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Matches 451 - 500 out of 1,168

Document Document Title
JP2002544464A5  
JP2002544464A
(57) From heat-resistant structural composite, it is formed by the summary rack and And a substrate (12), two or more support arms (20) which are fixed to the partition board (14) extended in a substrate top, and a partition board, and a...  
JP2002299020A
To provide a heat insulating board of an induction heating device which is hardly deformed or broken due to radiation heat from a heated material in induction heating.The heat insulating board of the induction heating device is disposed ...  
JP3333135B2
To provide a rapid and uniform heat treatment apparatus and its method for treating by heat the whole substrate without causing electrostatic breakdown. A plurality of minute protecting pins 93 are provided on the upper face of a heat-tr...  
JP2002532840A
(57) Especially summary book invention relates to the carrier substrate (1) for supporting the object exposed to a high temperature for the annealing processing used for manufacturing the shadow mask for a cathode-ray tube. By constituti...  
JP2002274873A
To improve thermal performance by downsizing a heat treatment apparatus for glass substrates, etc.The heat treatment apparatus is composed of heating plates 1 spaced by intervals c and supported by spacer pins 2 and a support beam 11, wo...  
JP2002261035A
To provide a vertical heat treatment apparatus that can prevent a substrate retention tool from falling down not only during standby and loading and unloading into a reaction pipe, but also during treatment in the reaction pipe, and to p...  
JP3317711B2  
JP2002519613A
(57) the revolving vacuum furnace (1) and method for heat-treating summary particulate-like solid material under a vacuum, The inner side surface of a wall, the outside surface of a wall, and an entrance low-temperature domain (3) and a ...  
JP2002515391A
(57) Summary book invention offers the equipment and the method for substrate conveyance. The system by the present invention equips the at least 1st and the 2nd chamber. The 1st chamber can be used as a load lock and the 2nd chamber can...  
JP2002141397A
To provide a new wafer supporting device and a method for manufac turing the same capable of drastically suppressing generation of particles in a wafer heat treatment process in a semiconductor manufacturing process, for instance, in a C...  
JP2002130959A
To facilitate a cleaning and exchange work for a work support part and to prevent damaging of a work during high temperature heat treatment.The work support constitutes a part of a cassette 1 on which works W are loaded in multistage and...  
JP2002110583A
To improve the temperature uniformity of a ring member 5 in heat treatment to avoid damaging the ring member.A ring heating controller 81 controls a straight pipe-like heating light source 10 located above a ring member 5 for mainly heat...  
JP2002510153A
(57) The substrate support part for a summary heat treatment chamber is offered. Substrate support parts, such as a 端環 part (134), contain an inner side portion (150) and the outside portion (152) which follows an inner side portion ...  
JP3267987B2
PURPOSE: To quickly attain specified work temp. and keep specified temp. during working by applying a coating for assisting the heat conduction between a work and platen on the surface of the platen, so that the coating has an emissivity...  
JP2002508444A
(57) By the composite material of heat-resistant structure, a summary loader device is formed and Base (20), The loading pole (30) which it is fixed to this base and elongated covering the overall height of this loader device at least, a...  
JP2002029857A
To provide a tray for firing of small-sized ceramic parts, such as disk type ceramic capacitors, chip type resistors, ring varistors, semiconductor capacitors, piezoelectric material products, chip type laminated capacitors and chip type...  
JP2001352969A
To automate an air conditioner through automating the loading/ unloading containers into/from a reaction chamber in a closed state.The subject automatic air conditioner comprises a reaction chamber 3 for holding a container 13 therein, a...  
JP2001324277A
To provide a heating apparatus, which can heat many objects to be heated simultaneously and effectively, does not cause the unevenness of temperature and of which size is smaller than the conventional heating apparatus.The heating appara...  
JP2001313328A
To provide a substrate thermal treatment apparatus, capable of easily controlling the temperature of a substrate in a cooling process by devising the supply of a cooling medium.A substrate thermal treatment apparatus is equipped with a m...  
JP2001304770A
To provide a supporting plate for resting a plate-like article to be fired, e.g. a tile, at the time of firing in which cracking or damage due to concentration of stress is prevented, and a sintering support equipped with such a supporti...  
JP2001294476A
To solve the problem that at least either a firing tool or a green boy is broken when they are conveyed and mounted. The loading device is constituted of a horizontally moving part which is freely reciprocatively movable between a convey...  
JP2001280855A
To produce a high quality electronic, optical or superconducting material of conventionally unattainable large size by holding a large material of arbitrary shape in a space in noncontact state and then heat treating it at a high tempera...  
JP3215503B2
PURPOSE: To make thin a bed and to prevent carbonization and adhesion of wax by covering the bed that is made of a thermal structure compound material with a thermal decomposition carbon or a pyrocarbon layer on the surface of a workpiec...  
JP2001240423A
To provide a method for manufacturing a silica-coated clad tube as a precursor of an optical fiber wherein processing accompanying a homogeneous gaseous reaction product and heating are promoted because concentration on a cold surface is...  
JP3197027B2
PURPOSE: To obtain a partitioning wall for a heating furnace, which is light in weight and sufficient in strength. CONSTITUTION: A plurality of beam members 7, 7,... are arranged between two pillar members 2a, 2b fixed to the floor of a ...  
JP2001196322A
To provide an auxiliary heating plate which is capable of lessening a temperature difference between the peripheral part and center of a semiconductor wafer so as to uniformly heat the semiconductor wafer, holding it in a light irradiati...  
JP2001192274A
To provide a setter for bebindering/sintering, which can be manufactured without using any mold, so that gas generation in a sintering stage of the manufacturing process of the setter is suppressed to a possible minimum and the change of...  
JP2001168178A
To provide a substrate holding structure capable of reducing deformation of a substrate, especially a large-sized substrate.A method and an apparatus are provided for holding the substrate having a holding frame 54 capable of minimizing ...  
JP3176366B2  
JP3175251B2
PURPOSE: To equally heat workpiece, even if they are placed at any place on trays, in the title furnace in which a number of the workpiece are placed on the trays provided in multistage form and are heated. CONSTITUTION: For trays 7 prov...  
JP2001151524A
To provide a glass substrate supporting mechanism for a firing furnace which is capable of uniformly firing glass substrates.The glass substrate supporting mechanism 6 for the firing furnace which is kept at a specified temperature, cont...  
JP2001123218A
To provide a jig for heat treatment, by which the deformation can be reduced by uniformly cooling an annular member. The annular member 12 is fitted into the inside of a restricting ring 40 and also, supported from the lower side by the ...  
JP2001082880A
To minimize heat dissipation loss at the terminal part of a tube by a method wherein a driving plate is attached to a graphite pipe indirectly while a flexible atmosphere seal assembly, a heating chamber and a heating body are provided o...  
JP3136747B2
PURPOSE: To improve a mechanical strength, facilitate manufacturing and reduce cost of a transporting roll set in a furnace in which a heated item is supported and transported within an industrial furnace such as a continuous vacuum furn...  
JP3133324B2  
JP3130009B2
To provide a single-wafer heat-treating device, with a simple structure, which can improve in-plane uniformity of the temperature of an object to be treated without making the structure complicated or increasing the cost. In a single waf...  
JP2000355751A
To inexpensively and securely prevent the sticking of webs after sintering by thermally spraying alumina on a substrate such as a carbon sheet and a stainless sheet to form an alumina film of a specified thickness, interposing and lamina...  
JP3116437B2
PURPOSE: To prevent the breakage of grids and legs when the grids are expanded thermally by a method wherein the legs of at least three corners among four corners of the grids are supported through spherical bodies capable of being rolle...  
JP2000340501A
To surely control the temperature of a substrate by adjusting the parameters of a heat-treatment gas, that is supplied to the substrate in accordance with a prescribed heat treatment period for adjusting the temperature of the substrate ...  
JP3086677B2  
JP2000510434A
(-- 57) summary -- it being the method of creating the ceramic products which have a thickness of at least about 2.5 cm, and, : containing the following (a) * (d) -- (a) silicate material, a metal oxide, and a nitride --Choose a ceramic ...  
JP2000213869A
To provide a continuous melting furnace that has a rapid refining speed and a high refining effect. In a melting furnace, a raw material is melted by an upper burner 25 and the melted object of the raw material is superheated by a lower ...  
JP2000509102A
(57) Summary book invention indicates the method of putting the object of a hard metal or a cermet on a graphite tray, and sintering it. Other heat-resistant oxides of YO containing ZrO not more than 20wt%, or the amount of considerable ...  
JP2000161865A
To prevent a heat insulation member and a heating structure from being corroded and deteriorated in a ceramic furnace.The present furnace is adapted such that a high heat conductive ceramic molded structure is disposed between a space 5 ...  
JP2000154973A
To provide a shelf plate for burning integrated with a post that can further suppress the misalignment between a shelf plate body and a post body.While, at a specific position at the inner-circumference side of an upper surface 50 of a s...  
JP2000150281A
To provide a method for burning a ferrite core mold without deformations and color change, without requiring selection steps. This method includes the steps of obtaining a ferrite core molding 10 of a flattened cylinder shape, having a f...  
JP2000146455A
To suppress fusion welding between ceramics and a support member by burning the ceramics in a burning furnace while the ceramics are placed on the support member made of a heat-resistant alloy. A number of tiles 12 being piled up in a st...  
JP2000124211A
To provide a single-wafer heat-treating device, with a simple structure, which can improve in-plane uniformity of the temperature of an object to be treated without making the structure complicated or increasing the cost.In a single wafe...  
JP3030240B2
To provide a device for holding a billet while maintaining the conditions required for the billet. This holding device is for induction heating of the billet of an alloy having thixotropic property and for holding and transferring this b...  

Matches 451 - 500 out of 1,168