Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1,151 - 1,200 out of 22,442

Document Document Title
WO/2009/118412A2
A method for the electrochemical plating or marking of metals includes providing a metal surface, providing an electroplating solution at the metal surface, and electroplating the metal surface with the electroplating solution. A top lay...  
WO/2009/119401A1
Disclosed is a method for plating a mandrel bar with Cr, comprising performing electroplating using a plating bath containing chromic acid: 100 to 250 g/L (liter), a sulfate radical: 3.0 to 5.5 g/L (liter), and a catalyst: 100 to 200% (w...  
WO/2009/116601A1
Disclosed is a metallic material for a connector, comprising a base material of a bar or a square wire material formed of copper or a copper alloy. In a part of the surface of the metallic material, a striped copper-tin alloy layer is pr...  
WO/2009/116346A1
Disclosed is a technique for forming a ULSI fine copper wiring by a simpler process. Specifically disclosed is an electronic member wherein an alloy thin film of tungsten and a noble metal, which is used as a barrier-seed layer for a ULS...  
WO/2009/116347A1
Disclosed is a technique for forming a ULSI fine copper wiring by a simpler process. Specifically disclosed is an electronic member wherein an alloy thin film of tungsten and a noble metal, which is used as a barrier-seed layer for a ULS...  
WO/2009/114965A1
An electrochemical deposition system which has a 3-D stacked architecture comprises a factory interface (10) for receiving semiconductor wafers, a mainframe (11) comprising a mainframe transfer robot (102,106) and a plurality of wafer ho...  
WO/2009/116602A1
Disclosed is a terminal for a connector, fabricated from a metallic material for a connector, comprising a tin layer or a tin alloy layer provided on a base material of copper or a copper alloy. The thickness of the tin layer or the tin ...  
WO/2009/117072A1
The present invention discloses thin film photovoltaic devices comprising Group II- VI semiconductor layers with a substrate configuration having an interface layer between the back electrode and the absorber layer capable of creating an...  
WO/2009/116621A1
Disclosed is a bearing comprising a base of a Cu alloy, a concave and convex part provided on the base, a plating layer which is formed of a ferromagnetic metal or an alloy of the ferromagnetic metal and is provided on the base to cover ...  
WO/2009/117475A1
A method includes: immersing a semiconductive substrate in an electrodeposition composition, wherein at least 20 percent by weight of resin solids in the composition is a highly cross-linked microgel component, and applying a voltage bet...  
WO/2009/116426A1
An electronic component is characterized in that a nickel plating film containing germanium is formed on a conductive base material surface of a connecting terminal section. In the electronic component, on the conductive base material su...  
WO/2008/129423A3
A method involves depositing a first electrically conductive material, using a deposition technique, into a via formed in a material, the via having a diameter at a surface of the material of less than about 10┬Ám and a depth of greater ...  
WO/2009/010473A3
This invention relates to a method for producing a metallic coating layer comprising nickel and molybdenum on an electrically conductive substrate by electrodeposition from an aqueous solution comprising nickel salts, gluconate anions an...  
WO/2009/110598A1
Provided is a plated product characterized by having equivalent hardness, contact resistance, color tone, and the like, to a rhodium plated product, and by being more economical than a rhodium plated product. A ruthenium-palladium alloy-...  
WO/2009/109171A2
The invention relates to a method for producing a multi-crystalline chromium layer as a substrate layer for the assembly of solar cells on a metal carrier, particularly for producing thin-film solar cells on galvanic strip processing sys...  
WO/2009/016292A3
The invention relates to a method for the electrolytic tinning of steel bands (2), using a soluble anode (600, 6000). The invention also relates to an electrotinning unit (1) and a removable, renewable soluble anode (600, 6000) for imple...  
WO/2008/103027A9
The present invention relates to a device for treating a band-shaped substrate (2) with a liquid, having a conveying system comprising a winding system (11) for guiding the band-shaped substrate (2) in a spiral path around the winding sy...  
WO/2009/093483A1
An object of the invention is to provide a ULSI micro-interconnect member wherein the coverages of especially the inner side surfaces of vias and trenches are adequate, the thickness with respect to the surface portion is even, and the m...  
WO/2009/089820A2
The invention relates to a strip electroplating plant for the electrochemical reinforcement of electrically conductive outer layers of a strip (2), particularly a foil strip (2), wherein the strip (2) having the electrically conductive o...  
WO/2009/089376A2
A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surf...  
WO/2009/083488A1
The invention relates to a method for making a metal microstructure, characterised in that it comprises the steps of forming, by a LIGA-UV method, a mould made of a photosensitive resin, and galvanically and uniformly depositing a layer ...  
WO/2009/079745A1
Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to...  
WO/2009/075320A1
The object is to provide a cooling device having a low thermal contact resistance between the cooling device and other material at a low cost. The cooling device is characterized by comprising a cooling body and a composite layer which i...  
WO/2009/076424A1
There is provided a method and composition for applying a composite coating having enhanced resistance to tin whisker formation onto a metal surface of an electrical component. The method comprises contacting the metal surface with an el...  
WO/2009/017530A3
Methods and apparatus for fabricating carbon nanotubes (CNTs) and carbon nanotube devices. These include a method of fabricating self-aligned CNT field-effect transistors (FET), a method and apparatus of selectively etching metallic CNTs...  
WO/2008/107194A3
The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, for the local introduction of doping agents and the local application of a metal seed layer, wherein a f...  
WO/2009/065557A1
The invention relates to the electric contacting of flat products to be treated electrolytically in flow-through systems. The products are particularly solar cells and printed circuit boards that are to be galvanized. The necessary elect...  
WO/2009/060821A1
A circuit board is provided with an insulating substrate (1) and a circuit (3) formed on the insulating substrate (1). The circuit is provided with a plated base layer (4) whereupon a pattern is formed by irradiating a metal thin film (2...  
WO/2007/056380A3
The present invention relates to an electroplating method in the manufacture of the surface mount precision metal resistor, the manufacturing steps are as below: a flat-shaped metal substrate strip being die stamped with predefined resis...  
WO/2009/055992A1
The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose su...  
WO/2008/154979A3
The invention relates to a method for producing a sliding element coated in a structured manner. According to said method, a metal or metal alloy is electrolytically deposited on the sliding element. The electrolytical deposition is carr...  
WO/2009/057707A1
A tin-plated material having a three-layer structure composed of a nickel layer, a copper-tin alloy layer, and a tin layer. The material is reduced in insertion force and improved in heat resistance. The tin-plated material comprises cop...  
WO/2009/054402A1
In an abrasion resistance reinforcing method of a sliding structure consisting of at least a pair of components in sliding relation and provided with a seal member on the sliding surface of one component, an abrasion resistant metal plat...  
WO/2009/054175A1
A press mold that even when foreign matter, such as iron powder, sticks to a mold surface, would maintain a high fair quality ratio of work after press working; a relevant method of treating a press mold surface; and a process for manufa...  
WO/2008/112086A3
This invention provides processes for selectively electroplating metal layers into recessed topographic features on the surface of a conductive substrate. The processes are useful for fabricating metal circuit patterns, for example for c...  
WO/2009/054092A1
A surface treatment device capable of applying a treatment with a high accuracy even to the top area of the end portion of a surface to be treated while preventing a surface treatment liquid from flowing to the side of the rear surface w...  
WO/2009/050878A1
A Ni plating is applied on a base metal in a metal strip form, and a brightener-free Sn-(1 to 4% by mass)Cu plating is applied on the Ni plating. The metal strip is heat-treated at a temperature at or above the melting point (solidus lin...  
WO/2009/050970A1
This invention provides a metal covered polyimide composite, which can effectively prevent separation in an adhesive-free flexible laminate (particularly a two-layer flexible laminate), particularly can effectively suppress separation fr...  
WO/2006/091937A3
A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution t...  
WO/2009/050971A1
This invention provides a metal covered polyimide composite, which can effectively prevent separation in an adhesive-free flexible laminate (particularly a two-layer flexible laminate), particularly can effectively suppress separation fr...  
WO/2009/048338A1
Method and device for supplying electrical power to a wafer that is at least partially submerged in a liquid. The device comprises : - a container filled with the liquid; - a transportation device comprising a wafer carrier device for tr...  
WO/2009/046532A1
Disclosed herein are medical devices, such as stents, coated with calcium phosphate and processes for making the same. The stent can comprise a cobalt chromium alloy that has been treated to improve surface adhesion to the calcium phosph...  
WO/2009/044530A1
A surface treatment device (10) performs a surface treatment by flowing down a predetermined treatment liquid (X) along the surface to be treated of a band-shaped thin body (S) disposed along a generally vertical direction. The surface t...  
WO/2009/045845A2
Disclosed are methods for treating metal substrates, including ferrous substrates, such as cold rolled steel and electrogalvanized steel. The methods include depositing an electropositive metal onto at least a portion of the substrate, a...  
WO/2009/040483A1
The invention relates to an equipment (1) for the electrolytic tinning of a continuously running steel strip (2) in at least one electrodeposition tank (30) containing an acidic electrolyte. The equipment (1) further includes a tin disso...  
WO/2009/041481A1
A silver-clad composite material (100) for movable contacts which comprises a base (110) made of an iron- or nickel-base alloy, an under clad layer (120) formed out of any one selected from among nickel, cobalt, nickel alloys and cobalt ...  
WO/2009/041292A1
With the development of electronic equipment, in semiconductor devices, the size has been further reduced, and the integration density has been further increased. This tendency has led to a demand for the adoption of a higher temperature...  
WO/2008/137951A3
A plating computer having a plating cell with an interior processing volume configured to contain a plating solution for a plating process, a cell mounting platform connected at least at a first point to an actuator and at a second point...  
WO/2009/031508A1
A treatment bath provided with a noncontact liquid seal section is used. The noncontact liquid seal section is not brought into contact with a web and suppresses liquid leakage.  
WO/2009/013398A3
The invention relates to equipment for the electrolytic tinning (1) of a continuously running steel strip (2) in at least one coating tank (30) fitted with at least one non-soluble anode (60) and containing an acidic electrolyte. The equ...  

Matches 1,151 - 1,200 out of 22,442