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WO/2006/065387A1 |
The invention provides methods, apparatus and systems in which there is partial boiling of a liquid in a mini-channel or microchannel for a length of at least 15cm. The partial boiling removes heat from an exothermic process.
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WO/2006/059622A1 |
A magnetic convection heat circulation pump, wherein magnets are disposed inside a magnetic filed flow passage for passing a magnetic fluid therein or on a part of the inner wall surface of a circulation flow passage in a magnetic pump t...
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WO/2006/059623A1 |
A forced convection heat transfer apparatus wherein a large quantity of heat can be efficiently transferred even when a temperature difference is small, by transmitting power to a magnet, which is rotatable along a circulation flow path ...
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WO/2006/058494A1 |
A heat transfer device includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure.
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WO/2006/055097A1 |
An apparatus for vaporizing a liquid and heating the vaporized liquid to an elevated temperature. The apparatus has a heat transfer wall having an outer surface for receiving heat and transferring the heat to an inner surface. A wick mat...
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WO/2006/053452A1 |
The invention relates to an insulating hollow body (5) for a cooling high-voltage loadable element. During the operation of said cooling element in an installation, said hollow body (5) forms an electric insulating section (1) and pours ...
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WO/2006/054015A2 |
The invention concerns a heat exchanger (4) for a combustion oven, said exchanger comprising a heat exchanging zone (2) provided with means for the passage of hot fumes derived from a burner of the oven, said zone being traversed by at l...
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WO/2006/029324A2 |
An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device furth...
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WO/2006/025852A2 |
A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high po...
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WO/2006/023737A2 |
One embodiment of the system is implemented as a device for two-phase heat transfer. This device comprises a chamber containing a fluid, where a heated wall makes up a portion of the chamber. The device also comprises an actuator that em...
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WO/2006/019219A2 |
A coolant phase changeable cooling apparatus using a capillary action is provided. The cooling apparatus prevents a generation of bubbles inside a wick of an evaporator (100) or an inverse flow of a vaporized gaseous coolant through a wi...
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WO/2006/017579A2 |
A high energy transport gas and a method to transport the high energy transport gas are used to increase the energy content of a pipeline and other vessels that are designed to carry natural gas under ambient conditions, in a compressed ...
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WO/2006/016293A1 |
The present invention relates to a cooling system for an electronic substrate comprising a heat transfer fluid (4, 10). The heat transfer fluid (4, 10) is arranged to flow along a path (5, 11, 12) by capillary force.
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WO/2006/014288A1 |
A heat pipe is disclosed comprising an elongated hollow housing having a condenser end and an evaporator end. A corrugated wick is disposed within the housing. The wick comprises a plurality of wedge-shaped capillaries extending from the...
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WO/2006/010541A1 |
A thermosiphon comprising a tight container (1) containing a heat carrying substance partially as a liquid, partially as vapor, and a heat sink (5) arranged on a first wall (4) of the container (1). Capillary lines are provided on the in...
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WO/2006/010538A1 |
A refrigerating device comprising a dual-walled container (1), wherein an inner wall (4) thereof defines an inner area (2) for receiving an object that is to be refrigerated and a cavity (6), which is surrounded by an outer wall (5), is ...
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WO/2006/007721A1 |
The present invention relates to hybrid wicking materials for use in high performance heat pipes and other fields where a bi-modal distribution of pore sizes offers advantages over a homogeneous monolithic porous structure. In one aspect...
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WO/2006/009267A1 |
In a heat sink (1), heat pipes (3) are arranged from a high temperature part to low temperature parts (B) in different directions, on one high temperature part (A) of a base board (2) whereupon a heating element (4) is provided.
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WO/2006/007163A1 |
A heat dissipating device (100). The heat dissipating device comprises a receptor plate (102) to be placed over a device that generates heat, an evaporator (106) coupling to the receptor plate (102), a condenser column (108) placed in fl...
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WO/2006/000205A2 |
The invention relates to a thermal energy discharge device comprising a coolant circuit, a heat exchanger wherein thermal energy is transferred to the coolant, also comprising a coolant pump for pumping coolant through the heat exchanger...
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WO/2006/001980A2 |
Steady-state cooling of the skin is achieved by a support surface without requiring external power or circulation of air. Heat is transferred from via a thermally conductive layer or layers of material(s) that are soft, pliable, and comf...
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WO/2005/124256A1 |
A metal hydride heat pump (10) comprising a first compartment (18), including a first fluid inlet (32) and a first fluid outlet (34), wherein the first fluid inlet (32) is configured for fluid communication with the first fluid outlet (3...
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WO/2005/124257A1 |
A heat transfer assembly for transferring heat from a heat generating device (5) to a circulating fluid, said heat transfer assembly comprising - an evaporator device (3) having at least one microchannel (1) formed therein, in thermally ...
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WO/2005/125296A1 |
A cooling device to which an electric circuit may be mounted includes a cooling body provided with a front edge having bores forming V-shaped channels inside the body. Intersecting V-shaped channels are closed by plugs to thereby define ...
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WO/2005/114084A1 |
A heat pipe (10) with superior heat transfer between the heat pipe (10) and the heat source and heat sink (16) is provided. The heat pipe (10) is held tightly against the heat source by mounting holes (12) which penetrate the structure o...
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WO/2005/114061A2 |
A heat transfer system (100) comprising a primary heat exchanger (102) for receiving heat from a heat source (104); a secondary heat exchanger (106) for exhausting heat to a heat sink (108); a conduit (110) connecting the primary heat ex...
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WO/2005/108897A2 |
A capillary structure (90) for a heat transfer device, such as a heat pipe is provided having a plurality of particles including a first species (71) having a first diameter and a second species (73) having a second diameter that are joi...
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WO/2005/100897A1 |
A heat transport apparatus, a method of manufacturing the heat transport apparatus, and electronic equipment on which the heat transport apparatus is mounted. In the heat transport apparatus, since a heat absorbing base plate (2) and a c...
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WO/2005/098335A2 |
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant...
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WO/2005/098336A1 |
An evaporator is formed, having an inflow opening from which a liquid or substantially liquid refrigerant flows in, heat exchanging piping for evaporating the refrigerant, and an outflow opening from which the refrigerant flows out. The ...
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WO/2005/098338A1 |
A thermal transfer device (20) comprises a housing having a base assembly (23) and a cover (22). The base assembly (23) comprises a thermal transfer base (25) and a fluid-porous, thermally conductive mesh structure (26). The thermal tran...
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WO/2005/094224A2 |
A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sec...
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WO/2005/086615A2 |
A cryogenic receiver front-end includes a heat sink having a mounting surface and a plurality of fins, a cryocooler mounted to the mounting surface of the heat sink, a heat rejector surrounding the cryocooler, the heat rejector including...
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WO/2005/083345A1 |
A flexible loop thermosyphon (50) is provided having a flexible, hermetic, outer tube (86) and a flexible, non-hermetic, inner tube, (85) positioned concentrically within the outer tube, forming an annulus between the outer tube and inne...
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WO/2005/081812A2 |
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...
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WO2004040218A9 |
A system includes a heat transfer system (105) and a priming system (110) coupled to the heat transfer system. The heat transfer system includes a main evaporator (115) having a core (135), a primary wick (140), and a secondary wick (145...
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WO/2005/071747A1 |
A heat pipe radiator of heat-generating electronic component comprises a tubular housing and flow channel having tubular thin wall mounted within the tubular housing. The edge of tubular housing and flow channel are hermetically connecte...
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WO/2005/063566A2 |
With a cooling system for expelling heat from a heat source (30) located in the interior of an aircraft to a heat reducer (32), with a piping system (10) sealed against the surrounding atmosphere which is thermally coupled to a heat inta...
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WO/2005/054766A1 |
The heat pipe radiator (10) is intended to be included into a heating system of the kind comprising a heat source arranged internally or externally to the radiator itself, a conduit (11) containing a heat carrier fluid which is heated by...
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WO/2005/055319A2 |
The present invention relates to a closed system for cooling without moving mechanical parts and at a low noise level, one or more heat-emitting elements. The system comprises a first heat-receiving part that is adapted to receive heat f...
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WO/2005/045134A1 |
According to the invention, a railway installation (11) is heated by a heat source with the aid of at least one heating pipe (1) that is filled with a working fluid. Said working fluid is heated by means of the heat source in the vicinit...
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WO/2005/043059A2 |
A method of making an evaporator (115) includes orienting a vapor barrier wall (117) , orienting a liquid barrier wall (135) , and positioning a wick (145) between the vapor barrier wall and the liquid barrier wall. The vapor barrier wal...
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WO/2005/038859A2 |
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implemen...
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WO/2005/038860A2 |
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implement...
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WO/2005/036075A2 |
The inventive device for cooling electronic device components comprises coolers disposed on the cooled electronic device components, a remote radiator and a heat pipe. Said heat pipe consists of four sections embodied in the form of heat...
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WO/2005/031238A1 |
Disclosed is a flat plate heat transfer device, which includes a thermal-conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid which is evaporated with absorbing heat from the heat s...
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WO/2005/024331A1 |
A loop type thermo siphon (100A), comprising a closed circuit having evaporators (110), a condenser (130A), feed tubes (120), and return tubes (140). The condenser (130A) further comprises an assembly having a feed tube side main tube (1...
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WO/2005/022052A1 |
A two-phase cooling apparatus for cooling an electronic assembly is disclosed. The apparatus comprises an evaporator (40) having a single-phase inlet (22) for receiving a single-phase liquid coolant and a two-phase outlet for discharging...
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WO/2005/019755A1 |
A geothermal heat collector for heat pumps and of the type having a heat conducting fin (18) which communicates at its conducting surface (18a) with the surface of the earth (14). A heat transfer fluid flows through the fin by way of a c...
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WO/2005/015104A2 |
A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular en...
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