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Patent Searching and Data


Matches 801 - 850 out of 14,119

Document Document Title
WO/2003/016044A1
A heat transfer medium is shown, having a very high heat transfer rate that is simple in structure, easy to make, environmentally sound, rapidly conducts heat, and preserves heat in a highly efficient manner. Also shown is a heat transfe...  
WO2002002201A3
A capillaray pump two phase heat transport system that combines the most favorable characteristics of a capillary pump loop (CPL) with the robustness and reliability of a loop heat pipe (LHP). Like a CPL, the hybrid loop has plural paral...  
WO/2003/014648A1
The invention relates to heat engineering, in particular to heat pipes and can be used for removing heat from miniature high-heat objects, in particular elements of radiotechnical instruments and computers requiring efficient removal of ...  
WO/2003/015234A2
Featured is a heat transferring device (200) being configured and arranged so that at least some of the heat energy being generated by a heat producing device, such as the a bearing assembly of a flywheel energy storage system, is commun...  
WO/2003/014697A2
This invention comprises devices, compositions and methods for quantitative detecting analytes in complex solutions by Raman spectroscopy. Passivating agents associated with enhancing surfaces can decrease direct, non-specific interactio...  
WO/2003/012357A2
A heat exchanger includes a manifold having a number of parallel heat pipes extending between a head pipe and a tail pipe or feeder pipe. The tail pipe is parallel to the head pipe. The heat pipes define many capillaries extending in par...  
WO/2003/009663A1
The present invention provides a thermal energy management architecture (5) for a functioning system of electronic components and subsystems (10) comprising a hierarchical scheme in whic thermal management components are: (i) operatively...  
WO2002072378A9
A solar-based power generating system (10) including an electrical alternator (32) or generator for generating electrical power in which the alternator or generator is driven by a refrigerant circulating through a closed-loop heat transf...  
WO2002058138A3
An electronic assembly (10) is described including a motherboard (12), a semiconductor die (20) mounted to the motherboard (12), and a heat pipe (22) having an evaporator portion (34) adjacent the die n (20), and a condenser portion (36)...  
WO/2003/006910A1
A thermal bus (5) is provided for cabinets (10) housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators (30) interconnected in flow communication with a condenser (36). Each evap...  
WO/2003/004944A2
A novel fluid heat transfer agent suitable for use in a closed heat transfer system, for example, wherein heat energy is transferred between an evaporator and a condenser in heat exchange relationship with the heat transfer agent that is...  
WO/2003/002916A1
An underfloor heating system having a main conduit (2) transporting a heat transfer medium therethrough, at least one heatpipe (4) contactable with said conduit, said heatpipe having means (6) for adjusting its positioning relative to th...  
WO/2003/001861A1
The heat management system (10) for an electronic cabinet (15) which is provided with a first heat exchanger (100) having a cold plate (103) with channels filled with liquid coolant, a second liquid-to-air heat exchanger (200) and tertia...  
WO/2002/099344A1
A refrigeratory for a refrigerating device comprising a refrigerating agent channel (4) which is guided between two side walls (2, 3). At least one of the side walls (3) is made of a non-rigid bending material which can be adapted intern...  
WO2002081996A3
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28)...  
WO/2002/090846A2
A heat transfer system first comprises an air conditioner (111) which includes an evaporator (112). The system further includes a chamber (113) having an air duct (114) comprised of an input end (115) for receiving fresh ambient make up ...  
WO/2002/090846A3
A heat transfer system first comprises an air conditioner (111) which includes an evaporator (112). The system further includes a chamber (113) having an air duct (114) comprised of an input end (115) for receiving fresh ambient make up ...  
WO/2002/087741A1
A hydrogen storage bed system (1) which includes a pressure container (2), a hydrogen storage alloy (3) disposed within the pressure container (2), and an integrated thermal management system integrally disposed within the pressure conta...  
WO2002056396A3
0 hydrogen storage bed system (1) which includes a pressure container (2), a hydrogen alloy (3) disposed within the pressure container (2), and an integrated thermal management system integrally disposed within the pressure container. Th...  
WO/2002/084195A1
A heat transfer fluid medium (25) within the closed system is arranged to boil to form a vapor in the evaporation section (12) and such that release of heat from the condensation section (11) to the fluid to be heated (4A) causes the vap...  
WO/2002/081996A2
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28)...  
WO/2002/077558A3
A heat pipe (105) having particle structures (160, 161) and a polymer (145, 146) thereon.  
WO2002052644A9
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit packag...  
WO/2002/077647A1
This invention comprises devices, compositions and methods for detecting analytes in complex solutions. In certain embodiments of this invention, the receptor molecules can be lacking in a Raman signal generating moiety that is present i...  
WO/2002/077558A2
A heat pipe (105) having particle structures (160, 161) and a polymer (145, 146) thereon.  
WO/2002/077547A1
An enclosure (100) for a refrigerated space (100). The enclosure includes a thermosiphon (250) and a Stirling cooler (300). The thermosiphon (250) includes a condenser end (260) and an evaporator end (270). The ends are connected by a sm...  
WO/2002/076165A1
An electronic module (20) includes a cooling substrate (21a), an electronic device (22) mounted thereon, and a heat sink (23) adjacent the cooling substrate (21a). More particularly, the cooling substrate (21a) may have an evaporator cha...  
WO/2002/072378A1
A solar-based power generating system (10) including an electrical alternator (32) or generator for generating electrical power in which the alternator or generator is driven by a refrigerant circulating through a closed-loop heat transf...  
WO2001088456A3
A capillary wick (312) for use in capillary evaporators (310) has properties that prevent nucleation inside the body of the wick, resulting in suppression of back-conduction of heat from vapor channels (316) to the liquid reservoir (320)...  
WO/2002/058879A1
An environmentally unrestricted plate heat pipe with excellent radiation characteristics, a hollow stacked body used for the plate heat pipe, and a plate stacked body used for the hollow stacked body, wherein the plate stacked body is fo...  
WO/2002/058138A2
An electronic assembly (10) is described including a motherboard (12), a semiconductor die (20) mounted to the motherboard (12), and a heat pipe (22) having an evaporator portion (34) adjacent the die n (20), and a condenser portion (36)...  
WO/2002/056396A2
0 hydrogen storage bed system (1) which includes a pressure container (2), a hydrogen alloy (3) disposed within the pressure container (2), and an integrated thermal management system integrally disposed within the pressure container. Th...  
WO/2002/054002A1
The present invention discloses an apparatus including a magnesium alloy vessel substantially free of aluminum and zinc, with the having a hollow interior cavity containing a working fluid, wherein the improvement includes the formation ...  
WO/2002/053999A1
A semiconductor package is provided that includes a substrate (7) having a top surface (11), a cover (20), and at least one semiconductor device (9) attached to the top surface of the substrate. The cover is secured to the substrate so a...  
WO/2002/052644A2
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit packag...  
WO/2002/050488A1
A heat pipe comprised of a condenser (12), an evaporator (11) and a capillary device (13).  
WO/2002/044639A1
Disclosed is a heat pipe with a wick structure containing pipe type continuous air holes, produced by positioning a tool at a center of the pipe and multiple wires (6) at a position attached to an inner wall of the pipe, respectively; ch...  
WO/2002/043224A1
The superconducting device (2) comprises a rotor (5) which is rotatable about an axis of rotation (A) and is provided with a superconductive winding (10) in a heat conducting winding carrier (9). The winding carrier (9) has a central coo...  
WO/2002/031418A1
A heat exchanger with an excellent heat exchanging efficiency and a refrigerator having the heat exchanger; the refrigerator, comprising a Stirling refrigerator machine (6) and a heat exchanger (10) allowed to abut-on the cold heat (62) ...  
WO/2002/023114A1
A die (400) containing a metal line (406) and a polymer (410).  
WO/2002/016832A1
A floor heater, comprising an integral-formed resin insulating panel (10), heat sources (20) laid down on the insulating panel (10), a radiating plate (30) supportedly placed on supporting columns (12) formed integrally with the insulati...  
WO/2002/014769A1
A heater, particularly for hanging articles thereon to dry, having a primary heatpipe and a plurality of secondary heatpipes extending therefrom, one or more of the heatpipes being connected to a heat source. The primary heatpipe may be ...  
WO/2002/014772A1
A high thermal conductive stainless steel plate (1) of a laminated structure, wherein the surface (5a) with loop-shaped meandering groove (7) of a grooved stainless steel plate (5) is stacked on a flat stainless steel plate (3), a meande...  
WO/2002/013588A1
A cooling apparatus using 'low profile extrusions' is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electroni...  
WO/2002/011930A1
The invention concerns a method for making heat-exchanging devices used in particular in the field of electronics, telecommunications, aeronautics and/or space exploration. For example, it may consist of heat exchangers for onboard elect...  
WO/2002/010661A1
A package (21) containing an electronic component (22) and having a heat removal system (23).  
WO/2002/006747A1
A heat exchanger (1) including a foam (14) having hollow ligaments (15) and an interstital volume (13).  
WO/2002/002201A2
A capillaray pump two phase heat transport system that combines the most favorable characteristics of a capillary pump loop (CPL) with the robustness and reliability of a loop heat pipe (LHP). Like a CPL, the hybrid loop has plural paral...  
WO/2001/088456A2
A capillary wick (312) for use in capillary evaporators (310) has properties that prevent nucleation inside the body of the wick, resulting in suppression of back-conduction of heat from vapor channels (316) to the liquid reservoir (320)...  
WO/2001/084068A1
A heat plate (410) containing a heat pipe (405) placed within a slotted (450) channel (401).  

Matches 801 - 850 out of 14,119