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WO/2021/236398A1 |
Nanotwinned copper and non-nanotwinned copper may be electroplated to form mixed crystal structures such as 2-in-1 copper via and RDL structures or 2-in-1 copper via and pillar structures. Nanotwinned copper may be electroplated on a non...
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WO/2021/231122A1 |
Various embodiments include methods and apparatuses to moisturize a substrate prior to an electrochemical deposition process. In one embodiment, a method to control substrate wettability includes placing a substrate in a humidification e...
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WO/2021/225827A1 |
Disclosed are apparatus, systems, and methods for electroplating cobalt, nickel, and alloys thereof in interconnect features of partially or fully fabricated electronic devices. During electroplating, cobalt, nickel, or alloys thereof fi...
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WO/2021/225259A1 |
The present invention relates to a multilayer copper foil, a method for manufacturing same, and an electroplating apparatus therefor. A multilayer copper foil according to an aspect of the present invention comprises: a recrystallization...
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WO/2021/225821A1 |
An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtua...
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WO/2021/222207A2 |
Plated metallic substrates and methods of manufacture are provided. The method comprises depositing a first layer onto at least a portion of the metallic substrate to create a coated substrate utilizing physical vapor deposition. The met...
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WO/2021/221872A1 |
Sequential electrodeposition of metals into through-mask features on a semiconductor substrate is conducted such as to reduce the deleterious consequences of lipseal's pressure onto the mask material. In a first electroplating step, a fi...
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WO/2021/220524A1 |
The purpose of the present invention is to provide a novel composite copper member. More specifically, a composite copper member which comprises a copper member and a layer formed on at least a part of the surface of the copper member an...
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WO/2021/211967A1 |
Articles and methods for depositing iron alloy coatings onto metal wires for wireless recharging devices are generally described.
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WO/2021/207254A1 |
Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features havin...
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WO/2021/205782A1 |
A composite material according to the present disclosure comprises a plurality of diamond particles and at least one first element selected from the group consisting of copper, silicone, chromium, cobalt, nickel, molybdenum, titanium, va...
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WO/2021/206092A1 |
A filament according to the present invention including a plating film, in which: the plating film contains copper, zinc and cobalt; when the total of the content ratios of copper, zinc and cobalt in the plating film is 100% by mass, the...
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WO/2021/200614A1 |
A flexible printed wiring board of an embodiment of the present disclosure is provided with a base film and a wiring layer having multiple wires and disposed on at least one surface of the base film, wherein the wires have an average lin...
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WO/2021/201330A1 |
The present invention relates to a partial plating jig for an impeller, and the partial plating jig for an impeller, according to the present invention, comprises: a shaft axially passing through an impeller; a first cover fixed to the s...
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WO/2021/201154A1 |
Provided is a circuit component that makes it possible to achieve both high heat dissipation and high circuit wiring adhesion. A circuit component that includes a metal member, an insulating resin layer that is formed on the metal member...
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WO/2021/199526A1 |
Provided is a silver plating material comprising a substrate and a surface layer formed thereon, the surface layer being formed of a silver plating layer, wherein the crystal plane of the surface layer has (110) plane preferred orientati...
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WO/2021/197950A1 |
The present invention provides a composition comprising copper ions, an acid, and at least one polyaminoamide comprising, a group of formula (L1) [A-B-A'-Z]n[Y-Z]m (L1) wherein B is a diacid fragment of formula (L2) A, A' are amine fragm...
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WO/2021/198245A1 |
The present invention relates to a wire electrode for spark-erosion cutting, with a core (2), which comprises a metal or a metal alloy, and a sheathing layer (3), which surrounds the core (2) and comprises regions of a morphology that co...
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WO/2021/189181A1 |
The present invention discloses plating apparatuses and plating methods for metal deposition on a substrate with pattern structures. In an embodiment, a plating apparatus comprises a plating bath configured to accommodate electrolyte, a ...
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WO/2021/193246A1 |
Provided is a roughened copper foil which, when used in a copper-cladded laminate board or a printed wiring board, can achieve both of excellent transmission properties and high peel strength. The roughened copper foil has a roughened su...
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WO/2021/193378A1 |
Provided is a bonding wire for a semiconductor device which has good bondability even if the bonding wire is used for wedge bonding at normal temperature, and which is excellent in bond reliability. The bonding wire has a core material c...
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WO/2021/191334A1 |
The invention relates to a method for electrodepositing a grey or black layer on an electrical circuit. Said electrical circuit is, for example, a printed circuit-type electrical circuit for producing a module designed to be integrated i...
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WO/2021/190804A1 |
The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate. The method for a chemic...
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WO/2021/193696A1 |
An electroplating solution comprising (A) a soluble salt containing at least a first tin salt, (B) an acid or a salt thereof, and (C) a surfactant. When electrolysis is carried out at an anodic current density of 0.7 A/dm2, the maximum v...
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WO/2021/193863A1 |
A surface-treated copper foil for printed wiring boards according to the present invention has a surface-treated coating film which has a roughened layer comprising roughening particles formed on at least one surface of a copper foil bas...
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WO/2021/193781A1 |
Provided is a PCB terminal including a rod-like base material and a plating layer covering a predetermined region of the base material, wherein the base material is composed of a copper alloy containing more than 20 mass% of zinc, the pl...
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WO/2021/184114A1 |
An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits ...
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WO/2021/185914A1 |
The invention relates to a method for producing markings on galvanized steel strip or steel plate, wherein a metal salt solution, more particularly an inorganic metal salt solution, is applied to regions of the steel surface, and the ste...
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WO/2021/182240A1 |
Provided are a metal material and connection terminal that are resistant to sulfide blackening even with the surfacemost exposure of an Ag-Sn alloy layer. Also provided is a method for producing a metal material that is capable of produc...
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WO/2021/180375A1 |
The invention relates to an electrical contact part comprising a carrier substrate made from a metal material, a metal coating applied to the carrier substrate, and a coating blocker material applied to the carrier substrate in a sub-reg...
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WO/2021/180980A1 |
This invention relates to a method for passivating a tinplate strip after electrodepositing the tin layer or tin layers, or after an optional flow-melting of the electrodeposited tin layer or tin layers, and an apparatus for producing sa...
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WO/2021/181901A1 |
Provided are: a silver-plated material having superior fretting wear properties than ever before; and a method for manufacturing the silver-plated material. The silver-plated material is manufactured by forming a base plating layer 12 ma...
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WO/2021/182423A1 |
A sliding member wherein the fatigue resistance of a surface layer obtained by dispersing a hard material in a soft metal matrix is enhanced. A sliding member comprising a substrate layer and a surface layer, wherein the surface layer ...
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WO/2021/175935A1 |
The present invention relates to a process for depositing a metal layer on a substrate by contacting the substrate with a metal plating bath comprising a metal ion source and a suppressor, and applying a current density to the substrate,...
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WO/2021/177231A1 |
A Ni-plated steel sheet according to one embodiment of the present invention comprises a base steel sheet and a Ni-plated layer provided to a surface of the base steel sheet. The Ni-plated layer includes a Ni-Fe alloy layer formed on the...
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WO/2021/171808A1 |
Provided are: a metal-filled microstructure that suppresses defects in the filling of a plurality of pores with metal as well as defects in the structure of conductors formed from the metal; a production method for the metal-filled micro...
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WO/2021/170460A1 |
The invention relates to a piston ring having a main body. The main body has an inner peripheral surface, a first flank surface, a second flank surface and an outer peripheral surface. A first hard chromium layer having a network of crac...
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WO/2021/166467A1 |
Provided are: a metal body for which whisker generation as a result of being subjected to external stress is suppressed, and which can be easily manufactured; a fitting-type connection terminal; and a metal body formation method. This me...
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WO/2021/166581A1 |
A terminal material for a connector, the terminal material comprising a substrate in which at least a surface layer thereof comprises copper or a copper alloy, a nickel plating layer that comprises nickel or a nickel alloy and is formed ...
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WO/2021/166965A1 |
A silver plating material 10 in which a silver plating film 2 is formed on a substrate 1. In the silver plating material 10, the silver plating film 2 has a layered crystal structure in which a plurality of sheet-form layers are layered.
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WO/2021/166964A1 |
A silver-plated material having a silver coating film formed on a base material. In the silver-plated material, the silver coating film contains 0.05 to 0.25% by mass of sulfur. The plated material can be produced by subjecting the base ...
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WO/2021/160212A1 |
The invention relates to a method for producing a silicon anode for secondary batteries, characterised by the steps of providing a monocrystalline silicon wafer with (100)-oriented flat sides, contacting the rear side of the wafer with a...
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WO/2021/157363A1 |
Provided is a roughened copper foil capable of achieving both excellent high-frequency characteristics and high shear strength from processing of a copper-clad laminate to production of a printed wiring board. This roughened copper foil ...
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WO/2021/157696A1 |
Provided is a thermal spray wire as a thermal spray material that is used with a continuous arc thermal spraying unit, the thermal spray wire having good electroconductivity and being configured for continuous, stable arc thermal sprayin...
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WO/2021/157362A1 |
Provided is a roughened copper foil which can achieve both of excellent etching properties and high share strength in the processing of a copper clad laminate plate or the manufacture of a printed wiring board. The roughened copper foil ...
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WO/2021/153160A1 |
One mode of this tin or tin alloy electroplating solution contains: a soluble salt (A) including at least a first tin salt; one or more compounds (B) selected from the group consisting of organic acids, inorganic acids, and salts thereof...
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WO/2021/151652A1 |
The invention relates to sheet metal packaging products, in particular tinplate or electrolytically chrome-plated sheet steel (ECCS), consisting of a sheet steel substrate (S) with a thickness in the region of 0.1 mm to 0.6 mm and a coat...
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WO/2021/144375A1 |
The invention relates to a method for etching or dissolving a hard material coating on a base body, characterised in that the hard material coating is treated in an aqueous solution. The aqueous solution comprises ferrate and a strong base.
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WO/2021/142357A1 |
A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of...
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WO/2021/140857A1 |
A surface treatment device (1) having: a jig (10) for holding a workpiece (W) so as to surround the peripheral edge thereof, the workpiece (W) having a first main surface (WF) and a second main surface (WB) as surfaces to be treated; a s...
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