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Patent Searching and Data


Matches 751 - 800 out of 21,923

Document Document Title
WO/2013/065730A2  
WO/2013/065230A1
Provided is a semiconductor device with which, while alleviating thermal resistance increases, it is possible to minimize thermal resistance which is applied to a solder layer. The semiconductor device has a positioning structure which c...  
WO/2013/061841A1
Provided is a porous current collector that can be manufactured cheaply, and has high heat resistance and oxidation resistance, and furthermore, is provided with the necessary mechanical strength, and is capable of demonstrating high dur...  
WO/2013/050664A1
The present invention relates to the production of a compression press for a pulverulent material for a tablet press comprising a preformed active part intended to be in contact with said material with a view to compressing said material...  
WO/2012/119822A3
The invention relates to a plain bearing composite material (2) having a carrier layer (4), in particular made of steel, a layer (6) made of a bearing material, in particular based on copper or aluminum, applied to said carrier layer, an...  
WO/2013/047272A1
An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 μm. Provided is the electrolytic copper...  
WO/2013/047628A1
Provided is silver plating that has favorable bending workability and that can suppress an increase in contact resistance even if used in a high temperature environment. The silver plating has a silver outer layer formed on the surface o...  
WO/2013/019412A3
Articles of manufacture comprise a body. A porous material is plated on the body, the porous material comprising nickel having a plurality of pores disposed in a generally ordered array extending into the nickel. Methods of forming a por...  
WO/2013/042663A1
Provided is a copper foil for a flexible printed wiring board having high thickness precision. The surface roughness (Ra) in the direction parallel to rolling has a mean value (Raavg) of 0.01 to 0.15 µm, and ΔRa=Ramax-Ramin is 0.025 µ...  
WO/2012/125053A3
A process for the selective electrochemical conversion of carbon dioxide into hydrocarbons, namely C2 hydrocarbons is presented. The process is carried out in an electrochemical cell where the cathode is a modified electrode with copper ...  
WO/2013/042572A1
Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal materi...  
WO/2013/038889A1
Provided is a solar cell interconnector material characterized by having, on an Al substrate surface, a 0.2μm or thicker Ni plating layer, and a Sn plating layer, in that order from the substrate side. By means of this invention, it is ...  
WO/2013/039671A1
A plating apparatus includes a vessel for holding a bath of plating liquid. A head is adapted to hold a work piece, such as a silicon wafer, in the vessel, with a seal on the head sealing against the work piece. A component cleaner assem...  
WO/2013/033810A1
A method and apparatus for electrochemically forming an oxide layer on a flat conductive surface which involves positioning a working electrode bearing the flat conductive surface in opposed parallel spaced apart relation to a flat condu...  
WO/2013/035805A1
 One purpose of the present invention is to provide a metal wire for rubber reinforcement that exhibits excellent wire drawability and adhesion with rubber compositions. The aforementioned issue is resolved by a metal wire for rubber...  
WO/2013/031913A1
Provided is a copper foil with a carrier, in which an ultrathin copper layer is not separated from a carrier before a process for lamination on an insulating substrate, while the ultrathin copper layer can be separated therefrom after th...  
WO/2013/031251A1
According to an embodiment of the present invention, plating is conducted using a strongly acidic tin-based plating solution which comprises a water-soluble tin (II)-containing substance, a water-soluble copper-containing substance, sulf...  
WO/2013/024814A1
Provided is a tin-plated copper alloy terminal member with outstanding insertion and removal characteristics and that demonstrates outstanding electrical connection properties while a coefficient of kinetic friction is reduced to 0.3 or ...  
WO/2013/019412A2
Articles of manufacture comprise a body. A porous material is plated on the body, the porous material comprising nickel having a plurality of pores disposed in a generally ordered array extending into the nickel. Methods of forming a por...  
WO/2013/018723A1
This high-strength steel sheet having superior moldability while securing the high strength of a maximum tensile strength of at least 900 MPa is characterized by having a predetermined component composition, the steel sheet structure con...  
WO/2013/018633A1
Provided is a sliding member comprising a member plated with a zinc alloy, in which a base is imparted with excellent corrosion resistance and which is a sliding member having excellent sliding properties, said sliding member comprising:...  
WO/2013/014863A1
In this production method for metal lattice: a recessed section having an insulated layer formed on the inside surface thereof is formed on a silicon substrate, and then the section of the insulated layer formed in the bottom section of ...  
WO/2013/012594A1
A method (100) for silver plating an electrical contact is provided. The method includes cleaning an electrical contact by removing oil (104) or other contaminants and exposing the electrical contact to at least one of an acid or base (1...  
WO/2011/073695A3
The present invention describes a method for manufacturing rotogravure cylinders with a cylinder base made of a light weight material like aluminum. The method involves the surface treatment of the cylinder with mechanical means, the cop...  
WO/2013/008019A1
Described herein are filter elements comprising a substrate with a composite layer on a surface of the substrate in which the composite layer comprises nanoparticles comprising a first metal, a first metal oxide or a combination thereof;...  
WO/2013/005774A1
Provided is a surface-treated steel sheet for battery cases which includes a nickel-cobalt alloy layer formed as an outermost layer on the surface which is to be the inner surface of a battery case. The steel sheet is characterized in th...  
WO/2013/004414A1
An installation (20) for continuously electroplating a plurality of elongated metal elements (21, 21', 21") with another metal comprises a bath (22) of an electrolyte wherein the elongated metal elements (21, 21', 21") are travelling. Th...  
WO/2013/002279A1
Provided is an electrolytic copper foil having a tensile strength of 300 MPa or greater and an elongation percentage of 3.0% or greater after heat treatment at 350ºC or higher for one hour. Also provided is a copper foil with which adhe...  
WO/2012/047102A3
The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the ...  
WO/2012/173178A1
Provided are: a conductive base for forming a wiring pattern of a collector sheet for solar cells, which has good rust inhibiting properties and solderability without using an organic rust inhibitor that may harm a solar cell element; an...  
WO/2012/173276A1
An embodiment of the present invention provides a hard-film-covered member in which a base material made from a soft metal is covered by an amorphous carbon film or other hard film so as to obtain better adhesion than conventionally. A h...  
WO/2012/169249A1
Provided is a copper clad laminate, which is obtained by bonding a liquid crystal polymer with a roughened copper foil that is formed of a copper-cobalt-nickel alloy plating, and which is free from roughening particle residue on the liqu...  
WO/2012/168447A1
The invention relates to a method for manufacturing, by percolation, a metallized or metallizable felt at least one felt element by means of electrodeposition, which includes: a step of keeping the felt element in a metallization reactor...  
WO/2012/165213A1
Provided are a porous metallic body having a three-dimensional network structure, a method for manufacturing the porous metallic body, an electrode material using the porous metallic body, and a cell. The porous metallic body exhibits a ...  
WO/2012/164992A1
This electrical contact component comprises a contact point for providing an electrical connection by contact, and a mounting part for providing an electrical connection with the exterior by solder joining. A plating layer containing car...  
WO/2012/165214A1
The purpose of the present invention is to provide a method for producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, said method being capable of forming an aluminum structure tha...  
WO/2012/085682A3
A method for plating strips comprising: providing a strip (1) of material, providing a masking belt (18) comprising patterned windows, providing a tank (13) with a plating solution, generating a continuous movement in the cell of an asse...  
WO/2012/156021A1
The invention relates to a press-in pin (10) having a main body and a coating which covers the main body at least in some sections. In order to provide a press-in pin with a lead-free coating which avoids or substantially minimises whisk...  
WO/2012/153728A1
[Problem] To provide an Ni-plated metal sheet having excellent welding properties, a welded structure, and a method for making a battery material. [Solution] An Ni-plated metal sheet (2) obtained by forming a first Ni-plating layer on th...  
WO/2012/147506A1
Provided is a technique for producing an electrical contact material for a connector whereby stable contact resistance is maintained over a long period and the insertion force during terminal insertion is sufficiently small, and which ha...  
WO/2012/146591A1
The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler for copper-deposition, w...  
WO/2012/141136A1
Provided is an aluminum electroplating solution which is highly soluble in non-aqueous solvents and whereby the quantity of electricity conducted in electroplating can be increased and aluminum electroplating can be carried out efficient...  
WO/2012/137613A1
This porous metal foil comprises a two-dimensional mesh structure composed of metal fibers. The porous metal foil has a first surface with a high degree of glossiness, and a second surface, positioned on the opposite side of the first su...  
WO/2012/137823A1
An Ni-containing surface-treated steel sheet for containers, which is to be molded by press molding. This Ni-containing surface-treated steel sheet for containers is provided with: a steel sheet which has a first surface that forms the o...  
WO/2012/138750A2
Embodiments of the invention relate to a method for preparing crystalline metal-organic frameworks (MOFs). The method includes the steps of providing an electrolyte solution in contact with a conductive surface, and applying a current or...  
WO/2012/133378A1
[Problem] To provide a Sn plating material that can suppress occurrences of Sn powder by partially exposing a Cu-Sn alloy layer in a reflow Sn plating layer on the surface of a copper or copper alloy strip. [Solution] A Sn plating materi...  
WO/2012/132572A1
This copper foil with a copper carrier comprises a structure of a copper layer, a nickel layer, and a copper carrier comprising a rolled copper foil or an electrolytic copper foil, and is characterized by having the nickel layer on the c...  
WO/2011/075561A8
The present invention provides a method and precursor structure to form a Group IBIIIAIVA solar cell absorber layer. The method includes forming a Group IBIIIAVIA compound layer on a base by forming a precursor layer on the base through ...  
WO/2012/132574A1
Provided is a composite copper foil formed from copper/nickel/copper, which is characterized in comprising rolled copper foil or electrolytic copper foil (A) having a thickness of 10 to 150 µm, a nickel layer (B) having a thickness of 0...  
WO/2012/132577A1
Provided is a copper foil with surface treatment layers, which is characterized by comprising a copper foil or copper alloy foil and, formed thereon, a plurality of surface treatment layers that comprise a roughened layer formed through ...  

Matches 751 - 800 out of 21,923