Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1,001 - 1,050 out of 14,005

Document Document Title
JP2014066464A
To provide an outside air introduction air conditioning system excellent in application of underfloor air.An outside air introduction air conditioning system 1 includes: an outside air introduction part 11 for introducing outside air int...  
JP2014067820A
To cool a heating part with a simple structure even in the case that a coolant in a heat exchanger is frozen.A cooling device includes: an inner case which can be installed inside an outer case; a heating part provided inside the inner c...  
JP5471119B2  
JP2014062658A
To provide a cooling module which improves adhesion between wicks and a contact surface of a hollow member, and to provide a loop type heat pipe.A cooling module includes: a hollow member where a working fluid of a loop type heat pipe, w...  
JP5466676B2  
JP2014055063A
To provide a roller device which prevents a diffusional permeable gas from intruding from the exterior while securing the uniformity of width direction temperature distribution in the roll body and prevents temperature rise of a peripher...  
JP2014056690A
To provide a cooling structure in which single batteries constituting a battery pack can be efficiently cooled and when single batteries fire because of thermal runaway, the fire can be extinguished.In the cooling structure, a plurality ...  
JP2014055761A
To solve the problem that an electronic device may be susceptible to heat failure or decreased reliability if heat energy is not effectively removed from a heat-generating component.A heat dissipation device for an electronic device incl...  
JP2014055698A
To provide a heat exchanger circulating a working medium while pressurizing the working medium without a pump.A self-pumping heat exchanger 100 includes a narrow-tube bent portion 110 including loop narrow tubes including a liquid-gas mi...  
JP2014055702A
To control abnormal increase in a temperature of a power semiconductor by preventing working fluid inside a heat pipe of a cooling device, which cools the power semiconductor of a power conversion device, from freezing.A power conversion...  
JP5455503B2  
JP2014052110A
To suppress temperature variation of working fluid when quantity of heat to be received from the outside varies.A loop type heat pipe comprises an evaporator which absorbs heat from the outside and evaporates working fluid from a liquid ...  
JP2014052117A
To provide a cooling device with improved cooling capacity, and to provide an electric vehicle and an electric apparatus which are equipped with the cooling device.A cooling device includes: a heat receiving device 8; a heat radiator 11 ...  
JP2014052115A
To provide a cooling device capable of improving a heat receiving performance and reducing a size of a heat receiving part.The cooling device comprises: a heat receiving part 3; a gas-liquid heat radiation part 5 connected to an exhaust ...  
JP2014052109A
To increase contact area between a liquid drive part and a storage part while securing a flow channel of working fluid.A loop type heat pipe comprises an evaporator 101 which absorbs heat from the outside and evaporates working fluid fro...  
JP5448151B2  
JP5448620B2  
JP5449801B2  
JP5447070B2  
JP2014047979A
To provide a self-excited vibration heat pipe that enhances startability to avoid burn-out in a heating unit, and can exhibit high cooling capability.A self-excited vibration heat pipe 10a includes a container 31 in which a closed loop s...  
JP2014048002A
To provide a cooling device which simplifies the structure while maintaining high heat exchange efficiency, and to provide an electric vehicle and an electronic apparatus which are equipped with the cooling device.A heat receiver 8 inclu...  
JP2014044031A
To provide a heat pipe which is formed by enclosing a working medium in a sealed pipe container and has a structure where a metal layer forming an inner layer of a side wall of the container and containing copper is not easily peeled dur...  
JP2014040952A
To provide a superfine particle sintered body which has the same porosity on the surface as a porosity on the interior in a stereoscopic shape, and has an even capillary force characteristic as a whole.A predetermined amount of superfine...  
JP5434725B2  
JP2014038902A
To provide a vapor cooling device capable of reducing thermal resistance.A vapor cooling device 1 includes: a refrigerant inclusion body 2 which has a hollow shape heat receiving section 3 for receiving heat from the outside, hollow shap...  
JP5424107B2  
JP2014031960A
To provide an ebullient cooling apparatus capable of preventing composition change caused by ebullition of a refrigerant.An ebullient cooling apparatus 1 includes: a refrigerant including body 2 having a hollow heat receiving portion 3 f...  
JP2014031962A
To provide a heat exchanger having a heat transfer member and a fin, and being capable of highly efficient heat exchange (heat transfer) between the fin and the heat transfer member.In a cross-sectional view, a heat pipe 17 is provided t...  
JP2014031912A
To provide a radiator capable of achieving favorable heat radiation efficiency by improving heat transfer efficiency in each part without enlarging the radiator in whole.A radiator includes a base part 10 receiving heat from a heating el...  
JP5422379B2  
JP2014029232A
To provide a cooling device capable of suppressing variation of cooling efficiency when it cools a heating source.A cooler 32 has: a housing 70 defining an internal space 74; a flow inlet 71 from which a refrigerant flows in the internal...  
JP5413735B2  
JP2014024436A
To eliminate the waste of a liquid refrigerant during idling stop control.An evaporator 6 includes: a pair of tank parts 61, 62; and multiple heat transfer tubes 63 which connect the pair of tank parts 61, 62 with each other. Liquid accu...  
JP2014025688A
To provide a heat exchange unit capable of ensuring protecting a heat exchanger, preventing damage during construction and maintenance, realizing excellent workability, excellent handleability, and excellent robustness, reducing a constr...  
JP2014025693A
To provide a cooling device which is improved in cooling performance.A working fluid 12 is forcibly circulate to a heat reception part 4, a heat radiation path 6, a heat radiation part 5, a return path 7, and then the heat reception part...  
JP2014025610A
To provide a wick manufacturing method and a wick structure capable of easily removing a core from a sintered wick, or suppressing or preventing breakage of a wick when removing the core.In a wick manufacturing method for manufacturing a...  
JP5405015B2  
JP2014502785A  
JP2014017488A
To cool the semiconductor elements efficiently with a light-weight device configuration, by combining the heat dissipation fin configurations optimally in accordance with the configuration of semiconductor elements to uniformize a temper...  
JP5403617B2  
JP5400091B2  
JP5404261B2  
JP2014013116A
To provide: a sintered wick capable of lowering flow resistance when a working fluid is supplied or discharged to a wick; and a method for manufacturing the same.A wick structure is formed by loading powder into a die member for determin...  
JP2014501868A  
JP2014011758A
To provide a heat radiation mechanism which efficiently radiates heat occurring therein using a heat pipe and enables the heat pipe to be disposed so as to avoid other electronic components and contact with a heat radiation portion witho...  
JP2014005418A
To provide a novel a thermal transfer medium that has incombustibility or low combustibility, and in which load to an atmosphere is small, and a heat transfer property is excellent.A thermal transfer medium includes a 2-6C fluorination u...  
JP2014005977A
To provide an underground heat exchanger in which a cross-sectional shape of a heat medium pipe is formed into a long circular shape to secure a surface area of the heat medium pipe and a contact area between the heat medium pipe and a h...  
JP2014005978A
To provide an underground heat exchanger having high heat conductivity and including a filling material that can be readily filled.The underground heat exchanger includes: a first cylindrical housing 11; a second cylindrical housing 12 i...  
JP5390008B2  
JP2014500470A  

Matches 1,001 - 1,050 out of 14,005