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Matches 151 - 200 out of 2,478

Document Document Title
WO/2005/085485A1
The invention relates to non-ferrous metallurgy, in particular to devises for producing a titanium sponge by magnesium-thermal reduction of a titanium tetrachloride. The inventive device comprises a furnace, wherein a retort-reactor prov...  
WO/2005/083341A1
An apparatus and method for uniformizing the temperature distribution across a semiconductor wafer during radiation annealing of process regions formed in the wafer is disclosed. The method includes forming a silicon layer atop the upper...  
WO2005013325B1
A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processin...  
WO/2005/068680A2
An apparatus and method for heating materials or substances in an oven at an oven temperature below their melting and/or vaporization points to either melt and/or vaporize the substance. Substances are inserted into a substantially spher...  
WO2005040705A3
Muffle furnace consisting of a furnace, a perforated plate at the base of the interior, a structure which divides the interior of the furnace into chambers; a further perforated plate beneath the cover of the furnace. It is used for the ...  
WO/2005/064254A1
A vertical heat treatment device includes a treatment container (5) having a treatment region (A1). The treatment region (A1) is set so as to receive to-be-treated substrates (W) held at vertical intervals. The device also has a heating ...  
WO2005013325A3
A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processin...  
WO2004078406B1
A one-piece or otherwise unitary annular shim member made from a perforated metallic material is used to maintain a space between stacked annular preforms during a manufacturing process, such as densification. The metallic material used ...  
WO2004094568A3
A Pulverized Coal Pressurized Gasifier (PCPG) including a gasifier chamber, a fuel (18) chamber and at least one flame retention burner (100). The flame retention burner (100) prolongs high temperature exposure of coal (18) to the hot fl...  
WO/2005/046920A2
As part of a system for processing a workpiece (122) by applying a controlled heat to the workpiece, a heating arrangement includes an array of spaced apart heating elements (102) for use in a confronting relationship with the workpiece ...  
WO/2005/040705A2
Muffle furnace consisting of a furnace, a perforated plate at the base of the interior, a structure which divides the interior of the furnace into chambers; a further perforated plate beneath the cover of the furnace. It is used for the ...  
WO/2005/038373A1
A high-pressure heat treatment furnace, comprising a pressure vessel having a furnace container and a furnace cover closing the furnace container and allowing an internal pressure to be controlled, heat-insulating walls installed in the ...  
WO2004008494A3
A method and system for controlling a servomotor network. The system has at least one local control node remotely located from a central processing area. The local control node actuates one or more servomotors, and is physically placed n...  
WO2004077505A3
An etching system for etching a wafer of a material has a measuring device, an etching chamber, and a controller. The measuring device measures the critical dimension test feature (CD) along the profile of the wafer at a plurality of pre...  
WO2004072323B1
A furnace incorporating a novel thermal design is disclosed. Heating element temperature is reduced compared to conventional designs while providing a precisely controlled process temperature in the range1000 - 1400 degrees centigrade. T...  
WO/2005/013325A2
A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processin...  
WO2004007800A9
A thermal processing apparatus (100) is provided comprising a process chamber (102) and a vacuum system (104) for evacuating the process chamber. The vacuum system comprises a pump unit (124) in flow communication with the chamber and a ...  
WO2004008054A9
A method and apparatus for insulating and controlling temperature in a semiconductor manufacturing environment. The invention comprises at least one modular heater element designed to be mounted about a semiconductor furnace process cham...  
WO/2005/001360A1
A gas cooling type vacuum heat treating furnace, comprising a gas cooling furnace having a cooling chamber allowing the stationary placement of a treated article therein and forming a gas flow passage in the vertical direction, a gas coo...  
WO/2004/113813A1
The inventive device (1) for compressing a ceramic dental mixture for producing dental prosthesis such as crowns, bridges and inlays comprises a top part (2), a lower part (4) movable with respect to the top part (2) and a piston (7) whi...  
WO/2004/114377A1
A heating means is disclosed which comprises a reflector plate composed of an opaque quartz and a quartz tube welded to the surface of the reflector plate. A carbon wire which generates heat when a current is applied is inserted in the q...  
WO2004008008A3
A gaseous flow control method and system. The flow control system monitors and controls gaseous levels and gas flow into and out of an enclosed space by using a proportional/integral/derivative (PID) controller to manipulate gas flow int...  
WO2004072323A3
A furnace incorporating a novel thermal design is disclosed. Heating element temperature is reduced compared to conventional designs while providing a precisely controlled process temperature in the range1000 - 1400 degrees centigrade. T...  
WO2004078406A3
A one-piece or otherwise unitary annular shim member made from a perforated metallic material is used to maintain a space between stacked annular preforms during a manufacturing process, such as densification. The metallic material used ...  
WO2004077912A3
A one-piece or otherwise unitary annular shim member made from a carbon material is used to maintain a space between stacked annular preforms during a manufacturing process, such as densification. The one-piece structure advantageously s...  
WO/2004/094568A2
A Pulverized Coal Pressurized Gasifier (PCPG) including a gasifier chamber, a fuel (18) chamber and at least one flame retention burner (100). The flame retention burner (100) prolongs high temperature exposure of coal (18) to the hot fl...  
WO/2004/085943A1
The aim of the invention is to provide a reliable and efficient operation of a dental furnace (1) for producing compacted ceramics, comprising a hood-shaped firing chamber (3), into which a muffle (5) can be inserted and which is closed ...  
WO/2004/077912A2
A one-piece or otherwise unitary annular shim member made from a carbon material is used to maintain a space between stacked annular preforms during a manufacturing process, such as densification. The one-piece structure advantageously s...  
WO/2004/078406A2
A one-piece or otherwise unitary annular shim member made from a perforated metallic material is used to maintain a space between stacked annular preforms during a manufacturing process, such as densification. The metallic material used ...  
WO/2004/077505A2
An etching system for etching a wafer of a material has a measuring device, an etching chamber, and a controller. The measuring device measures the critical dimension test feature (CD) along the profile of the wafer at a plurality of pre...  
WO/2004/072323A2
A furnace incorporating a novel thermal design is disclosed. Heating element temperature is reduced compared to conventional designs while providing a precisely controlled process temperature in the range1000 - 1400 degrees centigrade. T...  
WO/2004/073051A1
A heater assembly for an ALD or CVD reactor provides protection for an electrical conductor associated with a heating element by using a purge gas to isolate the conductor from the corrosive environment of the reactor chamber. The purge ...  
WO/2004/070747A1
A heat treatment system in which the direction of a magnetic field being generated by a field generating means (20) in a region for heat treating an object is in parallel with the direction of the object being carried into a heat treatme...  
WO2004007318A3
A loadport apparatus for conditioning the interior of a FOUP having a FOUP door. The apparatus includes platform, a housing, an loadport door, a loadport door seal and a conditioning system. The FOUP platform receives the FOUP. The housi...  
WO2004008493A9
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...  
WO/2004/059230A1
The invention relates to the thermochemical hardening of products, mainly having residual surface stress, for example metal products consisting of hot-rolled parts, metal wireworks including metal-woven, filtering fabrics, fastener threa...  
WO2004008491A3
An apparatus (100) and method are provided for thermally processing substrates (108) held in a carrier (106). The apparatus (100) includes a vessel (101) having a top (134), side (136) and bottom (138), and a heat source (110) with heati...  
WO/2004/044969A1
Two bypasses (32, 33) are formed in the valve box (21) of a main valve (18) provided in the piping (13) of the exhaust system (12) of a heat treatment furnace (1). Each bypath (32, 33) is opened&sol closed by an auxiliary valve (30, 31) ...  
WO2004008493A3
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...  
WO2004008052A3
A cooling system and method are provided for cooling an apparatus (100) having a vessel (102) containing a substrate (108) to be processed, and heating elements (10012) distributed coaxially around and spaced apart from the vessel to for...  
WO/2004/035846A1
A low pollution process for extracting arsenic in vacuum, including: heat and keep the smelting chamber to a temperature of 100-300 °C under the reduced pressure lower than 50 Pa to remove the water vapor and some dust; then heat and ke...  
WO/2004/033731A1
The invention concerns a heat treatment method for metal parts (6) arranged in feed (5) wherein the feed of parts is successively brought into a vertical treatment furnace (1) capable of being opened downwards, said method consisting in:...  
WO2004007819A3
The invention concerns a method which consists in heating carbon products in an oven (10) under reduced pressure and under neutral gas sweeping, while continuously extracting from the oven gas effluent containing elementary or combined s...  
WO/2004/027845A1
A heat−treating apparatus comprising a reaction chamber accommodating an object to be treated, a heat−insulating body surrounding the reaction chamber, holes defined in the heat−insulating body, annular spacer members provided in t...  
WO/2004/015348A1
A reactor chamber (130) is positioned between a top array of LED heat lamps (146) and a bottom array of LED heat lamps (148). The LED heat lamps (180) forming the top and bottom arrays (146, 148) are individually or controllable in group...  
WO/2004/007105A1
Various backfill injectors that provide upflowing gas and have improved uniformity of distribution of gas into the perimeter of the process chamber are provided for use in semiconductor wafer processing apparatus. Suitably optimized back...  
WO/2004/008008A2
A gaseous flow control method and system. The flow control system monitors and controls gaseous levels and gas flow into and out of an enclosed space by using a proportional/integral/derivative (PID) controller to manipulate gas flow int...  
WO/2004/008054A1
A method and apparatus for insulating and controlling temperature in a semiconductor manufacturing environment. The invention comprises at least one modular heater element designed to be mounted about a semiconductor furnace process cham...  
WO/2004/007318A2
A loadport apparatus for conditioning the interior of a FOUP having a FOUP door. The apparatus includes platform, a housing, an loadport door, a loadport door seal and a conditioning system. The FOUP platform receives the FOUP. The housi...  
WO/2004/007800A1
A thermal processing apparatus (100) is provided comprising a process chamber (102) and a vacuum system (104) for evacuating the process chamber. The vacuum system comprises a pump unit (124) in flow communication with the chamber and a ...  

Matches 151 - 200 out of 2,478