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Patent Searching and Data


Matches 101 - 150 out of 967

Document Document Title
WO/2011/089189A3
The invention relates to a guide disc assembly (40) for a heat exchanger (10), to a heat exchanger (10) using a guide disc assembly (40), to a production method for a heat exchanger (10), and to a retrofitting kit for retrofitting a heat...  
WO/2011/066011A1
A heat exchanger includes a heat-exchange section including a first group of tubes and a second group of tubes alternating with the first group of tubes. The first and second groups of tubes are in contact with a heat-conductive medium. ...  
WO/2011/028389A2
According to one embodiment, a heat transfer device includes an array of elongated pins coupled between a base plate and a cover plate. Each pin has a cross - sectional shape with a major width and a minor width that is perpendicular to ...  
WO/2011/006858A1
Radiation heating apparatus composed of a heat pump operating by a reverse refrigeration cycle and comprising radiant heat exchangers to the environment which are composed of a high thermal conductivity material such that they transfer h...  
WO/2011/008467A1
An anisotropic thermal conductive element that can conduct heat from a thermal source with high efficiency in the thickness direction which maintaining strength and a method of making the element. To achieve the above, an anisotropic the...  
WO/2010/147871A2
An inexpensive heat exchanger is disclosed, wherein the heat exchanger is made up of a plurality of plates and each plate has at least one channel defined in the plate. The plates are stacked and bonded together to form a block having co...  
WO/2010/147871A3
An inexpensive heat exchanger is disclosed, wherein the heat exchanger is made up of a plurality of plates and each plate has at least one channel defined in the plate. The plates are stacked and bonded together to form a block having co...  
WO/2010/141368A3
A honeycomb reactor or heat exchanger (12) includes a honeycomb (20) having a plurality of cells (22, 24) extending in parallel along a common direction from a first end (14) to a second end (16) thereof, with the cells being divided by ...  
WO/2010/141368A2
A honeycomb reactor or heat exchanger (12) includes a honeycomb (20) having a plurality of cells (22, 24) extending in parallel along a common direction from a first end (14) to a second end (16) thereof, with the cells being divided by ...  
WO/2010/141366A3
Methods and devices for providing a honeycomb monolith reactors 12 or heat exchangers 12 having improved pressure resistance are disclosed, including the method of (1) providing a honeycomb monolith 20 having a plurality of cells 22, 24 ...  
WO/2010/141366A2
Methods and devices for providing a honeycomb monolith reactors 12 or heat exchangers 12 having improved pressure resistance are disclosed, including the method of (1) providing a honeycomb monolith 20 having a plurality of cells 22, 24 ...  
WO/2010/132302A2
A heat exchanger may include a core control assembly movable between compressed and uncompressed positions, and a core. The core may have a plurality of layers with a plurality of passages interleaved therebetween, a portion of the passa...  
WO/2010/132302A3
A heat exchanger may include a core control assembly movable between compressed and uncompressed positions, and a core. The core may have a plurality of layers with a plurality of passages interleaved therebetween, a portion of the passa...  
WO/2010/090766A1
The invention is for an apparatus and method for removal of waste heat from heat-generating components including high-power solid-state analog electronics such as being developed for hybrid-electric vehicles, solid-state digital electron...  
WO/2010/056792A1
In one aspect, a cooling device (10) for an LED chip (18) mounted on a heat sink (16) includes an enclosed tube in contact with the heat sink (16). The tube includes a vacuum section (12) having a plurality of cooling fins (22) and a liq...  
WO/2010/042985A1
A thermal storage device (1) including an insulated casing (2) surrounding a tank (3) for holding a fluid, the tank having an inlet port (4) and an outlet port (8) with a fluid flow path there between, the inlet port (4) being connectabl...  
WO/2010/037164A1
A heat exchange unit (102) for use in a modular heat exchange system including at least one first heat exchanger (104) having a closed circuit for cooling fluid at least one air cooler (112) located upstream of the first heat exchanger, ...  
WO/2010/037165A1
A heat exchange system (100) including at least one first heat exchanger having a closed circuit for cooling fluid, a least one fan arrangement (110) operable to cause air to pass through the first heat exchanger, and, at least one air c...  
WO/2010/017091A1
A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling cool...  
WO/2010/011687A2
Heat exchanger plates (6) for indirect evaporative coolers, of the type having a dry side (9) having low permeability to an evaporative liquid (22) and formed to allow a product fluid (1) to flow over a heat transfer area of its surface,...  
WO/2010/008423A2
Systems include one or more medicinal storage containers. For example, an integrally thermally sealed medicinal storage container may include one or more segments of at least one ultra efficient insulation material, the one or more segme...  
WO/2009/132430A1
There is described a method for fabricating a modular heat sink, the method comprising: extruding N individual integral heat sink segments using an extrusion process, each one of the N segments corresponding to 1/N of the modular heat si...  
WO/2009/117062A2
In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements provided for transferring heat across the ends of the thermoelectric device. A method for...  
WO/2009/085291A1
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation with coolant.  
WO/2009/076835A1
A cooling package and an assembly method and a disassembly method thereof are provided. The cooling package includes: a main frame (100) with a first end and a second end, a first tank (11) supported by the first end of the main frame (1...  
WO/2009/073165A1
A cooling device for an electric component or components, includes a coolant liquid circulation system, a carbon-based heat intake block for transferring heat from said electrical component or components, a top layer on the carbon block ...  
WO/2009/049317A2
A direct exchange geothermal heating/cooling system (40) has a self-adjusting expansion valve (1) disposed in a liquid refrigerant transport line (8) and a bypass flow path (2 or 11) to improve efficiency when the system (40) operates in...  
WO/2009/049317A3
A direct exchange geothermal heating/cooling system (40) has a self-adjusting expansion valve (1) disposed in a liquid refrigerant transport line (8) and a bypass flow path (2 or 11) to improve efficiency when the system (40) operates in...  
WO/2009/021069A1
A conductive adapter for carrying relatively high current from a source to an external circuit without degradation is provided. The adapter includes a conducting member made from a conductive nanostructure -based material and having oppo...  
WO/2009/008836A1
A heat transfer device for maintaining a temperature of a device under test with heat generating capability at a prescribed temperature, the heat transfer device comprising an inlet flow-duct; an outlet flow-duct; a conductor block compr...  
WO/2009/003817A3
A heat exchanger for a boiler, comprising, within a monolithic structure, at least one pair (2, 3; 4, 5; 6, 7) of mutually opposite manifolds connected by perforated pins (8, 9; 10, 11; 12, 13) inserted within a portion of space which is...  
WO/2008/153989A1
A plasma-driven cooling device generates and drives a plasma-driven gas flow to cool down electronic devices. The plasma-driven cooling device comprises electrodes, dielectric pieces, and heat sink fins. The voltages applied on the elect...  
WO2008063372B1
A fluid-cooled heat sink (1) for electronic components comprises a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet ...  
WO/2008/144856A3
Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances, formed from a housing (7), specially developed along one of the faces (6) of the cabinet (4) for electric-e...  
WO/2008/137727A1
The modular heated cover is disclosed with a first pliable outer layer and a second pliable outer layer, wherein the outer layers provide durable protection in an outdoor environment, an electrical heating element between the first and t...  
WO/2008/137726A1
The grounded modular heated cover is disclosed with a first pliable outer layer and a second pliable outer layer, wherein the outer layers provide durable protection, an electrical heating element between the first and the second outer l...  
WO/2008/135321A1
This invention relates to a heat exchanger (1) having channels/ducts (3, 3', 4, 4') for the exchange of heat between two fluids, comprising at least one extruded longitudinal central body (2) which at least partly forms the channels/duct...  
WO/2008/112013A1
Carbon nanotube (CNT) arrays can be used as a thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance (PSTTR) technique, the thermal conductance of the two interfaces on either side of the CNT arrays can ...  
WO/2008/097557A2
A liquid cooling block consisting essentially of carbon for use with electric devices generating heat, comprising in combination; the cooling block contains grain in substantially normal orientation to the heat transfer surface between t...  
WO/2008/077216A3
An air conditioner includes alignment features to hold a partition and a top cover in a desired relative position prior to installation of a fastener. The top cover is held in place prior to installation of the fasteners by alignment fea...  
WO/2008/079593A3
A method of using a minimal surface or a minimal skeleton to make a heat exchanger component is provided. The method comprises the steps of generating a stereolithography file from design data, slicing the stereolithography file into two...  
WO/2008/079593A2
A method of using a minimal surface or a minimal skeleton to make a heat exchanger component is provided. The method comprises the steps of generating a stereolithography file from design data, slicing the stereolithography file into two...  
WO/2008/079679A3
In one embodiment, a method of making a heat exchanger is provided, comprising the steps of generating a stereolithography file from design data, slicing the stereolithography file into two-dimensional patterns, and depositing at least o...  
WO/2008/079679A2
In one embodiment, a method of making a heat exchanger is provided, comprising the steps of generating a stereolithography file from design data, slicing the stereolithography file into two-dimensional patterns, and depositing at least o...  
WO2007095044B1
An electrical circuit element on an electrical element package is cooled by structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with the electrical circuit element, and a rot...  
WO/2008/067434A2
An apparatus, system, and method for electronic cooling unit with unique features is disclosed. In representative embodiments and applications, the present invention generally provides improved methods and systems for cooling electronic ...  
WO/2008/063372A8
A fluid-cooled heat sink (1) for electronic components comprises a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet ...  
WO/2008/063372A3
A fluid-cooled heat sink (1) for electronic components comprises a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet ...  
WO/2008/060305A3
A cooling system has one or more fans disposed within a housing adapted to attach to a consumer electronics device. The cooling system can also include a switch, a male connector and a female connector adapted to interface with the consu...  
WO/2008/060305A2
A cooling system has one or more fans disposed within a housing adapted to attach to a consumer electronics device. The cooling system can also include a switch, a male connector and a female connector adapted to interface with the consu...  

Matches 101 - 150 out of 967