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WO/2021/111919A1 |
The present invention provides: an electrolytic copper plating solution which contains (A) sulfate ions, (B) a compound represented by general formula (1) and (C) copper ions, wherein the content of the component (B) is from 0.3 to 50 pa...
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WO/2021/110872A1 |
A tape for manufacturing an electrical circuit with electrical contact pads, comprising: - a flexible dielectric substrate (4), - a copper foil (10) covering at least partially the dielectric substrate (4), the copper foil (10) having an...
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WO/2021/107161A1 |
A nickel-plated steel plate according to an embodiment of the present invention comprises a base material steel plate and a nickel-plated layer provided to a surface of the base material steel plate, and the ratio of tin content to nicke...
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WO/2021/108466A1 |
An electroplating cup assembly comprises a cup bottom, a lip seal, and an electrical contact structure. The cup bottom at least partially defines an opening configured to allow exposure of a wafer positioned in the cup assembly to an ele...
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WO/2021/107100A1 |
This method of manufacturing a plated member comprises a plating step for plating a member to be plated while jetting and stirring the member together with an electrolytic solution from a bottom part to the upper side, inside a basket of...
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WO/2021/101676A1 |
A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monol...
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WO/2021/100212A1 |
A Ni-plated steel sheet according to one aspect of the present invention comprises a base steel sheet and a Ni-based coating layer arranged on a surface of the base steel sheet, wherein the distribution of the carbon concentration as obs...
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WO/2021/101909A1 |
An interconnect structure of a semiconductor device includes a conductive via and a barrier layer lining an interface between a dielectric layer and the conductive via. The barrier layer is selectively deposited along sidewalls of a rece...
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WO/2021/084853A1 |
This metal material for a sliding contact has a substrate formed from copper or a copper alloy, and a Pd-containing layer that is formed as an outermost layer on at least one part of the substrate and that contains 95 mass% or more of Pd...
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WO/2021/075221A1 |
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional el...
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WO/2021/075222A1 |
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional el...
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WO/2021/071885A1 |
Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a subs...
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WO/2021/065866A1 |
This terminal material has: a substrate in which at least the surface thereof is made of Cu or a Cu alloy; a Ni layer provided on the substrate and having a thickness of 0.1-1.0 µm; an Cu-Sn intermetallic compound layer provided on the ...
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WO/2021/067419A1 |
Undesired deposition of metals on a lipseal (lipseal plate-out) during electrodeposition of metals on semiconductor substrates is minimized or eliminated by minimizing or eliminating ionic current directed at a lipseal. For example, elec...
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WO/2021/057475A1 |
Embodiments of the present application provide an electroplating anode and an electroplating method using same. An electroplating anode and a cathode awaiting electroplating form an electric field so as to form an electroplated layer on ...
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WO/2021/058334A1 |
A composition for copper bump electrodeposition comprising copper ions and at least one additive comprising a polyalkyleneimine backbone comprising N-hydrogen atoms, wherein (a) the polyalkyleneimine backbone has a mass average molecular...
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WO/2021/058336A1 |
A composition comprising copper ions and at least one additive comprising a polyalkyleneimine backbone comprising N-hydrogen atoms, wherein (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 600 g/mol to 10...
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WO/2021/054105A1 |
Provided is a pin terminal comprising a rod-shaped substrate and a plating layer covering a prescribed region of the substrate, wherein: the constituent material of the substrate is pure copper or a copper alloy; the plating layer compri...
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WO/2021/054106A1 |
This pin terminal comprises a rod-like base material and a plating layer that covers a predetermined region of the base material, wherein: a constituent material of the base material is pure copper or a copper alloy; the plating layer co...
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WO/2021/054107A1 |
This pin terminal is provided with a rod-like substrate and a plating layer that covers a prescribed region of the substrate, wherein: the substrate is composed of a material that is either pure copper or copper alloy; the plating layer ...
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WO/2021/054108A1 |
This pin terminal is provided with a rod-like substrate and a plating layer that covers a prescribed region of the substrate, wherein: the substrate is composed of a material that is either pure copper or a copper alloy; the plating laye...
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WO/2021/054109A1 |
This pin terminal comprises a stick-shaped substrate and a plated layer that covers a prescribed area of the substrate, wherein: the plated layer comprises a tin-based layer formed of a metal including tin; one end of the substrate inclu...
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WO/2021/048343A1 |
A device for a cell of an apparatus for wet processing of a planar workpiece, comprises a structure comprising first and second walls (13a, b). The workpiece is movable in a central plane (4) through a space (3) between the first and sec...
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WO/2021/041200A1 |
The present disclosure provides insulated electrical conductors, e.g., wires, and methods for producing such insulated electrical conductors to combat partial discharge by enhancing bond strength between the electrical conductor and a ba...
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WO/2021/041371A1 |
Disclosed is a copper coated stainless-steel hydrophobic mesh and a method for synthesizing the hydrophobic mesh. In the method, a stainless-steel mesh is sonicated in a solution of acetone and ethanol, and then electroplated in a copper...
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WO/2021/041627A1 |
Microporous sheet product suitable for use as a battery separator and method of forming the same. According to one embodiment, the method involves forming an extrusion mixture of one or more thermoplastic polymers and a fluid having a hi...
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WO/2021/034851A1 |
The present invention provides steel sheet products having controlled compositions that are subjected to two-step annealing processes to produce sheet products having desirable microstructures and favorable mechanical properties such as ...
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WO/2021/023778A1 |
The present invention relates to a galvanic method and to a system for electrolytically coating a steel strip, in particular for the motor vehicle industry, comprising a coating based on zinc and/or a zinc alloy, by means of pulse techno...
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WO/2021/023783A1 |
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...
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WO/2021/023789A1 |
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...
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WO/2021/025071A1 |
Provided is a copper alloy sheet in which a central part in the sheet thickness direction contains more than 2.0% (mass%; hereinafter the same) and not more than 32.5% of Zn, 0.1-0.9% of Sn, not less than 0.05% and less than 1.0% of Ni, ...
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WO/2021/023779A1 |
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...
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WO/2021/020002A1 |
Provided is a slide member having an overlay on a bearing alloy. The overlay has a thickness T and has a sliding surface and an interface with respect to the bearing alloy. The overlay includes an intermetallic compound and a matrix of B...
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WO/2021/019907A1 |
Provided are: a composite plated material in which a composite plating film that comprises a composite material comprising a silver layer and carbon particles contained in the silver layer is formed on a base material, and in which the f...
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WO/2021/008635A2 |
Disclosed is an inductance device electrode preparation method, comprising: S1, surface insulation treatment, specifically: placing an inductance device in a obliquely rotating spray pot body, and using a fixed spray gun to perform therm...
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WO/2021/002009A1 |
A printed wiring board according to an aspect of the present invention is provided with: a base film having insulating property; and a conductive pattern laminated on at least one surface side of the base film, wherein the average width ...
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WO/2020/261930A1 |
This cylinder device is provided with: a tubular cylinder that has an opening at least at one end; a rod that is formed of a metal and protrudes from the opening of the cylinder; and a sliding member that is provided at the opening of th...
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WO/2020/263837A1 |
Tungsten-containing metal films may be deposited in recessed features of semiconductor substrates by electrodeposition. The tungsten-containing metal film is electrodeposited under conditions so that the tungsten-containing metal film is...
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WO/2020/255772A1 |
A substrate processing method according to the present disclosure comprises a preparation step, an inhibition film formation step and a plating step. In the preparation step, a substrate (W) is prepared, in which a depressed part is form...
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WO/2020/250650A1 |
A method for performing plating, the method including: a step in which a substrate having different patterns on a first surface and a second surface thereof is prepared; a plating step in which currents having a first plating current den...
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WO/2020/246467A1 |
A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughe...
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WO/2020/239905A1 |
The invention relates to a weight-reduced component which, in the tempered and/or hot-formed state, demonstrates an optimal combination of strength and toughness and meets the highest demands on the mechanical properties or requirements ...
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WO/2020/235406A1 |
The present invention provides a plating method whereby consumption of an additive in a plating solution can be suppressed during plating of a substrate having a via or hole for forming a through electrode, and provides an insoluble anod...
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WO/2020/228060A1 |
An integrated production method for a multi-part combined logo, comprising the following steps:(1) performing die-casting to obtain a die-cast piece (3) having a plurality of logo bodies (1) arranged in sequence; (2) assembling the logo ...
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WO/2020/229570A1 |
Method of manufacturing a ground apparatus and ground apparatus comprising an aluminum nut (16) having an internal thread and adapted to clamp an eyelet (28) of an electrical conductor on a corresponding contact area of the stud (12), wh...
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WO/2020/229046A1 |
The present invention relates to a wire electrode for wirecut electrical discharge machining (WEDM) having a carbonaceous surface layer, wherein the wire electrode comprises a core material (1), an outermost carbonization layer (3), and ...
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WO/2020/226161A1 |
An objective of the present invention is to provide a copper member comprising a novel composite surface treatment layer. The present invention provides a composite copper member comprising a metal layer formed from metal atoms other tha...
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WO/2020/226160A1 |
The purpose of the present invention is to provide a novel composite copper member. Provided by the present invention is a composite copper member which has a metal layer comprising metal other than copper formed on micro irregularities ...
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WO/2020/226446A1 |
The present invention relates to a flexible aluminum electrode based on textile materials, and a method for manufacturing same. According to an embodiment of the present invention, the flexible aluminum electrode based on textile materia...
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WO/2020/227358A1 |
This invention relates to plated bismuth shot for shotgun shells and methods of making.
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