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WO/2024/077925A1 |
A bent specially shaped ultra-thin vapor chamber, a manufacturing process therefor, and an application. The manufacturing process comprises: cleaning upper and lower housing plates, and drying; preparing a liquid absorption core material...
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WO/2024/080762A1 |
Disclosed is a vapor chamber having a porous filler portion forming a gas diffusion path. According to the present invention, the heat transmitted via a metal chamber housing quickly vaporizes a phase change liquid even at a relatively l...
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WO/2024/080213A1 |
This method for filling a heat transport device (110) with a refrigerant comprises: a pre-filling step (step 902) for filling a refrigerant flow path (10) of a heat transport device (110) with an inactive gas such that the pressure insid...
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WO/2024/076556A1 |
A system and method for operating an immersion tank for cooling electronics is provided. The system comprises an immersion tank configured to house a dielectric fluid and at least one electronic device; a cooling tank configured to house...
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WO/2024/075356A1 |
[Problem] To simultaneously achieve the following goals in a heat transport device that uses thermoacoustic self-excited oscillation. (A) Increase the heat transport quantity during heat transport that uses self-excited oscillation. (B) ...
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WO/2024/074504A1 |
A heating device comprising a heating element for emitting thermal radiation and a heat exchanger for harvesting thermal radiation, the heat exchanger comprising a heat absorption material for absorbing thermal radiation and a heat trans...
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WO/2024/075631A1 |
A vapor chamber 1 according to an embodiment of a thermal diffusion device comprises: a housing 10 which has a first inner surface 11a and a second inner surface 12a which face each other in a thickness direction Z and is provided with a...
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WO/2024/067973A1 |
A cooling apparatus for cooling one or more electronic components is disclosed. The cooling apparatus comprises a base plate having a front wall (110a), a rear wall (110b) and a base plate cavity (110c) and further comprises a plurality ...
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WO/2024/061070A1 |
A plate vapor chamber array assembly with a plurality of plate vapor chambers joined in an array and each chamber having an evaporation area and an evacuated sealed chamber. The plate vapor chambers may be in direct contact with adjacent...
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WO/2024/061470A1 |
Embodiments of the invention relate to a two-phase heat sink (100) for cooling an electrical heat source (200). The two-phase heat sink (100) comprises a chamber (110) which is configured to receive a cooling fluid (F). For improved cool...
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WO/2024/055907A1 |
Disclosed in the present application are an evaporator, a heat dissipation apparatus and an electronic device. The evaporator comprises a housing and a capillary core, wherein the housing is provided with a liquid inlet and an air discha...
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WO/2024/056772A1 |
The invention relates to a heat exchanger (10) for cooling components, having at least one meandering channel (25), which is arranged inside a housing (12), for a cooling medium (15), wherein the housing (12) is formed in a sandwich-like...
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WO/2024/051332A1 |
A vapor chamber (100), an electronic device and a chip packaging structure. The vapor chamber (100) comprises a housing (1), wherein a cavity (11) is formed in the housing (1); a cooling liquid is accommodated in the cavity (11); the hou...
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WO/2024/054862A1 |
The present disclosure describes a system and method involving a mechanism for a microfluidic pump that leverages alternating adverse and favorable thermocapillary stresses along menisici in a periodically fully-developed internal flow i...
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WO/2024/048107A1 |
A boiling cooler (100) comprises: a boiling unit (10) that boils a refrigerant (5) through heat-exchange with a heating element (HS); and a condensing unit (20) that condenses the refrigerant vaporized by the boiling unit and returns the...
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WO/2024/048484A1 |
The present invention relates to a heat sink (1) comprising a base section (20) including a first surface (21) and a second surface (22) opposing to the first surface (21) and to which heating elements (100) are thermally connected, and ...
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WO/2024/045736A1 |
A vapor chamber assembly (V) having a two-phase flow cycle of two working fluids, the vapor chamber assembly comprising a first bracket (1), a second bracket (2) parallel to the first bracket (1), and at least one first heat pipe (3), wh...
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WO/2024/042738A1 |
A liquid immersion cooling device that cools a heating element provided on a substrate, the liquid immersion cooling device comprising: a casing that houses the substrate inside and stores a refrigerant in the lower part of the inside; a...
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WO/2024/042739A1 |
A liquid immersion cooling system for cooling a heat generator provided to a substrate, the cooling system comprising: a cooler main body including a casing which accommodates the substrate and the heat generator inside and in which a re...
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WO/2024/033674A1 |
A method and a cooling system which use a dissipation unit (E) having a heat sink (2) and a cover (3); wherein the heat sink (2) transmits by conduction the heat (H) of said source (C) to a porous body (14), which is inserted inside the ...
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WO/2024/036163A1 |
A two-phased liquid-cooled electrical power apparatus includes a plurality of cooling circuits that recirculate and transition respective engineered fluids between liquid and vapor states around closed-loop fluid paths to cool a pluralit...
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WO/2024/034632A1 |
A vapor chamber according to the present disclosure comprises: a vapor chamber body that has a first surface, a second surface positioned opposite the first surface, and an inner space portion that is positioned between the first surface...
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WO/2024/034279A1 |
This heat dissipation device 1A comprises: a casing 100 which has a first inner surface 10a and a second inner surface 10b opposite one another in a thickness direction T and is provided with an internal space; a working medium 20 which ...
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WO/2024/027962A1 |
The invention relates to a heat exchanger (10) comprising a body (11) containing a working fluid and comprising a first manifold (21) and a second manifold (31); at least one internal partition (50) arranged in the body (11) to form at l...
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WO/2024/027970A1 |
The invention relates to a cooling body (1) comprising a pulsating heat pipe (5) that has a channel structure of interconnected main channel portions (9) and connecting channel portions (11). Each main channel portion (9) extends in one ...
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WO/2024/024763A1 |
Provided is a heat sink with which it is possible to reduce pressure loss occurring when cooling air flows along a heat-dissipating fin while ensuring exceptional heat exchange performance in the heat-dissipating fin. A heat sink havin...
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WO/2024/021606A1 |
Embodiments of the present application provide a chip heat dissipation method, a single board, an electronic device, a computer device, and a computer-readable storage medium. The method comprises: according to first feature parameters o...
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WO/2024/021722A1 |
The present invention discloses a vapor chamber having two-phase flow circulation of different working fluids, comprising a first groove and a second groove which are staggeredly arranged in parallel, the first groove and the second groo...
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WO/2024/025544A1 |
A power plant includes a gas turbine engine, which includes a compressor and a turbine. The compressor includes a compressor outlet. The turbine discharges a first exhaust gas stream therefrom. A heat recovery steam generator extracts he...
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WO/2024/024167A1 |
Provided is a heat pipe comprising: a container in which hydraulic fluid is sealed; a water-permeable first wick that is in contact with the inner periphery of the container; and a water-permeable second wick that is in contact with the ...
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WO/2024/024712A1 |
Provided is a heat sink in which the thermal resistance when heat is transmitted from a heat-generating body to a heat-receiving part of a heat pipe is reduced, thereby making it possible to exhibit exceptional cooling characteristics ev...
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WO/2024/021719A1 |
The present application discloses a vapor chamber and an electronic device. The vapor chamber comprises a first cover plate and a second cover plate, the second cover plate is snap-fitted to the first cover plate to form a sealed cavity,...
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WO/2024/018846A1 |
A vapor chamber 1, which is one embodiment of a heat diffusing device, comprises a housing 10 which has a first inner surface 11a and a second inner surface 12a that face one another in a thickness direction Z and which is provided with ...
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WO/2024/019108A1 |
This heat-emitting substrate comprises: a housing having an internal space; and a sealing body that seals the internal space. The housing includes: a through hole that connects to the internal space; and an inside bottom surface. The sea...
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WO/2024/014429A1 |
Provided is a copper alloy material for heat-radiating components which, even after being subjected to a thermal history at high temperatures as a result of bonding such as brazing or welding, is capable of maintaining the rigidity of th...
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WO/2024/011715A1 |
A slurry for preparing a capillary structure, a preparation method for the slurry, a preparation method for the capillary structure and a vapor chamber. The slurry comprises a metal powder, a compound powder, an adhesive and an organic s...
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WO/2024/015405A1 |
Heat pipe fuel element includes an evaporation section, a condensing section, a capillary section connecting the evaporation section to the condensing section, and a primary coolant. In a cross-section in a plane perpendicular to a longi...
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WO/2024/014751A1 |
Provided according to an embodiment of the present disclosure is a heating element cooling device comprising: a body part including a hollow portion in which working fluid is circulated and a wick portion which is disposed in at least a ...
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WO/2024/009504A1 |
This refrigeration cycle device (100) comprises: a first circulation flow path (L1) by which a compressor (10), a first heat exchanger (20), a depressurization device (30), and a second heat exchanger (40) are connected and in which a fi...
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WO/2024/010314A1 |
The present invention provides a vacuum chamber having a multilayer graphite stack. The objective of the present invention is to provide a vacuum chamber having a multilayer graphite stack, the chamber having a graphite unit, formed by s...
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WO/2024/002772A1 |
A system (1) for thermal regulation of a spacecraft (S), comprising: - a hot source (C) interface, - a radiator (10) having a thermally conductive body (11) comprising at least one radiative surface (12), - two separate single-phase cool...
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WO/2024/004258A1 |
This cooling device comprises: a heating unit in which a storage space for storing a refrigerant in a liquid phase is provided, and which is thermally connected to a heat-generating body and has a heat transfer surface for transmitting t...
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WO/2024/004728A1 |
Disclosed is a circuit structure that makes it possible to directly draw heat without requiring a busbar to be routed from a terminal section of a heat-generating component, and to build a heat dissipation route for a heat-generating com...
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WO/2024/001199A1 |
Embodiments of the present application provide a vapor chamber, a heat sink, and an electronic device. The vapor chamber comprises: a bottom plate, a top plate, side plates and a backflow piece. The bottom plate comprises a first heat di...
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WO/2023/245376A1 |
The present disclosure relates to a heat dissipation assembly and a fabrication method therefor, a middle frame assembly, a housing assembly, and a terminal device. The heat dissipation assembly comprises an evaporator, a condenser, and ...
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WO/2023/243184A1 |
Provided is a cooling device for cooling an object to be cooled, the cooling device being characterized by having a circulation system for circulating a refrigerant for cooling the object to be cooled, wherein: the circulation system is ...
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WO/2023/241238A1 |
An LED lamp using aluminum-based flat plate heat pipes for heat transfer, the LED lamp comprising a first flat plate heat pipe (11), second flat plate heat pipes (12) and an LED light source (15), wherein the first flat plate heat pipe (...
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WO/2023/238625A1 |
Provided is a vapor chamber 1 which is one embodiment of a heat spreading device, the vapor chamber comprising: a housing 10 that includes a first inner surface 11a and a second inner surface 12a which face each other in the thickness di...
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WO/2023/240034A1 |
Apparatus and methods for cooling or heating a liquid in a container. In certain embodiments, the apparatus comprises a first conduit, a second conduit and a pump in fluid communication with the first conduit and the second conduit. The ...
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WO/2023/238626A1 |
A vapor chamber 1 as an embodiment of this heat diffusion device comprises: a housing 10 having a first inner surface 11a and a second inner surface 12a, which face each other in the thickness direction Z; a working fluid 20 enclosed in ...
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