Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 801 - 850 out of 21,923

Document Document Title
WO/2012/132578A1
Provided is a copper foil with a copper carrier, the copper foil being characterized by comprising: a copper carrier (A) comprising an electrolytic copper foil or a rolled copper foil; a nickel layer (B) having a thickness of 0.03-2 μm ...  
WO/2012/132576A1
This rolled copper or copper-alloy foil provided with a roughened surface is a rolled copper or copper-alloy foil which is roughened by forming fine copper particles and which is characterized by being provided with a base plating layer ...  
WO/2012/132573A1
Provided is a composite copper foil that comprises a copper layer having a thickness of at least 5.1 μm and a nickel layer having a thickness of 0.5-3 μm on both surfaces or one surface of an electrolytic copper foil or a rolled copper...  
WO/2012/128150A1
The purpose of the present invention is to provide a copper alloy bar suitable for a battery connection tab material, which has a good balance among good tensile strength, electrical conductivity, repeated bendability and weldability. Th...  
WO/2012/128046A1
Provided is a metal member having a coating layer on a metal base material wherein the metal member is provided with a surface region in which the visual sense and tactile texture are different in different parts. Also provided is a meth...  
WO/2012/129190A2
This invention relates to a process for metal-coating a polyamide surface, to achieve metal-polyamide adhesion, and such metal-coated polyamide articles.  
WO/2012/124711A1
A Ni-W electroforming solution for producing forming dies which is for use in producing, by electroforming, a forming die to be used for producing a formed article which has a surface with a rugged pattern, the Ni-W electroforming soluti...  
WO/2012/122300A2
Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodiz...  
WO/2012/117533A1
Using a substrate intermediate (4) having through-holes (7) passing through an insulating layer (6) and two electroconductive masks (5) having openings at positions corresponding to the through-holes (7), the entirety of front and rear s...  
WO/2012/052657A3
The invention relates to manufacturing a I-III-VI compound in the form of a thin film for use in photovoltaics, including the steps of: a) electrodepositing a thin-film structure, consisting of I and/or III elements, onto the surface of ...  
WO/2012/114667A1
The present invention relates to a rubber-metal wire composite body which exhibits high adhesion between a rubber and a metal wire even if used for a long period of time. The present invention more specifically relates to a rubber-metal ...  
WO/2012/111601A1
The present invention provides: a three-dimensional porous aluminum mesh having a cell diameter that is not uniform in a thickness direction; a collector and electrode using said porous aluminum mesh; and manufacturing methods therefor. ...  
WO/2012/110676A1
The invention relates to a method for producing sintered sliding bearings by means of a powder-metallurgy process. Said method is characterised in that it includes the application of a porous surface coating (5) consisting of a soft meta...  
WO/2012/111353A1
The present invention addresses the problem of providing a method for producing an R-Fe-B sintered magnet having a plating film on the surface thereof and with excellent adhesion, said method including a series of steps that are performe...  
WO/2012/111585A1
Provided is a method in which the urethane resin is easily removed from an aluminum structure obtained by forming an aluminum film on the surface of a porous urethane resin having a three-dimensional network structure, while preventing t...  
WO/2012/108528A1
A sliding member (11) is provided with a substrate (12) and an overlay layer (13) superposed on the substrate (12). The overlay layer (13) has, arranged in the thickness direction, a plurality of regions from a region (13a) on a sliding ...  
WO/2012/103357A1
A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at sa...  
WO/2012/101975A1
Provided is a method for manufacturing an Sn alloy bump, wherein composition of the Sn alloy bump can be easily controlled. The method for manufacturing an Sn alloy bump formed of an alloy composed of Sn and other one or more kinds of me...  
WO/2012/098941A1
A porous metal which has a three-dimensional network structure constituted of an alloy comprising Ni and Cr, the porous metal being characterized in that the porous metal has a framework which is constituted of a shell having a hollow at...  
WO/2012/096220A1
The purpose of the present invention is to enable the aluminum plating of the surface of an article even when the article is a porous resin molding having a three-dimensional network structure, and to form a plating film having a uniform...  
WO/2012/091060A1
To supply an electrolytic copper foil for lithium-ion secondary battery negative electrodes with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even ...  
WO/2012/091139A1
Provided are a carbon nanotube/plating metal composite material with high conductivity and wherein metal plating is plated onto the inside of a high-density carbon nanotube assembly, and a production method for same. Also provided is a m...  
WO/2012/084046A1
An ECPR master electrode (30, 100, 200) is presented. The master electrode comprises a carrier element (31, 101, 201) having an electrically conducting electrode surface (33, 103, 203) on a back side and a topographical pattern on a fron...  
WO/2012/085811A1
Disclosed is a composition comprising a source of metal ions, one or more suppressing agents and at least one additive comprising a linear or branched, polymeric biguanide compound comprising the structural unit of formula L1 or the corr...  
WO/2012/084048A1
A method for providing a topographical pattern on a conducting or semiconducting carrier element of an ECPR master electrode is provided. The method comprises the steps of providing an etch mask on a front side of said carrier element; a...  
WO/2012/084045A1
Master electrodes and a methods for obtaining said master electrodes (100), for forming an electrochemical cell with a substrate, said master electrode comprising a first side (102) for arrangement on the substrate and a second side (104...  
WO/2012/084047A1
An ECPR master electrode(10) and a method for providing such master electrode is provided. The master electrode comprises a carrier element (20) having an electrically conducting electrode surface(23) on a backside (21) and a topographic...  
WO/2011/066824A8
The invention relates to the electrical contacting of band-shaped or plate-shaped material (1), which can be conveyed through an electroplating system on a transport track. The cathodically polarized contact means (6) are located, for ex...  
WO/2012/079101A1
The invention relates to a device (1) for metallizing wafers (11), in particular microchip wafers, in an electrolyte, the device consisting of a plurality of holder arrangements (3), each holder arrangement (3) having a chamber (27) for ...  
WO/2012/077550A1
Provided is a metallic porous body having excellent corrosion resistance, which is suitable for batteries, such as lithium-ion batteries, capacitors and current collectors of fuel cells. A method for manufacturing the metallic porous bod...  
WO/2012/073545A1
A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the ex...  
WO/2012/072437A1
The invention relates to an accumulator cell (20) comprising two terminals (10, 21). One terminal (10) is provided with a coating (12) made of a metal. The metal is identical to the metal of which the second terminal (21) consists, or ea...  
WO/2012/073652A1
Provided are a method for producing a porous silicon material filled with a metal, the method comprising the steps of rendering hydrophobic a porous silicon substrate having pores from 1 to 5 nm in diameter, and depositing a metal into t...  
WO/2012/070591A1
The objective of the present invention is to provide a copper foil having excellent softening resistance with which it is possible to inhibit reductions in tensile strength after heating at temperatures of around 350°C to 400°C. To ach...  
WO/2012/070589A1
The purpose of the present invention is to provide a copper foil exerting excellent resistance to softening and capable of preventing the tensile strength from reducing after being subjected to heat treatment at a temperature of 350 to 4...  
WO/2012/067202A1
A composite plating material that comprises the following: at least one base plating layer (2), on a conductive substrate (1), that comprises copper, nickel, cobalt, iron, or an alloy that contains at least one of said elements; and a su...  
WO/2012/059789A1
In this invention, a method for continuously surface treating and coating of foils (metals such as copper, aluminium, steel or other metals or non-metal materials) to able to have selective properties against solar spectrum and to improv...  
WO/2012/060914A2
An electrically conductive protective coating or film is provided over the surface of a reflective coating of a solar mirror by flowing or directing a cation containing liquid and an anion containing liquid onto the conductive surface. T...  
WO/2012/060275A1
Compared to a metal layer (plating layer) formed on the surface of or inside of a polyelectrolyte obtained using only conventional electroless plating, the disclosed method uses electroplating to produce a polyelectrolyte complex which i...  
WO/2012/021695A3
An electroplating apparatus having improved contact deplating features includes a bowl assembly (26) having a bowl (30) for holding an electroplating solution. A head (22) having a rotor (34) including a contact ring (40) and a head moto...  
WO/2012/056519A1
Provided are a metal component having a unique flat pattern which is different from patterns obtained by printing, stamping, etc., and a method for forming the metal component. An intermediate member (10a) for making an ornamental button...  
WO/2012/053283A1
The present invention provides an electroplating bath with which an electroplating Fe-W alloy coating may be formed. The elemental composition of the electroplating coating (energy dispersive X-ray spectroscopy, same hereafter) is W: 2 t...  
WO/2012/052532A1
The invention relates to a metal friction-fit member for assembling two parts, which comprises, on at least one surface thereof to be placed in contact with one of the parts, a coating of an oxide of said metal produced by treating the m...  
WO/2012/052657A2
The invention relates to manufacturing a I-III-VI compound in the form of a thin film for use in photovoltaics, including the steps of: a) electrodepositing a thin-film structure, consisting of I and/or III elements, onto the surface of ...  
WO/2012/050057A1
A template for use in the feeding of a treatment solution to predetermined positions on a substrate comprises; multiple openings which are formed on the surface of the template at positions respectively corresponding to the predetermined...  
WO/2012/007526A3
A device and method for electrochemical pattern replication, ECPR, is provided. The device comprises;a base;a bottom chuck on a X-Y-Theta stage;and a Z-stage with an attached top chuck, said chucks being configured to hold a master elect...  
WO/2011/149965A3
A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition co...  
WO/2012/046804A1
Provided is a copper foil with carrier capable of providing wirings of line/space=15 μm/15 μm or less on a printed circuit board on which copper foils are laminated. Also provided are a printed circuit board and a multilayer printed ci...  
WO/2012/047102A2
The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the ...  
WO/2012/020947A3
A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including ...  

Matches 801 - 850 out of 21,923