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Patent Searching and Data


Matches 801 - 850 out of 22,410

Document Document Title
WO/2013/172155A1
Provided are: a metal coating film which has excellent solder joint characteristics and is not susceptible to the formation of Sn whiskers; and an electronic component which is provided with this metal coating film. A metal coating film ...  
WO/2013/166569A1
The present invention relates to a galvanisation process (1) that includes a residue purification step, with the aim of achieving many improvements and ease of use for the manufacturing and processing industry of metal wires (A) in gener...  
WO/2013/168646A1
Provided are: a surface-treated copper foil which can adhere satisfactorily to a resin and which has an advantage in that, when the foil has been removed by etching, the resulting resin exhibits high transparency; and a laminate using th...  
WO/2013/168764A1
The purpose of the present invention is to provide a plated terminal which is for use in a connector and requires less insertion force by reducing the coefficient of friction, and a terminal pair formed using such a plated terminal for a...  
WO/2013/161125A1
Provided is a plated terminal for connectors, said plated terminal having a tin plating layer with aluminum or an aluminum alloy as a base material, and suppressing connection reliability deterioration due to corrosion of the plating lay...  
WO/2013/161334A1
A carrier-supported copper foil is provided in which the adhesion force between the carrier and the ultrathin copper layer is high before a step for laminating to an insulating substrate and which, after the step for laminating to an ins...  
WO/2013/102558A3
The invention provides a metallic foam material with better mechanical properties than known foamed materials, and a method of making such a material. Although known foamed metals are light in weight, and sandwich structures formed of su...  
WO/2013/151365A1
The present invention relates to a substrate carrier device for double-sided electroplating of a solar cell. The substrate carrier device (100) of the present invention comprises: wafer accommodation areas (105) which have apertures and ...  
WO/2013/151381A1
An apparatus for anodizing the inner surface of a tube of the present invention comprises: an electrolyte container for storing an electrolyte solution; a first solution conduit connected to the electrolyte container to be supplied with ...  
WO/2013/150690A1
To provide, at a low cost, a plated member and a plated terminal for connectors, to each of which a large current can be applied, and each of which has a good balance between low friction coefficient and high heat resistance. To also pro...  
WO/2013/149965A1
This process for manufacturing a cutting wire formed of abrasive particles held on a central core by a binder, comprises: a) the deposition (204) of abrasive particles on the central core, each abrasive particle comprising a magnetic mat...  
WO/2013/146088A1
Provided is a metal foil which has excellent adhesion to adhesives. At least one surface of the metal foil has a ten-point average roughness (Rz) of 2.0-6.0 µm and has a ratio of the roughness (Rz) to the average spacing (S) between the...  
WO/2013/140699A1
Disclosed are: an electric contact (14), which has improved durability by preventing a terminal (2a) of an electric component and the electric contact (14) from sticking to each other after continuity test; and a socket (10) for electron...  
WO/2013/141166A1
A solder-coated ball (10A) according to one embodiment of the present invention has a ball-shaped core (11) and a solder layer (12) formed so as to coat the core (11), the solder layer (12) includes Sn and Bi, the Bi content is 45 mass% ...  
WO/2013/137121A1
A silver plating material having a silver plating film having a thickness of no more than 10 µm formed upon a raw material comprising copper or a copper alloy. The arithmetic average roughness (Ra) of the surface of the silver plating f...  
WO/2013/133762A1
The invention relates to a doctor blade (1), having a multiple layer coating. The coating comprises at least one electrolytically puls-plated abrasion resistant nickel composite layer and at least one outer electrolytically puls-plated l...  
WO/2013/133885A1
A method of manufacturing a hohlraum in large quantities is disclosed. The method includes steps of electroplating a mandrel having a surface configured to correspond to the interior surface of half the hohlraum and then pressing the man...  
WO/2013/133269A1
An objective of the present invention is to provide a method for manufacturing a printed wiring board that has fewer manufacturing steps, has superior laser processing properties, and can satisfactorily form a wire pattern; and a copper ...  
WO/2013/129588A1
Provided are: an electrolytic copper foil, which has similar surface configurations on both surfaces, good wettability with an active material slurry and high battery capacity, while being suppressed in deterioration of the battery capac...  
WO/2013/129508A1
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad laminate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the...  
WO/2013/127405A1
Coins consisting of a steel core and a nickel surface layer are internationally known, as are coins with a copper surface layer. In circulating coins, nickel remains shiny, while copper becomes dull and dark, whereby the coin loses aesth...  
WO/2013/129306A1
The present invention is an antidazzle film which comprises a transparent support and an antidazzle layer formed on the transparent support and has a total haze of 1% or less, said antidazzle film being characterized in that the antidazz...  
WO/2013/129484A1
The present invention is a method for manufacturing a mixed crystal. The mixed crystal includes either or both of a microcrystal containing selenium and a microcrystal containing sulfur, a microcrystal containing copper, a microcrystal c...  
WO/2013/129030A1
The present invention is a primer composition for electrolytic plating that is used when performing electrolytic plating. The purpose of the present invention is to provide a primer composition for electrolytic plating that is capable of...  
WO/2013/125076A1
A copper-clad two-layer material which comprises a polyimide film having a thickness of 12.5 µm or less and a copper layer with a thickness of 1-10 µm formed on one surface of the polyimide film by sputtering or electroplating, charact...  
WO/2013/118416A1
A copper foil with a carrier provided with a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer. The intermediate layer is configured by lami...  
WO/2013/117269A1
A process of sequentially plating a plurality of elongated metal members (100, 200) in two or more plating cells (102, 110, 116, 126) comprises the following steps: a) guiding the plurality of elongated metal members (100, 200) at a firs...  
WO/2013/115079A1
This terminal (10) has: a connecting part (11) conductively connected to the counterpart terminal; and a barrel part (14), which is crimped to the terminal of a wire (15) in continuation from the connecting part (11). The terminal (10) i...  
WO/2013/115382A1
Provided is a copper foil for a printed wiring board that enables circuits that are suitable for fine pitches and have a cross-sectional shape with small footings to be manufactured at satisfactory cost. A copper foil for a printed wirin...  
WO/2013/115138A1
Provided is a hot-working tool having superior seize resistance. The present embodiment of a hot-working tool is provided with a substrate and a plating film. The plating film is formed at the substrate surface. Furthermore, the plating ...  
WO/2013/115276A1
Provided are a press-fit terminal that exhibits high whisker resistance, requires a low insertion force, is unlikely to cause shaving of plating when inserting the press-fit terminal into a substrate, and has high heat resistance, and an...  
WO/2013/076277A3
The present invention concerns an electrode for oxygen evolution in electroplating plants comprising a valve metal substrate and an outer catalytic layer, the substrate consisting of a metal plate provided with slits of area ranging from...  
WO/2013/111625A1
Provided are an electronic part for which whisker-inhibiting ability in terms of whisker length is dramatically increased, and a manufacturing method therefor. An electronic part having an electronic part element on which external electr...  
WO/2013/108415A1
Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper film is removed by etching. The surface-treated copp...  
WO/2013/108414A1
Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper foil is removed by etching. In the surface-treated c...  
WO/2013/105420A1
Disclosed is a plating device (1) that has a plating tank (3) that retains a plating fluid (2) and carries out magnetic metal plating on a shaft shaped member (5) immersed in the plating fluid (2) as a negative electrode. The plating dev...  
WO/2013/099532A1
A method for producing a porous metal body, the method being characterized in comprising: a step for forming an electroconductive covering layer by applying a coating on at least a skeleton surface of a porous resin in the form of a thre...  
WO/2013/102031A1
An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having ...  
WO/2013/092312A1
The present invention relates to a cyanide-free, pyrophosphate-containing electrolyte and a process for the electrolytic deposition of a ternary alloy of the elements copper, tin and zinc. The electrolyte and the process are characterize...  
WO/2013/094766A1
A plated article comprising a multi-layer plating film formed on top of a conductive-metal substrate. Said plated article is characterized by having the following on top of the aforementioned substrate, in this order: a porous plating la...  
WO/2013/088647A1
This method for manufacturing a metal lattice comprises: forming a recess on a principal surface of a silicon substrate; forming a first insulating layer on the surface at the side at which the recess has been formed; removing the first ...  
WO/2013/084949A1
Disclosed are a grease filter which reduces apparent specific gravity to reduce the weight of the grease filter, and has sufficient bending strength and high oil removal performance, and a method for manufacturing same. The present inven...  
WO/2013/084429A1
This method for manufacturing a metal lattice comprises forming a depression in the principal face of a silicon substrate, forming a first insulation layer on the surface of the side on which the depression is formed, removing the first ...  
WO/2013/084929A1
Provided are: a processing unit that has a condenser and that is caused to be able condense and reuse as processing liquid a processing liquid that is in a mist state having been vaporized during platemaking processing at the processing ...  
WO/2013/083987A1
A method of manufacturing a sliding bearing comprising providing a substrate as a cathode in an electrolyte within which a hard particulate is suspended, and depositing a composite layer of hard particulate embedded in a metallic matrix ...  
WO/2013/081139A1
The purpose of the present invention is to provide an electrolysis copper alloy foil that has excellent laser workability properties and that after laser working can be etched at a uniform speed in the thickness direction. In the present...  
WO/2013/076277A2
The present invention concerns an electrode for oxygen evolution in electroplating plants comprising a valve metal substrate and an outer catalytic layer, the substrate consisting of a metal plate provided with slits of area ranging from...  
WO/2013/073452A1
Provided are: a method for manufacturing brass-plated steel wire, said method achieving both energy saving in the manufacturing process and improvement in the quality of brass-plated steel wire; and a brass-plated high-carbon steel wire ...  
WO/2013/073339A1
A treatment method for substrates that carries out prescribed treatment by supplying a treatment liquid to a region to be treated on the substrate surface has: an alignment liquid supply step that supplies an alignment liquid to an align...  
WO/2012/060914A3
An electrically conductive protective coating or film is provided over the surface of a reflective coating of a solar mirror by flowing or directing a cation containing liquid and an anion containing liquid onto the conductive surface. T...  

Matches 801 - 850 out of 22,410