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Matches 1 - 50 out of 21,343

Document Document Title
WO/2018/163541A1
The wire rod for an oblique-coil spring according to the present invention is provided with a core wire comprising steel having a pearlite structure, a copper plating layer comprising copper or a copper alloy covering the outer circumfer...  
WO/2018/165329A1
Methods and apparatus for electroplating substrates are described herein. In some cases, an ionically resistive element is positioned near the substrate, creating a cross flow manifold between the ionically resistive element and the subs...  
WO/2018/164127A1
[Problem] To provide corrosion-resistant terminal material with which galvanic corrosion does not arise easily by using copper or a copper alloy base material as a terminal to which an end of wire having an aluminum core wire is crimped,...  
WO/2018/159760A1
A surface-treated steel sheet according to one embodiment of the present invention comprises a steel sheet base material and a plating layer; and the plating layer comprises an Ni-Co alloy plating layer, an Ni-Fe alloy layer and an Ni la...  
WO/2018/150641A1
Provided is a metallic material for an electronic component, said metallic material having low adhesive wear properties. A metallic material for an electronic component comprises: a substrate; a lower layer constituted by one or more ele...  
WO/2018/145919A1
The present invention concerns pyridinium compounds, a synthesis method for their preparation, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths. The p...  
WO/2018/142955A1
The electrolytic treatment device (1, 1A) pertaining to an embodiment of the present invention performs electrolytic treatment of a treatment substrate, and is provided with a substrate retaining part (10) and an electrolytic treatment p...  
WO/2018/139628A1
Provided is: a terminal material for a connector terminal, which uses a copper or copper alloy substrate and is free from the occurrence of electrical corrosion, said connector terminal being crimped to an end of an electric wire that is...  
WO/2018/140433A1
Gallium target bodies for producing germanium-68 are disclosed. The targets include an alloy of a base metal and gallium. The alloy is enriched in gallium-69 to increase geramnium-68 production. Methods for producing such alloys by elect...  
WO/2018/139615A1
Provided is a plated steel wire that has, on the surface of a steel wire, a coating film layer containing Zn and at least any element selected from the element group consisting of Co, Cr, Cu, Ni, P, Sn, Mn, and Fe. The content in the coa...  
WO/2018/138989A1
Provided are a metallic foil manufacturing method and a cathode for manufacturing a metallic foil with which a metallic film electrodeposited by electrolysis on an electrodeposition surface of a cathode can be easily peeled off and a dif...  
WO/2018/138928A1
Provided is a surface-treated plated material, in which formation of whiskers is suppressed, which maintains good solderability and low contact resistance even when exposed to high temperature environments, and for which the insertion fo...  
WO/2018/135482A1
[Problem] To provide a terminal material for connectors having excellent insertion/removal properties, which is decreased in the coefficient of kinetic friction to as low as 0.3 or less, while exhibiting excellent electrical connection c...  
WO/2018/135655A1
This wiring circuit board is provided with a metal support substrate, an insulating layer and conductor layer disposed on one thickness-directional side of the metal support substrate, a gold plating layer disposed on the other thickness...  
WO/2018/128304A1
The present invention relates to a method for manufacturing a mask and a mother plate used therefor. The method for manufacturing a mask according to the present invention, which is a method for manufacturing a mask (100 ) by electroform...  
WO/2018/123380A1
[Problem] To provide a heat dissipation component which is for a semiconductor element, which has a high thermal conductivity and a linear expansion coefficient close to that of a semiconductor element, and which is highly reliable and h...  
WO/2018/122058A1
The present invention concerns a tin plating bath comprising tin ions; at least one complexing agent selected from the group consisting of pyrophosphate ions, linear polyphosphate ions and cyclic polyphosphate ions and a nitrogen and sul...  
WO/2018/122980A1
[Problem] To provide a resin film treatment device for reliably conveying a resin film to a treatment tank and performing satisfactory treatment even when a thin resin film is conveyed. [Solution] A resin film treatment device whereby a ...  
WO/2018/122935A1
Provided is a member for slide fasteners or buttons, which is formed from a plated aluminum or aluminum alloy, and which has both cracking resistance and gloss at the same time. A member for slide fasteners or buttons, which comprises: a...  
WO/2018/124114A1
The present invention provides a surface treatment material and an article fabricated using the same, whereby a surface treatment coating can be formed easily, with good adhesion, and in a short time on an electroconductive substrate tha...  
WO/2018/122216A1
The present invention relates to an electrolyte composition for depositing copper on a conductive surface. The composition contains a combination of 2,2'- bipyridine, imidazole, tetra-ethyl-ammonium, and a complexing agent for copper. Th...  
WO/2018/124115A1
This surface treatment material (10) has an electroconductive substrate (1) and a surface treatment coating (2) comprising at least one metal layer (3, 4) formed on the electroconductive substrate (1), and among the at least one metal la...  
WO/2018/123708A1
A lead frame member (10) is provided with an electrically conductive substrate (1) and a roughened film (3) which includes at least one roughened layer (2) formed of a plurality of roughened particle projections (4) on at least one side ...  
WO/2018/114498A1
The invention relates to a method for producing a steel substrate having a modified Zn protective coating, comprising the following steps: providing a steel substrate, applying a Zn protective coating by means of electrolysis such that a...  
WO/2018/114308A1
The invention relates to a method for coating a cold-worked multi-cone anchoring element for chemical fastening technology. In particular, the invention relates to a method for coating a cold-worked multi-cone anchoring element, which an...  
WO/2018/115338A1
Disclosed is a chromium-free pickling solution for pickling synthetic materials, comprising - one or more oxidizing acids, - 0.1 to 2 g/l of a vanadium compound, measured at 20 °C as vanadium pentoxide, - 1 to 10 g/l of manganese, measu...  
WO/2018/117751A1
The present invention relates to a Zn-Ni electroplated steel sheet having excellent corrosion resistance and formability and a manufacturing method therefor. One embodiment of the present invention provides a Zn-Ni electroplated steel sh...  
WO/2018/114985A1
The invention relates to polyamine-based or polyhydric alcohol-based suppressing agents which are modified by reaction with a compound that introduce a branching group into the suppressing agent before they are reacted with alkylene oxid...  
WO/2018/117124A1
A plated steel wire which is provided with: a steel wire to be plated; and a brass plating layer which covers the surface of the steel wire to be plated and is composed of Cu, Zn, Al and impurities, while having an average thickness of f...  
WO/2018/109848A1
The purpose of the present invention is to provide an electroplating method for a metal fastener, the method enabling each element of a metal fastener to be easily plated with high uniformity. Provided is an electroplating method for a f...  
WO/2018/110019A1
The present invention is a fastener stringer that is provided with a metal element row which has a plating film, the fastener stringer being configured such that even if the elements are not electrically connected in advance, the plating...  
WO/2018/109983A1
Provided is an electroplating method with which a plating film having excellent uniformity and adhesion can be easily formed on an exposed surface of each element of a metal fastener even if the elements are not electrically connected to...  
WO/2018/110198A1
The present invention addresses the problem of providing a method for forming a transparent electroconductive film, whereby a transparent electroconductive film can be formed which has excellent electrical conductivity and in which a thi...  
WO/2018/110579A1
A surface treated copper foil having laminated, in order, upon at least one surface of the copper foil, a roughening layer, an antitrust treatment layer, and a silane coupling layer. The surface treated copper foil has a developed area r...  
WO/2018/109998A1
The purpose of the present invention is to provide an electroplating method for a metal fastener, the method enabling each element of a metal fastener to be easily plated with high uniformity. Provided is an electroplating method for a f...  
WO/2018/107092A1
A method for functionalizing a tubular structure with an array of metal oxide nanotubes or an array of metal oxide-free polymer nanotubes is provided. The method may include positioning an electrode in a lumen of a suitable tubular struc...  
WO/2018/105388A1
Provided are: a Sn plating material which has a Zn plating layer formed at a surface thereof, and which when used as a material for a terminal which is connected to an electric wire formed of aluminum or an aluminum alloy by pressure-att...  
WO/2018/103793A1
The invention relates to a continuous separation installation (10; 20; 30; 50) for the galvanic deposition of a substance on objects (1), wherein said continuous separation installation (10; 20; 30; 50) comprises contacting devices (12; ...  
WO/2018/098793A1
A selective plating device (1) and a selective plating die (30) thereof. The selective plating die (30) comprises a roller-shaped die body (31). Plating holes (310) are formed in the roller-shaped die body (31). The selective plating die...  
WO/2018/101076A1
The present invention relates to: a semiconductor device which enables deterioration in signal characteristics caused by generated parasitic capacitance to be inhibited by providing a configuration which is capable of achieving an electr...  
WO/2018/097184A1
The present invention addresses the problem of providing an electrolytic nickel (alloy) plating solution which is able to fill micro holes or micro recesses 14 within an electronic circuit component with nickel or nickel alloy 18 without...  
WO/2018/095133A1
A method of preparing an electroplating copper layer having a preferred growth orientation includes: providing an electroplating solution that includes 120 to 200 g /L of copper sulfate, 50 to 150 g /L of sulfuric acid, 100 to 1000 ppm o...  
WO/2018/087135A1
This invention relates to a method for electroplating an uncoated steel strip with a plating layer from a trivalent Cr-electrolyte, where the uncoated strip is subjected to a cleaning and pickling step prior to the plating process and th...  
WO/2018/083496A1
Herein is disclosed, a method of plating an item with a first metal, the method comprising providing a plating solution comprising a liquid medium, a precursor species for forming a layer of the first metal on the items, and a plurality ...  
WO/2018/084811A1
A method for producing a coated wire rope, the method comprising the steps of: guiding an element to a first wire coating device; applying a metal and metal coated grit to said element; guiding said element to a second wire coating devic...  
WO/2018/079253A1
The present invention provides: an electrical contact which is capable of achieving a good balance between low coefficient of friction and low contact resistance even after sliding; and a connector terminal pair and a connector pair, eac...  
WO/2018/074212A1
Provided is a threaded joint for a pipe having excellent seizing resistance and an excellent external appearance; also provided is a manufacturing method therefor. An embodiment of this threaded joint for a pipe is equipped with a pin (3...  
WO/2018/074883A1
An embodiment of the present invention provides a through-electrode filling method comprising: a step of immersing a through-electrode including a via in a copper plating solution having a leveler and a copper electrolyte; a first curren...  
WO/2018/074256A1
[Problem] To provide a conductive bar material which maintains low contact resistance in a high temperature environment and exhibits excellent heat resistance, while having excellently low insertion resistance. [Solution] A conductive ba...  
WO/2018/074255A1
Provided are a connection terminal and a method for producing the connection terminal, which make it possible to reduce the coefficient of friction and curb the changes over time at high temperatures, while also maintaining connection re...  

Matches 1 - 50 out of 21,343