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Matches 1 - 50 out of 21,008

Document Document Title
WO/2018/004151A1
The present invention relates to a surface-treated copper foil for a microcircuit board and a method for manufacturing the same and, more specifically, to a surface-treated copper foil for a microcircuit board and a method for manufactur...  
WO/2018/003620A1
This method for producing a plated roll comprises: a smoothing step of smoothing the surface of a roll base material composed of a cylindrical carbon fiber reinforced plastic; a base plating step of performing metal plating on the roll b...  
WO/2018/005155A1
An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module...  
WO/2018/003826A1
Provided is a carrier system capable of reliably carrying a substrate that is in a bent state. This carrier system is provided with an upper hand 237 on which a substrate WF is loaded. The upper hand 237 is provided with a base part 132 ...  
WO/2017/219797A1
The present invention relates to an electric copper plating liquid and an electric copper plating process thereof. The electric copper plating liquid comprises the following components: 20g/L to 240g/L of copper sulfate pentahydrate, 20 ...  
WO/2017/221485A1
[Problem]: To provide a copper-coated magnesium wire which meets the demand for a lightweight coil wire material, and a method of manufacturing the same. [Solution]: The abovementioned problem is solved by a copper-coated magnesium wire ...  
WO/2017/217387A1
According to the present invention, an electrodeposition article is formed with use of a tin or tin alloy plating bath which contains a predetermined branched polyoxyalkylene compound such as an alkylene oxide addition product of an alip...  
WO/2017/217234A1
[Problem] To provide a copper plating bath which contains a reduced amount of chlorine, considered to be attributable to wiring resistance, or is free of chlorine, without the need to highly purify copper sulfate. The copper plating bath...  
WO/2017/213021A1
The purpose of the present invention is to equalize the deposited amount of plating liquid remaining on a steel sheet between electroplating cells, thereby equalizing the thickness of final plating and achieving a surface appearance of f...  
WO/2017/206969A1
The invention relates to a device for chemically or electrochemically coating balls (1), comprising at least one spacing apparatus (2) for holding and spacing a plurality of balls (1) and a rotation apparatus (3) for holding and rotating...  
WO/2017/203668A1
This production method for a resin substrate with a plated coating includes: a step in which a surface treatment gas which includes at least fluorine gas is supplied to a resin substrate (20) that includes a reinforced fiber material (10...  
WO/2017/203767A1
This production method for a resin substrate with a coating includes: a step in which a surface treatment gas which includes at least fluorine gas is supplied to a resin substrate (20) that includes a reinforced fiber material (10), wher...  
WO/2017/205182A1
A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to pr...  
WO/2017/204246A1
In order to provide a soluble copper anode, an electrolytic copper plating device, an electrolytic copper plating method, and a method for preserving acidic electrolytic copper plating liquid that can stably suppress the generation of an...  
WO/2017/202587A1
The invention relates to a method and an installation for coating a scaled hot-rolled strip (10). The method comprises at least the following steps: (i) providing a hot-rolled strip (10) in the form of a hot-rolled preliminary strip, (ii...  
WO/2017/199664A1
Provided is a Sn-plated article that has a glossiness of 0.3-0.7 and that is manufactured by electroplating a substrate, made of copper or a copper alloy, at a current density of 5-13 A/dm2 in a Sn-plating bath, which contains only stann...  
WO/2017/199846A1
The objective of the invention is to provide a press-fit terminal connection structure in which a circuit board connection portion from a press-fit terminal is connected by being press-fitted into a through-hole provided on a printed cir...  
WO/2017/195768A1
Provided is an electrochemical corrosion-proof terminal material that uses a copper or copper alloy base as the terminal which is crimped to the end of an electrical wire formed from an aluminum wire material. An intermediate zinc layer ...  
WO/2017/191415A1
Process for manufacturing a composite material comprising vertically aligned carbon nanotubes (VACNT) and a copper metal matrix coating said nanotubes, said process comprising at least the following steps: a) a provision of vertically al...  
WO/2017/188530A1
The present invention relates to a wire having etched grooves and a method for manufacturing same, the method enabling enhanced adhesion with rubber by means of forming a pattern of various depths and shapes on a wire plating layer by us...  
WO/2017/188601A1
The present invention relates to electrolytic copper foil for graphene and a method for producing the former, more specifically to electrolytic copper foil, for graphene, facilitating graphene synthesis due to the addition of nickel duri...  
WO/2017/188600A1
The present invention relates to electrolytic copper foil for graphene and a method for producing the former, more specifically to electrolytic copper foil for graphene capable of facilitating graphene formation due to prevention of surf...  
WO/2017/186454A1
The present invention relates to an electrode comprising an electrically conductive substrate of which at least one portion of the surface is covered with a metal deposit of copper, the surface of said deposit being in an oxidised, sulph...  
WO/2017/186917A1
The present invention provides magnetic and electrocatalytic, pseudo-ordered mesoporous alloy films as well as their use. Two different types of mesoporous alloy films have been provided by the invention: (1) non-noble metal + noble meta...  
WO/2017/188531A1
The present invention relates to a wire having etched grooves and a method for manufacturing same, the method enabling enhanced adhesion with rubber by means of forming a pattern of various depths and shapes on a plating layer of a stran...  
WO/2017/183516A1
Provided is a connection terminal having an alloy-containing layer in which a tin-palladium alloy along with tin are exposed on the outermost surface thereof such that the friction coefficient can be reduced effectively, and when sliding...  
WO/2017/184380A1
An aqueous trivalent chromium electrolyte comprising trivalent chromium ions and amino acids that allow for producing a dark colored hue in the trivalent chromium coating which is plated on a substrate. The amino acids described herein c...  
WO/2017/179416A1
Provided is a treated surface copper foil that, when used in SAP, is able to impart to a laminate body a surface profile that is not only excellent in plated circuit adhesiveness but also in etchability with respect to electroless copper...  
WO/2017/179244A1
Provided is a connector terminal wire rod that includes: a base material containing a metal material; a first metal layer, which is formed on the base material by being exposed, and which contains Sn; and a second metal layer, which is f...  
WO/2017/175880A1
The present invention relates to a device for selectively plating only a part corresponding to a terminal part of a bus bar for connecting a plurality of cells arranged in a row in a secondary battery, wherein a first compartment of a pl...  
WO/2017/170067A1
A cell 10 for a solid polymer fuel cell and equipped with an anode-side cell constituent member 11 and a cathode-side cell constituent member 12, wherein: the anode-side cell constituent member 11 and the cathode-side cell constituent me...  
WO/2017/169765A1
Provided is a terminal which has an even lower frictional resistance (low insertion/extraction force) than in the prior art, which can maintain the reliability of an electrical connection (low contact resistance), and which can be produc...  
WO/2017/170731A1
The present invention reduces the time required for a smoothing step performed through polishing, etc., so as to improve the efficiency in manufacturing, from molding to smoothing of an impeller. The impeller manufacturing method accordi...  
WO/2017/169318A1
Disclosed is an automotive terminal that can be used, for example, as an electrical contact component, such as a connector, a lead frame, or a harness plug, used in an automobile. The automotive terminal comprises a Cu plating layer form...  
WO/2017/169317A1
Disclosed is a connection component material that can be used, for example, for electrical contact components, such as connectors, lead frames, and harness plugs, used in electrical devices, electronic devices, etc. The connection compon...  
WO/2017/171214A1
The present invention relates to a thermochemical gas sensor comprising: a substrate having an insulating layer; a seed layer provided above the insulating layer; a thermoelectric thin film provided above the seed layer; an electrode pro...  
WO/2017/154496A1
An electrical contact which is composed of a first contact (10) and a second contact (20) that are capable of forming an electrical contact with each other, and wherein: the first contact (10) has a silver-tin alloy layer (12) that is ex...  
WO/2017/155313A1
An anodizing apparatus of the present invention comprises: a plurality of gripping members to which an object is coupled; a rotation unit to which the plurality of gripping members are coupled so as to be spaced apart from each other and...  
WO/2017/154288A1
Provided is an Ni-plated copper or copper alloy material having both exceptional hardness and bending resistance. Provided is an Ni-plated copper or copper alloy material in which the area ratio of crystals in the <001> plane orientation...  
WO/2017/150657A1
The present invention prevents degradation of uniformity of the thickness of a plating film due to organic material adhering to an edge section of a substrate and/or an oxide film formed on the edge section of the substrate. A plating ap...  
WO/2017/150666A1
Provided is an electroplating apparatus capable of suppressing occurrence of a non-plated region when forming an alloy plating layer on the surface of a thread of a steel pipe. An electroplating apparatus (10) includes: an electrode (1);...  
WO/2017/146465A1
Disclosed is a method for producing a catheter electrode, the method, which is a method for producing a catheter electrode by means of electroplating, comprising the steps of: attaching a wire part to an electroplating member, at least a...  
WO/2017/141625A1
A method for manufacturing plated rod-shaped metal that has a preparation step for preparing a rod-shaped metal, and a plating step for selectively electroplating a region of the surface of the metal that runs in the longitudinal directi...  
WO/2017/141496A1
Provided is a plating device that has: a frame body that has a shape surrounding an area to be plated; a conveyance part that conveys a substrate to a position below the frame body while supporting another main face of the substrate whil...  
WO/2017/141925A1
Provided is a cermet powder able to produce a cermet film which exhibits high abrasion resistance and high resistance to strong acids having pH values of less than 1. This cermet powder is characterized by containing 40 mass% or more of ...  
WO/2017/141495A1
Provided is a substrate treatment system that is equipped with: a plating device that has a first conveyance part for conveying a first substrate and carries out the first substrate using the first conveyance part after the surface of th...  
WO/2017/138338A1
The present invention provides: a surface-treated copper foil which achieves a balance at a high level between reflow heat resistance and transmission characteristics, while ensuring sufficient adhesion to an insulating substrate; and th...  
WO/2017/126021A1
This method for producing a comb includes: a resin molded article production step for producing a resin molded article comprising multiple teeth laid out in a row, a body from which those teeth protrude, a grip part which is to be grippe...  
WO/2017/127197A1
A method and apparatus for processing a silicon substrate are provided. In some implementations, the method comprises providing a silicon substrate having an aperture containing an exposed silicon contact surface at a bottom of the apert...  
WO/2017/123034A1
Disclosed are a copper foil capable of securing a secondary battery having a high capacity retention rate, a method for manufacturing the same, an electrode comprising the same, and a secondary battery comprising the same. In the present...  

Matches 1 - 50 out of 21,008