Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 22,369

Document Document Title
WO/2020/189689A1
An aluminum-based wire material provided with a core wire which comprises pure aluminum or an aluminum alloy and a coating layer which is arranged on the outer periphery of the core wire, wherein the coating layer has a first layer arran...  
WO/2020/179693A1
In a porous body comprising a porous electrically conductive base material and a metal coating film formed on the porous electrically conductive base material, both of the reduction of the amount of a metal to be used for the formation o...  
WO/2020/174047A1
The present invention is related to an aqueous post treatment composition for providing a post treatment layer on at least a part of a passivation layer, which is covering at least a part of a zinc layer being on at least a part of an ir...  
WO/2020/173728A1
The invention is relative to manufacturing method of a type of telescope which is athermal, lightweight, optical quality for visible and IR applications.The method is is characterized by these steps: a) optical mirrors (1) are being made...  
WO/2020/173950A1
This invention relates to a method for electrolytically depositing a chromium oxide layer onto i) blackplate or onto ii) blackplate coated with a chromium electrodeposited coating produced based on chromium(III) technology electroplating...  
WO/2020/173953A1
This invention relates to a method for electroplating a steel strip with a plating layer and an improvement thereof.  
WO/2020/169439A1
The invention relates to an assembly (1) for electrically contacting a microchip substrate (2) during electrolytic metallization comprising: - a holder (6) having a recess (10), to which negative pressure can be applied, for receiving th...  
WO/2020/167487A1
Methods of manufacturing an extrusion die (100) having a plurality of pins (600a-c) and a plurality of slots (601) defined by the plurality of pins, each pin having a base, the method including applying a coating material (604) over side...  
WO/2020/166119A1
[Problem]To provide a technology capable of reducing the probability of generating a Cu-Sb compound and peeling between layers in an overlay. [Solution]This sliding member is provided with an overlay formed by using a plating film of a B...  
WO/2020/168074A1
Systems and methods are provided for method for etch assisted gold (Au) through silicon mask plating (EAG-TSM). An example method comprises providing a seed layer on a substrate and providing a silicon mask on at least a portion of the s...  
WO/2020/166500A1
Provided is a threaded joint for pipes, which has a large delta torque and can be screw-tightened with both of a tightening torque equal to the conventional one and a tightening torque higher than the conventional one. The threaded joint...  
WO/2020/162068A1
One aspect of the present invention relates to a surface-treated copper foil comprising a copper foil and a fine roughing particle treatment layer made from copper and arranged on at least one surface of the copper foil, the surface-trea...  
WO/2020/161256A1
Electrodeposition of a cobalt or copper alloy, and use in microelectronics The present invention relates to a process for fabricating cobalt or copper interconnects, and to an electrolyte enabling implementation of said process. The elec...  
WO/2020/158418A1
An electrolytic copper plate or a copper alloy plating bath, each of which contains at least two types of electrolytes, wherein at least one of nitric acid and a nitrate salt is included in the electrolytes. By using the electrolytic cop...  
WO/2020/156179A1
A surface processing foil, comprising a processing face, wherein a void volume (Vv) of the processing face is from 0.4 to 2.2 μm 3/μm 2, and the kurtosis (Sku) of the processing face is from 1.6 to 4.0.  
WO/2020/096374A3
The present invention relates to an electrolyte solution containing bromine ions for copper electroplating and a method for copper electroplating using same. The electrolyte solution for copper electroplating according to the present inv...  
WO/2020/156183A1
A surface-treated copper foil (100), comprising a treated surface (100A), the sum of the void volume (Vv) and the material volume (Vm) of the treated surface (100A) being 0.13 to 1.50μm 3/μm 2, and the root mean square gradient (Sdq) o...  
WO/2020/160352A1
A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrod...  
WO/2020/156967A1
A steel cord that is suitable for reinforcing rubber articles such as tires. The inventive steel cord enables to completely eliminate the presence of cobalt in a tire when combined with the proper cobalt free compound. Advantageously the...  
WO/2020/158141A1
A surface-treated copper foil provided with a copper foil and a surface-treating layer formed on at least one surface of the copper foil. In the surface-treated copper foil, the root mean square slope RΔq of the surface-treating layer i...  
WO/2020/158140A1
A surface-treated copper foil comprising a copper foil and a surface-treating layer formed on at least one surface of the copper foil. In the surface-treated copper foil, the average length RSm of the surface-treating layer is 3.3 to 5.2...  
WO/2020/153396A1
Provided are: a connector terminal material which can have improved abrasion resistance and heat resistance; and a method for manufacturing a connector terminal. The connector terminal material according to the present invention compri...  
WO/2020/148754A1
The invention provides a process for preparing an electrode, comprising: electrodeposition of metallic ruthenium/ruthenium oxide (Ru(0) /RuO2) coating onto a progressively etched nickel surface; and partial electrochemical oxidation of s...  
WO/2020/149401A1
Provided are: a metallic material which has an Au-containing surface layer and can keep the contact resistance thereof at a low level even when being heated; and a connecting terminal. A metallic material 1 comprising a base material 10 ...  
WO/2020/144959A1
This pattern plate for plating is configured so as to transfer a transfer pattern formed by electroless plating to a substrate. The pattern plate for plating is provided with a transfer part which has a transfer surface configured such t...  
WO/2020/144960A1
A pattern plate for plating is configured to transfer a transfer pattern formed by plating onto a board. The pattern plate for plating includes a base material and a plurality of transfer portions provided on the base material. Each of t...  
WO/2020/133731A1
Provided is a coarsened bare diamond wire saw, comprising a base line (1), a metal coating (2) and diamond particles (3) embedded in the metal coating, the surfaces of the diamond particles being subjected to coarsening. The embedded dep...  
WO/2020/138414A1
Provided is an anti-corrosion terminal material having a high corrosion-preventing effect and excellent film adhesion. A first film is formed on at least part of a base material, at least the surface thereof comprising copper or a copp...  
WO/2020/138321A1
The present invention pertains to a metal sheet comprising a plurality of plated parts, a frame part, and a linking part linking the plated parts and the frame part, wherein the plurality of plated parts, the frame part, and the linking ...  
WO/2020/131883A1
A process for the formation of a deformable battery electrode includes mixing a metal component including at least one of a metal or a metal alloy, a polymer component, and a dispersant component to create a mixture. The method further i...  
WO/2020/126817A1
Disclosed is an electrolyte for the electrolytic deposition of chromium as a metal, comprising (a) a chromium (III) salt and (b) metallic chromium, the use of the electrolyte for producing chromium layers on rotationally symmetrical comp...  
WO/2020/131995A1
A part includes a surface that having a rich textured appearance farmed by an anisotropic repeating pattern including first regions having a first microtexture and second regions having a second microtexture different from the first micr...  
WO/2020/126687A1
A composition comprising metal ions consisting essentially of cobalt ions, and a specific monomeric and polymeric suppressing agent comprising a carboxylic, sulfonic, sulfinic, phosphonic, or phosphinic acid functional groupswhich show a...  
WO/2020/121657A1
[Problem] To provide a work roll for rolling that is capable, when temper rolling a high strength steel strip, of effectively performing rolling while stabilizing the product quality even when the rolling distance advances, and a temper ...  
WO/2020/120701A1
The invention relates to a sheet metal blank for producing a heat-shaped and press-hardened steel sheet component (7) in a heat-shaping method, wherein, in a heat treatment step, the sheet metal blank (6) is heat-treated to above the mat...  
WO/2020/111751A1
A circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness is disclosed. A circuit pattern continuous manufacturing device comprises: an unwinder for unwinding a tra...  
WO/2020/112570A1
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set o...  
WO/2020/105289A1
Provided is a surface-treated copper foil that, in the case of use in the SAP method, can provide a resin substrate with a surface profile that can effectively prevent the generation of deposition that can be produced in a circuit in the...  
WO/2020/101566A1
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of a material selected from the group consisting of pure copper, doped copper with a co...  
WO/2020/094162A1
A treatment method of textile material to increase its absorption and reflectivity of electromagnetic radiation, electrical and thermal conductivity, antimicrobial characteristics wherein it is characterized in that continuously moving t...  
WO/2020/093157A1
A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricat...  
WO/2020/092244A1
A copper structure having a high density of nanotwins is deposited on a substrate. Electroplating conditions for depositing a nanotwinned copper structure may include applying a pulsed current waveform that alternates between a constant ...  
WO/2020/083799A1
The present invention relates to the electrolytic deposition of an alloy predominantly containing silver. Further components of the deposited alloy layer are palladium, tellurium and one or more of the metals Ce, Dy, Pb, Bi, AI, Ga, Ge, ...  
WO/2020/083808A1
The invention relates to a gas exchange valve (1) comprising a valve stem (3) and a valve disk (2). A nickel-phosphorus-boron carbide layer (4) is disposed in at least some areas on the valve stem (3) of the gas exchange valve (1).  
WO/2020/079905A1
Provided is an electroconductive material exhibiting excellent resin adhesion even in a harsh environment. An electroconductive material in which a resin is molded on the surface thereof, or the surface of which is sealed by a resin, whe...  
WO/2020/080411A1
A copper or copper alloy strip with a surface coating layer according to an embodiment of the present invention comprises a base material 4 of a copper or copper alloy strip and comprises, as a surface coating layer on the surface of the...  
WO/2020/079904A1
Provided is an electroconductive material exhibiting excellent resin adhesion even in a harsh environment. An electroconductive material in which a resin is molded on the surface thereof, or the surface of which is sealed by a resin, whe...  
WO/2020/074552A1
The present disclosure relates to a method of electroplating of a silver- graphene composite onto a substrate (1). The method comprises preparing a plating bath (6) comprising: a dissolved water soluble silver salt, dispersed graphene fl...  
WO/2020/072649A1
In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an ...  
WO/2020/071321A1
A plating device 1 is provided with a first plating tank 11A filled with a plating solution 3, an anode 14 disposed in the first plating tank 11A so as to face an article 2 to be plated, a cathode 12 for supplying power to the article 2 ...  

Matches 1 - 50 out of 22,369