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Patent Searching and Data


Matches 1,001 - 1,050 out of 14,637

Document Document Title
WO/2000/070288A1
A heat pipe (10) having mounting holes (12) therethrough.  
WO/2000/070289A1
An apparatus suitable for two-phase heat transfer where volatile fluids such as volatile halogenated organic compounds may be used as a heat-transfer fluid without first de-gassing the volatile fluid or having to maintain the apparatus/s...  
WO/2000/069561A1
An apparatus (figure 8) for temperature control of biological/chemical samples employing liquid metal (83) is described. A gallium-indium alloy may be used to provide excellent temperature control. Methods of using liquid metal to provid...  
WO/2000/068630A1
A thermal control system (10) for use in a mobile craft is disclosed. The thermal control system (10) generally includes a structure (14) for supporting one or more heat sources (18), such as electronic equipment and at least a first hea...  
WO/2000/059034A1
A cooling unit for an integrated circuit. The cooling unit (10) includes a peltier device (18) that may be coupled to the integrated circuit and a plurality of fins (22) that are thermally coupled to the peltier device. The fins (22) are...  
WO/2000/057471A1
A heat pipe cooling device and power converting device having a heat receiving member for mounting a heating element thereon and a plurality of heat pipes, comprising a heat conductor which is provided with long and short heat pipes and ...  
WO/2000/054332A1
The apparatus comprises thermally coupling Phase Change Material (PCM) to the dissipating semiconductor device. PCM absorbs heat and stays at a constant temperature during its phase change from solid to liquid. The PCM melting point is c...  
WO/2000/046443A1
A roller (10) incorporating a heat pipe cavity (12) has a port (25) through which a medium (29) is flowed and a vacuum is drawn. The port (25) is sealed by a plug (20) which is lodged in a hole (14) by advance of a screw (16) against the...  
WO1999061397A9
A water gas shift reactor (10) in which the shift reactor is maintained at near constant temperatures and/or is continuously humidified in manners that attain low exit temperatures at elevated humidity in order to achieve minimum carbon ...  
WO/2000/037863A1
An improved HTSC filter system (10) comprises a cryocooler and dewar assembly (22), a heat dissipation assembly (14) and at least one heat pipe (28) providing a thermal coupling between said heat dissipation assembly (14) and said cryoco...  
WO/2000/037873A1
The invention tackles the problem of controlling the temperature of a heat-generating object (15) so that the temperature of the object (15) does not exceed a predetermined maximum value or fall below a predetermined minimum value when t...  
WO1999061397A3
A water gas shift reactor (10) in which the shift reactor is maintained at near constant temperatures and/or is continuously humidified in manners that attain low exit temperatures at elevated humidity in order to achieve minimum carbon ...  
WO/2000/027702A1
The invention concerns a method for thermal control of space equipment which consists in using at least one pumping unit (10, 20) of a pumping assembly comprising at least two series-connected pumping units (10, 20), each pumping unit (1...  
WO/2000/028269A1
Heat exchange means (30, 40) for a vehicle (10) comprising a tank (13) containing a first fluid and a heat exchange element (30) in thermal connect with said first fluid, said heat exchange element (30) comprising a passage (31) wherein ...  
WO/2000/014469A1
A heat exhanger is disclosed comprising a heat pipe (1) having at its end an attachment part (2, 4; 3, 4) the length of which is adjustable. Thus the length of the whole heat exhanger can be adjusted and set to an optimal contact at the ...  
WO/2000/012948A1
The invention concerns a method using a flexible exchanger with heat-pipe effect for controlling the temperature of a plane and/or skew surface walls. The method comprises at least the following steps: applying on said surface (4, 5) a f...  
WO/2000/011423A1
The invention relates to a heat exchanger (10) for conducting elsewhere heat energy generated by a heat source (11) by means of heat energy bound to working fluid in phase transition. The heat exchanger (10) comprises a heat exchanger el...  
WO/2000/004326A1
A heat exchanging method and apparatus (100) for improving heat transfer in a cooling system. Specifically, the heat exchanging method and apparatus is an absorption chiller that comprises a heat transfer device (114) having one heat pip...  
WO1999059394A3
A pipe stand heater system (20) for heating an instrument (M) within an enclosure (30) supported by a pipe stand. The heater system includes a housing mounted to the pipe stand and a heater unit in the housing. A bracket (34) is provided...  
WO/2000/000774A1
A heat exchanger which is relatively small in size for an exchangeable heat quantity and high in heat exchange efficiency, comprising a first compartment (310) allowing a first fluid (A) to flow and a second compartment (320) allowing a ...  
WO/1999/061397A2
A water gas shift reactor (10) in which the shift reactor is maintained at near constant temperatures and/or is continuously humidified in manners that attain low exit temperatures at elevated humidity in order to achieve minimum carbon ...  
WO/1999/060709A1
Method and apparatus for cooling heat-generating electronic components of radio base stations installed at elevated locations, such as mast-mounted radio base stations (1). A thermosiphon cooling system (3), including a closed pipe circu...  
WO/1999/059394A2
A pipe stand heater system (20) for heating an instrument (M) within an enclosure (30) supported by a pipe stand. The heater system includes a housing mounted to the pipe stand and a heater unit in the housing. A bracket (34) is provided...  
WO/1999/060321A1
A heat transfer changeover switch capable of effecting or cutting off positively heat transfer, requiring no contact or separation of a solid contact of a switch piece, easily being incorporated in a fine electronic device and generating...  
WO/1999/053255A1
A plate type heat pipe, comprising two plate materials forming a hollow part and opposed to each other, either one thereof being connected to at least one part to be cooled, at least one heat transfer block installed in the hollow part a...  
WO/1999/053254A1
A plate type heat pipe, comprising (1) a container part comprising a plate material having a surface connected to a part to be cooled installed on a substrate, another plate material opposed to the first plate material, and a hollow part...  
WO/1999/053256A1
A plate type heat pipe, comprising an enclosed container having principal plane parts (A) and (B) opposed to each other, at least one heat transfer block for heat transfer installed in the container so that the inner wall of the principa...  
WO/1999/050607A1
The invention concerns a heat exchange device (50) with active two-phase fluid, comprising at least a capillary pumping channel (9) and at least a gas transfer channel (6), said device enabling reversible fluid passage, between at least ...  
WO/1999/050604A1
This invention relates to a thermoelectric cooling device using heat pipe for conducting and radiating. The device composes mainly a plurality of heat pipe conduction sheets which are disposed on the cold end of a thermoelectric cooling ...  
WO/1999/042781A1
The invention relates to a heat exchanger (10) based on heat energy bound to working fluid in phase transition comprising heat exchanger elements (12) that contain working fluid for conducting elsewhere the heat energy generated by a hea...  
WO/1999/039145A1
A heat pipe type cooling device capable of efficiently cooling a cooling plate according to heat reception comprises a cooling plate (3) of which one side is a heat receiving surface and of which the other side is a heat dissipating surf...  
WO/1999/035402A1
The invention concerns a cooling device wherein the chamber (2) represents cooling channels arranged in the thickness of the pump cylinder walls. The steam flux (7) generated by the heat to be evacuated reaches the upper end of the conde...  
WO/1999/031451A1
The invention relates to a system (1) for exchanging heat between two gaseous fluids (A, B) which are guided in channels. The inventive device has a housing-like module (2) in which an evaporator chamber (5) is separated from a condenser...  
WO/1999/030091A1
The present invention relates to a temperature control system, especially a thermosiphon system (301), with controllable refrigeration capacity, comprising an evaporator (303), a condenser (305), a rise pipe (307), a fall pipe (309) and ...  
WO/1999/026461A2  
WO/1999/022192A1
A multi-mode, two-phase cooling module (10) comprises a first housing portion (20), a second housing portion (30), and a third housing portion (40). Cooling liquid (22) is held in first housing portion (20), and one or more electronic co...  
WO/1999/010797A1
To manage heat in a computer environment or the like, a base plate and/or an input/output (I/O) plate (55) includes an integrated heat pipe (51). For example, the base plate, located between a bottom surface of a laptop computer chassis ...  
WO/1999/006903A1
An apparatus for cooling a heat generating component located within a portable computer system enclosure. In one embodiment a flat heat pipe is attached to the buttom surface of the portable computer keyboard support plate. The flat heat...  
WO/1998/057111A1
A temperature control device capable of heating or cooling flat plates, such as semiconductor wafers, highly uniformly and efficiently. A circular flow passage (81) is linked to the lower surface (2A) of a circular plate-shaped heat pipe...  
WO/1998/053260A1
The invention concerns an installation comprising a cupboard with a top section (5) forming a reserve of units of cold (9), and a preserving section (6) provided with shelves (10) and trays (12) with through slots (13) for placing contai...  
WO/1998/044307A1
According to an aspect of the present invention, the foregoing needs are addressed by an apparatus for cooling a heat source (10), including a carrier plate (19) having a channel (28, 38) therein. The channel has an inlet end (30) and an...  
WO/1998/035197A1
A heat pipe that can be laid horizontally, a method of manufacturing the same, and a method of effectively utilizing the same, for example, a method of performing soil desinfection at low cost. A heat supply pipe (2) is inserted into a v...  
WO/1998/033031A1
The invention relates to a heat exchanger tube (10) for transporting heat from an evaporation area (22) to a condensation area (24), comprising a housing (12) with housing walls, a capillary structure (20) fitted in the housing (12) and ...  
WO/1998/031194A1
A heat transfer roller (10) in a machine for coating, printing, copying or heating a web, has a hollow cylindrical roller core (11) and a metal sleeve (15) for conducting heat to or from an object contacting an outer surface (17) of the ...  
WO/1998/029936A1
Heat energy is converted into the kinetic energy of conductive liquid or liquid metal with a high efficiency, and hence highly efficient MHD generation is realized. Heat pipes having thermal switch functions are provided between a high t...  
WO/1998/029699A1
Other parts than an indoor unit (B) and an existing piping (21b) are removed from an existing refrigeration apparatus which uses R22 while the indoor unit (B) and the existing piping (21b) are left. A refrigerant-refrigerant heat exchang...  
WO/1998/028584A1
The invention relates to a heating device (10) for heating systems, comprising a rising line and a return line (22, 24) and at least one heating unit having at least one hollow cavity, and is characterized in that a heating pipe (12, 14)...  
WO/1998/027392A1
A diode conductive wall (1) is described, that is, a wall (2) which is made of thermally insulating material delimited by two thermally conductive external surfaces (3, 4) connected together by one or more thermal diodes (5) (consisting ...  
WO/1998/022767A1
A heat spreading apparatus (20) includes a first planar body (22) for attachment to a heat generating surface and a second planar body (21) connected to the first planar body (22) defining a void therebetween. The void contains a vaporiz...  
WO/1998/019859A1
A superconducting heat transfer medium (6) that has three basic layers (20, 22, and 24), the first layer (20) being various combinations of metals and dichromate radical; the second layer (22) formed over the first layer (20) and being v...  

Matches 1,001 - 1,050 out of 14,637