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WO/2009/118863A1 |
A fastener for thermal insulation layer that has a novel structure such that in the event of the occurrence of breakage or other failures on a fastener for fixing of thermal insulation layer, allows easily replacing of the fastener for f...
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WO/2009/113621A1 |
A single chamber vacuum treating furnace (A) comprises a furnace body (1) in which a water-cooling jacket (15) is formed on a furnace wall (11) and a treatment space (S) for an article to be treated (W) is formed by the furnace wall (11)...
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WO/2009/071137A1 |
The invention relates to a device for the secondary and vacuum metallurgical treatment of liquid steel, comprising a vacuum vessel (100), such as an RH, VD or VOD container, which can be sealingly closed for the vacuum process using a ra...
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WO/2009/059489A1 |
A continuous distilling vacuum oven is used to refine metals. At least one coiling flow-guide groove (3) is disposed in every evaporation plate (1), whereof the beginning point (2) is the location at which the materials flow in, and the ...
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WO/2009/025840A1 |
A heating muffle for a muffle kiln for the production of a dental ceramic product containing titanium, which comprises a hollow unit, which is provided with at least one opening for the uptake of the ceramic product and has heatable inne...
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WO/2009/022590A1 |
A hydrogen vacuum furnace (100) is provided with a processing chamber (1) wherein a subject (10) to be heated is stored; a heating chamber (2) wherein a heater lamp (25) is stored; and a quartz board (3) for separating the subject (10) a...
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WO/2008/155426A1 |
The invention relates to a method and a vacuum furnace (1) for heat treatment of metal workpieces having a useable space disposed in a steel housing (3) and designed as an interior furnace chamber (5), devices for heating (7) and cooling...
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WO/2008/110193A1 |
The invention relates to a heat treatment furnace for the heat treatment of particularly metal work pieces (2, 20), comprising a furnace chamber (3), which can be closed by means of a furnace door (4) said furnace chamber (3) comprising ...
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WO/2008/063840A1 |
Methods for compensating for a thermal profile in a substrate heating process are provided herein. In one embodiment, a method of processing a substrate includes determining an initial thermal profile of a substrate resulting from a proc...
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WO/2008/063095A1 |
The invention relates to devices for thermochemically processing steels and alloys in gas media using automatic control. The inventive unit comprises a muffle or muffleless heating furnace, a device which is used for catalytically acting...
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WO/2008/037941A1 |
A method and apparatus are described for manufacturing Ebonex® articles such as rods and tiles from titanium oxide precursors. The precursors are held within the interior space of a kiln and heated in a reducing gas. The precursors are ...
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WO/2008/022675A1 |
The invention relates to a pressure chamber for the heat treatment of metallic workpieces, having a fan wheel arranged inside the volume space enclosed by the pressure chamber and a drive motor for driving the fan wheel. The drive motor ...
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WO/2008/022546A1 |
A reducer comprises: a body composed of top (11), bottom (12) and side wall (13), in which, the bottom (12) is a sloping, there are a feed opening (14) and a discharge port (16) for metallic vapor near the top (11), and there is a residu...
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WO/2008/011788A1 |
A reduction retort (11) used in a vacuum metal refining reduction furnace comprises a retort (12), a condenser (13) arranged on one end of the retort, a charge end shield (14) hermetically connected to the condenser, and a discharge end ...
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WO/2008/006599A2 |
The invention relates to a dental furnace (1) comprising a hood-shaped combustion chamber (3) with a heating element (12) that is placed therein and an opening (13), and a closing plate (4) which is arranged so as to be movable relative ...
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WO/2008/008585A2 |
The present invention relates to an apparatus and method for heating a semiconductor processing chamber. One embodiment of the present invention provides a furnace for heating a semiconductor processing chamber (205). The furnace compris...
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WO/2008/005995A2 |
A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder ha...
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WO/2007/107791A1 |
A Glass tempering furnace has been developed specifically to temper profiled glass. The furnace has been designed to solve the problem of Thermal Shock. This has been achieved by the gradual heating the profiled glass. With the design of...
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WO/2007/093584A1 |
A pipe (12) for feeding a gas into an oven, a furnaces, or the like (such as a CVI /CVD oven), and in particular into a reaction chamber structure (16) inside the oven, is provided with a gastight tubular sealing device (32) extending ra...
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WO/2007/080628A1 |
A burning furnace (10) for burning an object article uniformly within a short time comprises a burning chamber (13) composed of an electrically insulating thermal insulation material, and carbon muffle (15) arranged in the burning chambe...
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WO/2007/065202A1 |
Apparatus for treating materials, the apparatus including a main body which includes an elongated retort section having a primary treatment chamber therein, a feed inlet at an upstream end of the retort section and a discharge outlet at ...
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WO/2007/036334A2 |
The inventive recycling oven for treating explosive materials containing precious metals with organic portions, the combustion of which is associated with important energy release, comprises a switching device for alternating the a combu...
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WO/2007/010607A1 |
A carburization furnace has a vertical tubular furnace body (12) with closed upper end, a graphite tubular heat producing body (13) covering the inner surface of the furnace body (12), a movable bed (13) vertically movably placed so that...
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WO/2006/130573A2 |
An approach for optimizing the thermal budget during a pulsed heating process is disclosed A heat sink or thermal transfer plate (20) is configured and positioned near an object, such as a semiconductor wafer, undergoing thermal treatmen...
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WO/2006/130701A2 |
Heating element assemblies, heating furnaces incorporating heating element assemblies, methods to form heating element assemblies, methods to form heating furnaces and methods to reduce a magnetic field in a bifilar coil are disclosed. T...
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WO/2006/111252A1 |
The invention relates to a method for heat-treating metal work pieces, whereby a cooling gas flow is produced in a vacuum furnace by means of a fan, driven by a three-phase AC motor, in order to quench the work pieces. The aim of the inv...
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WO/2006/103697A1 |
A system for heat-treatment of large metallic samples (14), comprising a microwave heating apparatus with wave guide (8), means for monitoring and measuring temperature holding means for holding the metallic sample (14), wherein said hol...
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WO/2006/086217A2 |
A vacuum furnace adapted to cool a load. The vacuum furnace has one or more means for cooling a fluid and a muffle substantially containing the load. The fluid flows in a substantially unidirectional flow substantially within the muffle.
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WO/2006/055772A1 |
Kilns for processing ceramics and methods for using such kilns are disclosed herein. In one embodiment, a kiln includes an inner body configured to hold one or more ceramic workpieces for processing. The kiln can also include an outer bo...
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WO/2006/016430A1 |
A firing kiln that is free from any substantial drop of heat insulating performance of heat insulating layer, being free from any splitting into two parts or exfoliation of heat insulating layer, and that excels in long-term durability a...
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WO/2006/013651A1 |
A firing kiln that is free from the occurrence of warpage and corrosion of heat insulating layer and that eliminates the need of replacing members of heat insulating layer for a prolonged period of time, excelling in durability and heat ...
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WO/2006/000011A2 |
The invention relates to a method for thermally treating a metal strip prior to the application of a metallic coating, according to which said metal strip is annealed in a reductive, protective gas atmosphere containing hydrogen. To impr...
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WO/2005/122231A1 |
A radiation heat blocking shutter (20) is provided at the middle between a high-temperature area (32) and a low-temperature area (30) so as to be advanced and retreated from the high-temperature area to the low-temperature area. A board ...
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WO2005013325A9 |
A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processin...
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WO/2005/093353A1 |
A apparatus (60) and method of thermally treating a wafer (12) or other substrate, such as rapid thermal processing (RTP). An array (24) of radiant lamps (26) directs radiation to the back side of a wafer to heat the wafer. The front sid...
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WO/2005/093354A1 |
An improved transfer mechanism (21) is provided for vertical heat treatment equipment. The transfer mechanism transfers a treating object W between a treating object storing container (carrier) (16) and a treating object holder (boat) (9...
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WO/2005/090836A1 |
A sealing system for a container (2) containing a fluid at high pressure, comprising a head (10) moving between a closed position and an open position of the container (2), a piston (12) for the pressurisation of the container (2) mounte...
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WO/2005/086588A2 |
A thermal treatment system (100) with at least one apparatus (102) comprising: one platform (110)or two substantially opposite platforms, where at least one of the platforms has at least one thermal means (140) for heating or cooling of ...
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WO/2005/085485A1 |
The invention relates to non-ferrous metallurgy, in particular to devises for producing a titanium sponge by magnesium-thermal reduction of a titanium tetrachloride. The inventive device comprises a furnace, wherein a retort-reactor prov...
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WO/2005/083341A1 |
An apparatus and method for uniformizing the temperature distribution across a semiconductor wafer during radiation annealing of process regions formed in the wafer is disclosed. The method includes forming a silicon layer atop the upper...
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WO/2005/068680A2 |
An apparatus and method for heating materials or substances in an oven at an oven temperature below their melting and/or vaporization points to either melt and/or vaporize the substance. Substances are inserted into a substantially spher...
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WO/2005/064254A1 |
A vertical heat treatment device includes a treatment container (5) having a treatment region (A1). The treatment region (A1) is set so as to receive to-be-treated substrates (W) held at vertical intervals. The device also has a heating ...
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WO2004078406B1 |
A one-piece or otherwise unitary annular shim member made from a perforated metallic material is used to maintain a space between stacked annular preforms during a manufacturing process, such as densification. The metallic material used ...
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WO/2005/046920A2 |
As part of a system for processing a workpiece (122) by applying a controlled heat to the workpiece, a heating arrangement includes an array of spaced apart heating elements (102) for use in a confronting relationship with the workpiece ...
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WO/2005/040705A2 |
Muffle furnace consisting of a furnace, a perforated plate at the base of the interior, a structure which divides the interior of the furnace into chambers; a further perforated plate beneath the cover of the furnace. It is used for the ...
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WO/2005/038373A1 |
A high-pressure heat treatment furnace, comprising a pressure vessel having a furnace container and a furnace cover closing the furnace container and allowing an internal pressure to be controlled, heat-insulating walls installed in the ...
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WO2004072323B1 |
A furnace incorporating a novel thermal design is disclosed. Heating element temperature is reduced compared to conventional designs while providing a precisely controlled process temperature in the range1000 - 1400 degrees centigrade. T...
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WO2004007800A9 |
A thermal processing apparatus (100) is provided comprising a process chamber (102) and a vacuum system (104) for evacuating the process chamber. The vacuum system comprises a pump unit (124) in flow communication with the chamber and a ...
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WO2004008054A9 |
A method and apparatus for insulating and controlling temperature in a semiconductor manufacturing environment. The invention comprises at least one modular heater element designed to be mounted about a semiconductor furnace process cham...
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WO/2005/001360A1 |
A gas cooling type vacuum heat treating furnace, comprising a gas cooling furnace having a cooling chamber allowing the stationary placement of a treated article therein and forming a gas flow passage in the vertical direction, a gas coo...
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