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Patent Searching and Data


Matches 901 - 950 out of 21,923

Document Document Title
WO/2011/105392A1
Disclosed is a multilayer film lamination method, by which an amorphous carbon film can be formed at the top of an aluminum or aluminum alloy base with high adhesion and corrosion of a layer below the amorphous carbon film can be suppres...  
WO/2011/059831A3
Processes are provided herein for the fabrication of MFMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component ...  
WO/2011/105119A1
Disclosed are a plating bath and a plating method which enable the formation of a plated film comprising a copper alloy containing molybdenum at a high concentration. The plating bath can be used for the formation of a plated film compri...  
WO/2011/102059A1
Disclosed is a metal laminate structure (100) wherein: a first metal layer (1), which contains tungsten, is arranged on a first surface (2a) of a second metal layer (2), which contains copper; a third metal layer (3), which contains tung...  
WO/2011/038704A3
The invention relates to a copper die or copper die plate, and to a method for reworking such worn dies or die plates used for the continuous casting of metals or metal alloys. According to the invention, a coating consisting of electrol...  
WO/2011/099574A1
Disclosed are: a silver-coated composite material for a movable contact component, which has excellent plating adhesion even under repeated shear stress, while having a stably low contact resistance for a long period of time, and which p...  
WO/2011/096523A1
Disclosed is a sliding member (11) that has a base section (12) and an overlay layer (13) provided on the base section (12). The overlay layer (13) has Bi or a Bi alloy as the base, and contains Sn or an Sn alloy. The average particle si...  
WO/2011/096524A1
Disclosed is a sliding member having an overlay layer (13) containing Bi-based particles (14) comprising Bi or a Bi alloy. The long axis of the Bi-based particles (14) is considered to be X, the short axis Y, and the aspect ratio Z = X÷...  
WO/2010/062822A3
A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the v...  
WO/2011/093023A1
An electrolytic plating device (2) is provided with: a cathode (20) which is connected to an electroconductive layer (12); an anode (21) which is arranged below a substrate (1) so as to face the other surface of the substrate (1); and an...  
WO/2011/092131A1
The invention relates to a device for transporting plate-shaped substrates (10) in a system (8) for chemical and/or electrochemical treatment, in particular for currentless separation of conductive layers. The device according to the inv...  
WO/2011/090174A1
Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also ...  
WO/2011/090175A1
Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A ...  
WO/2011/090044A1
Provided is a copper foil for a secondary battery negative electrode power collector, which is obtained by performing a roughing process on both of the front and back surfaces of a rolled copper alloy foil. The copper foil is characteriz...  
WO/2011/086972A1
Disclosed is an electronic circuit which is characterized by comprising a copper circuit that is formed by etching and removing a part of a laminate, which is composed of a layer (A) that is composed of a copper or copper alloy foil form...  
WO/2011/086089A1
The invention relates to a tool for galvanically coating sliding bearings comprising at least one cover (34), to which a thief (36) is attached.  
WO/2011/083562A1
Provided is a Ni-plated steel sheet which has excellent pressability and is highly inhibited from causing die wear and which gives an alkali battery that can retain the battery characteristics even after a lapse of time. The Ni-plated st...  
WO/2010/130786A3
In a method for coating a wafer to produce solar cells, a metal such as nickel, copper, or silver is deposited on the wafer in a continuous process in a coating bath containing said metal. A wafer is inserted into the coating bath, and a...  
WO/2011/036306A3
The invention relates to an anti-corrosion layer containing predominantly zinc, in particular for steel materials. Said anti-corrosion layer is permeable to hydrogen. The invention also relates to a steel component comprising said layer ...  
WO/2011/076499A1
The invention relates to a method for coating a work piece, wherein a layer is electrochemically produced from a first material (28). In order to generate an inhomogeneous expansion behavior of the layer, according to the invention a the...  
WO/2011/042324A3
The invention relates to a method for producing metallised semiconductor substrates, in which a substrate is immersed in a coating bath, where it is coated in a preferably light-induced or light-assisted manner. The coated substrate is t...  
WO/2011/078077A1
Disclosed is a surface-treated copper foil characterized by comprising: a copper foil having a roughened surface; and a plating layer that is formed on the roughened surface of the copper foil and comprises cobalt and nickel in the total...  
WO/2011/075564A1
The present invention provides a method and precursor structure to form a solar cell absorber layer. The method includes electrodepositing a first layer including a film stack including at least a first film comprising copper, a second f...  
WO/2011/036158A3
The present invention is directed to a pretreatment process for copper electroplating of via or trench features on a wafer, comprising filling the via or trench feature with a pretreatment solution, wherein the pretreatment solution comp...  
WO/2011/075561A1
The present invention provides a method and precursor structure to form a Group IBIIIAIVA solar cell absorber layer. The method includes forming a Group IBIIIAVIA compound layer on a base by forming a precursor layer on the base through ...  
WO/2011/069683A1
The invention relates to a method and to an equipment for restoring a portion (11) of a metal body (1), said equipment including: an anode; a cathode; a current generator (7) for electrolysis between the cathode and the anode that can be...  
WO/2011/066824A1
The invention relates to the electrical contacting of band-shaped or plate-shaped material (1), which can be conveyed through an electroplating system on a transport track. The cathodically polarized contact means (6) are located, for ex...  
WO/2011/065166A1
Disclosed is a reflow Sn plated member wherein the occurrence of whiskers is suppressed, and which has reduced insertion/removal force. A reflow Sn layer is formed on the surface of base material comprising Cu or a Cu-based alloy, and th...  
WO/2010/133221A3
The invention relates to a device and a method for electrically contacting plate-shaped or strip-shaped material (1) which is conveyed on a conveyor belt through a continuous electroplating plant by means of rotating transport means and/...  
WO/2011/054036A1
A method of photoplating a metal contact onto a surface of a cathode of a photovoltaic device is provided using light induced plating technique. The method comprises: a) immersing the photovoltaic device in a solution of metal ions, wher...  
WO/2011/054571A1
The invention relates to a process for producing A steel strip having a cathodic anti-corrosion coating, wherein the steel strip is hot-rolled and then cold-rolled, wherein the steel strip is subjected to electrolytic galvanizing and, fo...  
WO/2011/054037A1
A light induced plating system (LIP) for creating front contacts on a photovoltaic is disclosed. The system involves the use of a patterned metal electrode with a plurality of raised contact areas that are in electrical contact with elec...  
WO/2010/133222A3
The invention relates to a method and a device for the electrochemical treatment of substrates in continuous installations or dip coating installations including the electric contacting of the material (1) on opposite edges by means of r...  
WO/2011/042324A2
The invention relates to a method for producing metallised semiconductor substrates, in which a substrate is immersed in a coating bath, where it is coated in a preferably light-induced or light-assisted manner. The coated substrate is t...  
WO/2010/133220A3
The invention relates to a method and a device for electroplating a material (1) comprising an electric contact in the outer edge thereof, especially for electroplating substrates, e.g. as a wafer in a cup plater. Conventional methods re...  
WO/2011/040280A1
Provided are a coating film of Sn or an Sn alloy formed by plating and a composite material having the coating film. The Sn or Sn alloy coating film formed by plating is prevented from wearing or falling off. Low-maintenance properties f...  
WO/2011/039875A1
Disclosed is a tin-plated Cu-Ni-Si-based alloy strip having excellent resistance to heat separation of the tin-plating. Specifically disclosed is a tin-plated Cu-Ni-Si-based alloy strip which comprises Ni in an amount of 1.0 to 4.5% by m...  
WO/2011/036306A2
The invention relates to an anti-corrosion layer containing predominantly zinc, in particular for steel materials. Said anti-corrosion layer is permeable to hydrogen. The invention also relates to a steel component comprising said layer ...  
WO/2011/036004A1
The invention relates to a method for coating a work piece (11), preferably the work roll of a mill, wherein the coating is carried out electrochemically, by means of brush plating, for example, by a carrier (15). According to the invent...  
WO/2011/036158A2
The present invention is directed to a pretreatment process for copper electroplating of via or trench features on a wafer, comprising filling the via or trench feature with a pretreatment solution, wherein the pretreatment solution comp...  
WO/2011/033916A1
Disclosed is a film-forming method which comprises: a step in which a substrate is prepared by forming a Co film as a seed layer on the surface of the substrate; a step in which negative voltage is applied to the substrate in such a way ...  
WO/2011/029507A1
In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization of the electrolyte liquid in the pores a...  
WO/2011/027528A1
Disclosed is a plating device which makes it possible to effectively form a plated layer of uniform thickness on base particles having an electrically conductive surface. The plating device is a device for plating base particles having a...  
WO/2011/024443A1
Disclosed is an Ni-plated steel sheet which has excellent pressability. Specifically disclosed is an Ni-plated steel sheet which comprises, in a surface that forms the outer surface of a battery can, an Fe-Ni diffusion layer, a softened ...  
WO/2011/019042A1
Disclosed is a copper alloy material for electrical/electronic components in which an alloy layer containing at least copper and tin is formed on a substrate comprising copper or copper alloy, wherein the area ratio of the region of the ...  
WO/2011/018478A1
The invention relates to an electrolyte for copper electroplating on a copper diffusion barrier layer (B), the barrier layer (B) covering a surface of a semiconductor substrate (S), said electrolyte comprising: - a source of copper ions,...  
WO/2011/019055A1
Disclosed is a copper foil which has excellent high frequency characteristics and heat resistance, while achieving high heat-resistant adhesion to a resin substrate at the same time. Specifically disclosed is a heat-resistant copper foil...  
WO/2010/147508A3
The invention relates to the field of producing finishing materials by chemically treating the surface of elongated metal articles, preferably finishing panels used for cladding the facades of buildings and structures and for finishing h...  
WO/2011/013445A1
Provided are a bead wire manufacturing method and manufacturing apparatus, in which a wire rod which has been raised to a high temperature by drawing a wire is subject to bluing without cooling the wire rod, whereby the temperature of th...  
WO/2011/010540A1
Provided is a resin composite electrolytic copper foil having a further increased thermal resistance, and an increased plating adhesion strength when a plating process is performed after a desmear process is performed in additive method ...  

Matches 901 - 950 out of 21,923