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WO/2010/114164A1 |
Provided is a spring wire that, while achieving electrical conductivity that can even handle high-frequency signals having frequencies of at least 1 GHz, can be used to make springs. Also provided are a contact probe using said spring wi...
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WO/2010/113749A1 |
Provided are a Cu-Zn-Sn alloy plate and a tin-plated Cu-Zn-Sn alloy strip having not only excellent pressing processability, but also excellent strength, electrical conductivity, and bending processability. The Cu-Zn-Sn alloy plate compr...
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WO2010110061A1 |
A copper foil provided with an electric resistance film characterized in that the electric resistance film comprises a metal foil made of copper or copper alloy, the surface roughness of at least one surface of which is set as ten point ...
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WO/2010/108996A1 |
The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: - a container (10) intended to contain an electrolyte (E), - a support (2...
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WO2010110092A1 |
Disclosed is a copper foil for a printed wiring board, which is characterized by comprising, on at least one surface thereof, a roughened layer that is composed of needle-like fine roughening particles each having a diameter of 0.1-2.0 Â...
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WO2010110259A1 |
Disclosed is a two-layered flexible substrate which has excellent bending endurance, and furthermore, wherein Kirkendall voids do not arise even if a chip-on-film lead section is tin plated and heat treatment is performed. The disclosed ...
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WO/2010/102516A1 |
A method of forming hard gold jewellery includes forming a mandrel of low melting point material, electroplating a gold layer over the mandrel, electroplating a copper layer over the gold layer, forming holes through the electroplated la...
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WO/2010/095658A1 |
Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and...
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WO/2010/094998A1 |
A process of electrodepositing high purity copper in a via in a silicon substrate to form a through-silicon-via (TSV), including immersing the silicon substrate into an electrolytic bath in an electrolytic copper plating system in which ...
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WO/2010/093009A1 |
Disclosed is a surface-treated metal foil which can be produced at low cost and enables easy formation of an extremely thin electroless plated copper foil, which does not require a sputtering process for forming a fine circuit and is cap...
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WO/2010/092579A1 |
A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.
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WO/2010/087076A1 |
A spark plug and a process for producing the plug, in which a deposit formed on a ground electrode by plating can be relatively easily removed without causing an increase in cost and ignition properties can be prevented from decreasing. ...
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WO/2010/086111A2 |
The invention relates to a method for generating metal crystalline surface structures in the course of a galvanic metal deposition on an electrode surface disposed within an electrolyte fluid relative to a counter-electrode comprising th...
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WO/2010/084532A1 |
Disclosed is a conductive member having a stable contact resistance, which is hardly separated and requires a small inserting/drawing force when used as a connector. The conductive member is characterized in that a Cu-Sn intermetallic co...
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WO/2010/080946A2 |
There is disclosed a non-stick apparatus, comprising a liquid storage or conveyance article comprising a first material; a coating on an internal surface of the article comprising a second material; wherein the second material comprises ...
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WO/2010/074061A1 |
Provided is a rolled copper foil or an electrolytic copper foil for an electronic circuit wherein a circuit is formed by etching. The rolled copper foil or the electrolytic copper foil is provided with: a nickel or nickel alloy layer, wh...
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WO/2010/074072A1 |
Provided is a rolled copper foil or an electrolytic copper foil for an electronic circuit wherein a circuit is formed by etching. The rolled copper foil or the electrolytic copper foil is provided with: a heat-resistant layer, which is ...
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WO/2010/074054A1 |
Provided is a method for forming an electronic circuit, wherein after forming a nickel or nickel alloy layer on the etching surface side of a rolled copper foil or an electrolytic copper foil, a copper-plated multilayer board is formed b...
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WO/2010/074053A1 |
A rolled copper foil or electrolytic copper foil for electronic circuits which is etched to form a circuit, characterized by including, formed on the side to be etched, a nickel alloy layer that has a lower etching rate than copper, the ...
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WO/2010/067854A1 |
A process for producing a two-layer flexible copper-clad laminate substrate by wet plating using an acidic copper plating bath composition and a resin film coated with a conductive metal serving as a seed layer. The process for two-laye...
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WO/2010/065739A1 |
An article of manufacture comprises a carbon-containing matrix. The carbon- containing matrix may comprise at least one type of carbon material selected from the group comprising graphite crystalline carbon materials, carbon powder, and ...
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WO/2010/061736A1 |
A copper foil for printed circuits which comprises a copper foil and, formed on the surfaces thereof, an electrodeposited ternary-alloy layer comprising copper, cobalt, and nickel. The copper foil for printed circuits is characterized i...
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WO/2010/061766A1 |
By bringing an aqueous solution of an alkali metal hydrogen carbonate such as sodium hydrogen carbonate into contact with a cathode which is coated with a nickel-tin alloy, dissolvable nickel and tin contained in the coating layer are di...
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WO/2010/062822A2 |
A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the v...
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WO/2010/035570A1 |
A collar surface (15a) of an inner ring (10) of a cylindrical roller bearing (1) and a collar surface (23a) of an outer ring (20) of the bearing (1) are constituted of hard chromium deposits (15 and 25). The hard chromium deposits (15 a...
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WO/2010/034511A2 |
A support comprising iron (Fe) is made up of components of a hydraulic cylinder moving relative to each other over a running surface, in particular a piston rod, with an electrochemically applied outer layer of chromium (Cr) with an elec...
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WO/2010/026958A1 |
A device for plating a cylinder block for subjecting the cylinder inner peripheral surface of a cylinder of a cylinder block to plating pretreatment or plating treatment by circulating a treatment liquid with one end side of the cylinder...
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WO/2010/027052A1 |
Disclosed is an ultrathin copper foil with carrier that suppresses blistering and stabilizes peeling strength, specifically an ultrathin copper foil with carrier in which the carrier foil and ultrathin copper foil can be easily peeled ap...
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WO/2010/027021A1 |
A copper-zinc alloy electroplating bath which can form a copper-zinc alloy plating layer having improved corrosion resistance and which can form a uniform and bright copper-zinc alloy plating layer having an objective composition over a ...
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WO/2010/022824A2 |
The invention relates to the wet processing and electroplating of one side and/or the edge of a flat product (1) used as a substrate in production systems containing process chambers (4), through which treatment liquid flows (8), wetting...
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WO/2010/020373A1 |
The invention relates to a method for coating a printing press cylinder or a printing press roll, comprising at least the following steps: a) a printing press cylinder or roll having a metal base that has an external surface is prepared;...
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WO/2010/012955A2 |
The invention relates to the production of a photovoltaic structure that includes a thin coating film, generally made of a transparent conductive oxide, deposited on top of a sublayer having photovoltaic properties. According to the inve...
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WO/2010/010892A1 |
In order to provide a flexible laminated circuit board using a surface-treated copper foil that meets all conditions for a copper foil related to a polyimide, including adhesive strength, acid resistance, and etching properties, in a fle...
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WO/2010/010893A1 |
In order to provide a surface-treated copper foil that meets all conditions for a copper foil related to a polyimide, including adhesive strength, acid resistance, and etching properties, as well as a laminated circuit board using the su...
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WO/2010/005088A1 |
Disclosed is an electronic component comprising at least a conductive member, wherein corrosion is prevented or suppressed and high connection reliability is achieved by providing an adequate layer between the conductive member and a mai...
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WO/2010/001054A2 |
The present invention relates essentially to a method of preparing an electrical insulating film on the surface of an electrically conducting or semiÂconducting substrate, such as a silicon substrate. According to the invention, this me...
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WO/2009/157457A1 |
Disclosed is a composite material for electrical/electronic components used as a material for an electrical/electronic component which is formed by blanking, wherein substantially one layer of an insulating film is formed on at least a p...
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WO/2009/157458A1 |
Disclosed is a composite material for electrical/electronic components, which is characterized in that: at least a part of a metal base is provided with a resin coating; at least a part of the metal base, where the resin coating is not p...
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WO/2009/157456A1 |
Disclosed is a composite material for electrical/electronic components used as a material for an electrical/electronic component, wherein an insulating film is formed on at least a part of a metal base at least the surface of which is co...
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WO/2009/156386A1 |
The invention relates to a component (11) with a layer (12) with CNT (13) incorporated into the grains thereof. According to the invention, particles (14) of a dry lubricant are also embedded into the layer. This provides advantageous op...
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WO/2009/154066A1 |
Disclosed is a copper foil for a printed circuit board comprising a roughened surface of a copper foil, a layer containing nickel and zinc or compounds of nickel and zinc (hereinafter referred to as a “nickel zinc layer”), and a chro...
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WO/2009/152896A1 |
The invention relates to the wet-chemical or electrolytic treatment of flat material, for example a wafer, which according to the prior art is treated by means of technically complex frames or grippers in treatment chambers. Particularly...
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WO/2009/150915A1 |
The problem is to provide an electrolytic gold plating solution suitable for nickel barrier plating while maintaining the excellent properties of the gold plating film, e.g., mechanical characteristics, corrosion resistance, and electric...
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WO/2009/146773A1 |
The invention relates to the electrical contact of flat material (1) as sections in straight-through installations for the electrolytic and/or chemical wet treatment of the treatment side (10) of the material using external electric curr...
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WO/2009/145207A1 |
Provided is a technique, which can be applied to insulating resin substrates having a low dielectric constant, for forming a roughened copper-foil surface on which fine-pitch wiring circuits can be formed. The surface of the copper foil...
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WO/2009/144973A1 |
The issue is to provide a Sn or Sn alloy plated film and a composite material having same that allow excellent roll maintenance and improve productivity by preventing rubbing and loss of the Sn or Sn alloy plated film. A Sn or Sn alloy p...
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WO/2009/141551A2 |
One subject of the present invention is an electroplating composition intended in particular for coating a semiconductor substrate with copper, serving to fabricate structures of the “through-via” type for producing interconnects in ...
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WO/2009/139384A1 |
Disclosed is a copper‑zinc alloy electroplating bath, and a plating method using the same, capable of forming a uniform, brilliant plated layer of the intended composition and having a wide current density range, without the use of a c...
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WO/2009/139440A1 |
In a method in which a slide bearing alloy layer (3) is joined to the surface of a steel back plate (1), and the slide bearing alloy layer (3) is then coated with a Bi‑based overlay layer (10) by electroplating, Bi is kept from being s...
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WO/2009/134732A2 |
Open pore foams are coated with metal or metal alloys by electrolytic or electroless plating. The characteristics of the plating bath are adjusted to decrease the surface tension such that the plate bath composition can pass into the por...
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