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JP2011216831 |
To secure sufficient natural convection wind to improve cooling capacity without using forced air cooling by a fan, in a boil cooling device for cooling a heating element by boil and condensation of a cooling medium.This boil cooling dev...
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JP2011204851 |
To provide a loop-type heat pipe which is easy to promptly be started after heated.The loop-type heat pipe has an evaporator 1 connected between a liquid pipe and a steam pipe where the evaporator 1 includes a porous body which makes a w...
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JP2011204154 |
To provide a cooling system of an electronic apparatus capable of shortening a period of forced circulation while minimizing stopping of natural circulation, and carrying out smooth change from the natural circulation to the forced circu...
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JP2011196659 |
To provide a boil cooling device responding to high-heat flux exceeding 1000 W/cm2 and contributing to further high integration and miniaturization of an electronics device.A porous body 10 used for the boil cooling device is formed by s...
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JP2011196632 |
To provide an ebullient cooling device enabling gas liquid separation of a refrigerant within a condensation part 30 and improvement of heat exchange efficiency.The ebullient cooling device includes: a storage part 2 storing a liquid ref...
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JP2011199053 |
To provide a compact semiconductor device assuring higher cooling efficiency.The semiconductor device 2 includes a semiconductor element 4, an inlet port 8 through which a liquefied coolant 6 inflows, a coolant sucking material 10 for su...
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JP2011190996 |
To provide a loop type heat pipe (LHP) enabling mass production in a form with stable cooling performance (no large variations).The LHP is equipped with an evaporator which includes a case 12 and a wick 13. The wick 13 made of an elastic...
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JP2011191033 |
To provide a heat recovery device that suppresses a decrease in efficiency of heat exchange that is caused by high temperature of a high-temperature fluid.The heat recovery device 60 includes: an evaporator 70 for exchanging heat between...
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JP2011190965 |
To provide a heat exchanging device that allows efficient heat exchange by reducing thermal resistance, and also has a simple structure with reduced number of components, thus achieving cost reduction.The heat exchanging device includes ...
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JP2011190955 |
To provide a method of manufacturing a heat pipe, capable of stably evaporating or boiling a hydraulic fluid, and quickly and readily manufacturing the heat pipe in which a predetermined amount of hydraulic fluid is enclosed, at low cost...
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JP2011179690 |
To achieve a heat pipe type cooling system capable of changing heat radiation amount in a high temperature section using a heat pipe.A motor cooling system 26 as a heat pipe type cooling system includes: a heat pipe 34 connected between ...
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JP2011174647 |
To provide a heat pipe type radiator suppressing degradation of radiation efficiency of heat generated from a heating element mounted on an evaporating section.This heat pipe type radiator 1 is equipped with: the bottomed evaporating sec...
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JP2011169514 |
To provide an exhaust heat recovery device capable of suppressing loss of a heat amount at a condensation part and considerably improving the efficiency of exhaust heat recovery.The condensation part 40 which heats engine cooling water b...
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JP2011169506 |
To provide a connecting section of a heat pipe heat receiving section, and a method of connecting the heat pipe heat receiving section of high heat efficiency, in which a clearance gap is hardly found between a base plate and the heat re...
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JP2011163622 |
To provide a jointed part of a heat dissipation fin and a heat pipe in which the heat dissipation fin and a heat dissipation part of the heat pipe inserted to a notch of the heat dissipation fin are jointed to each other with low heat re...
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JP2011163568 |
To suppress degradation of heat exchanging capacity of each outer pipe comparatively in a short time even when the plurality of outer pipes are buried in soil, in an in-ground heat exchanger including the plurality of outer pipes exchang...
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JP2011163758 |
To efficiently cool at a low running cost an electronic device of which precision operations of a computer, a server, etc. are demanded while a heating value from itself is large.This cooling system for the electronic device includes ser...
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JP2011162151 |
To use the capacity of a cabin air conditioner for cooling electric equipment mounted on a vehicle, while restraining a load increase in the cabin air conditioner, in a cooling system for the vehicle.This cooling system 10 for the vehicl...
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JP2011163751 |
To provide a cooling-radiating system efficiently changing the phase of an operating fluid from a liquid phase to a gas phase and efficiently radiating heat of a heating source, and a cooling device for use in the cooling-radiating syste...
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JP2011155107 |
To provide an ebullient cooling device capable of making an appropriate distance between a heating surface and a wall surface opposite thereto and improving a heat transfer rate.The ebullient cooling device includes the heating surface 2...
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JP2011153776 |
To provide a cooling device which reduces electric power consumption by Peltier elements by uniformizing the operation of the respective Peltier elements, when the plurality of Peltier elements are used.The cooling device includes: a hea...
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JP2011149563 |
To provide a heat pipe and a heat sink with the heat pipe, which allow working fluid to easily evaporate at an evaporating section of the heat pipe.This heat pipe for moving heat on the basis of phase change of the working fluid 24, incl...
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JP2011145044 |
To provide a heat transport unit capable of quickly transporting heat of a heat generation body toward a prescribed direction.This heat transport unit (1) includes an upper part plate (2), a lower part plate (3) opposed to the upper part...
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JP2011141200 |
To easily keep the inside of a container at a desired temperature, while suppressing energy consumption.One end of a natural circulation coolant circuit 110 is arranged in a heat insulation container 2, and the other end is arranged out ...
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JP2011142298 |
To obtain a compact boiling cooler capable of increasing refrigerant circulation efficiency to improve cooling performance and improving flexibility in installation.A boiling cooler includes a refrigerant tank 4, a radiator 6, a refriger...
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JP2011137568 |
To provide a heat exchanger capable of draining a large amount of water without causing clogging.The heat exchanger includes a refrigerant pipe 4 in which a refrigerant heated by compressor 14 is passed; an intermediate heating pipe 5 fo...
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JP2011137571 |
To provide a heat treatment device, a treatment device and waste treatment apparatus capable of effectively exchanging heat among fluids.The heat exchange device includes a first pipe conduit 90 in which a first fluid flows; a second pip...
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JP2011134938 |
To provide a cooling unit with improved heat transference to a heat pipe.The cooling unit is equipped with a heat-transfer member 2 in contact with a heat generator 1 to transfer heat generated in the heat generator 1, the heat pipe 3 pr...
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JP2011134449 |
To provide a heating device capable of efficiently carrying out induction heating of contents in a container.The heating device 1 heating a container 2 with solutions contained, includes: a housing part 3 formed of a member 6 forming a f...
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JP2011127868 |
To provide an ebullient cooling method capable of suppressing the degradation of condensing capacity by removing a noncondensable gas from the circumference of a condensation pipe.Bubbles B generated by boiling of a liquid refrigerant in...
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JP2011127780 |
To provide a heat transport device which can maintain high reliability by preventing the deformation of a container and can be manufactured inexpensively with good work efficiency and electronic equipment mounted with the heat transport ...
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JP2011124456 |
To provide a cooling device that can efficiently cool a heat generating body having a large calorific volume even though it is extremely compact in size and can reduce a mounting volume.The cooling device 1 includes a substrate 2 where a...
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JP2011122789 |
To provide a flat plate type heat pipe which achieves a sufficient heat diffusing performance even at a temperature lower than the lower limit of a temperature region where an operating fluid circulating motion of the heat pipe is availa...
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JP2011122813 |
To provide a thin heat pipe in a simple constitution, which does not need special processing, is superior in mass-productivity, and has high heat radiating and heat absorbing properties so that the entire surface can be heated or cooled ...
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JP2011115036 |
To advantageously perform power generation using the heat of a heat generation source and cooling of the heat generation source, in terms of efficiency.The power generation method, using the heat of a heat generation source has a first s...
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JP2011112330 |
To maintain high capillary force and suitable circulation performance of working fluid, and to enhance thermal conductivity.The heat radiation component 20 includes a wick layer 24 formed on an inner wall of a sealed vessel 22 made of me...
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JP2011108685 |
To provide a natural circulation type boiling cooler capable of enhancing the condensing capability of a condenser unit.The natural circulation type boiling cooler includes a storage portion 2, which stores a liquid coolant for receiving...
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JP2011106793 |
To provide an electronic device which can be made thinner.The electronic device 1 includes: a housing 6; a first heating element 21 provided in the housing 6; a heat sink 28 provided in the housing 6; a first pressing member 26; a first ...
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JP2011102691 |
To overcome a problem wherein a conventional aluminum chamber having a net-like or groove-type capillary structure is not adequate to a heat release structure of a transistor with high output because heat flow speed is extremely low; and...
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JP2011103396 |
To provide a natural circulation evaporation cooling device that keeps a separation distance between a heat transfer surface and a facing surface at a predetermined distance and maintains a liquid refrigerant flow from a circulation pass...
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JP2011103384 |
To provide a heat sink which can improve the efficiency of a heat dissipation space.The heat sink 1 includes a base substrate 2, a fin assembly 3, heat pipes 4a and 4b, and a heat dissipation plate 5. The fin assembly 3 has a plurality o...
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JP2011101067 |
To provide an apparatus and a method for removing heat from a device for generating heat.The apparatus and a method preferably utilize an electroosmotic pump that can generate high pressure and high flow without moving mechanical compone...
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JP2011094880 |
To provide an air bubble circulation driving type heat pipe device enabling highly efficient heat transport at high speed.A heating working fluid reservoir 13 is connected to a working fluid heating part 11 via a heating working fluid ri...
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JP2011096983 |
To provide a cooling device that can effectively cool a plurality of heating components arranged in a sealed housing and differing in heating value, and uses heat exchangers.The cooling device which dissipates heat in the housing wherein...
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JP2011094888 |
To improve heat radiation efficiency of a heat radiator for radiating heat in a circuit.The heat radiator for radiating heat in the circuit includes: a first heat pipe having a first end part, a first linear part which is a linear pipe c...
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JP2011094822 |
To provide a loop-type heat pipe and an electronic device including the same, superior in starting performance and a heat transporting capacity.This loop type heat pipe 10 includes: a compensation chamber 11 for storing working liquid 18...
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JP2011097064 |
To provide an electronic apparatus capable of maintaining superior cooling characteristics of heat generating parts in a housing by suppressing leakage of cooling wind from a space between a heat dissipation section and a fan.The electro...
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JP2011089673 |
To provide a loop type heat pipe capable of quickly starting circulation of working fluid.This loop type heat pipe 10 configured by connecting a compensation chamber 11, an evaporating section 12, a steam pipe 13, a condensing section 14...
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JP2011089660 |
To efficiently cool a superconductive magnet in a low temperature area by incorporating the self-excited oscillation type heat pipe in the superconductive magnet.In this superconductive magnet, a self-excited oscillation type heat pipe s...
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JP2011091384 |
To provide a heat pipe heat radiating device having high heat dissipation efficiency.A heat pipe heat radiating device has a first heat radiator, used for radiating heat of a first electronic element on an electric circuit board, and the...
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