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JP2010249424 |
To efficiently recover heat of exhaust while minimizing a fluid filling amount, in an exhaust heat recovery device 1 having a loop-type heat pipe structure to arbitrarily increase a temperature of a heated object 56 by recovering the hea...
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JP2010245531 |
To provide a heat dissipation device for cooling electronic components, and to provide fasteners thereof.Each of the fasteners 60 includes a connecting portion 62, and a first operating portion 64 extending from the connecting portion an...
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JP2010243036 |
To provide a heat transport device capable of efficiently performing heat transport.The heat transport device includes a working fluid, an evaporation portion, a condensation portion, and a flow path portion. The heat transport device fu...
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JP2010243035 |
To provide a heat transport device capable of efficiently performing heat transport, an electronic apparatus including the heat transport device and a highly reliable method of manufacturing the heat transport device facilitating manufac...
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JP2010245451 |
To provide a heat radiating unit for electronic apparatus which saves an installation space, lowers thermal resistance at transferring the heat, and in addition, can be produced by a simple manufacturing method and at a low cost, and to ...
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JP2010237767 |
To improve efficiency of the detaching operation of a heat pipe.An electronic apparatus includes: a body 4; a circuit board 14 housed in the body 4; a heating body 22 mounted on the circuit board 14; a heat pipe 32 having an end portion ...
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JP2010238805 |
To provide an electronic apparatus cooling device in which cost in operation is reduced.The electronic apparatus cooling device includes a cabinet 12 which is installed in outdoor and accommodates an electronic apparatus 11, and an evapo...
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JP2010236792 |
To provide an ebullient cooling device properly forming the flow of refrigerant vapor in a container.In this ebullient cooling device 10 including a refrigerant storing section 12 for storing a liquid refrigerant receiving heat of a heat...
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JP2010230276 |
To cool a heating element within a prescribed temperature range by efficiently cooling the heating element even when a heating value of the heating element is low, and a target temperature to keep the temperature of the heating element w...
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JP2010223463 |
To provide an evaporative cooling device capable of controlling a flow of a liquid refrigerant in a boiling part and cooling the liquid refrigerant in the boiling part immediately after generation of air bubbles.In the evaporative coolin...
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JP2010216676 |
To provide a cooling substrate having a flow passage capable of reducing a pressure loss in the flow passage by relatively increasing the cross sectional area of the flow passage at a heat transport side, and suppressing the generation o...
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JP2010216712 |
To provide a heat pipe capable of suppressing generation of dryout and enhancing heat transfer capacity.The heat pipe includes: a cylindrical container (10) of which longitudinal direction is a direction for transferring heat; working fl...
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JP2010216801 |
To provide a laminate effective for a condenser, a heat exchanger, and other components of a heat transmitting and (or) power system or a chemical treatment system.A microcomponent sheet architecture wherein macroscale unit processes are...
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JP2010210193 |
To provide a cooling device of a data center capable of cooling a cooled section by taking out cold storage heat.This cooling device 5 of the data center 1 includes a cold storage heat accumulating section 6 for accumulating soil 6a or w...
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JP2010212623 |
To provide a cooling device being capable of efficiently transferring a heat from a heating element at the place of a heat dissipation while being a small size and a thin type.The cooling device 1 includes: a heat diffuser 3 diffusing th...
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JP2010203672 |
To provide a pipe heater device and method of installing the same, reducing a welding process requiring accuracy, enabling careful temperature control corresponding to a place after installation, requiring no large-scale facilities such ...
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JP2010203732 |
To reduce pressure loss of exhaust while performing the setting to efficiently recover exhaust heat, in an exhaust heat recovery device 1 of a loop type heat pipe structure for increasing a temperature of a prescribed area by recovering ...
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JP2010196999 |
To provide a supporting structure of an ebullient cooling device in a moving body capable of preventing insufficient cooling of a heating element even when the moving body is inclined to a horizontal face.In this supporting structure of ...
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JP2010196912 |
To provide an ebullient cooling device preventing freezing of a liquid refrigerant and of suppressing the occurrence of burn out.The ebullient cooling device 1 includes a storage part 2 for storing therein the liquid refrigerant receivin...
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JP2010190453 |
To obtain a gas liquid filling device capable of accurately filling working fluid and non-condensable gas within a heat pipe and having good manufacturing efficiency.The gas liquid filling device includes: a working fluid supply part 52;...
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JP2010185599 |
To provide a heat exchanger capable of being easily installed, and achieving piping work and heat exchanging capacity as designed.This heat exchanger 100 for transferring and receiving heat between the ground and the water, has a pipe 1 ...
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JP2010181057 |
To provide a sealed pipe and a method of sealing a thin pipe, free from defect as a sealing part is wholesome even though the pipe is thin.On an outer peripheral part of a part to be sealed 1b of a pipe 1 having a plurality of grooves 1a...
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JP2010169371 |
To provide a cylindrical heat pipe with a high manufacturing yield and capable of obtaining an excellent heat transfer characteristic for a long period, a heating/uniformly-heating roller using it, a thread winding device or an fixing de...
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JP2010169283 |
To provide a heat exchange system having high reliability for a long period and capable of transporting heat in both directions.In this heat exchange system in which working fluid is enclosed in a loop flow channel installed in a sealed ...
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JP2010168860 |
To provide a fuel-solidification preventive device of a construction machine capable of suppressing a generation of waxy oil content in a fuel, that is, suppressing a generation of fuel-solidification.A fuel-solidification preventive dev...
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JP2010169379 |
To provide a method of manufacturing an inexpensive thermal transport device which is efficiently manufactured in the small number of processes.In the method of manufacturing the thermal transport device, a capillary member 5 with its th...
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JP2010121791 |
To provide an ebullient cooling apparatus capable of preventing freezing of liquid refrigerant and suppressing generation of burnout.This ebullient cooling apparatus 1 includes a receiving section 2 for receiving the liquid refrigerant r...
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JP2010121867 |
To provide a heat spreader capable of obtaining high heat radiation effects without increasing the size, electronic equipment including the heat spreader, and a method of manufacturing the heat spreader enabling easy and inexpensive manu...
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JP2010121795 |
To provide a heat pipe of which through-holes existing on both end closing walls of a container are surely closed.This heat pipe 1 includes the tubular container 3 closed at both ends by closing walls 6 of which a diameter is reduced tow...
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JP2010122887 |
To provide a server device with cooling capacity capable of coping with increase in heat generated by a CPU of a server module attachable and detachable to and from a blade server.A server module includes an enclosure accommodating there...
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JP2010116622 |
To provide a ferritic stainless steel for the heat pipe of a high temperature waste heat recovery device.The ferritic stainless steel has a composition comprising, by mass, 16 to 32% Cr, 0.03% C, 0.03% N, 3% Si, 2% Mn, 0.008% S and 0 to ...
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JP2010112656 |
To advantageously closely attach and join a heat pipe to a heat transfer member easily and positively.In this joining method for joining the heat pipe 1 to a groove 3 of the heat transfer member 2, the groove 3 is formed on a flat face 2...
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JP2010107093 |
To provide a heat storage device for a vehicle effectively storing heat with a simple constitution and effectively utilizing exhaust heat by keeping a proper temperature.This heat storage device for the vehicle includes a heat storage se...
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JP2010107153 |
To suppress refrigerant backflow without installing an additional check valve etc. and increase heat transport amount.This evaporator includes: a refrigerant supply portion 13 storing refrigerant liquid made to flow in from a liquid pipe...
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JP2010096495 |
To provide a combined cycle power generation plant capable of improving efficiency by improving heat transfer in HRSG (heat recovery steam generator).This combined cycle power generation plant 10 includes a gas turbine 12, a steam turbin...
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JP2010096405 |
To provide a heat pipe capable of bringing about efficient capillarity by air gaps and minimizing a gap between the heat pipe and a heat pipe container inner wall face.The heat pipe includes a monolith type porous body having a three-dim...
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JP2010098063 |
To provide an in-building cooling mechanism which efficiently cools OA equipment installed in various positions in a building without using pumps.The in-building cooling mechanism 10 for cooling an OA equipment room 41 wherein OA equipme...
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JP2010091257 |
To provide a method for manufacturing a heat pipe in which an evaporating section of a heat pipe is leveled by a multi-step press work process dispensing with frequent changes of pressing dies.In a first step S1, at least one heat pipe 1...
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JP2010079406 |
To provide a blade server equipped with a cooling structure on which a high performance CPU is mounted.A groove is formed in a direction almost in parallel with a tube axial direction on the internal surface of a tube, and the cross-sect...
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JP2010078161 |
To provide a heat exchanger 1 for cooling capable of efficiently exhausting heat with a simple structure.In this heat exchanger 1 for cooling, a columnar ventilation passage 3 is formed, a plurality of heat collection fins 5 are disposed...
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JP2010078259 |
To provide an evaporator for a micro loop heat pipe with suppressed thickness.An interior of the evaporator 3 is partitioned by a bulkhead part 13 comprising a porous member, one partition is used as a reservoir part 14, another partitio...
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JP2010079401 |
To provide a new cooling system for optimally cooling a heating element including the semiconductor device of a freely attachable/detachable CPU blade in electronic equipment including a blade server.The cooling system is configured of: ...
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JP2010079402 |
To provide a cooling system for efficiently transporting heat from a heating source such as a CPU in electronic equipment such as a blade server, and its saturated water pump.The cooling system of electronic equipment such as a blade ser...
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JP2010072904 |
To obtain electronic equipment equipped with a heat transport member for improving thermal conduction efficiency between a plurality of heating components.Electronic equipment 1 includes: first and second heating components 11 and 12; a ...
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JP2010065879 |
To provide a heat pipe capable of reducing thermal resistance and increasing critical heat transport amount.In the heat pipe, working fluid comprising a mixture of HFC-134a and HFE-347pc-f is filled in a container. A mixing ratio between...
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JP2010059960 |
To implement a temperature rise promoting process for a catalyst 5 provided in an exhaust path 4 of an internal combustion engine 1, and a temperature rise promoting process for cooling water for the internal combustion engine 1, as need...
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JP2010060164 |
To provide a heat pipe type heat sink capable of securing normal operation of a heat pipe even under a low-temperature environment, and saving a space while exerting high cooling performance.This heat pipe type heat sink 10 is constitute...
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JP2010060243 |
To provide a heat pipe and electronic device, efficiently cooling a light emitting element disposed at the end, so that the heat pipe can be efficiently mounted on the electronic device in a narrow space.This heat pipe includes: an upper...
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JP2010060206 |
To improve heat transfer performance of an aluminum heat pipe by removal of non-condensive gas.By contacting and fitting gaseous hydrogen removal members 6 into a plurality of portions of an inner wall surface 7 of a condensing part 4, i...
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JP2010054103 |
To provide a heat treatment device capable of suppressing wasteful energy consumption.This heat treatment device 1 employs a heat pipe structure, and comprises a heat treatment plate 11 of a hollow structure, and a cooling plate 51 for c...
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