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Patent Searching and Data


Matches 801 - 850 out of 22,548

Document Document Title
WO/2014/038718A1
Provided are surface-treated copper foil, a laminated board, a copper-clad laminated board, a printed circuit board and an electronic device using this surface-treated copper foil which bonds well to resin and yields superior resin trans...  
WO/2014/038717A1
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which bonds well to resin and yields superior resin transparency after the copper foil has been etched and removed. After surface-treat...  
WO/2014/032994A1
The invention relates to a method for producing a metal component of a fitting, in particular of a pull-out guide. Said method is characterized by the following steps: I. providing a metal component made of steel; II. pre-treating, in pa...  
WO/2014/034171A1
The present invention provides a plating pretreatment technique whereby, when a workpiece is plated with the surface to be plated facing downward, the effects of air bubbles, etc., on the fine vias or trenches formed in the surface to be...  
WO/2014/034300A1
Provided is a connector terminal which uses aluminum or an aluminum alloy as a base, and has a nickel layer and a tin layer that is arranged on the nickel layer. This connector terminal can be easily processed and is reduced in damage to...  
WO/2014/030461A1
Provided is a plated terminal for connectors, which has a tin plating layer that forms the outermost surface and a nickel base layer, and wherein increase of the contact resistance of the outermost surface due to growth of a plate-like t...  
WO/2014/024878A1
Provided is a metal foil with a carrier, wherein the peel strength between a metal foil and a plate-like carrier that is formed of a resin is adjusted. A metal foil with a carrier, which is composed of a plate-like carrier that is formed...  
WO/2014/025727A2
Generally stated, provided is a sealed laminated metal structure. This laminated metal structure has a metal layer, where the metal layer has a first surface and an opposite second surface. A material is laminated on each of the first an...  
WO/2014/024994A1
Provided is a copper foil with a carrier attached thereto, wherein the adhesive force between the carrier and an ultrathin copper layer is high before a step consisting of lamination to an insulating substrate but decreases after said st...  
WO/2014/021219A1
Provided is a connector terminal which uses aluminum or an aluminum alloy as a base material and has a nickel layer and a tin layer that is formed on the surface of the nickel layer. This connector terminal is free from an increase in th...  
WO/2014/017238A1
Provided are: a metal material for electronic components, which has low occurrence of whiskers, low adhesive wear properties and high durability; a connector terminal which uses the metal material for electronic components; a connector; ...  
WO/2014/017937A1
The present invention refers to an electrodeposition process of nickel-cobalt coatings (2), from aqueous solutions containing nickel and cobalt salts, by applying a pulsed waveform in the cathodic current range. It also refers to nickel-...  
WO/2014/007002A1
Provided is a surface treated steel plate for a battery container that has a nickel-cobalt alloy layer formed on the outermost surface of a surface that forms the inner surface of a battery container. The surface treated steel plate for ...  
WO/2014/007568A1
Provided is a nickel (Ni)-copper (Cu) plated high-carbon steel wire for springs. The Ni-Cu plated high-carbon steel wire includes a core wire that includes a high-carbon steel wire; and a Ni-plating layer and a Cu player which are sequen...  
WO/2014/007090A1
This electroplating device is equipped with: a pipe interior sealing mechanism that closes off an internal flow path on the inside of a steel pipe in the axial direction of the pipe; a cylindrical insoluble anode arranged so as to face a...  
WO/2014/007139A1
[Problem] To provide a pipe which has a heat-resistant corrosion-resistant multi-ply plating layer having excellent processability. [Solution] A pipe which is characterized by comprising a multi-ply plating layer that is composed of: a Z...  
WO/2014/007025A1
Provided is a surface-treated steel sheet for battery containers, which has an iron-nickel diffusion layer that is formed by performing a thermal diffusion treatment after forming a nickel plating layer on a steel sheet so that the nicke...  
WO/2014/006781A1
Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is lami...  
WO/2014/003145A1
An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal using said electronic component metal material, and a connector terminal, a connector and an electronic compone...  
WO/2014/003144A1
An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal, a connector and an electronic component using said electronic component metal material are provided. This elec...  
WO/2012/085682A8
A method for plating strips comprising: providing a strip (1) of material, providing a masking belt (18) comprising patterned windows, providing a tank (13) with a plating solution, generating a continuous movement in the cell of an asse...  
WO/2014/003147A1
An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal using said electronic component metal material, and a connector terminal, a connector and an electronic compone...  
WO/2013/187420A1
Provided is a surface-treated copper foil with which adhesion with a resin is good and transparency of the resin after the copper foil has been removed by etching is excellent. Also provided is a laminated sheet using the same. The surfa...  
WO/2013/182615A1
The invention relates to a method for the production of a part, comprising the following steps: a) deposition of a diffractive layer on a substrate; b) deposition of a first photosensitive resin layer on the diffractive layer; c) illumin...  
WO/2013/180027A1
[Problem] To provide a surface-treated steel sheet for a container, a method for manufacturing the same, an organic-resin-coated surface-treated steel sheet, and a metal can, the surface-treated steel sheet having excellent processing ad...  
WO/2013/176133A1
Provided are a surface-treated copper foil that adheres well to resins and imparts superior resin transparency after the copper foil is etched away, and a laminated board using the same. A surface-treated copper foil is bonded, from a si...  
WO/2013/176115A1
The purpose of the present invention is to provide a copper foil which is inexpensive and can have a sufficient level of tensile strength even after being subjected to a heat treatment. To achieve the purpose, a copper foil is provided, ...  
WO/2013/175591A1
[Problem] A plating structure which is not sulfurized even by a lapse of time or a temperature rise; a light-emitter support provided with a reflecting surface which has a plating structure with excellent sulfurization resistance; and a ...  
WO/2013/172155A1
Provided are: a metal coating film which has excellent solder joint characteristics and is not susceptible to the formation of Sn whiskers; and an electronic component which is provided with this metal coating film. A metal coating film ...  
WO/2013/166569A1
The present invention relates to a galvanisation process (1) that includes a residue purification step, with the aim of achieving many improvements and ease of use for the manufacturing and processing industry of metal wires (A) in gener...  
WO/2013/168646A1
Provided are: a surface-treated copper foil which can adhere satisfactorily to a resin and which has an advantage in that, when the foil has been removed by etching, the resulting resin exhibits high transparency; and a laminate using th...  
WO/2013/168764A1
The purpose of the present invention is to provide a plated terminal which is for use in a connector and requires less insertion force by reducing the coefficient of friction, and a terminal pair formed using such a plated terminal for a...  
WO/2013/161125A1
Provided is a plated terminal for connectors, said plated terminal having a tin plating layer with aluminum or an aluminum alloy as a base material, and suppressing connection reliability deterioration due to corrosion of the plating lay...  
WO/2013/161334A1
A carrier-supported copper foil is provided in which the adhesion force between the carrier and the ultrathin copper layer is high before a step for laminating to an insulating substrate and which, after the step for laminating to an ins...  
WO/2013/102558A3
The invention provides a metallic foam material with better mechanical properties than known foamed materials, and a method of making such a material. Although known foamed metals are light in weight, and sandwich structures formed of su...  
WO/2013/151365A1
The present invention relates to a substrate carrier device for double-sided electroplating of a solar cell. The substrate carrier device (100) of the present invention comprises: wafer accommodation areas (105) which have apertures and ...  
WO/2013/151381A1
An apparatus for anodizing the inner surface of a tube of the present invention comprises: an electrolyte container for storing an electrolyte solution; a first solution conduit connected to the electrolyte container to be supplied with ...  
WO/2013/150690A1
To provide, at a low cost, a plated member and a plated terminal for connectors, to each of which a large current can be applied, and each of which has a good balance between low friction coefficient and high heat resistance. To also pro...  
WO/2013/149965A1
This process for manufacturing a cutting wire formed of abrasive particles held on a central core by a binder, comprises: a) the deposition (204) of abrasive particles on the central core, each abrasive particle comprising a magnetic mat...  
WO/2013/146088A1
Provided is a metal foil which has excellent adhesion to adhesives. At least one surface of the metal foil has a ten-point average roughness (Rz) of 2.0-6.0 µm and has a ratio of the roughness (Rz) to the average spacing (S) between the...  
WO/2013/140699A1
Disclosed are: an electric contact (14), which has improved durability by preventing a terminal (2a) of an electric component and the electric contact (14) from sticking to each other after continuity test; and a socket (10) for electron...  
WO/2013/141166A1
A solder-coated ball (10A) according to one embodiment of the present invention has a ball-shaped core (11) and a solder layer (12) formed so as to coat the core (11), the solder layer (12) includes Sn and Bi, the Bi content is 45 mass% ...  
WO/2013/137121A1
A silver plating material having a silver plating film having a thickness of no more than 10 µm formed upon a raw material comprising copper or a copper alloy. The arithmetic average roughness (Ra) of the surface of the silver plating f...  
WO/2013/133762A1
The invention relates to a doctor blade (1), having a multiple layer coating. The coating comprises at least one electrolytically puls-plated abrasion resistant nickel composite layer and at least one outer electrolytically puls-plated l...  
WO/2013/133885A1
A method of manufacturing a hohlraum in large quantities is disclosed. The method includes steps of electroplating a mandrel having a surface configured to correspond to the interior surface of half the hohlraum and then pressing the man...  
WO/2013/133269A1
An objective of the present invention is to provide a method for manufacturing a printed wiring board that has fewer manufacturing steps, has superior laser processing properties, and can satisfactorily form a wire pattern; and a copper ...  
WO/2013/129588A1
Provided are: an electrolytic copper foil, which has similar surface configurations on both surfaces, good wettability with an active material slurry and high battery capacity, while being suppressed in deterioration of the battery capac...  
WO/2013/129508A1
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad laminate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the...  
WO/2013/127405A1
Coins consisting of a steel core and a nickel surface layer are internationally known, as are coins with a copper surface layer. In circulating coins, nickel remains shiny, while copper becomes dull and dark, whereby the coin loses aesth...  
WO/2013/129306A1
The present invention is an antidazzle film which comprises a transparent support and an antidazzle layer formed on the transparent support and has a total haze of 1% or less, said antidazzle film being characterized in that the antidazz...  

Matches 801 - 850 out of 22,548