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Patent Searching and Data


Matches 201 - 250 out of 2,539

Document Document Title
WO/2004/070747A1
A heat treatment system in which the direction of a magnetic field being generated by a field generating means (20) in a region for heat treating an object is in parallel with the direction of the object being carried into a heat treatme...  
WO2004007318A3
A loadport apparatus for conditioning the interior of a FOUP having a FOUP door. The apparatus includes platform, a housing, an loadport door, a loadport door seal and a conditioning system. The FOUP platform receives the FOUP. The housi...  
WO2004008493A9
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...  
WO/2004/059230A1
The invention relates to the thermochemical hardening of products, mainly having residual surface stress, for example metal products consisting of hot-rolled parts, metal wireworks including metal-woven, filtering fabrics, fastener threa...  
WO2004008491A3
An apparatus (100) and method are provided for thermally processing substrates (108) held in a carrier (106). The apparatus (100) includes a vessel (101) having a top (134), side (136) and bottom (138), and a heat source (110) with heati...  
WO/2004/044969A1
Two bypasses (32, 33) are formed in the valve box (21) of a main valve (18) provided in the piping (13) of the exhaust system (12) of a heat treatment furnace (1). Each bypath (32, 33) is opened&sol closed by an auxiliary valve (30, 31) ...  
WO2004008493A3
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...  
WO2004008052A3
A cooling system and method are provided for cooling an apparatus (100) having a vessel (102) containing a substrate (108) to be processed, and heating elements (10012) distributed coaxially around and spaced apart from the vessel to for...  
WO/2004/035846A1
A low pollution process for extracting arsenic in vacuum, including: heat and keep the smelting chamber to a temperature of 100-300 °C under the reduced pressure lower than 50 Pa to remove the water vapor and some dust; then heat and ke...  
WO/2004/033731A1
The invention concerns a heat treatment method for metal parts (6) arranged in feed (5) wherein the feed of parts is successively brought into a vertical treatment furnace (1) capable of being opened downwards, said method consisting in:...  
WO2004007819A3
The invention concerns a method which consists in heating carbon products in an oven (10) under reduced pressure and under neutral gas sweeping, while continuously extracting from the oven gas effluent containing elementary or combined s...  
WO/2004/027845A1
A heat−treating apparatus comprising a reaction chamber accommodating an object to be treated, a heat−insulating body surrounding the reaction chamber, holes defined in the heat−insulating body, annular spacer members provided in t...  
WO/2004/015348A1
A reactor chamber (130) is positioned between a top array of LED heat lamps (146) and a bottom array of LED heat lamps (148). The LED heat lamps (180) forming the top and bottom arrays (146, 148) are individually or controllable in group...  
WO/2004/007105A1
Various backfill injectors that provide upflowing gas and have improved uniformity of distribution of gas into the perimeter of the process chamber are provided for use in semiconductor wafer processing apparatus. Suitably optimized back...  
WO/2004/008008A2
A gaseous flow control method and system. The flow control system monitors and controls gaseous levels and gas flow into and out of an enclosed space by using a proportional/integral/derivative (PID) controller to manipulate gas flow int...  
WO/2004/008054A1
A method and apparatus for insulating and controlling temperature in a semiconductor manufacturing environment. The invention comprises at least one modular heater element designed to be mounted about a semiconductor furnace process cham...  
WO/2004/007318A2
A loadport apparatus for conditioning the interior of a FOUP having a FOUP door. The apparatus includes platform, a housing, an loadport door, a loadport door seal and a conditioning system. The FOUP platform receives the FOUP. The housi...  
WO/2004/007800A1
A thermal processing apparatus (100) is provided comprising a process chamber (102) and a vacuum system (104) for evacuating the process chamber. The vacuum system comprises a pump unit (124) in flow communication with the chamber and a ...  
WO/2004/007819A2
The invention concerns a method which consists in heating carbon products in an oven (10) under reduced pressure and under neutral gas sweeping, while continuously extracting from the oven gas effluent containing elementary or combined s...  
WO/2004/008491A2
An apparatus (100) and method are provided for thermally processing substrates (108) held in a carrier (106). The apparatus (100) includes a vessel (101) having a top (134), side (136) and bottom (138), and a heat source (110) with heati...  
WO/2004/008052A2
A cooling system and method are provided for cooling an apparatus (100) having a vessel (102) containing a substrate (108) to be processed, and heating elements (10012) distributed coaxially around and spaced apart from the vessel to for...  
WO/2004/008494A2
A method and system for controlling a servomotor network. The system has at least one local control node remotely located from a central processing area. The local control node actuates one or more servomotors, and is physically placed n...  
WO/2004/008493A2
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...  
WO/2004/005203A1
A method of forming a single crystalline structure having a substantially linear response at least over the wave lengths of 1,200 to 1,700 nanometers, the resulting structure and its use as an optical media or a barrier coating. Thus, ma...  
WO/2004/001311A1
A heating muffle for a muffle kiln for the production of a dental ceramic product containing titanium, which comprises a hollow unit, which is provided with at least one opening for the uptake of the ceramic product and has completely he...  
WO/2003/091462A1
A vertical muffle type heat treating furnace, comprising a vertically disposed muffle allowing metal strips to be led therein from an upper side to a lower side, a heating zone for heating, from the outside of the muffle, the metal strip...  
WO/2003/073485A1
A heat treating device (50) has a cooling sleeve that covers a treating vessel (56) and a heater (100). The cooling sleeve has a cylindrical base member (110) and a cooling pipe (112) spirally wound on the outer peripheral surface hereof...  
WO/2003/035307A1
The invention relates to a method for controlling the binder-release process for MIM- (Metal Injection Moulding), or CIM- (Ceramic Injection Moulding) pieces, in which a polymeric plastic, for example, is used as binder, which, by intera...  
WO2002058437B1
A method of heating an article (29) with microwave energy is described in which a thin layer (34) of a highly microwave absorbed material is provided around at least a portion of a container (31) made of microwave transparent material. T...  
WO2002101850A3
An electrically insulating collar (170) for an electric furnace (1) is described. This collar has a mounting flange (176) and passageway (182). An electrically conductive lead (90) is at least partially in the passageway and, a means for...  
WO/2003/012849A1
The exhaust pressure in an exhaust system (15) for exhausting a treatment furnace (2) is measured as an absolute pressure by a differential pressure gage (23) for measuring the pressure as the differential pressure between the exhaust pr...  
WO2002049395A3
A method and system for inductively coupling energy to a heating filament (7A', 7B', 7C', 7A, 7B, 7C) in a thermal processing environment. By applying AC power to a coil antenna (11) and inductive coupling to a filament (e.g., a halogen ...  
WO/2002/101850A2
An electrically insulating collar (170) for an electric furnace (1) is described. This collar has a mounting flange (176) and passageway (182). An electrically conductive lead (90) is at least partially in the passageway and, a means for...  
WO/2002/101806A1
The invention relates to a method and a device for the thermal treatment, especially short-term, of flat objects in particular, such as semi-conductor, glass or metal substrates. Heat is, at least in part, supplied to or taken away from ...  
WO2001029902A3
The invention relates to a device for simultaneously tempering and processing several process goods by means of electromagnetic radiation. The device is a batch-type furnace. The process goods and the energy sources are arranged adjacent...  
WO/2002/066687A1
A gas-cooled single chamber heat treating furnace (T), wherein vent holes (9A, 9B) for cooling gas opened and closed by doors (11A, 11B) are provided in each of the opposed walls of an inner chamber (5) forming a treating chamber and, in...  
WO/2002/061818A1
A sheet type heat treating device (2) comprising a processing chamber (5) for receiving a board (W) to be processed, with a shower head (10) disposed on the ceiling thereof. In applying a semiconductor processing to the board (W), a supp...  
WO/2002/058437A1
A method of heating an article (29) with microwave energy is described in which a thin layer (34) of a highly microwave absorbed material is provided around at least a portion of a container (31) made of microwave transparent material. T...  
WO/2002/049395A2
A method and system for inductively coupling energy to a heating filament (7A', 7B', 7C', 7A, 7B, 7C) in a thermal processing environment. By applying AC power to a coil antenna (11) and inductive coupling to a filament (e.g., a halogen ...  
WO/2002/032831A1
A burning furnace and a method of producing burnt bodies, wherein a burning-subject formed of ceramic material, fine ceramic material or the like is burnt to produce a burnt body. A heat insulation wall (28) and an inner shell (25) defin...  
WO2001051867A3
A thermal processing plant has heating tubes (4) which are arranged in an undulating line (10) in an oven chamber (3). Burners (6) which generate a stream of gas that is directed against the opposite wall of the oven are positioned on ea...  
WO/2002/000407A1
The invention relates to a device for heating a meltable material, such as plastic, before it enters a processing installation, such as a casting or extrusion installation. The inventive device comprises a conveying channel (1) for the m...  
WO/2001/092171A1
An oven for heat treatment of glass articles, or the like, in particular CRT tubes, comprises an enclosure (38), a fan (48) for driving a flow of air through the enclosure and a radiant heater (64) located within the enclosure. The inven...  
WO/2001/051867A2
A thermal processing plant has heating tubes (4) which are arranged in an undulating line (10) in an oven chamber (3). Burners (6) which generate a stream of gas that is directed against the opposite wall of the oven are positioned on ea...  
WO/2001/049075A1
Infrared oven for heating a plurality of preforms and comprising: a conduit through which said preforms move, a flow of outside air that flows through said conduit from an intake mouth to an exhaust mouth under the action of a blower, a ...  
WO/2001/035453A1
A film forming device, comprising a treating furnace, gas feeding means feeding treating gas into the processing furnace, heating means heating the inside of the treating furnace to a specified treating temperature, and a normal pressure...  
WO/2001/029902A2
The invention relates to a device for simultaneously tempering and processing several process goods by means of electromagnetic radiation. The device is a batch-type furnace. The process goods and the energy sources are arranged adjacent...  
WO/2001/016255A1
A heater includes a radiant section having a wall and a roof, the roof having a longitudinal opening. A radiant heat exchange tube is disposed in the radiant section, and the tube has an inlet and outlet through which a process fluid can...  
WO/2001/013054A1
An apparatus (10) for heat treatment of a wafer (28) is disclosed. The apparatus includes a heating chamber (18) having a heat source (20). A cooling chamber (32) is positioned adjacent to the heating chamber and includes a cooling sourc...  
WO/2000/029799A1
A dual resistive heater system includes a base or primary heater (120A), surrounded by a peripheral or edge heater (120B). Both resistive heaters deliver heat to a heated block, and the heaters and heated block are substantially enclosed...  

Matches 201 - 250 out of 2,539