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WO/2014/125972A1 |
Provided are a continuous plating patterning roll, which solves the problem of side etching and has excellent insulating layer adhesiveness, and a manufacturing method therefor. The continuous plating patterning roll is configured so as ...
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WO/2014/123878A1 |
Provided in one embodiment is a filtering article, comprising: powders comprising bundles of nanotubes, each bundle comprising hollow titania nanotubes. Embodiments of the methods of making and using the filtering articles are also provi...
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WO/2014/115457A1 |
This sliding member comprises: a base; a hard chromium plating layer that is formed on the surface of the base and is mainly composed of chromium; and a hard carbon layer that is formed on the hard chromium plating layer and is mainly co...
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WO/2014/112298A1 |
Provided is a connector terminal with which the heat resistance is excellent and the formation of a high-hardness insulating film on an electrical contact outermost surface is avoided even in usage in a high-temperature environment; also...
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WO/2014/110958A1 |
A method and a system for producing an electrolytic copper foil by using reverse flow of a copper sulfate solution. The system comprises a cathode roller (1) and an anode groove (3). Upper end openings (3-1) of two sides of the anode gro...
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WO/2014/109396A1 |
Provided are a surface treated copper foil that even when employed in high-frequency circuit boards affords satisfactory reduction of transmission loss, a laminate board, a copper foil with a carrier, a printed wiring board, a printed ci...
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WO/2014/108756A1 |
A drill pipe tool joint comprising:a pin including a male threaded portion at an outer surface; and a box including a female threaded portion at an inner surface, the female threaded portion to be screwed and fastened to the male threade...
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WO/2014/109083A1 |
A copper ally for an electronic or electrical device, containing more than 2.0 to 36.5 mass% of Zn, 0.1 to 0.9 mass% of Sn, 0.05 to less than 1.0 mass% of Ni, 0.5 to less than 10 mass ppm of Fe, 0.001 to less than 0.10 mass% of Co, and 0...
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WO/2014/094998A1 |
The invention relates to an object (18) such as a wire which is electrolytically coated by dipping the object into an electrolyte tank (10) having an electrolyte (12), in which at least one soluble anode (14), which is connected to a pos...
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WO/2014/090125A1 |
Provided are a composition and a method for preparing a diamond wire saw using same. The composition comprises 85-95% by weight of ethyl α-cyanoacrylate, 3-8% by weight of a tackifier, 1-3% by weight of a stabilizer, and 2-4% by weight ...
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WO/2014/088944A1 |
The present disclosure provides devices, systems and methods with applicability in the coating of surfaces, in particular three-dimensional surfaces, via anodization reactions. For example, the disclosed devices, systems and methods find...
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WO/2014/084304A1 |
The present invention is a manufacturing method for a semiconductor device, wherein a template, which has multiple flow paths for delivering a treatment liquid to a substrate, said substrate having multiple through-holes penetrating in t...
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WO/2014/080958A1 |
Provided is a copper foil having a carrier, endowed with high cohesive force between the carrier and an ultra-thin copper film prior to the step of lamination to an insulating substrate, the cohesion of the carrier and the ultra-thin cop...
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WO/2014/080765A1 |
The objective of the present invention is to obtain a substrate for flexible devices, which has good moisture barrier resistance and good adhesion of an insulating layer. A substrate (11) for flexible devices according to the present inv...
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WO/2014/081041A1 |
Provided are a surface-treated electrolytic copper foil, a laminate, and a printed circuit board with which increased fineness of pitch is possible and for which the reliability of resin adherence is excellent. A surface-treated electrol...
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WO/2014/079911A2 |
This invention relates to a method for electrodeposition of a chromium containing metal coating on an electrically conductive object from a trivalent chromium based electrolyte wherein the object acts as the cathode and wherein at least ...
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WO/2014/079910A1 |
The invention relates to a coated steel substrate for packaging applications, said substrate containing 1. a recrystallisation annealed single or double reduced packaging steel blackplate, or 2. a cold-rolled and recovery annealed blackp...
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WO/2014/080959A1 |
Provided is a copper foil with carrier that is suitable for fine pitch formation. The copper foil with carrier is equipped with, in the following order, a carrier, a release layer, an ultra thin copper layer, and an optional resin layer....
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WO/2014/079909A1 |
The invention relates to a coated steel substrate for packaging applications, said substrate containing i). a conventional non-passivated electrolytic, optionally flowmelted, tinplate, or ii). a cold-rolled and recovery annealed electrol...
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WO/2014/076078A2 |
The device (1) according to the invention is suggested for gentle treatment of a flat material (B) to be treated with a treatment liquid (F). The device (1) has the following components: at least one treatment chamber (20), in which the ...
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WO/2014/073695A1 |
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, and a laminate using the same. A surface-treated copper foil in which the sk...
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WO/2014/073696A1 |
Provided are a surface-treated copper foil exhibiting excellent resin transparency after removal of the copper foil by etching, and a laminate using the same. A surface-treated copper foil, wherein when adhering the copper foil to both s...
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WO/2014/073692A1 |
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent visibility when seen through the resin, and a laminate using the same. A surface-treated copper foil having a color difference (ΔE*ab) ba...
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WO/2014/073694A1 |
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, a laminate using the same, a copper-clad laminate, a printed circuit board, ...
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WO/2014/073693A1 |
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent visibility when seen through the resin, and a laminate using the same. A surface-treated copper foil having a surface treatment performed ...
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WO/2014/067937A1 |
The invention relates to a method for manufacturing a strip made of aluminum or an aluminum alloy as well as to a coated aluminum or aluminum alloy strip, a formed metal part made of said aluminum or aluminum alloy strip as well as to an...
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WO/2014/065207A1 |
Provided is a mesh structure of one embodiment of the present invention that reinforces the connection portions of mesh and suppresses a deterioration in quality by using a plating film. This mesh structure comprises an insulation film f...
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WO/2014/065430A1 |
Provided is a copper foil with a carrier in which there are no limits to the types of ultra-thin copper layers and carriers, nor to the thicknesses of the copper layers and carriers, and in which warping of the copper foil is satisfactor...
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WO/2014/061352A1 |
Provided is a method for producing a metal plate having an alloy plating layer, which comprises a step wherein electroplating is carried out in a plating bath by having a metal strip continuously passed through the plating bath that is p...
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WO/2014/060333A1 |
The invention relates to an anodizing device for anodizing at least one internal surface element (22) of a metal tubular body (18) having an extension direction (24), comprising: an anodizing tank (10) for accommodating an electrolyte (1...
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WO/2014/057052A2 |
The present invention describes a method for manufacturing rotogravure cylinders with a cylinder base made of aluminum. The method involves the coating of the cylinder surface with high velocity spraying, the copper plating in an appropr...
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WO/2014/054189A1 |
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...
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WO/2014/054190A1 |
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...
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WO/2014/054817A1 |
[Problem] To provide at low cost and good producibility a silver reflection film, which has a high reflectance, the reflectance of which does not change easily even before and after heating, and which does not soften easily, and a light ...
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WO/2014/050772A1 |
A method for manufacturing a silver plating material that forms a surface layer comprising silver on the surface of a raw material or on the surface of a base layer formed on the raw material, wherein electroplating is performed in a sil...
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WO/2014/051123A1 |
A copper foil provided with surface-treated layers is characterized by being provided with a plurality of surface-treated layers comprising: a roughened layer which is formed upon a copper foil or a copper alloy foil as a result of rough...
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WO/2014/045704A1 |
The purpose of the present invention is to provide a connector terminal having a tin layer on the outermost surface and a material for the connector terminal, wherein independent of the details of the fine structure of the outermost surf...
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WO/2014/042412A1 |
The present invention relates to a method for surface-treating copper foil, the method comprising the steps of: a) forming nodules on the copper foil surface; b) adding the copper foil, on which nodules have formed, into a plating soluti...
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WO/2014/042201A1 |
Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper l...
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WO/2014/038263A1 |
Provided is an aluminum plating apparatus which is capable of successfully forming an aluminum plating on the surface of a base even in the cases where the surface is provided with an insulating or poorly conductive metal oxide film or t...
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WO/2014/038716A1 |
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which yields superior resin transparency after the copper foil has been etched and removed. After surface-treated copper foil has been ...
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WO/2014/038718A1 |
Provided are surface-treated copper foil, a laminated board, a copper-clad laminated board, a printed circuit board and an electronic device using this surface-treated copper foil which bonds well to resin and yields superior resin trans...
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WO/2014/038717A1 |
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which bonds well to resin and yields superior resin transparency after the copper foil has been etched and removed. After surface-treat...
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WO/2014/032994A1 |
The invention relates to a method for producing a metal component of a fitting, in particular of a pull-out guide. Said method is characterized by the following steps: I. providing a metal component made of steel; II. pre-treating, in pa...
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WO/2014/034171A1 |
The present invention provides a plating pretreatment technique whereby, when a workpiece is plated with the surface to be plated facing downward, the effects of air bubbles, etc., on the fine vias or trenches formed in the surface to be...
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WO/2014/034300A1 |
Provided is a connector terminal which uses aluminum or an aluminum alloy as a base, and has a nickel layer and a tin layer that is arranged on the nickel layer. This connector terminal can be easily processed and is reduced in damage to...
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WO/2014/030461A1 |
Provided is a plated terminal for connectors, which has a tin plating layer that forms the outermost surface and a nickel base layer, and wherein increase of the contact resistance of the outermost surface due to growth of a plate-like t...
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WO/2014/024878A1 |
Provided is a metal foil with a carrier, wherein the peel strength between a metal foil and a plate-like carrier that is formed of a resin is adjusted. A metal foil with a carrier, which is composed of a plate-like carrier that is formed...
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WO/2014/025727A2 |
Generally stated, provided is a sealed laminated metal structure. This laminated metal structure has a metal layer, where the metal layer has a first surface and an opposite second surface. A material is laminated on each of the first an...
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WO/2014/024994A1 |
Provided is a copper foil with a carrier attached thereto, wherein the adhesive force between the carrier and an ultrathin copper layer is high before a step consisting of lamination to an insulating substrate but decreases after said st...
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