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Patent Searching and Data


Matches 451 - 500 out of 9,291

Document Document Title
WO/2006/068283A1
A flattening method can flatly process a surface of a metal film as an interconnect material over the entire film surface at a sufficiently high processing rate even when the metal film has initial surface irregularities. The flattening ...  
WO/2006/068300A1
An aluminum material for electrolytic capacitor electrodes, wherein, in an alloy composition, the aluminum material contains Ga: 0.0005 mass% or more, and wherein a ratio AGa/BGa of Ga content AGa (mass%) in a surface layer ranging from ...  
WO/2006/057713A2
A polishing pad includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of conducting polishing elements each affixed to the compressible under-layer and passing through...  
WO/2006/056367A1
A device is provided to clean an object by positioning the surface of the object to be cleaned in contact with a cleaning medium comprising one or more liquids having a dielectric constant of from 1 to 200 and placed in an electric field...  
WO/2006/057713A3
A polishing pad includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of conducting polishing elements each affixed to the compressible under-layer and passing through...  
WO2005090648A3
An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electr...  
WO/2006/046058A2
A method of forming a plurality of optical microstructures is disclosed. The method includes laser machining a plurality of holes onto a surface and electrolytically polishing at least the holes to remove debris created during the laser ...  
WO/2006/042985A1
The invention concerns a device for chemically etching an electrically conductive layer (2) on a transparent substrate (1), comprising means for supporting (4) the substrate (1) and means for spraying (5) a solution. The invention is cha...  
WO2005075712A3
An improved electrochemical IR calculation and correction system allows for the precise measurement and control of the interfacial voltage drop at an electrode double layer. In an exemplary use of the invention, this improved IR correcti...  
WO/2006/037584A1
The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the contact angle of the acid solution on a ...  
WO/2006/030998A1
Disclosed are an electro polishing combined electric plating apparatus and an electroless plating apparatus using the same that that can form a plating film on a workpiece shaped in a pipe made of a material selected from the group consi...  
WO/2006/029708A1
The invention relates to a method for creating structures or microstructures on metallic surfaces by means of electrochemical etching. The invention further relates to components that are processed according to such a method.  
WO/2006/020080A3
Systems and methods are disclosed for reducing the influence of plasma generated debris on internal components of an EUV light source. In one aspect, an EUV metrology monitor is provided which may have a heater to heat an internal multi-...  
WO2004106592A8
Apparatus (1) for the recovery of synthetic diamonts from capsules includes a plurality of enclosures (2), in this embodiment bags, formed from an ion permeable membrane (3) each having a plate-like anode (5) centrally positioned therein...  
WO/2006/013812A1
A process for producing an aluminum electrode foil for a capacitor, comprising a first step of preparing an emulsion from a mixture containing a first phase of a liquid resin or a resin solution of a resin dissolved in a solvent, a secon...  
WO2005042160A3
A reactor defines a reaction chamber for processing a substrate. The reactor comprises a first inlet for providing a first reactant and to the reaction chamber and a second inlet for a second reactant to the reaction chamber. A first exh...  
WO/2006/010888A1
A method of depositing or etching a micro- or nano- scale pattern on a work-piece is disclosed, comprising the steps of: (a) placing the work piece in an electrochemical reactor in close proximity to a patterned tool; (b) connecting the ...  
WO/2006/008017A1
The invention relates to a method and device for electrolytically descaling flat metal products (2), particularly strips of stainless steel and or C-steel. At least one diamond electrode and /or at least one lead/tin electrode, e.g. a le...  
WO/2006/008371A1
The invention relates to a method for continuously producing an aluminium alloy strip for transferring a sublimable decoration from a temporary carrier consisting in using the aluminium alloy strip having a gloss and high-gloss quality, ...  
WO/2006/002610A1
The invention relates to a method for removing coatings which are applied to components, such as turbine blades. When the turbine blades have reached the end of the product life cycle, said coatings can be removed so that the turbine bla...  
WO/2006/000301A1
The invention relates to a device for the electrochemical surface treatment of metal parts in an electrolyte bath (B). The device comprises a drum (12) which is rotatable about an axis (X) and provided with a shell (14) and sidewalls (16...  
WO/2006/001699A1
The present invention relates to a method of improving the current efficiency (CE) in an electrolytic aluminium production cell with an electrolytic bath, at least one anode and at least one cathode, and passing current between said anod...  
WO/2005/123317A1
A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur sim...  
WO/2005/120743A1
The invention concerns a method comprising: a) providing sheet or format metal; b) swaging said metal by means of a swaging lubricant, so as to form a swaged blank (1); c) degreasing said swaged blank (1), so as to typically remove the r...  
WO/2005/113863A3
The invention provides a cylindrical electrochemical cell which includes a first electrode and a second electrode which is a counter electrode to the first electrode, and an electrolyte. The first electrode includes a polyanion-based ele...  
WO2004077526A3
A UV detector (10) has a UV detection thin film of coated spherical silicon nanoparticles formed upon a substrate (12). The detector includes structures to bias the thin film. In preferred embodiments, a thin conductor (18) that is at le...  
WO/2005/113863A2
The invention provides a cylindrical electrochemical cell which includes a first electrode and a second electrode which is a counter electrode to the first electrode, and an electrolyte. The first electrode includes a polyanion-based ele...  
WO/2005/110286A1
A method for making an implantable stent includes the steps of (i) providing a plurality of elongate stent wires; (ii) forming said wires into a hollow tubular structure having opposed first and second open ends; (iii) terminating said w...  
WO/2005/108041A1
A method for cleaning a mold, wherein a main cleaning solution for use in the electrolytic cleaning as a main cleaning comprises a strongly alkaline component containing one or more selected from sodium hydroxide, potassium hydroxide and...  
WO/2005/105356A2
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Appli...  
WO/2005/106081A1
The invention relates to a method for selectively coating or etching surfaces during which the surface areas that are not to be treated are masked with a masking device (18) during the actual coating or etching process. The masking devic...  
WO2005083159A3
This invention provides a membrane-mediated electropolishing apparatus for polishing and/or planarizing metal work-pieces. The work-piece is wetted with a low-conductivity fluid. The wetted work-piece is contacted with a first side of a ...  
WO/2005/105356A3
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Appli...  
WO2005000363B1
The present invention relates to methods and apparatuses for the use of atmospheric pressure non-thermal plasma to clean and sterilize the surfaces of liquid handling devices.  
WO/2005/100643A2
The present invention relates to a process for production, shipment, and treatment of a NH4F(HF)x feedstock for local production of fluorine and NF3 for semiconductor chamber cleaning without the need for storage of large quantities of d...  
WO2005042810A3
This invention provides a membrane-mediated electropolishing process for polishing and/or planarizing metal work pieces. The work piece is wetted with a low-conductivity fluid. The wetted work piece is contacted with a first side of a ch...  
WO/2005/093135A1
An electrolytic processing apparatus (50) has feed electrodes (74) to feed a current to a substrate (W), an ion exchanger (76) brought into contact with the substrate (W), and process electrodes (72) to perform an electrolytic process on...  
WO/2005/090648A2
An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electr...  
WO/2005/086192A1
Capacitor foil (10) having a core layer (11), at least one porous layer (12; 13) and a porous surface layer (16; 17), and a method for producing the same and an electrolytic capacitor. The at least one porous layer (12; 13) and the porou...  
WO/2005/085502A1
The invention relates to a method for electrolytically pickling metallic bands, particularly stainless steel bands made of titanium, aluminum, chromium or nickel, during which the electrical current is conducted directly into the anode a...  
WO/2005/083159A2
This invention provides a membrane-mediated electropolishing apparatus for polishing and/or planarizing metal work-pieces. The work-piece is wetted with a low-conductivity fluid. The wetted work-piece is contacted with a first side of a ...  
WO/2005/082057A2
A metal layer formed on a wafer, the wafer having a center portion and an edge portion, is electropolished by aligning a nozzle and the wafer to position the nozzle adjacent to the center portion of the wafer. The wafer is rotated. As th...  
WO/2005/083158A1
The invention relates to a method for electrochemically removing a coating from components, especially gas turbine components. According to said method, the component from which the coating is to be removed is connected to a positive ter...  
WO/2005/082057A3
A metal layer formed on a wafer, the wafer having a center portion and an edge portion, is electropolished by aligning a nozzle and the wafer to position the nozzle adjacent to the center portion of the wafer. The wafer is rotated. As th...  
WO2005066395A3
A method of cleaning or polishing an alloy comprising at least one noble metal and at least one non-noble metal said method comprising the step of submerging said alloy in an electrolytic acidic bath comprising at least one complexing ag...  
WO2005024098A3
A method for making a ferritic stainless steel article having an oxidation resistant surface includes providing a ferritic stainless steel comprising aluminum, at least one rare earth metal and 16 to less than 30 weight percent chromium,...  
WO/2005/078751A1
A method for manufacturing an aluminum material for electrolytic capacitor electrodes of the present invention, comprising the steps of heating an aluminum material in an oxidative atmosphere, removing the surface layer of the aluminum m...  
WO/2005/075711A1
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a conductive material from a substrate surface including sulfuric ...  
WO2005000363A3
The present invention relates to methods and apparatuses for the use of atmospheric pressure non-thermal plasma to clean and sterilize the surfaces of liquid handling devices.  
WO/2005/075712A2
An improved electrochemical IR calculation and correction system allows for the precise measurement and control of the interfacial voltage drop at an electrode double layer. In an exemplary use of the invention, this improved IR correcti...  

Matches 451 - 500 out of 9,291