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Patent Searching and Data


Matches 1,001 - 1,050 out of 6,982

Document Document Title
JP2013092275
To efficiently cool liquid and enable conveyance as needed.This liquid cooling device 1 includes: an evaporator 20 immersed in liquid and vaporizing working fluid by exchanging heat between the liquid and the working fluid therein; a fir...  
JP2013086170
To provide a casting mold capable of using copper-water type heat pipe under heat-resistance limitation for cooling a narrow cast hole and a narrow part in light metal casting.The casting mold 10 includes a cooling part 20 containing a h...  
JP2013088062
To provide a heat radiation device with high heat conductivity configured to prevent heat resistance, and a method of manufacturing the heat radiation device.A body 11 includes a first plate body 112, a second plate body 113, a chamber 1...  
JP2013088031
To provide a cooling system that suitably cools an object to be cooled even in a partial load operation, and to provide a method for controlling the same.The cooling system 1 includes: an evaporators 21a, 21b for evaporating a refrigeran...  
JP2013088051
To provide a self-excited vibration heat pipe capable of maintaining a high heat transporting performance with simple configuration.The self-excited vibration heat pipe includes: a conduit line extending a plurality of times between a fi...  
JP2013083399
To provide a cooling device with a low profile.The cooling device includes a refrigerant circulation path in which a heat receiving unit 4, a gas phase tube 5, a heat dissipation unit 6, and a liquid phase tube 7 are connected in this or...  
JP2013083413
To provide a cooling device in which a decrease in cooling performance is suppressed, and that can supply an amount of working fluid required for cooling even when heat generated in a semiconductive switching element in an invertor circu...  
JP2013083385
To provide a loop type heat pipe reducing heat resistance between a wick and a metal case storing the wick, and a method of manufacturing the loop type heat pipe.First, the wick 41 made of a porous body is stored within the metal case 22...  
JP2013079748
To easily install a heat exchanger body without changing a layout pattern of a heat exchanging tube.On the ground, a heat exchanging tube 12 wound into a coil is shifted in a direction along a coil surface and extended to form a winding ...  
JP2013073722
To provide a battery temperature adjusting unit and a battery temperature adjusting apparatus that are capable of efficient battery-temperature adjustment.The battery temperature adjusting unit is capable of being inserted between adjace...  
JP2013072627
To provide a loop heat pipe capable of securely starting operation regardless of arrangement condition and an electronic apparatus including the same.A loop heat pipe 100 includes an evaporator 1, a condenser 8, a vapor pipe 12 and a liq...  
JP2013068120
To provide an internal combustion engine having an EGR passage, in which even when condensation water is generated inside an EGR cooler, it is discharged to an exhaust passage with a simple structure.An EGR cooler 14 is connected to an e...  
JP2013069740
To solve the problem that the improvement of cooling performance leads to the size increase of a cooling device, which uses a vapor cooling method.A flat plate type cooling device of the invention has: a first flat plate; a second flat p...  
JP2013069925
To provide a loop heat pipe which improves the operation limit for the increase of the heat value while inhibiting flow interruption due to phase changes of a working fluid in areas other than an evaporator and a condenser.A condensation...  
JP2013068370
To provide a natural circulation type (boiling circulation type) cooling system configured to prevent dew condensation of a heat exchange unit installed in a room.An outdoor unit 50 including an outdoor heat exchange unit 51 installed ou...  
JP2013068380
To provide a self-excited oscillation heat pipe where a fitting wall surface of an injecting pipe and a wall surface to be fitted of a fitted portion are joined properly with a jointing material.In a cross section along an axis orthogona...  
JP2013068400
To solve the problem that in a conventional heat exchanger directly heat-exchanging oil with water via a heat transmission wall when a lubricant or a fuel oil at high temperature is cooled down by water, if sea water is used as cooling w...  
JP2013068335
To provide a pump capable of maintaining cooling properties for a long period of time even when using a boiling and cooling method, and to provide a manufacturing method therefor and a cooling device.The pump includes: a casing having an...  
JP2013057502
To provide a heat exchanger for removing heat energy from a heat generator.The heat exchanger has at least one conduit 110 for a working fluid and the conduit is arranged in an upright position of at least angle of 45°. Each conduit has...  
JP2013057439
To provide a loop-type heat pipe that can prevent deterioration in heat transportation efficiency due to bubbles, and to provide an electronic apparatus with the loop-type heat pipe.The loop-type heat pipe 30 includes: an evaporator 31 s...  
JP2013057578
To provide a passive cooling device of nuclear fuel capable of cooling spent nuclear fuel stored in a pool in a necessary and sufficient manner without the need of machinery such as a cooling apparatus for cooling the cooling water in th...  
JP2013053837
To provide structure of a plate type heatpipe capable of preventing a crack from being generated by thermal fatigue, in a junction portion between the plate type heatpipe and a heat generation source, and a method of manufacturing the sa...  
JP2013053766
To solve a problem that the cooling efficiency of the whole electronic device is decreased when a cooling device using a phase change is mounted to the thin electronic device.The cooling device 20 includes: a refrigerant 90; a boiling un...  
JP2013055355
To provide a cooling device which improves the endothermic performance for heat generated from a high heat generating electronic component, and to provide an electronic apparatus including the cooling device.A cooling device performs coo...  
JP2013050277
To provide a cooling module that can abolish a fan dedicated to an ebullient cooler.The cooling module includes: a condenser 1 for exchanging heat between refrigerant circulating in a refrigeration cycle mounted on a vehicle and air; an ...  
JP2013050254
To provide a condensation structure that can ensure a cooling performance, irrespective of a traveling state of a vehicle.The structure in which upper and lower surfaces of condensation fins 21 are arrayed in a longitudinal direction (ve...  
JP2013044496
To effectively generate boiling in an evaporative cooling device.The evaporative cooling device 10 includes: a housing 12 having an flow inlet 14 in which a refrigerant flows, a flow outlet 16 from which the refrigerant after heat transf...  
JP2013044459
To provide a flat heat pipe suitable for cooling a semiconductor chip.The heat pipe 10 includes a strut 12 for connecting an upper plate 2 and a lower plate 6 of the heat pipe in the heat pipe. The strut 12 is provided in a position not ...  
JP2013040718
To provide a loop heat pipe with a plurality of wicks built in an evaporator that can prevent a backflow of vapor into a liquid pipe side even by non-uniform heat input.A loop heat pipe 30 includes: an evaporator 10 internally including ...  
JP2013040702
To prevent retention of a refrigerant circulating inside a cooling device.In a cooling device which has a condensing part 1 on the upper side, and an evaporation part 11 on the lower side, the both being connected by a pair of connection...  
JP2013040758
To provide a thermal energy releasing system that can efficiently release thermal energy.A fluid inlet/outlet port 1011 of a heating device 101 communicates with a fluid inlet/outlet port 3012 and a fluid inlet/outlet cover 1010 through ...  
JP2013040725
To provide a device for continuously increasing pressure of low-pressure gas to high pressure without using an adiabatic compressor, since use energy reduction is required for a refrigeration cycle device and a steam boiler.With a pressu...  
JP2013036674
To provide a cooling device that can stably cool a heat generation source.The cooling device 1 for cooling a heat generation source in a cooling unit 30 by circulating a coolant to a cooling unit 30, includes: a heat exchanger 14 for exc...  
JP2013036718
To provide a radiation unit structure and a method of manufacturing the same capable of improving assembling efficiency of a base and a radiation member, for improving the assembling efficiency of the base and the radiation member.This r...  
JP2013032904
To provide a cooling system that efficiently circulates a refrigerant therethrough and is improved in cooling performance.The cooling system 3 circulates a hydraulic fluid 12 to a heat receiving part 4, a radiating passage 6, a radiating...  
JP2013033807
To provide a cooling device which improves the cooling performance and achieves the low height.A cooling device comprises: an evaporation part 2 internally provided with a refrigerant evaporated with heat generated by a heating element; ...  
JP2013030736
To provide a cooling device which equalizes temperatures between heating elements and prevents the occurence of the heating elements that are not easily cooled even when multiple heating elements, having different heating values, are mou...  
JP2013028672
To provide a novel clathrate hydrate containing hydrofluorocarbons as a guest substance, which has large heat of formation of a hydrate, has a lot of storage of cooling heat, and has superior performances as a heat transfer material.The ...  
JP2013024555
To provide a close-loop temperature equalization device with observation maintenance interface.The close-loop temperature equalization device is disposed in a natural heat storage body (100). Heat energy of the natural heat storage body ...  
JP2013026362
To make it possible to reduce the ebullient noise from a siphon in order to make the siphon thinner and smaller because a server and an electronic device are desired to reduce their noise, and in the server and electronic device, a cooli...  
JP2013024456
To provide a boiling cooler which can improve its cooling performance by suppressing the obstruction of heat conduction due to the occurrence of burnout or the production of a large quantity of bubbles.The boiling cooler includes a coole...  
JP2013024278
To improve workability in replacing or moving a heat pipe.A coupler A for the heat pipe includes a housing 10 formed with a cooling chamber 19 for letting cooling fluid flow inside, and a joint function part 15 having a form of opening i...  
JP2013024478
To provide a cooling device with improved cooling performance for efficiently circulating a refrigerant.The cooling device 3 includes a heat receiving part 4 including a heat receiving plate 11 for transferring heat to working fluid 12, ...  
JP2013019617
To effectively release indoor heat to the outside while increasing the strength and rigidity of a roof, and to facilitate the expansion and relocation of a building, in the building storing an electronic apparatus.An intermediate ceiling...  
JP2013019549
To provide a cooling device suppressing the deterioration of the cooling performance, which can supply a quantity of working fluid required for cooling, even when heat generated in a semiconductor-switching element in an inverter circuit...  
JP2013019634
To provide a cooler which has a degree of freedom for a mounting posture of the cooler and is simple structure, and to provide a cooling device.The cooler includes: a housing 30 in which a refrigerant flows; a separator arranged in the h...  
JP2013017279
To incorporate a boiling cooler, in a vehicle cooling system, suitably for mounting thereof to a vehicle.The vehicle cooling system 10 includes a refrigerant discharge flow path 16 for flowing a refrigerant at temperature raised by heat ...  
JP2013015277
To provide a heat pipe and the like superior in long-time reliability, and having high flexibility in design of layout, and high efficiency.A heat receiving part joining section 7 and a heat radiating part joining section 9 are formed on...  
JP2013011363
To provide a heat pipe capable of improving maximum heat transport performance by performing protection against the intrusion of a wick in a thin groove formed at the inner peripheral surface of a container to reduce overall heat resista...  
JP2013008723
To improve the maintainability of computing machinery in a cooling system.A cooling system has: an apparatus installation area 12 in which an electronic apparatus 23 is installed; an air conditioner 21 conducting air conditioning in the ...  

Matches 1,001 - 1,050 out of 6,982