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Matches 851 - 900 out of 21,940

Document Document Title
WO/2012/007522A3
Methods for separating a master electrode (101, 201) and a substrate (102, 202) in an ECPR process after printing are disclosed. The master electrode (101, 201) or the substrate (102, 202) is arranged on a first chuck (103, 104, 203, 204...  
WO/2012/043514A1
Provided are a cylinder plating method and device with which it is possible to form a plating layer of uniform thickness using cylinder plating technology, and in addition to combine with plating technology that uses a divided insoluble ...  
WO/2012/043717A1
In order to address the problem of providing a novel method for forming an electric copper plating film with excellent adhesion on the surface of a rare earth permanent magnet, the method of the present invention is characterized by the ...  
WO/2012/043182A1
A copper foil for a printed wiring board, the copper foil being characterized by having, on at least on surface thereof, a roughened layer of the copper foil in which: at a distance accounting for 10% of the length of a particle from the...  
WO/2012/043513A1
Provided is an apparatus for plating a cylinder, wherein service life of the whole apparatus can be improved with a technology of plating a cylinder, hardness nonuniformity of the plating layer on the cylinder surface can be eliminated b...  
WO/2012/039285A1
A method for manufacturing a copper foil for a printed circuit board characterized by forming a roughened layer of roughened copper particles on at least one surface of a copper foil by using an electroplating bath of sulfuric acid or co...  
WO/2012/035701A1
The adhesiveness of a nickel-plated layer to a main fitting is improved, and a corrosion resistance improvement effect is sufficiently demonstrated as a result of providing the nickel-plated layer. A spark plug (1) is provided with a mai...  
WO/2011/110682A3
A photovoltaic cell (100) is proposed. The photovoltaic cell includes a substrate (105; 105') of semiconductor material, and a plurality of contact terminals (Tf,Tb) each one arranged on a corresponding contact area (122) of the substrat...  
WO/2012/029162A1
Disclosed is a method for producing an electrode for hydrogen generation in which electrolysis is carried out with a conductive base material for the cathode, a platinum group metal for the anode, and an aqueous solution of an inorganic ...  
WO/2012/029865A1
The purpose of the present invention is to provide a method for manufacturing a multilayer wiring board with excellent productivity, whereby highly fine metal wiring having high adhesiveness can be manufactured, and a multilayer wiring b...  
WO/2011/117256A3
The invention relates to a method for producing a selectively absorbing coating (3) on a solar absorber component (10), comprising the following steps: providing a substrate (1) having a metal surface, determining the inner surface of th...  
WO/2012/021695A2
An electroplating apparatus having improved contact deplating features includes a bowl assembly (26) having a bowl (30) for holding an electroplating solution. A head (22) having a rotor (34) including a contact ring (40) and a head moto...  
WO/2012/020947A2
A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including ...  
WO/2012/016937A1
The invention relates to a bearing arrangement (1), comprising at least one bearing (2) with a bearing outer ring (3) and a bearing inner ring (4), wherein the bearing outer ring (3) is arranged by way of an externally cylindrical seat s...  
WO/2011/047875A3
The present invention relates to a light-induced, galvanic deposition method, wherein the potential difference between a first metal contact and an auxiliary electrode is varied as a function of time according to a predefined voltage/tim...  
WO/2012/014029A1
Process of electrodepositing a metal in a high aspect ratio via in a silicon substrate to form a through-silicon-via (TSV), utilizing an electrolytic bath including a redox mediator, in an electrolytic metal plating system including a ch...  
WO/2012/015139A1
Disclosed is a production method for a plate heat exchanger. According to one embodiment of the present invention, the method for producing a plate heat exchanger comprises the steps of: forming a plate by the surface electroplating of a...  
WO/2012/008118A1
In the disclosed metallic lattice (DG) and the manufacturing method for the same, slit grooves are formed, by means of dry etching, in second silicon sections (12a) which are attached to a first silicon layer (11) and which have a higher...  
WO/2012/008119A1
In the disclosed metal lattice (DG) and the manufacturing method for the same, slit grooves are formed, by means of dry etching, in p-type silicon sections (12a) attached to an n-type silicon layer (11) so as to at least reach the n-type...  
WO/2011/012462A3
According to the present invention a composition is provided comprising at least one source of metal ions and at least one additive obtainable by reacting a) a polyhydric alcohol condensate compound derived from at least one polyalcohol ...  
WO/2012/007525A1
A chuck for holding a substrate or master electrode in an ECPR process is provided. The chuck comprises an interaction surface (101) for a master electrode or a substrate; and holding means for holding the substrate or master electrode o...  
WO/2012/007524A1
A chuck (100) for holding a substrate or master electrode in an ECPR process is provided. The chuck comprises an interaction surface (101) for holding a master electrode or a substrate; a buffer surface (102) circumferentially of the int...  
WO/2012/008120A1
Disclosed are a metal grid and a method for manufacturing the metal grid, wherein a slit trench that reaches at least a first silicon layer (11) is formed by dry-etching, in a second silicon portion (12a) attached to a first silicon laye...  
WO/2012/007521A1
A contact sheet (100) for making electrical contact to a master electrode in an ECPR process is provided. Said contact sheet (100) has a first proximal side (101) and a second distal side (102). The contact sheet (100) comprises an insul...  
WO/2012/007191A1
An integrated Electro Chemical Pattern Replication (ECPR) system (500) for performing electrochemical printing of nano or micro structures with an ECPR master on a conductive surface of a substrate is disclosed. By scheduling the operati...  
WO/2012/007520A1
A chuck (100, 200, 500) for holding a master electrode (107, 207) or a substrate (111, 211) during an ECPR process is provided. The chuck comprises an interaction surface (102, 201) onto which the master electrode (107, 207) or the subst...  
WO/2012/007523A1
A chuck for holding a substrate or master electrode in an ECPR process is provided. The chuck has a proximal and a distal end, and comprises an interaction surface (205) for holding the substrate or master electrode positioned in a first...  
WO/2012/005355A1
Disclosed is an anode collector that is for a lithium ion secondary battery and that has a large discharge capacity and high strength. The anode collector uses a copper-clad steel foil (10) that is for supporting an anode active material...  
WO/2012/005112A1
Provided are: a separator material for a fuel cell, in which a uniform first Au-plated layer having a thickness of 0.5-4 nm is formed on one surface of a metal thin plate and a uniform second Au-plated layer having a larger thickness tha...  
WO/2011/162126A1
Disclosed is an electrode for an electric storage device, which has, compared with conventional cases of bonding performed using spot welding and bolting, a large grounding area and a low resistance value at the bonding area, and which e...  
WO/2011/158698A1
A substrate having multiple electronic circuits formed on the surface thereof and a template are arranged so that the position of a through-hole in the substrate and the position of an opening formed on the surface of the template corres...  
WO/2011/154493A1
The subject-matter of the present invention is a composition especially intended for filling, by the electroplating of copper, a cavity in a semiconductor substrate such as a "through-via" structure for the production of interconnects in...  
WO/2011/145033A1
A method for anodising a profiled section (8) of aluminium or alloys thereof comprising the following steps : - electrically connecting a negative pole of a direct current generator (7) to a cathode (5) and a positive pole of the direct ...  
WO/2011/145647A1
Disclosed is a silver plated or silver alloy plated article which has high productivity, high reflectance in the visible light range and excellent sulfuration resistance. Specifically disclosed is an electrolytically silver plated and/or...  
WO/2011/142338A1
The disclosed method involves an conductivity-imparting step for forming on a surface of a resin molded body a conductive layer comprising one or more types of metal selected from a group comprising gold, silver, platinum, rhodium, ruthe...  
WO/2011/138876A1
Disclosed is a copper foil for a printed circuit formed from a secondary particle layer, which is formed from a three-element alloy comprising copper, cobalt, and nickel, on a primary particle layer, following the formation of a copper p...  
WO/2011/135673A1
Provided is a copper plating technique that enables the filing of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates and ceramic substrates. The disclosed tec...  
WO/2011/136061A1
Disclosed is a laminate for flexible wiring, in which a copper plate is applied entirely or locally on a copper foil that is cladded on an insulating resin substrate, and which is characterized in that the ratio (A) of the area intensity...  
WO/2011/135716A1
Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed tec...  
WO/2011/132538A1
Disclosed is a high purity aluminum structure formed by using a resin porous body having a three-dimensional network structure, plating, with aluminum in a molten salt bath, a resin molded body, at least the surface of which has been ren...  
WO/2011/127513A1
The invention relates to a multi-layer plain bearing (1) that has a front side (4) that can face the element to be supported and a rear side (6) opposite the front side, comprising a supporting layer (2), a sliding layer (3) arranged on ...  
WO/2011/127511A1
The invention relates to an anti-fretting layer (5) for a multi-layer plain bearing (1), the anti-fretting layer being composed of a copper-based alloy, which in addition to copper as the main alloying element contains at least one eleme...  
WO/2011/125555A1
Provided is a Cu-Zn alloy strip which is a copper alloy containing 2-12 mass% Zn, with the remainder comprising Cu and incidental impurities, and in which the frequency of twin-crystal boundaries is 40-70%. The alloy strip has satisfacto...  
WO/2011/118650A1
Disclosed is a copper alloy for electronic material which exhibits excellent plating film uniformity. When the cross section of the copper alloy is observed by SIM in a direction parallel to the rolling direction thereof: at a depth of 5...  
WO/2011/118537A1
Disclosed is a cyanide based electrolytic gold plating solution characterized by containing a dicyanoaurate (I) alkali salt or dicyanoaurate (I) ammonium salt such that the gold concentration is 1.0 - 5.0 g/L, crystal adjuster, conductiv...  
WO/2011/064154A3
A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide represented by formula (I) or derivatives of a polyaminoamide of formula (I) obtainable by complete or partial protonation, ...  
WO/2011/113908A1
A composition comprising a source of metal ions and at least one additive comprising a polyalkyleneimine backbone, said polyalkyleneimine backbone having a molecular weight Mw of from 300 g/mol to 1000000 g/mol, wherein the N hydrogen at...  
WO/2011/111700A1
Provided is a chip fuse which includes a fuse element that can be fused at a low temperature without fail. Surface electrodes are formed on a surface of an insulating substrate (1), and an Ni-P-Fe layer (15) is formed by plating so as to...  
WO/2011/108467A1
Disclosed is a copper foil for a negative electrode collector capable of simultaneously achieving high capacity and long life charge/discharge cycles in a secondary battery, wherein the front and rear surfaces are of a uniform shape and,...  
WO/2011/105072A1
A substrate treating apparatus (1) is provided with: a bath (11) wherein a substrate treatment solution (TL) is supplied thereto, and a substrate (PB) is immersed in the supplied substrate treatment solution (TL); and a holding section (...  

Matches 851 - 900 out of 21,940