Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 951 - 1,000 out of 6,969

Document Document Title
JP2013194919
To provide a self-excited oscillation heat pipe with excellent startup performance.One hollow capillary 7 forming a closed loop is routed several times between a heat generating unit 3 and a cooling unit 5. Between a heat source 23 dispo...  
JP2013197125
To solve the problem that cooling performance is lowered when a cooling structure using an ebullient cooling system is disposed so as to greatly tilt.A cooling structure 10 includes: a coolant 20; a heat-receiving portion 30 storing the ...  
JP2013186474
To provide a DMD module cooling device which is capable of quickly absorbing and moving heat generated by a DMD module by use of a heat pipe and a heat block which are coupled with the DMD module, and is capable of preventing damage and ...  
JP2013185774
To suppress strength from being lowered and facilitate work of manufacture, and also secure stable performance without depending on the mounting position of a cooled body.A vapor chamber is provided with a pair of surface layer members 1...  
JP2013181728
To provide a flow velocity control method capable of preventing thermal runaway of a heating element by equalizing heat of a heat pipe even when a working fluid is frozen, and further reducing costs.A flow velocity control device 1 inclu...  
JP2013174376
To provide a sheet-shaped heat pipe for a heater element, with which an electronic apparatus can be miniaturized, reduced in weight and thickness, and which enables cost reduction.A sheet-shaped heat pipe 10 includes a container 17 formi...  
JP2013170746
To provide a cooling device capable of achieving stable cooling performance.A cooling device includes a heat receiving section 5 and a heat dissipating section 7, the heat receiving section 5 includes a heat receiving plate 12 kept into ...  
JP2013167377
To provide a heat transport device which can be extended in length suppressed in restriction on a working fluid.A heat transport device includes: a low temperature unit-side reservoir 20 having a flexible member 22; a high temperature un...  
JP2013167434
To provide deep hole processing for mounting a heat pipe and a heat pipe mounting structure.By processing heat pipes adjacent to each other, from both sides of a shell to a hole processing reference face offset to right and left both sid...  
JP2013160406
To obtain a practical device which prevents a decrease in thermal efficiency in a dew condensation preventing device for exhaust in a latent heat recovery type combustion apparatus using a heat pipe.A latent heat recovery heat exchanger ...  
JP2013160420
To provide a self-excited vibration heat pipe that has high starting characteristics without performing alteration of a flow passage structure, addition of a component and the like.There is provided a self-excited vibration heat pipe 1 t...  
JP2013155925
To provide a boiling cooler that can prevent dry out by improving cooling efficiency of a heating element by facilitating heat transfer of the heating element to a refrigerant.A boiling cooler M is housed in a casing 1, and includes refr...  
JP2013154268
To obtain a reduced pressure steam heating apparatus which can optionally control the temperature of liquid in a tank only by supplying a small amount of a cooling fluid.A steam supply pipe 3 is connected to a jacket part 11 of a reactio...  
JP2013157111
To provide a cooling and heating structure which can cool single cells constituting a battery pack efficiently, and can heat the single cells to a proper temperature range in a short time before starting use even in a cold district.In th...  
JP2013148289
To suppress a flat surface to which a heat-generating body is mounted, from being expanded and curved due to an increase in internal pressure in a flat heat pipe.A flat heat pipe 2 includes: a pair of flat plates (top plate 3 and bottom ...  
JP2013145069
To provide a cooling device in which a working fluid can be supplied to a heat receiving part and deterioration of cooling capacity is suppressed, even when heat generated in a semiconductor switching element in an inverter circuit of an...  
JP2013137181
To provide a thermosiphon cooler arrangement capable of achieving elimination of heat from electric and/or electronic components with improved efficiency and flexibility.A module 102 includes a guiding structure, an inlet 614 to take in ...  
JP2013137188
To provide a heat exchanger which can efficiently heat a panel for heat radiation by more uniformly heating the panel for heat radiation.The heat exchanger includes a steam generator 5 for a heat transfer liquid 4 to be heated, a panel 1...  
JP2013137186
To reduce efforts for manufacturing a gas-liquid phase filling heat pipe so as to suppress a manufacture cost.The method concerned includes a body manufacturing process, a regulator mounting process, a filling process, and a heating proc...  
JP2013133989
To provide a heat transport device of a fuel pool capable of stably cooling fuel pool water for a long time without the usage of external power.The heat transport device 10 of the fuel pool 32 includes an ascending pipe 1 for receiving h...  
JP2013130332
To provide a bubble-driven cooling device that achieves reduction in size, weight and energy consumption, as well as improving reliability, while taking advantage of a liquid-cooling system.The bubble-driven cooling device includes: mult...  
JP2013130379
To provide a cooler which enhances the efficiency of heat transfer of a heat receiving part and improves cooling performance.A plurality of pipes 3 running along the vertical direction are vertically disposed side by side in the longitud...  
JP2013130331
To provide a compact bubble-driven cooling device.A bubble-driven cooling device 1A includes: a heat receiving part AP in contact with a heating element; a radiator 8 provided near the heat receiving part AP to enable heat exchange with ...  
JP2013124781
To provide a heat pipe that is flat in cross section and has superior thermal transport properties and thermal transport capability.In a flat heat pipe 1, the inside of a flat container 2 having a large width relative to a thickness ther...  
JP2013124841
To provide a technology for decreasing a fin pitch while employing a technology for simultaneously molding a heat pipe body and a fin by a method such as extrusion, casting, or forging.The present specification discloses a method of manu...  
JP2013122369
To provide a vehicle heat exchanger that is improved in heat dissipation effects of working fluids flowing therein by utilizing an evaporation type heat exchange principle.A vehicle heat exchanger in this embodiment comprises: a heat abs...  
JP2013122370
To provide a solar water heater that has superior heat exchange efficiency, and reduces fluctuation in the temperature of supplied hot water and prevents a latent heat storage material from being excessively heated.The solar water heater...  
JP2013120053
To provide a heat pipe further improved in heat transport efficiency.The heat pipe 100 uses a porous pipe. The porous pipe in the heat pipe 100 is provided with a plurality of through-holes two-dimensionally disposed in a cross section o...  
JP2013120010
To provide a cooling device for efficiently circulating a refrigerant and enhancing cooling performance.The cooling device 3 is composed of a heat receiving part 4 equipped with a heat receiving plate 11 for transferring heat to a workin...  
JP2013105962
To provide a heat radiation structure of an electronic component which efficiently radiates heat of the electronic component mounted on a housing.This invention relates to a heat radiation structure of an electronic component 10 mounted ...  
JP2013104581
To suppress a foreign matter that is generated in association with friction stir welding from flowing into a flow path, in a device wherein a refrigerant case formed with the flow path in which a refrigerant flows and a lid, are joined t...  
JP2013104059
To provide a promoter to improve heat conduction efficiency, which can reduce the generation of NOx, which is a greenhouse gas.The promoter to improve heat conduction efficiency has a nano powder and a micron powder. The promoter is adde...  
JP2013103506
To provide a cooler for a vehicle control device which can efficiently cool a semiconductor cooling device using traveling wind by increasing the amount of cooling wind passing the cooler.The semiconductor cooler for the vehicle control ...  
JP2013103632
To provide a heating system for vehicle, capable of efficiently transferring heat from a heat source side of a driving part or the like to the heating system side with a simple structure, and also can prevent the heat from the heating sy...  
JP2013100923
To easily form a wick structure of a sintered heat pipe.Space parts are formed in a container 1 by using a molded plate 3 and a pressure rod 5 inserted along a major axis direction in a pipe-shaped container 1, and is filled with metal p...  
JP2013100977
To provide a cooling device which has a strong capillary force, is not affected by gravity, has a sufficient flow rate of working fluid, and prevents reduction in transportation function.A unidirectional copper fiber assembly 8 is mounte...  
JP2013100922
To easily extract a core bar even when the core bar is stuck to a part of metal powder, in manufacturing a sintered heat pipe.In the method of manufacturing a sintered heat pipe, a core bar 2 is divided into a plurality of core bars, eac...  
JP2013092275
To efficiently cool liquid and enable conveyance as needed.This liquid cooling device 1 includes: an evaporator 20 immersed in liquid and vaporizing working fluid by exchanging heat between the liquid and the working fluid therein; a fir...  
JP2013086170
To provide a casting mold capable of using copper-water type heat pipe under heat-resistance limitation for cooling a narrow cast hole and a narrow part in light metal casting.The casting mold 10 includes a cooling part 20 containing a h...  
JP2013088062
To provide a heat radiation device with high heat conductivity configured to prevent heat resistance, and a method of manufacturing the heat radiation device.A body 11 includes a first plate body 112, a second plate body 113, a chamber 1...  
JP2013088031
To provide a cooling system that suitably cools an object to be cooled even in a partial load operation, and to provide a method for controlling the same.The cooling system 1 includes: an evaporators 21a, 21b for evaporating a refrigeran...  
JP2013088051
To provide a self-excited vibration heat pipe capable of maintaining a high heat transporting performance with simple configuration.The self-excited vibration heat pipe includes: a conduit line extending a plurality of times between a fi...  
JP2013083399
To provide a cooling device with a low profile.The cooling device includes a refrigerant circulation path in which a heat receiving unit 4, a gas phase tube 5, a heat dissipation unit 6, and a liquid phase tube 7 are connected in this or...  
JP2013083413
To provide a cooling device in which a decrease in cooling performance is suppressed, and that can supply an amount of working fluid required for cooling even when heat generated in a semiconductive switching element in an invertor circu...  
JP2013083385
To provide a loop type heat pipe reducing heat resistance between a wick and a metal case storing the wick, and a method of manufacturing the loop type heat pipe.First, the wick 41 made of a porous body is stored within the metal case 22...  
JP2013079748
To easily install a heat exchanger body without changing a layout pattern of a heat exchanging tube.On the ground, a heat exchanging tube 12 wound into a coil is shifted in a direction along a coil surface and extended to form a winding ...  
JP2013073722
To provide a battery temperature adjusting unit and a battery temperature adjusting apparatus that are capable of efficient battery-temperature adjustment.The battery temperature adjusting unit is capable of being inserted between adjace...  
JP2013072627
To provide a loop heat pipe capable of securely starting operation regardless of arrangement condition and an electronic apparatus including the same.A loop heat pipe 100 includes an evaporator 1, a condenser 8, a vapor pipe 12 and a liq...  
JP2013068120
To provide an internal combustion engine having an EGR passage, in which even when condensation water is generated inside an EGR cooler, it is discharged to an exhaust passage with a simple structure.An EGR cooler 14 is connected to an e...  
JP2013069740
To solve the problem that the improvement of cooling performance leads to the size increase of a cooling device, which uses a vapor cooling method.A flat plate type cooling device of the invention has: a first flat plate; a second flat p...  

Matches 951 - 1,000 out of 6,969