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WO/2008/069180A1 |
A high-strength aluminum alloy plate for printing plate containing given amounts of Si, Fe, Cu, Mg and Mn and the balance of Al and unavoidable impurities, or high-strength aluminum alloy plate for printing plate containing given amounts...
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WO/2008/068070A1 |
The invention relates to a method for coating a component (1) provided with openings, in which an MCrAlY coating (3) is applied two-dimensionally to the component (1) and the MCrAlY coating (3a-c) is electrochemically removed locally in ...
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WO/2008/058986A1 |
A continuous annealing and pickling process of flat cold-rolled products, such as stainless steel strips, to obtain a high surface quality product at high production rates and with a low environmental impact. It comprises the following s...
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WO/2008/046035A1 |
An apparatus and a method for operating the same. The method includes providing an apparatus which includes a chamber, (200) wherein the chamber includes first (260b) and second (260a) inlets, an anode (210) and a cathode (230) structure...
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WO/2008/034818A1 |
The invention relates to a device (1) for processing a surface (207) of a workpiece (203), the device comprising a reactor (2) in which the workpiece (203) forms a first electrode and a tool (205) forms the second electrode, wherein the ...
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WO/2008/028311A1 |
Arranged in a removable holder (5) above a tank (2) filled with an electrolyte is a coupling (7), which can rotate about a vertical axis of rotation, for attaching a workpiece carrier (15) which may, for example, be loaded with workpiece...
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WO/2008/029736A1 |
This invention provides a method for separating a surface layer of diamond, characterized by comprising implanting ions into diamond to form a nondiamond layer in a part around the surface of the diamond, then applying an alternating cur...
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WO/2008/017559A1 |
The invention relates inter alia to a method for producing a starting material (M, N, N') for the production of a wear layer (420). It is provided according to the invention that a coating (40) with a composition which corresponds to tha...
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WO/2008/013877A2 |
A method of removing contaminants from a fuel cell catalyst electrode. The method includes providing a getter electrode and a fuel cell catalyst electrode having at least one contaminant to a bath and applying a voltage sufficient to dri...
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WO/2008/006375A1 |
The invention provides a process for the manufacture of ultra-thin sections in an electrically conducting material, comprising: firstly removing material in an electrochemical process to a material thickness of approximately 10 to 20 mic...
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WO/2008/000663A1 |
The invention relates inter alia to a method for removing a protective coating (40) from a component (10), especially a turbine blade. According to the invention, the protective coating (40) is removed, using mechanical shock waves (S1, ...
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WO/2007/148716A1 |
With simpler facilities and procedures than those of the prior art, a surface treatment can be made on a part inside or the like while simplifying a grinding work. A first pressed dust electrode (31), which has its leading end portion ta...
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WO/2007/147655A1 |
The invention relates to a method for the electrochemical removal of a metal coating from a component (4, 120, 130). According to said method, the component (4, 120, 130) is immersed in an electrolyte solution (2) and a current is passed...
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WO/2007/134917A2 |
According to the prior art, electrolytic methods comprise pulsed currents or voltages that have the same voltage level over time. According to the invention, pulsed currents or voltages (U) are likewise used, but the level of the pulse a...
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WO/2007/136024A1 |
[PROBLEMS] To provide a method of pretreatment for plating in which lead, etc. dissolved in an etchant are prevented from being electrodeposited (readhering) to a lead-containing copper alloy as a work to be plated without the necessity ...
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WO/2007/123832A2 |
Operation of a DI HCCI engine is optimized for maximizing load capability and load ranges via matching fuel ignitability with the compression ratio of the engine.
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WO/2007/121999A2 |
Electrolytic solution for the electrochemical polishing of metal articles which constitute the anode in the polishing process by application of electrical currents. The solution comprises at least one compound of the alkylbenzene sulfoni...
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WO/2007/122752A1 |
Opposed to conductive metal oxide thin-film (12) lying on a surface of base material (11), positive electrode (13) and first negative electrode (14) are disposed in parallel in a noncontact state. Between the positive electrode (13) and ...
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WO/2007/110469A1 |
The invention relates to a method that inhibits the formation of a deposition layer on metal surfaces in liquid submersion in a process susceptible to deposition, e.g. in an enrichment process. In the method, anodic current is supplied t...
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WO/2007/103446A2 |
An apparatus and method are provided for simultaneously electropolishing a plurality of metallic stents. A plurality of elongated members on the apparatus are movably engaged with a plate such that movement of the plate relative to the e...
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WO/2007/099210A1 |
The invention provides a method and a device for reliable, rapid, simple, easily implementable and reproducible electrochemical microstructuring and/or nanostructuring. For this purpose, the subject of the invention is a method for elect...
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WO/2007/097105A1 |
This invention provides a method for manufacturing an aluminum support for a lithographic printing plate material that, even when the speed of electrochemical surface roughening treatment by web transfer, the electrochemical surface roug...
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WO/2007/095388A2 |
Broadly speaking, the embodiments of the present invention provide an improved chamber cleaning mechanism, apparatus and method. The present invention can also be used to provide additional knobs to tune the etch processes. In one embodi...
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WO/2007/095439A2 |
A method for electrochemically etching a metal layer deposited on a dielectric with an etch resist layer pattern to form circuitry for high density interconnect electronic modules using a nonactive electrolyte solution is described. The ...
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WO/2007/094869A2 |
A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an ele...
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WO/2007/088013A1 |
The invention provides a process for producing a metal body, which leads in a simple and reliable way to formation of a defined surface topography, if desired also combined, in the range from 10 nm to 500 µm on a metal base body or blan...
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WO/2007/085062A1 |
Perforated aluminium foil or sheet is produced electrochemically, so that the size of pores can be controlled by applying specific voltage on electrodes. In the presented technological process, the pore size ranges from 0.3 to 1.5 µ wit...
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WO2007043688A9 |
A Co-based alloy having a fundamental composition of Co-Al binary system containing 3-15% Al and having a lamellar structure wherein f.c.c. structure a-phase and ß(B2)-phase are superimposed on each other in layers, which Co-based alloy...
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WO/2007/058603A1 |
Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple e...
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WO/2007/058605A1 |
A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a...
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WO/2007/058604A1 |
An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material...
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WO/2007/056992A1 |
The invention relates to a single-stage method for the electrolytic cleaning and descaling of steel and other metals in an acidic aqueous electrolyte, in which the workpiece is connected to the anode of a current source. In this case, th...
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WO/2007/047454A2 |
Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is prov...
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WO/2007/035408A1 |
A method for electrochemically processing a substrate is provided. In one embodiment, a method for electrochemically processing a substrate includes processing a substrate using a multi-step routine that includes a first processing perio...
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WO/2007/026931A1 |
This invention provides an electrochemical machining method that, while suppressing the working of a wiring metal, can preferentially work a diffusion barrier layer, and consequently can omit CMP or can reduce working pressure in CMP. Th...
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WO/2007/017156A1 |
The invention relates to an inexpensive and environmentally friendly method for electrochemically polishing steel, especially low-alloy steels. The method is characterized in that the workpieces, after electropolishing, are rinsed in a p...
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WO/2007/015938A2 |
By patterning an underbump metallization layer stack (105) on the basis of a dry etch process (111), significant advantages may be achieved compared to conventional techniques involving a highly complex wet chemical etch process. In part...
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WO2006121600B1 |
Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is prov...
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WO/2007/015454A1 |
[PROBNLEMS] A method and a device for removing a conductive metal oxide thin film without leaving a scar nor stress deformation. [MEANS OF SOLVING PROBLEMS] The device comprises a first electrode (18) disposed so as to immerse one end th...
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WO/2007/014967A1 |
The invention relates to etching agents for etching surfaces, in particular metal surfaces. The inventive etching agents are characterised in that they are removable from each etched surface in a residue-free manner.
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WO/2007/007617A1 |
In an electrochemical surface treatment, reduction of a metal waste liquid and formation of a high-quality metal film, which exhibits good adhesion and has no pinhole, are easily realized. Specifically disclosed is a surface treatment me...
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WO/2007/006690A1 |
The invention relates to a method for processing at least two workpieces (7) by means of electrochemical treatment. During the method, the workpieces (7) are provided as working electrodes in an electrolytic treatment solution (3) inside...
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WO2006083693B1 |
In one embodiment, a method for treating a silicon-containing surface is provided which includes removing contaminants and/or smoothing the substrate surface by a slow etch process (e.g., about <100 Å/min). The substrate is exposed to a...
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WO/2007/003956A2 |
There is provided a mixture having a freezing point of up to 50°C, formed by reaction between: (A) one molar equivalent of a salt of formula I (Mn+)(X-)n I or a hydrate thereof; and (B) from one to eight molar equivalents of a complexin...
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WO/2007/003725A1 |
The invention relates to an austenitic stainless steel strip having an elastic limit Rp0.2 which is greater than or equal to 600 MPa, a breaking load Rm which is greater than or equal to 800 MPa, an elongation A80 which is greater than o...
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WO2005110286A9 |
A method for making an implantable stent includes the steps of (i) providing a plurality of elongate stent wires; (ii) forming said wires into a hollow tubular structure having opposed first and second open ends; (iii) terminating said w...
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WO/2007/001263A2 |
A decontaminating system (200) is provided that includes: (a) a decontaminating apparatus (100) including (i) an electrically conductive scrubbing shoe (104) having an inlet (204) for a gel-like material and (ii) an insulating standoff (...
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WO/2006/138110A2 |
The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a...
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WO/2006/131177A2 |
The invention relates to a method for producing seed layers for depositing a semiconductor material during which a monocrystalline semiconductor substrate (12) is electrochemically etched in an aqueous solution with F- ions. A series of ...
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WO/2006/129540A1 |
An Nb-Al type superconducting wire which is in a state before transformation to an Nb3Al compound. It comprises an Nb-Al type wire in the state of a supersaturated solid solution, a nickel coating film as an interlayer, and a copper coat...
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