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WO/2013/099532A1 |
A method for producing a porous metal body, the method being characterized in comprising: a step for forming an electroconductive covering layer by applying a coating on at least a skeleton surface of a porous resin in the form of a thre...
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WO/2013/102031A1 |
An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having ...
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WO/2013/092312A1 |
The present invention relates to a cyanide-free, pyrophosphate-containing electrolyte and a process for the electrolytic deposition of a ternary alloy of the elements copper, tin and zinc. The electrolyte and the process are characterize...
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WO/2013/094766A1 |
A plated article comprising a multi-layer plating film formed on top of a conductive-metal substrate. Said plated article is characterized by having the following on top of the aforementioned substrate, in this order: a porous plating la...
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WO/2013/088647A1 |
This method for manufacturing a metal lattice comprises: forming a recess on a principal surface of a silicon substrate; forming a first insulating layer on the surface at the side at which the recess has been formed; removing the first ...
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WO/2013/084949A1 |
Disclosed are a grease filter which reduces apparent specific gravity to reduce the weight of the grease filter, and has sufficient bending strength and high oil removal performance, and a method for manufacturing same. The present inven...
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WO/2013/084429A1 |
This method for manufacturing a metal lattice comprises forming a depression in the principal face of a silicon substrate, forming a first insulation layer on the surface of the side on which the depression is formed, removing the first ...
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WO/2013/084929A1 |
Provided are: a processing unit that has a condenser and that is caused to be able condense and reuse as processing liquid a processing liquid that is in a mist state having been vaporized during platemaking processing at the processing ...
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WO/2013/083987A1 |
A method of manufacturing a sliding bearing comprising providing a substrate as a cathode in an electrolyte within which a hard particulate is suspended, and depositing a composite layer of hard particulate embedded in a metallic matrix ...
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WO/2013/081139A1 |
The purpose of the present invention is to provide an electrolysis copper alloy foil that has excellent laser workability properties and that after laser working can be etched at a uniform speed in the thickness direction. In the present...
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WO/2013/076277A2 |
The present invention concerns an electrode for oxygen evolution in electroplating plants comprising a valve metal substrate and an outer catalytic layer, the substrate consisting of a metal plate provided with slits of area ranging from...
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WO/2013/073452A1 |
Provided are: a method for manufacturing brass-plated steel wire, said method achieving both energy saving in the manufacturing process and improvement in the quality of brass-plated steel wire; and a brass-plated high-carbon steel wire ...
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WO/2013/073339A1 |
A treatment method for substrates that carries out prescribed treatment by supplying a treatment liquid to a region to be treated on the substrate surface has: an alignment liquid supply step that supplies an alignment liquid to an align...
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WO/2013/069689A1 |
A commutator material such that all or part of a conductive substrate is plated with silver or a silver alloy, and the silver or silver-alloy surface is further plated with gold or a gold alloy, the commutator material being characterize...
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WO/2013/065831A1 |
Provided is a roughened copper foil that has a black surface and good etching properties. This copper foil for a printed circuit has a non-black roughened layer and a nickel-tungsten alloy plating layer formed in this order on at least o...
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WO/2013/065713A1 |
Provided is a copper foil for a printing circuit in which after a first particle layer of copper is formed on the surface of a copper foil, a second particle layer of a ternary alloy comprising copper, cobalt and nickel is formed on top ...
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WO/2013/065727A1 |
A copper foil for a printed circuit, the foil having a copper primary particle layer formed on the surface of a copper foil, and a three-component alloy secondary particle layer, formed from copper, cobalt and nickel, subsequently formed...
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WO/2013/065730A2 |
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WO/2013/065230A1 |
Provided is a semiconductor device with which, while alleviating thermal resistance increases, it is possible to minimize thermal resistance which is applied to a solder layer. The semiconductor device has a positioning structure which c...
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WO/2013/061841A1 |
Provided is a porous current collector that can be manufactured cheaply, and has high heat resistance and oxidation resistance, and furthermore, is provided with the necessary mechanical strength, and is capable of demonstrating high dur...
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WO/2013/050664A1 |
The present invention relates to the production of a compression press for a pulverulent material for a tablet press comprising a preformed active part intended to be in contact with said material with a view to compressing said material...
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WO/2013/047272A1 |
An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 μm. Provided is the electrolytic copper...
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WO/2013/047628A1 |
Provided is silver plating that has favorable bending workability and that can suppress an increase in contact resistance even if used in a high temperature environment. The silver plating has a silver outer layer formed on the surface o...
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WO/2013/042663A1 |
Provided is a copper foil for a flexible printed wiring board having high thickness precision. The surface roughness (Ra) in the direction parallel to rolling has a mean value (Raavg) of 0.01 to 0.15 µm, and ΔRa=Ramax-Ramin is 0.025 µ...
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WO/2013/042572A1 |
Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal materi...
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WO/2013/038889A1 |
Provided is a solar cell interconnector material characterized by having, on an Al substrate surface, a 0.2μm or thicker Ni plating layer, and a Sn plating layer, in that order from the substrate side. By means of this invention, it is ...
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WO/2013/039671A1 |
A plating apparatus includes a vessel for holding a bath of plating liquid. A head is adapted to hold a work piece, such as a silicon wafer, in the vessel, with a seal on the head sealing against the work piece. A component cleaner assem...
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WO/2013/033810A1 |
A method and apparatus for electrochemically forming an oxide layer on a flat conductive surface which involves positioning a working electrode bearing the flat conductive surface in opposed parallel spaced apart relation to a flat condu...
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WO/2013/035805A1 |
One purpose of the present invention is to provide a metal wire for rubber reinforcement that exhibits excellent wire drawability and adhesion with rubber compositions. The aforementioned issue is resolved by a metal wire for rubber re...
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WO/2013/031913A1 |
Provided is a copper foil with a carrier, in which an ultrathin copper layer is not separated from a carrier before a process for lamination on an insulating substrate, while the ultrathin copper layer can be separated therefrom after th...
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WO/2013/031251A1 |
According to an embodiment of the present invention, plating is conducted using a strongly acidic tin-based plating solution which comprises a water-soluble tin (II)-containing substance, a water-soluble copper-containing substance, sulf...
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WO/2013/024814A1 |
Provided is a tin-plated copper alloy terminal member with outstanding insertion and removal characteristics and that demonstrates outstanding electrical connection properties while a coefficient of kinetic friction is reduced to 0.3 or ...
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WO/2013/019412A2 |
Articles of manufacture comprise a body. A porous material is plated on the body, the porous material comprising nickel having a plurality of pores disposed in a generally ordered array extending into the nickel. Methods of forming a por...
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WO/2013/018723A1 |
This high-strength steel sheet having superior moldability while securing the high strength of a maximum tensile strength of at least 900 MPa is characterized by having a predetermined component composition, the steel sheet structure con...
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WO/2013/018633A1 |
Provided is a sliding member comprising a member plated with a zinc alloy, in which a base is imparted with excellent corrosion resistance and which is a sliding member having excellent sliding properties, said sliding member comprising:...
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WO/2013/014863A1 |
In this production method for metal lattice: a recessed section having an insulated layer formed on the inside surface thereof is formed on a silicon substrate, and then the section of the insulated layer formed in the bottom section of ...
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WO/2013/012594A1 |
A method (100) for silver plating an electrical contact is provided. The method includes cleaning an electrical contact by removing oil (104) or other contaminants and exposing the electrical contact to at least one of an acid or base (1...
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WO/2013/008019A1 |
Described herein are filter elements comprising a substrate with a composite layer on a surface of the substrate in which the composite layer comprises nanoparticles comprising a first metal, a first metal oxide or a combination thereof;...
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WO/2013/005774A1 |
Provided is a surface-treated steel sheet for battery cases which includes a nickel-cobalt alloy layer formed as an outermost layer on the surface which is to be the inner surface of a battery case. The steel sheet is characterized in th...
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WO/2013/004414A1 |
An installation (20) for continuously electroplating a plurality of elongated metal elements (21, 21', 21") with another metal comprises a bath (22) of an electrolyte wherein the elongated metal elements (21, 21', 21") are travelling. Th...
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WO/2013/002279A1 |
Provided is an electrolytic copper foil having a tensile strength of 300 MPa or greater and an elongation percentage of 3.0% or greater after heat treatment at 350ºC or higher for one hour. Also provided is a copper foil with which adhe...
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WO/2012/173178A1 |
Provided are: a conductive base for forming a wiring pattern of a collector sheet for solar cells, which has good rust inhibiting properties and solderability without using an organic rust inhibitor that may harm a solar cell element; an...
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WO/2012/173276A1 |
An embodiment of the present invention provides a hard-film-covered member in which a base material made from a soft metal is covered by an amorphous carbon film or other hard film so as to obtain better adhesion than conventionally. A h...
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WO/2012/169249A1 |
Provided is a copper clad laminate, which is obtained by bonding a liquid crystal polymer with a roughened copper foil that is formed of a copper-cobalt-nickel alloy plating, and which is free from roughening particle residue on the liqu...
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WO/2012/168447A1 |
The invention relates to a method for manufacturing, by percolation, a metallized or metallizable felt at least one felt element by means of electrodeposition, which includes: a step of keeping the felt element in a metallization reactor...
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WO/2012/165213A1 |
Provided are a porous metallic body having a three-dimensional network structure, a method for manufacturing the porous metallic body, an electrode material using the porous metallic body, and a cell. The porous metallic body exhibits a ...
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WO/2012/164992A1 |
This electrical contact component comprises a contact point for providing an electrical connection by contact, and a mounting part for providing an electrical connection with the exterior by solder joining. A plating layer containing car...
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WO/2012/165214A1 |
The purpose of the present invention is to provide a method for producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, said method being capable of forming an aluminum structure tha...
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WO/2012/156021A1 |
The invention relates to a press-in pin (10) having a main body and a coating which covers the main body at least in some sections. In order to provide a press-in pin with a lead-free coating which avoids or substantially minimises whisk...
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WO/2012/153728A1 |
[Problem] To provide an Ni-plated metal sheet having excellent welding properties, a welded structure, and a method for making a battery material. [Solution] An Ni-plated metal sheet (2) obtained by forming a first Ni-plating layer on th...
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