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Patent Searching and Data


Matches 1,051 - 1,100 out of 6,922

Document Document Title
JP2012167900
To provide a heat relay that facilitates switching modes of heating and cooling.This heat relay includes a first wickless heat pipe and a second wickless heat pipe respectively having first ends and second ends, both of the first ends of...  
JP2012163227
To provide a heat pipe that can more efficiently cool electronic components requiring inductance.A heat pipe 20 is a laminate 21 constituted by laminating flat plates includes: the laminate 21 formed by laminating flat plates and having ...  
JP2012160490
To provide a cooling device which enables, in a space-saving manner, a cooling method for reducing the temperature on an air intake side of an electronic device to be cooled, while enabling implementing various cooling methods.A cooling ...  
JP2012157821
To provide a hot-water washing system which can decrease the amount of heating by a boiler and produce hot-water with good thermal efficiency.The hot-water washing system 1 includes a hot-water tank 5 which heats washing water by steam o...  
JP2012154622
To provide an elliptical heat pipe having an excellent capillary force without blocking a vapor channel.A shaft 12 which is provided with a notch 15 of a predetermined shape is longitudinally inserted into a tubular container 10, metal p...  
JP2012154569
To improve the heat transport capacity of a heat pipe by minimizing a gap generated between a wick of mesh structure and a pipe inner wall in a flatly worked pipe.In the thin heat pipe, the wick of the mesh structure is arranged on the i...  
JP2012149786
To provide a combination method for heat dispersion modules enhanced in the yield and reduced in a manufacturing cost.At least one end of a heat pipe 2 is tightly pressed with a single time or a plurality of times of pressurizations to t...  
JP2012149819
To provide a loop heat pipe that includes a low-profile evaporation part that can be easily manufactured.The loop heat pipe includes: the evaporation part 20 for evaporating operating fluid by heat from a heating element; and a condensat...  
JP2012145404
To use a simple structure to excellently cool an ultrasonic sensor.A cooling device comprises: an ultrasonic sensor 4 which applies supersonic waves to a high-temperature body 1 to be checked in order to check a deterioration level; and ...  
JP2012145240
To provide a temperature control system that bonds a heat conduction plate and heat pipe with high bonding strength without allowing the heat pipe to be damaged by heat, and to provide a method of manufacturing the same.The temperature c...  
JP2012141094
To provide a thin, lightweight and flexible heat sheet with an easy structure and a suppressed manufacturing cost, the heat sheet maintaining performance thereof even when repeating bending thereof.The flexible heat sheet includes a plur...  
JP2012141082
To provide a technique in a cooling device of an electronic apparatus, the cooling device which can be miniaturized and is capable of contributing to component sharing.The cooling device is provided for cooling a heating element stored i...  
JP2012138439
To provide a heat pipe type cooling apparatus of power converter, capable of achieving reductions in its size and weight by making temperatures of heat receiving members with a power semiconductor element on uniform.The cooling apparatus...  
JP2012132582
To provide a thin sheet type heat pipe that has a thinner thickness than a conventional thin sheet type heat pipe and has high heat transport and diffusion performance.The thin sheet type heat pipe 1 is fabricated by enclosing a flow pas...  
JP2012132613
To provide a loop type heat pipe that is less likely to cause drying-out.A unit is employed where a primary wick 22 is inserted into an evaporator container 21 as an evaporator 20 in the loop type heat pipe, and sequentially a secondary ...  
JP2012132661
To obtain a cooling device capable of easily removing vapor bubbles so as to gain stable cool performance even if the vapor bubbles are generated in a liquid-phase working fluid.A cooling device includes: an evaporator 1 having a porous ...  
JP2012127642
To provide a thin film type heat pipe that can be suitably used for electronic equipment of a compact thin film structure.The thin film type heat pipe is produced by extrusion and comprises a body part having a flat plate shape, a penetr...  
JP2012127583
To prevent a pipe member from being damaged due to contact of the upper end of the pipe member in an excavation pipe with the excavation pipe, when extracting the excavation pipe from the excavation hole.The method for building the pipe ...  
JP2012122694
To provide a thin sheet-like heat pipe which is thin and very strong, and achieves high heat radiation efficiency even for a small light source.The thin sheet-like heat pump 10 includes: a container 11; working fluids (not shown) filled ...  
JP2012117786
To provide a heat pipe that is manufactured more easily.The heat pipe includes: a pipe body 12 having a sealed space 20 inside; and working fluid enclosed in the sealed space 20. The pipe body 12 includes: a heat generating part 14 that ...  
JP2012112373
To provide a multi-cooling device for a vehicle, which is capable of simultaneously cooling refrigerants for engine cooling, electric parts cooling, and a condenser, and also which is capable of satisfying reference cooling temperatures ...  
JP2012109604
To provide a highly efficient inexpensive contact member which can achieve a highly efficient cooling and can ensure high durability, and to provide a cooling device for an electronic apparatus, an electronic apparatus and an image formi...  
JP2012107801
To provide an air conditioning system capable of appropriately controlling introduction of outside air according to the temperature and humidity of outside air and further reducing power consumed in an air conditioning facility.An indoor...  
JP2012102923
To provide a heat recovery device that makes a circulation of a heating medium smooth and relaxes stress concentration, with respect to a structure where flat-shaped tubular member in which the heating medium circulates is bonded to a bu...  
JP2012104891
To provide a television receiver and an electronic apparatus which enable high density assembly.An electronic apparatus includes a housing, a heat sink housed in the housing, a heat pipe having a bending part bended toward the heat sink,...  
JP2012102192
To provide a heat transport fluid which may improve thermal conductivity while controlling thermal resistance and to provide a heat transport device using the same.The heat transport fluid includes a solvent comprising water or organic s...  
JP2012093012
To provide a loop type heat pipe capable of stably circulating working fluid in a fixed direction and a technology for manufacturing the loop type heat pipe.As an evaporator 2 absorbing heat of a heating element H, a first metallic pipe ...  
JP2012083082
To provide a loop-type heat pipe capable of starting even when vapor-phase working fluid exists in a liquid pipe.This loop-type heat pipe 10 includes: an evaporating section 11 having a wick 11a for evaporating liquid-phase working fluid...  
JP2012077988
To provide a heat relay mechanism for conducting the heat of a heating component to a component which does not operate unless it reaches a fixed temperature or more.A heat relay mechanism includes: a heat-dissipating member 20 for dissip...  
JP2012079764
To provide an ebullient cooling device which reduces thermal influence on adjacent heating elements even when the device is inclined.An ebullient cooling device has an ebullition part in which a coolant is accumulated, a condensation par...  
JP2012067976
To provide a sealing structure of a flat type heat pipe, capable of preventing the work of combining the flat type heat pipe with a heat radiation unit from being hindered by protrusion of a sealing end of a flat type heat pipe and a tub...  
JP2012067981
To provide a cooling technology of a loop-type heat pipe that can be applied to a cooled element having a large variation of a heat value.A cooling system includes: an evaporator for receiving heat from a heating element to evaporate a w...  
JP2012063118
To tightly connect a radiation fin and a heat pipe.This radiation fin includes a body 11. The body 11 has a first side face 112 and a second side face 113 having front and back relationship to each other, and at least one through hole 11...  
JP2012062861
To provide a heat engine excellent in output efficiency and appropriate for use in an exhaust heat recovery system.The heat engine includes: a boiler unit 11 including a liquid reservoir 111 in which a hydraulic fluid 14 is reserved and ...  
JP2012059895
To provide an electronic apparatus which efficiently exhausts heat and does not affect the degree of freedom of the arrangement of the housing.Multiple radiation fins 16 are provided at a heat sink 23, and the width is large at a base of...  
JP2012057836
To efficiently circulate a heat medium, in an underground heat exchanger for performing heat collection from soil.The underground heat exchanger is provided with: an underground heat exchanging part (21) which is formed in a pipe shape, ...  
JP2012057902
To provide a cooling device capable of further reducing power consumption in comparison with the prior arts.A cooling device 20 has a heat intake part 21 and a heat radiation part 31. The heat intake part 21 has: a reservoir pipe 22 for ...  
JP2012057841
To solve the problem of not capable of coping with miniaturization and enhancing of performance, which being requested lately, of a heat pipe, relating to a conventional wick structure for a heat pipe which is composed of a groove about ...  
JP2012052734
To provide a heat pipe in which the temperature of fluid upon discharging from the heat pipe hardly increases or decreases compared with temperature upon flowing into the heat pipe, and to provide a temperature control system using the h...  
JP2012049497
To provide a charge module with a heat sink that can have a larger heat dissipation area by insertion of a heat pipe at a side surface of the heat sink by extending a fan cover on the side surface of the heat sink.A charge module for cha...  
JP2012042115
To provide a loop-type heat pipe excellent in stable operation and heat transport capacity and an electronic equipment having the same.The loop-type heat pipe includes: an evaporation part for evaporating an operating fluid by receiving ...  
JP2012037098
To provide a loop heat pipe that facilitates installation of wicks overlapping in the radial direction.In this loop heat pipe, an evaporator 101 includes: an evaporator body 103 for evaporating working fluid; a liquid reservoir part 111 ...  
JP2012037097
To provide a loop heat pipe capable of further stable liquid transport.This loop heat pipe includes an evaporator 101 for evaporating working fluid by absorbing heat from the outside. In the loop heat pipe for condensing the working flui...  
JP2012037197
To prevent an oil from entering the steam even if a heat exchanger for generating steam is damaged, relating to a steam generator that uses a heat pump in which the oil of a compressor may enter the circulation path of refrigerant of the...  
JP2012026721
To provide a cooling device having a high stability of operation and superior cooling performance, by controlling a rapid increase of temperature and a dry-out at an initial stage of heating, while maintaining a high performance of heat ...  
JP2012026723
To provide a heat dissipation system carrying out convection by thermal actuation of a natural thermo carrier to reduce installation costs and operation costs.A device is configured so as to carry out convection by thermal actuation by d...  
JP2012021698
To improve radiation efficiency by devising a shape of a radiation fin and a position of a heat pipe.The radiation fin 1 includes: a radiation opening 11 formed on the center of the same; heat pipe insertion holes 12 formed around the ra...  
JP2012017850
To minimize energy loss and increase refueling efficiency in hydrogen refilling systems.In an apparatus, compression heat of refueling of an on board vehicle tank is evacuated from the interior of the on board tank by a heat absorber wit...  
JP2012013277
To provide a heat sink capable of suppressing the heat resistance of a heat-receiving portion and a heat-radiating portion of a heat pipe to be low.The heat sink includes a heat-receiving block 2, one or a plurality of first holes 11 for...  
JP2012013263
To provide a heat dissipation device that achieves a fall of heat resistance, reduction of manufacturing cost, and simple assembly, and a method of manufacturing the same.The heat dissipation device 1 includes a heat dissipating unit 11 ...  

Matches 1,051 - 1,100 out of 6,922