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Matches 351 - 400 out of 16,600

Document Document Title
WO/2021/111919A1
The present invention provides: an electrolytic copper plating solution which contains (A) sulfate ions, (B) a compound represented by general formula (1) and (C) copper ions, wherein the content of the component (B) is from 0.3 to 50 pa...  
WO/2021/110872A1
A tape for manufacturing an electrical circuit with electrical contact pads, comprising: - a flexible dielectric substrate (4), - a copper foil (10) covering at least partially the dielectric substrate (4), the copper foil (10) having an...  
WO/2021/107161A1
A nickel-plated steel plate according to an embodiment of the present invention comprises a base material steel plate and a nickel-plated layer provided to a surface of the base material steel plate, and the ratio of tin content to nicke...  
WO/2021/108466A1
An electroplating cup assembly comprises a cup bottom, a lip seal, and an electrical contact structure. The cup bottom at least partially defines an opening configured to allow exposure of a wafer positioned in the cup assembly to an ele...  
WO/2021/107100A1
This method of manufacturing a plated member comprises a plating step for plating a member to be plated while jetting and stirring the member together with an electrolytic solution from a bottom part to the upper side, inside a basket of...  
WO/2021/101676A1
A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monol...  
WO/2021/100212A1
A Ni-plated steel sheet according to one aspect of the present invention comprises a base steel sheet and a Ni-based coating layer arranged on a surface of the base steel sheet, wherein the distribution of the carbon concentration as obs...  
WO/2021/101909A1
An interconnect structure of a semiconductor device includes a conductive via and a barrier layer lining an interface between a dielectric layer and the conductive via. The barrier layer is selectively deposited along sidewalls of a rece...  
WO/2021/084853A1
This metal material for a sliding contact has a substrate formed from copper or a copper alloy, and a Pd-containing layer that is formed as an outermost layer on at least one part of the substrate and that contains 95 mass% or more of Pd...  
WO/2021/075221A1
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional el...  
WO/2021/075222A1
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional el...  
WO/2021/071885A1
Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a subs...  
WO/2021/065866A1
This terminal material has: a substrate in which at least the surface thereof is made of Cu or a Cu alloy; a Ni layer provided on the substrate and having a thickness of 0.1-1.0 µm; an Cu-Sn intermetallic compound layer provided on the ...  
WO/2021/067419A1
Undesired deposition of metals on a lipseal (lipseal plate-out) during electrodeposition of metals on semiconductor substrates is minimized or eliminated by minimizing or eliminating ionic current directed at a lipseal. For example, elec...  
WO/2021/057475A1
Embodiments of the present application provide an electroplating anode and an electroplating method using same. An electroplating anode and a cathode awaiting electroplating form an electric field so as to form an electroplated layer on ...  
WO/2021/058334A1
A composition for copper bump electrodeposition comprising copper ions and at least one additive comprising a polyalkyleneimine backbone comprising N-hydrogen atoms, wherein (a) the polyalkyleneimine backbone has a mass average molecular...  
WO/2021/058336A1
A composition comprising copper ions and at least one additive comprising a polyalkyleneimine backbone comprising N-hydrogen atoms, wherein (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 600 g/mol to 10...  
WO/2021/054105A1
Provided is a pin terminal comprising a rod-shaped substrate and a plating layer covering a prescribed region of the substrate, wherein: the constituent material of the substrate is pure copper or a copper alloy; the plating layer compri...  
WO/2021/054106A1
This pin terminal comprises a rod-like base material and a plating layer that covers a predetermined region of the base material, wherein: a constituent material of the base material is pure copper or a copper alloy; the plating layer co...  
WO/2021/054107A1
This pin terminal is provided with a rod-like substrate and a plating layer that covers a prescribed region of the substrate, wherein: the substrate is composed of a material that is either pure copper or copper alloy; the plating layer ...  
WO/2021/054108A1
This pin terminal is provided with a rod-like substrate and a plating layer that covers a prescribed region of the substrate, wherein: the substrate is composed of a material that is either pure copper or a copper alloy; the plating laye...  
WO/2021/054109A1
This pin terminal comprises a stick-shaped substrate and a plated layer that covers a prescribed area of the substrate, wherein: the plated layer comprises a tin-based layer formed of a metal including tin; one end of the substrate inclu...  
WO/2021/048343A1
A device for a cell of an apparatus for wet processing of a planar workpiece, comprises a structure comprising first and second walls (13a, b). The workpiece is movable in a central plane (4) through a space (3) between the first and sec...  
WO/2021/041200A1
The present disclosure provides insulated electrical conductors, e.g., wires, and methods for producing such insulated electrical conductors to combat partial discharge by enhancing bond strength between the electrical conductor and a ba...  
WO/2021/041371A1
Disclosed is a copper coated stainless-steel hydrophobic mesh and a method for synthesizing the hydrophobic mesh. In the method, a stainless-steel mesh is sonicated in a solution of acetone and ethanol, and then electroplated in a copper...  
WO/2021/041627A1
Microporous sheet product suitable for use as a battery separator and method of forming the same. According to one embodiment, the method involves forming an extrusion mixture of one or more thermoplastic polymers and a fluid having a hi...  
WO/2021/034851A1
The present invention provides steel sheet products having controlled compositions that are subjected to two-step annealing processes to produce sheet products having desirable microstructures and favorable mechanical properties such as ...  
WO/2021/023778A1
The present invention relates to a galvanic method and to a system for electrolytically coating a steel strip, in particular for the motor vehicle industry, comprising a coating based on zinc and/or a zinc alloy, by means of pulse techno...  
WO/2021/023783A1
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...  
WO/2021/023789A1
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...  
WO/2021/025071A1
Provided is a copper alloy sheet in which a central part in the sheet thickness direction contains more than 2.0% (mass%; hereinafter the same) and not more than 32.5% of Zn, 0.1-0.9% of Sn, not less than 0.05% and less than 1.0% of Ni, ...  
WO/2021/023779A1
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...  
WO/2021/020002A1
Provided is a slide member having an overlay on a bearing alloy. The overlay has a thickness T and has a sliding surface and an interface with respect to the bearing alloy. The overlay includes an intermetallic compound and a matrix of B...  
WO/2021/019907A1
Provided are: a composite plated material in which a composite plating film that comprises a composite material comprising a silver layer and carbon particles contained in the silver layer is formed on a base material, and in which the f...  
WO/2021/008635A2
Disclosed is an inductance device electrode preparation method, comprising: S1, surface insulation treatment, specifically: placing an inductance device in a obliquely rotating spray pot body, and using a fixed spray gun to perform therm...  
WO/2021/002009A1
A printed wiring board according to an aspect of the present invention is provided with: a base film having insulating property; and a conductive pattern laminated on at least one surface side of the base film, wherein the average width ...  
WO/2020/261930A1
This cylinder device is provided with: a tubular cylinder that has an opening at least at one end; a rod that is formed of a metal and protrudes from the opening of the cylinder; and a sliding member that is provided at the opening of th...  
WO/2020/263837A1
Tungsten-containing metal films may be deposited in recessed features of semiconductor substrates by electrodeposition. The tungsten-containing metal film is electrodeposited under conditions so that the tungsten-containing metal film is...  
WO/2020/255772A1
A substrate processing method according to the present disclosure comprises a preparation step, an inhibition film formation step and a plating step. In the preparation step, a substrate (W) is prepared, in which a depressed part is form...  
WO/2020/250650A1
A method for performing plating, the method including: a step in which a substrate having different patterns on a first surface and a second surface thereof is prepared; a plating step in which currents having a first plating current den...  
WO/2020/246467A1
A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughe...  
WO/2020/239905A1
The invention relates to a weight-reduced component which, in the tempered and/or hot-formed state, demonstrates an optimal combination of strength and toughness and meets the highest demands on the mechanical properties or requirements ...  
WO/2020/235406A1
The present invention provides a plating method whereby consumption of an additive in a plating solution can be suppressed during plating of a substrate having a via or hole for forming a through electrode, and provides an insoluble anod...  
WO/2020/228060A1
An integrated production method for a multi-part combined logo, comprising the following steps:(1) performing die-casting to obtain a die-cast piece (3) having a plurality of logo bodies (1) arranged in sequence; (2) assembling the logo ...  
WO/2020/229570A1
Method of manufacturing a ground apparatus and ground apparatus comprising an aluminum nut (16) having an internal thread and adapted to clamp an eyelet (28) of an electrical conductor on a corresponding contact area of the stud (12), wh...  
WO/2020/229046A1
The present invention relates to a wire electrode for wirecut electrical discharge machining (WEDM) having a carbonaceous surface layer, wherein the wire electrode comprises a core material (1), an outermost carbonization layer (3), and ...  
WO/2020/226161A1
An objective of the present invention is to provide a copper member comprising a novel composite surface treatment layer. The present invention provides a composite copper member comprising a metal layer formed from metal atoms other tha...  
WO/2020/226160A1
The purpose of the present invention is to provide a novel composite copper member. Provided by the present invention is a composite copper member which has a metal layer comprising metal other than copper formed on micro irregularities ...  
WO/2020/226446A1
The present invention relates to a flexible aluminum electrode based on textile materials, and a method for manufacturing same. According to an embodiment of the present invention, the flexible aluminum electrode based on textile materia...  
WO/2020/227358A1
This invention relates to plated bismuth shot for shotgun shells and methods of making.  

Matches 351 - 400 out of 16,600