Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 801 - 850 out of 14,763

Document Document Title
WO2005055319A3
The present invention relates to a closed system for cooling without moving mechanical parts and at a low noise level, one or more heat-emitting elements. The system comprises a first heat-receiving part that is adapted to receive heat f...  
WO2004083760A3
An apparatus and method of circulating a heat-absorbing material within a heat exchanger (100) is disclosed. The apparatus comprises a manifold layer (101) coupled to an interface layer (150). The manifold layer (101) comprises an inlet ...  
WO2004040218A9
A system includes a heat transfer system (105) and a priming system (110) coupled to the heat transfer system. The heat transfer system includes a main evaporator (115) having a core (135), a primary wick (140), and a secondary wick (145...  
WO/2005/071747A1
A heat pipe radiator of heat-generating electronic component comprises a tubular housing and flow channel having tubular thin wall mounted within the tubular housing. The edge of tubular housing and flow channel are hermetically connecte...  
WO2005036075A3
The inventive device for cooling electronic device components comprises coolers disposed on the cooled electronic device components, a remote radiator and a heat pipe. Said heat pipe consists of four sections embodied in the form of heat...  
WO2003029731A3
A micro heat exchanger (200) comprised of an electroosmotic pump (300) and a heat producing device (50).  
WO2004071139A3
A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, ...  
WO2004061908A3
A cooling apparatus has a low profile extrusion (20) with a plurality of micro tubes (21) extended there through. In the caps interconnect the ends of the micro tubes (21) in fluid communications and to inlet (18) and outlet (22) tubes. ...  
WO2005005903A3
A capillary structure (25) for a heat transfer device (2), such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound (30) are formed...  
WO2004042307A3
Methods and apparatus for cooling a device are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid that near or above its critical pres...  
WO/2005/063566A2
With a cooling system for expelling heat from a heat source (30) located in the interior of an aircraft to a heat reducer (32), with a piping system (10) sealed against the surrounding atmosphere which is thermally coupled to a heat inta...  
WO2004019379A3
A number of compact, high-efficiency thermoelectric system utilizing the advantages of thermal isolation in the direction of a working medium flow or movement, in manufacturable systems, are described. Such configurations exhibit high sy...  
WO/2005/060370A3
A system (200) to extract heat from a high power density device (202) and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit (203a) using one or more electronmagnetic pumps (211) for carrying ...  
WO/2005/054766A1
The heat pipe radiator (10) is intended to be included into a heating system of the kind comprising a heat source arranged internally or externally to the radiator itself, a conduit (11) containing a heat carrier fluid which is heated by...  
WO/2005/055319A2
The present invention relates to a closed system for cooling without moving mechanical parts and at a low noise level, one or more heat-emitting elements. The system comprises a first heat-receiving part that is adapted to receive heat f...  
WO2004097900A3
A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid co...  
WO/2005/045134A1
According to the invention, a railway installation (11) is heated by a heat source with the aid of at least one heating pipe (1) that is filled with a working fluid. Said working fluid is heated by means of the heat source in the vicinit...  
WO2005015104A3
A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular en...  
WO2004042302A3
A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfe...  
WO2005003503A3
A temperature management system for managing the temperature of a discrete, thermal component.The temperature management system comprises a heat exchanger in thermal contact with the thermal component.The system also comprises a fluid tr...  
WO/2005/043059A2
A method of making an evaporator (115) includes orienting a vapor barrier wall (117) , orienting a liquid barrier wall (135) , and positioning a wick (145) between the vapor barrier wall and the liquid barrier wall. The vapor barrier wal...  
WO/2005/038859A2
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implemen...  
WO2005006395A3
A capillary structure (25) for a heat transfer device, such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound are formed between ...  
WO/2005/038859A3
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implemen...  
WO/2005/038860A2
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implement...  
WO2004059696A3
The invention provides to thermal management devices constructed from flexible graphite. In one embodiment, the thermal management device includes a wick structure (16) inside a shell (14). In certain preferred embodiments, the wick stru...  
WO/2005/038860A3
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implement...  
WO/2005/036075A2
The inventive device for cooling electronic device components comprises coolers disposed on the cooled electronic device components, a remote radiator and a heat pipe. Said heat pipe consists of four sections embodied in the form of heat...  
WO/2005/031238A1
Disclosed is a flat plate heat transfer device, which includes a thermal-conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid which is evaporated with absorbing heat from the heat s...  
WO2004109757A3
Methods and apparatus for controlling the boiling temperature of a fluid within a heat pipe (404) are disclosed. According to one aspect of the present invention, a method for controlling a temperature associated with a heat pipe that co...  
WO2004072541A3
A method is used to increase the energy content of a pipeline and other vessels that are designed to carry natural gas under ambient conditions, in a compressed state or in a liquefied state. Methane and other gas are used as the feedsto...  
WO/2005/024331A1
A loop type thermo siphon (100A), comprising a closed circuit having evaporators (110), a condenser (130A), feed tubes (120), and return tubes (140). The condenser (130A) further comprises an assembly having a feed tube side main tube (1...  
WO/2005/022052A1
A two-phase cooling apparatus for cooling an electronic assembly is disclosed. The apparatus comprises an evaporator (40) having a single-phase inlet (22) for receiving a single-phase liquid coolant and a two-phase outlet for discharging...  
WO/2005/019755A1
A geothermal heat collector for heat pumps and of the type having a heat conducting fin (18) which communicates at its conducting surface (18a) with the surface of the earth (14). A heat transfer fluid flows through the fin by way of a c...  
WO2005008158A3
An improved system (102) for transferring heat, utilizing diols, specifically 1,3-propanediol (PDO). The system reduces the energy consumption, maintenance costs, corrosion, toxicity, and the risk of the fire associated with such heat-de...  
WO2004107535A3
The invention relates to a rotating electrical machine, provided with a stator, a cooling device comprising at least one fan that initiates a coolant flow in order to cool and evacuate, to the outside, the heat produced in the machine co...  
WO/2005/015104A2
A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular en...  
WO/2005/010451A1
A thermosyphon formed in a simple structure, enabling an increase in heat transfer efficiency for transferring heat from the thermosyphon to the outside, and manufacturable at low cost and a method of manufacturing the thermosyphon. The ...  
WO/2005/008161A1
A thermosyphone device for both cooling and warming (heating) enabling, by a simple structure, the easy installation operation, elimination of the need of adjusting operation, a reduction in manufacturing cost, and an increase in heat tr...  
WO/2005/008158A2
An improved system (102) for transferring heat, utilizing diols, specifically 1,3-propanediol (PDO). The system reduces the energy consumption, maintenance costs, corrosion, toxicity, and the risk of the fire associated with such heat-de...  
WO2004086827A3
An apparatus for controlling the temperature of an electronic device utilizes a thermal head attached to a base structure (36) including an integral isolation arrangement. For example, the isolation arrangement can be formed as a planar ...  
WO/2005/005903A2
A capillary structure (25) for a heat transfer device (2), such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound (30) are formed...  
WO/2005/006395A2
A capillary structure (25) for a heat transfer device, such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound are formed between ...  
WO/2005/003503A2
A temperature management system for managing the temperature of a discrete, thermal component.The temperature management system comprises a heat exchanger in thermal contact with the thermal component.The system also comprises a fluid tr...  
WO/2005/003865A1
A hot roll and a fixing device, the hot roll wherein a heat transfer body (3) formed mainly of water is held in a hollow cylindrical core (2). Both ends of the core (2) are sealed by sealing members (4). A heat transfer body agitating me...  
WO/2004/109757A2
Methods and apparatus for controlling the boiling temperature of a fluid within a heat pipe (404) are disclosed. According to one aspect of the present invention, a method for controlling a temperature associated with a heat pipe that co...  
WO/2004/106822A1
The present invention provides a thin plate type cooling device including at least one cavity formed on an inside wall of coolant circulation loop in order to prevent dry-out of the coolant.  
WO/2004/107535A2
The invention relates to a rotating electrical machine, provided with a stator, a cooling device comprising at least one fan that initiates a coolant flow in order to cool and evacuate, to the outside, the heat produced in the machine co...  
WO/2004/104497A1
A cooling technique involves: reducing a pressure of a cooling fluid to a subambient pressure at which the cooling fluid has a boiling temperature less than a temperature of a heat-generating structure (16, 17); bringing the cooling flui...  
WO/2004/102779A1
The motor device comprises a motor (2) with a rotor (5) rotating about an axis (A), the superconducting winding of which is coupled with thermal conduction to a central refrigerant cavity (12). The cavity (12) forms a single-tube system,...  

Matches 801 - 850 out of 14,763