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Patent Searching and Data


Matches 1,051 - 1,100 out of 6,969

Document Document Title
JP2012251750
To provide a fluid conveying device capable of supplying a sufficient quantity of a working fluid in a fluid returning pipe to an evaporation part in a circulating type heat pipe used in a top heat mode.The circulating type heat pipe 10 ...  
JP2012247166
To provide a heat pipe that does not cause a decrease in condensation even if an uncondensed gas is mixed.Two kinds of incompatible refrigerants 14 and 16 are accommodated in a container. The liquid density of the second refrigerant 16 i...  
JP2012247114
To prevent a wick structure inside from being pressed and damaged.This method of manufacturing a heat pipe, includes a step for preparing a pipe body 1 and the wick structure 2, a step for disposing the wick structure 2 in the pipe body ...  
JP2012242009
To provide a connection pipe capable of preventing the deterioration cooling capability caused by the generation of non-condensing gas.This connection pipe includes a metal layer having a hollow portion for making a refrigerant flow and ...  
JP2012241976
To provide a loop heat pipe capable of preventing both a scattering phenomenon and a water hammer phenomenon and suppressing the deterioration of efficiency in heat transport.The loop heat pipe encloses a working fluid condensed by heati...  
JP2012242952
To provide a cooling device of an automatic vending machine for satisfactorily reducing power consumption.A cooling device 10 of an automatic vending machine includes a refrigerant circuit 20 configured by successively connecting an evap...  
JP2012237491
To solve the problem that a cooling device using a boiling and cooling system becomes large in size if cooling performance is improved.A flat cooling device includes: a flat container having a first flat plate and a second flat plate fac...  
JP2012234928
To provide an ebullient cooling device which inhibits a liquid coolant from entering into a condensation part and enables the cost and weight reduction.An ebullient cooling device of this invention includes: a housing part 2 housing a li...  
JP2012233673
To provide a method of manufacturing a heat pipe, capable of reducing a heating space and consumption of heat energy, and achieving effects of environment conservation and energy-saving.In this method of manufacturing a heat pipe, a pipe...  
JP2012235108
To provide a heat radiation device which has a base having high mechanical strength and does not deform.A heat radiation device according to this invention includes: a base including a bottom plate, a top plate, and a heat pipe held betw...  
JP2012233642
To provide a loop heat pipe exhibiting a heat transfer function as a heat pipe in any attitude.A first loop heat pipe includes a first evaporator 32-1 thermally contacting a heating element 20 and a first condenser 34-1. A second loop he...  
JP2012233598
To provide a high-performance loop heat pipe that facilitates mass production, and to provide an electronic instrument using the same.An evaporator 31 of the loop heat pipe includes: a wick 43 being a porous body which working fluid of a...  
JP2012233625
To provide a high-performance loop heat pipe that is further thinner than a conventional one, and to provide a method for manufacturing the same.The loop heat pipe includes: an evaporator 32 having an inner space in which a wick 43 is ar...  
JP2012233627
To achieve a heat transport system functioning in the same way as a heat pump by a new mechanism completely different from the past.A magnetic field forming device 4 applies a magnetic field to the lower portion of a first tubular body. ...  
JP2012233737
To provide a passive decay heat removal device for nuclear reactor capable of effectively and sufficiently removing decay heat generated after a scrum of a nuclear reactor without needing power equipment or power to actuate the equipment...  
JP2012229879
To provide a flat heat pipe and a method for manufacturing the same including a wick improved in recirculation characteristic without reducing an area in which a working fluid in the wick is vaporized.The flat heat pipe 5 transporting he...  
JP2012229909
To provide a thermosyphon system improving the efficiency of heat conduction.The thermosyphon system includes a condenser, and an evaporator fluidly connected with the condenser by a condensate line. The evaporator has a housing. The hou...  
JP2012225623
To provide a cooling device efficiently circulating refrigerant and improved in cooling performance.The cooling device 3 includes a heat dissipation path 6 and a return path 7 which connect a heat receiving section 4 with a heat dissipat...  
JP2012225622
To provide a cooling device efficiently circulating refrigerant and improved in cooling performance.The cooling device 3 includes a heat receiving section 4 including a heat receiving plate 11 for transmitting heat to working fluid 12, a...  
JP2012220141
To provide a heat pipe capable of improving cooling efficiency of heating elements.A heat pipe 10 comprises: a housing 12 that has a heating section 16 that is made of metal and is contacted with a heating element 14, a cooling section 2...  
JP2012220179
To provide a heat pipe manufacturing method that makes it possible to reduce manufacturing costs.The heat pipe where capillary members inside are formed by sintering of copper powders is manufactured by the following steps: a core rod 13...  
JP2012220160
To provide a channel structure of a self-excited vibration heat pipe, which can accelerate a circulation flow of a refrigerant.A cavitary small pipe 7 formed in a closed loop is reciprocated by the multiple number of times between a heat...  
JP2012220180
To provide a flat heat pipe manufacturing method that makes it possible to maintain the quality of a product.The heat pump to be formed using a pipe 11 and a core rod 13 having a part 14 to be removed is manufactured by the following ste...  
JP2012220108
To improve heat conductivity and dissipation efficiency by reducing the weight of the heat dissipation device of an electronic apparatus.The heat dissipation device is composed of a first cavity 30, the second cavity 40, and a plurality ...  
JP2012215375
To provide a heat pipe capable of easily switching between top heat and bottom heat by performing opening and closing operations of a valve, superior in heat transfer properties, capable of being used in a heating and air conditioning sy...  
JP2012216543
To provide a light-emitting diode lamp having a high heat radiation efficiency.The light-emitting diode lamp includes a heat radiator, a heat pipe connected to the heat radiator, and a light-emitting diode connected to the heat pipe. The...  
JP2012207849
To form a loop type heat pipe with high cooling capacity within a small space.A heating element 20 is mounted on a base plate 10. The heating element 20 is housed in an evaporation part 30. A steam flow path 40 connected to the evaporati...  
JP2012202570
To provide an evaporator and a cooling apparatus capable of stably cooling a heat source body.The evaporator includes a hollow container having a first opening for a liquid refrigerant to flow in and a second opening for a gaseous refrig...  
JP2012197994
To provide an ebullient cooling device that uses a reduced amount of refrigerant compared with the related art with a relatively simple configuration, cools a heating element sufficiently even when the ebullient cooling device is located...  
JP2012198019
To provide a loop heat pipe that starts circulation of working fluid so as not to prevent the circulation after starting the circulation in a top heat state or the like, and to provide an electronic apparatus with the loop heat pipe moun...  
JP2012197765
To achieve a hermetic compressor and a refrigerating device with high efficiency, in which heating in a suction pipe of the hermetic compressor is prevented and a cooling effect of a refrigerant gas is further enhanced.The hermetic compr...  
JP2012198015
To provide a heat insulation system of a U-shaped pipeline that prevents thermal energy loss when fluid with temperature difference passing through the U-shaped pipeline where piping segments of a fluid inlet end and a fluid outlet end a...  
JP2012198000
To prevent overcooling without decreasing cooling performance or increasing the size of a product, concerning a cooling device and a heating element storage apparatus using the same.The cooling device includes natural-circulation-system ...  
JP2012192916
To provide a structural panel of an artificial satelite, having a built-in heat exchanger.The structural panel (PS) for an artificial satelite includes an outer plate (PE) intended to be arranged in the outside of an artificial satelite,...  
JP2012193912
To provide a loop heat pipe that supplies working fluid of a liquid phase to an evaporator in a stable manner.The evaporator 16 includes a first wick 30; and a second wick 31 arranged to come into contact with the first wick 30, and part...  
JP2012189260
To provide a radiation unit having a hydrophilic compound thin film capable of easily improving heat transferring efficiency at low costs, and a method of depositing hydrophilic compound thin film.This radiation unit includes a chamber 1...  
JP2012184913
To provide a radiation device and an assembling method of the same, that can improve a heat transfer effect between heat pipes adjacent to each other.This method includes a step (A) for providing a heat transfer base and the plurality of...  
JP2012186246
To restrain accumulation of dusts by making an electric potential of a heat sink approximate to a reference electric potential.A portable computer 100 houses a heat radiation unit 200 in a system housing 105. The heat radiation unit radi...  
JP2012184875
To provide a plane type heat pipe structure and a method of manufacturing the same, for improving a yield, by strengthening bearing power of a plane type heat pipe.The plane type heat pipe structure includes a pipe body 11, a thin piece ...  
JP2012183978
To simplify a configuration of a heating device using a plurality of heat sources.The heating device uses a heat transferred by a loop heat pipe 10. An evaporation part 11 of the loop heat pipe 10 is configured so that fluid 17 of a work...  
JP2012182159
To improve a heat dissipation efficiency in a cooling device of a semiconductor power module in which the semiconductor power module is installed onto a heat sink, a groove is provided in a plane of the heat sink on a side where the semi...  
JP2012177530
To provide an auxiliary cooling device capable of cold storage by using outside cold, and cooling a data center using the stored cold in the case where such a situation occurs as the data center cannot be cooled by a cooling system.An ic...  
JP2012172901
To provide a chemical heat storage heat transfer device that has superior heat transfer capability, and in reactivity in ammonia immobilization and desorption, while the cracks and pulverization of a heat storage material molding can be ...  
JP2012172896
To provide an antifreezing device for a tank storage liquid, along with a liquid storage tank with an antifreezing function, capable of performing the heat insulation of the inside of a tank so that storage liquid can be prevented from b...  
JP2012172940
To provide a heat transport device for removing factors which block circulation of a working medium and for suppressing a decrease in heat transport capacity.The heat transport device 1 includes: a vaporizer 2 for heating and vaporizing ...  
JP2012172866
To provide an ebullient cooling apparatus for reducing heat resistance.The ebullient cooling apparatus 1 includes: a hollow heat receiving part 3 for receiving heat from outside; a hollow heat radiation part 4 for radiating heat outside;...  
JP2012167866
To provide a boiling refrigerant type cooling device allowing use of a seal member on a joining portion between a cooling container and a heat exchanger.The boiling refrigerant type cooling device includes the cooling container 11 storin...  
JP2012167900
To provide a heat relay that facilitates switching modes of heating and cooling.This heat relay includes a first wickless heat pipe and a second wickless heat pipe respectively having first ends and second ends, both of the first ends of...  
JP2012163227
To provide a heat pipe that can more efficiently cool electronic components requiring inductance.A heat pipe 20 is a laminate 21 constituted by laminating flat plates includes: the laminate 21 formed by laminating flat plates and having ...  
JP2012160490
To provide a cooling device which enables, in a space-saving manner, a cooling method for reducing the temperature on an air intake side of an electronic device to be cooled, while enabling implementing various cooling methods.A cooling ...  

Matches 1,051 - 1,100 out of 6,969