  
WO/2013/065727A1
A copper foil for a printed circuit, the foil having a copper primary particle layer formed on the surface of a copper foil, and a three-component alloy secondary particle layer, formed from copper, cobalt and nickel, subsequently formed...  
WO/2013/065730A2  
WO/2013/065230A1
Provided is a semiconductor device with which, while alleviating thermal resistance increases, it is possible to minimize thermal resistance which is applied to a solder layer. The semiconductor device has a positioning structure which c...  
WO/2013/061841A1
Provided is a porous current collector that can be manufactured cheaply, and has high heat resistance and oxidation resistance, and furthermore, is provided with the necessary mechanical strength, and is capable of demonstrating high dur...  
WO/2013/050664A1
The present invention relates to the production of a compression press for a pulverulent material for a tablet press comprising a preformed active part intended to be in contact with said material with a view to compressing said material...  
WO/2012/119822A3
The invention relates to a plain bearing composite material (2) having a carrier layer (4), in particular made of steel, a layer (6) made of a bearing material, in particular based on copper or aluminum, applied to said carrier layer, an...  
WO/2013/047272A1
An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 μm. Provided is the electrolytic copper...  
WO/2013/047628A1
Provided is silver plating that has favorable bending workability and that can suppress an increase in contact resistance even if used in a high temperature environment. The silver plating has a silver outer layer formed on the surface o...  
WO/2013/019412A3
Articles of manufacture comprise a body. A porous material is plated on the body, the porous material comprising nickel having a plurality of pores disposed in a generally ordered array extending into the nickel. Methods of forming a por...  
WO/2013/042663A1
Provided is a copper foil for a flexible printed wiring board having high thickness precision. The surface roughness (Ra) in the direction parallel to rolling has a mean value (Raavg) of 0.01 to 0.15 µm, and ΔRa=Ramax-Ramin is 0.025 µ...  
WO/2012/125053A3
A process for the selective electrochemical conversion of carbon dioxide into hydrocarbons, namely C2 hydrocarbons is presented. The process is carried out in an electrochemical cell where the cathode is a modified electrode with copper ...  
WO/2013/042572A1
Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal materi...  
WO/2013/038889A1
Provided is a solar cell interconnector material characterized by having, on an Al substrate surface, a 0.2μm or thicker Ni plating layer, and a Sn plating layer, in that order from the substrate side. By means of this invention, it is ...  
WO/2013/039671A1
A plating apparatus includes a vessel for holding a bath of plating liquid. A head is adapted to hold a work piece, such as a silicon wafer, in the vessel, with a seal on the head sealing against the work piece. A component cleaner assem...  
WO/2013/033810A1
A method and apparatus for electrochemically forming an oxide layer on a flat conductive surface which involves positioning a working electrode bearing the flat conductive surface in opposed parallel spaced apart relation to a flat condu...  
WO/2013/035805A1
 One purpose of the present invention is to provide a metal wire for rubber reinforcement that exhibits excellent wire drawability and adhesion with rubber compositions. The aforementioned issue is resolved by a metal wire for rubber...  

Matches 701 - 750 out of 21,882