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Patent Searching and Data


Matches 151 - 200 out of 972

Document Document Title
WO/2008/137726A1
The grounded modular heated cover is disclosed with a first pliable outer layer and a second pliable outer layer, wherein the outer layers provide durable protection, an electrical heating element between the first and the second outer l...  
WO/2008/135321A1
This invention relates to a heat exchanger (1) having channels/ducts (3, 3', 4, 4') for the exchange of heat between two fluids, comprising at least one extruded longitudinal central body (2) which at least partly forms the channels/duct...  
WO/2008/048493A3
A thermal management device (401) is provided which comprises a synthetic jet actuator (403) and a heat sink (405) comprising a fin (407). The fin has at least one interior channel (409) defined therein which has first and second opening...  
WO/2008/079593A3
A method of using a minimal surface or a minimal skeleton to make a heat exchanger component is provided. The method comprises the steps of generating a stereolithography file from design data, slicing the stereolithography file into two...  
WO/2007/146281A3
A biogas treatment system (10) removes moisture and other unwanted materials from biogas originating, for example, with a landfill or anaerobic digester. Water and other unwanted materials are thus removed from landfill gas and waste wat...  
WO/2008/063372A3
A fluid-cooled heat sink (1) for electronic components comprises a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet ...  
WO/2007/081617A3
A microchannel heat sink is manufactured from graphite materials. A heat sink member (300) has at least a first thermal contact surface (308) for making thermal contact with an electronic device (312). The heat sink member is constructed...  
WO/2008/112013A1
Carbon nanotube (CNT) arrays can be used as a thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance (PSTTR) technique, the thermal conductance of the two interfaces on either side of the CNT arrays can ...  
WO/2007/001726A3
An image display device (10) comprising an image display panel, a frame system including a framework operatively engaging the image display panel and a plurality of electronic components operatively engaging the framework, heat dispersio...  
WO/2008/097557A2
A liquid cooling block consisting essentially of carbon for use with electric devices generating heat, comprising in combination; the cooling block contains grain in substantially normal orientation to the heat transfer surface between t...  
WO/2008/079679A3
In one embodiment, a method of making a heat exchanger is provided, comprising the steps of generating a stereolithography file from design data, slicing the stereolithography file into two-dimensional patterns, and depositing at least o...  
WO/2007/089865A3
A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises in...  
WO/2008/079593A2
A method of using a minimal surface or a minimal skeleton to make a heat exchanger component is provided. The method comprises the steps of generating a stereolithography file from design data, slicing the stereolithography file into two...  
WO/2008/079679A2
In one embodiment, a method of making a heat exchanger is provided, comprising the steps of generating a stereolithography file from design data, slicing the stereolithography file into two-dimensional patterns, and depositing at least o...  
WO2007095044B1
An electrical circuit element on an electrical element package is cooled by structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with the electrical circuit element, and a rot...  
WO/2008/030745A3
In one embodiment, an apparatus includes a monolithically formed thermal conducting body that includes a passageway that extends from a first end to a second end of the body. At least one of the first end or the second end of the body is...  
WO/2008/067434A2
An apparatus, system, and method for electronic cooling unit with unique features is disclosed. In representative embodiments and applications, the present invention generally provides improved methods and systems for cooling electronic ...  
WO/2008/060305A2
A cooling system has one or more fans disposed within a housing adapted to attach to a consumer electronics device. The cooling system can also include a switch, a male connector and a female connector adapted to interface with the consu...  
WO/2008/053090A1
The invention relates to a heat exchanger with an extruded body (3), comprising a tubular housing (4) with open ends (4.1, 4.2) and internal walls (5, 9) running parallel from one end of the housing to the other and defining open channel...  
WO/2008/053092A1
The invention relates to a heat exchanger, comprising a body (3) defining a central channel (7), surrounded by peripheral channels (10) and having ends provided with means for defining independent circuits arranged such that the central ...  
WO/2008/053093A1
The invention relates to a regulator valve (2) for a heat exchanger (1), comprising a valve body (21), provided with means (30) for mounting the same on the heat exchanger and a valve (26) movably mounted in the body facing a seat (25) f...  
WO/2007/095044A3
An electrical circuit element on an electrical element package is cooled by structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with the electrical circuit element, and a rot...  
WO/2007/133853A3
A device housing (105) and a method (500) of manufacturing the same. The method can include positioning within a mold (300) an insert (205) of thermally conductive film (210). For example, graphite film can be positioned within the mold....  
WO/2008/051535A2
An apparatus enhances the efficiency of a combustion heating device such as a fireplace by incorporating an ionic gas propulsion mechanism (e.g., a corona discharge device) to transport ambient air through a heat exchanger. A heat exchan...  
WO/2008/047096A1
A heat exchanger is formed with tessellating conduits (4) passing therethrough. The tessellating conduits having transverse cross-sectional shapes which together substantially completely cover the transverse plane to the heat exchange (2...  
WO/2007/117446A3
An integrated pumping assembly includes a pump coupled to a heat exchanging device via a mounting plate. The mounting plate is sealed to the heat exchanging device. The heat exchanging device is any fluid-based heat exchanging device, su...  
WO/2008/033882A2
A brazable composite metal material for a heat exchanger tube or manifold, a method of making the tube or manifold, and a heat exchanger made therefrom. The method of making the heat exchanger tube includes the steps of (a) providing a c...  
WO/2008/030745A2
In one embodiment, an apparatus includes a monolithically formed thermal conducting body that includes a passageway that extends from a first end to a second end of the body. At least one of the first end or the second end of the body is...  
WO/2008/018868A1
A mounting structure (34) for receiving a sensor (18) having a sensing portion (26) and a base portion (30) includes a substantially flat sheet of material (20) having a first surface (20a), a second surface (20b) opposite the first surf...  
WO/2006/133211A3
A cooling surface for cooling an electronic component, the surface having two sets of fins, each set of fins defining a set of channels, and a number of passageways connecting the sets of channels. The cooling surface can be attached to ...  
WO/2006/026460A3
The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system....  
WO/2007/059425A3
Apparatus (100) for housing electronic equipment (215, 217, 219) including an outer cabinet (101), an inner container (103) inside the cabinet, a plurality of enclosed air passages (421, 423, 425, 427) between the cabinet and the contain...  
WO/2007/089869A3
The multi-layer tape wrapped tubing for effectively impeding the diffusion of vapor is made in a continuous in-line process and has three distinct layers: an inner tubing layer, a middle diffusion barrier layer and an outer jacketing lay...  
WO/2006/007488A3
A fluid-containing cooling plate includes a bottom plate (10), a top plate (30), and metal wire (20)or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire (30) is plated or otherwise coated with a b...  
WO/2004/083759A3
An apparatus and method of manufacturing an apparatus for circulating a cooling material within a heat exchanger is disclosed. The apparatus comprises a manifold layer and an interface layer. The interface layer comprises one or more nar...  
WO/2006/113218A3
A heat dissipation device with a fluid cavity that utilizes a hybrid of star pins with concave surfaces and sharp edges, and truncated dimples, which creates turbulence and a vortex phenomenon perpendicular to fluid flow transmission, an...  
WO/2007/022431A3
The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems, ...  
WO/2007/095044A2
An electrical circuit element on an electrical element package is cooled by structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with the electrical circuit element, and a rot...  
WO2004061901A8
A heat sink (100) for use with a heat generating device, that includes: a base member (110); a fixed set of adjacent heat dissipating surfaces (120) formed in the base member (110) for causing the heat sink (100) to have a predetermined ...  
WO/2005/081812A3
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...  
WO/2006/127094A3
A system and method for storing a product in a thermally stabilized state is disclosed. The system includes a thermally-conductive structure having at least an enclosed volume and an open section. The open section is configured to store ...  
WO/2006/029324A3
An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device furth...  
WO/2005/098335A3
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant...  
WO/2007/046853A2
The present invention provides methods and systems for discretized, combinatorial processing (110) of regions of a substrate such as f the discovery, implementation, optimization, and qualification of new materials, processes, and proces...  
WO/2006/028992A3
One embodiment of the cooling module is implemented as a device having a heat sink and an integrated synthetic jet actuator. The heat sink is configured to have a channel and a jet distribution system associated with the synthetic jet ac...  
WO/2007/042514A1
A heater is described which operates on the principle of convection air currents within heating fins being established by heating of air adjacent to one or more heating elements and the transfer of heat from the convection currents to th...  
WO2006071631B1
Apparatus for cooling of an electrical element package, comprising in combination: structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the ...  
WO/2006/025852A3
A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high po...  
WO/2007/024229A1
A thermoelectric system (10) for pumping heat having at least one foam heat exchanger (45) is provided that enhances heat transfer awayfrom the system (10) to increase overall system efficiency and performance of the system.  
WO/2006/125152A3
The present invention discloses a thermal laminate for dissipating heat generated in the vicinity of an installed PCMCIA card. The thermal laminate includes top film, middle gap filler and bottom layers. The top film layer provides a pro...  

Matches 151 - 200 out of 972