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Matches 201 - 250 out of 967

Document Document Title
WO/2006/064202A1
A heat exchanger may be manufactured using a number of different methods, each having their own benefits and deficiencies. A method of making a monolithic heat exchanger having a plurality of conduits passing through it is provided and c...  
WO2006022979A3
Heat exchanger fins and a method for fabricating fins particularly suitable for the head of Stirling engine. The fins have a frusto-conical contour and surround and are brazed to the heater head at axially spaced positions. The inner edg...  
WO/2006/052317A3
A heat exchanger includes a cooling plate having a heat collection surface for fixing against an object to be cooled, an opposed heat transfer surface which may be provided with fins, and a cooling chamber over the heat transfer surface,...  
WO2005100899A3
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions re...  
WO/2006/042190A3
In one embodiment, a cooling and heating system includes a heat exchanger, a thermoelectric cooler coupled to the heat exchanger and operable to cool or heat a fluid within the heat exchanger, a heat transfer device, an input conduit cou...  
WO/2006/033894A2
A heat riser (10) for bridging the gap between a heat source and a heat dissipation device in an electronic component, the heat riser formed of a flexible graphite article having two operative surfaces (10a, 10b), one of which is in oper...  
WO/2006/028992A3
One embodiment of the cooling module is implemented as a device having a heat sink and an integrated synthetic jet actuator. The heat sink is configured to have a channel and a jet distribution system associated with the synthetic jet ac...  
WO/2006/028787A1
An electrical apparatus that is cooled via natural convection includes an electrical component, a vertical heat dissipation surface in thermal communication with the electrical component, and a diverter extending from the heat dissipatio...  
WO/2006/029324A3
An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device furth...  
WO/2006/025852A3
A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high po...  
WO/2006/026460A2
The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system....  
WO/2006/026460A3
The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system....  
WO2005121508A3
A heat exchanger and method for making a heat exchanger including, forming an annular ring of a solid heat conductive mass, the annular ring having a central axis and having axially opposite faces. A plurality of passages are drilled thr...  
WO/2006/019767A1
An azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system. An azeotrope coolant is utilized within a two-phase thermal management system for thermally managing one or mor...  
WO/2006/017193A1
A packaging system, packaging method and method of depositing a thin layer of material at a desired location upon a substrate, and in particular a layer of thermally-conductive phase change material at the interface between a heat-dissip...  
WO/2006/007488A3
A fluid-containing cooling plate includes a bottom plate (10), a top plate (30), and metal wire (20)or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire (30) is plated or otherwise coated with a b...  
WO/2006/007488A2
A fluid-containing cooling plate includes a bottom plate (10), a top plate (30), and metal wire (20)or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire (30) is plated or otherwise coated with a b...  
WO2005108897A3
A capillary structure (90) for a heat transfer device, such as a heat pipe is provided having a plurality of particles including a first species (71) having a first diameter and a second species (73) having a second diameter that are joi...  
WO/2005/121508A2
A heat exchanger and method for making a heat exchanger including, forming an annular ring of a solid heat conductive mass, the annular ring having a central axis and having axially opposite faces. A plurality of passages are drilled thr...  
WO/2005/121684A1
A heat exchange device (10, 50) comprising a fluid flow passage (18) having a plurality of successive segments (20, 22) in fluid flow communication with one another, the segments being adapted to maintain a developing flow therein and th...  
WO/2005/114084A1
A heat pipe (10) with superior heat transfer between the heat pipe (10) and the heat source and heat sink (16) is provided. The heat pipe (10) is held tightly against the heat source by mounting holes (12) which penetrate the structure o...  
WO/2005/108897A2
A capillary structure (90) for a heat transfer device, such as a heat pipe is provided having a plurality of particles including a first species (71) having a first diameter and a second species (73) having a second diameter that are joi...  
WO/2005/100899A2
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions re...  
WO/2005/098335A3
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant...  
WO/2005/098338A1
A thermal transfer device (20) comprises a housing having a base assembly (23) and a cover (22). The base assembly (23) comprises a thermal transfer base (25) and a fluid-porous, thermally conductive mesh structure (26). The thermal tran...  
WO2005038761A3
A heat spreader (10) for a display device, such as a plasma display panel, a light emitting diode or a liquid crystal display, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater tha...  
WO/2005/085737A1
The invention relates to a device (10) for exchanging heat, particularly for motor vehicles, and to a method for the production of said device. The exchange matrix (100) is produced in a step involving extrusion. The inventive heat excha...  
WO2005028980A3
Geometric parameters of the aspect ratio are determined for channels in a micro channel heat exchanger for gaseous fluids in which micro channels have a surface area density greater than 10000 M<2>/M<3> in the alternate situations a) whe...  
WO/2005/081947A3
A temperature control device (100) that includes a miniature liquid-cooled heat sink (103) with integral heater and sensing elements (132,134) is used as part of a system to provide a controlled temperature surface to an electronic devic...  
WO/2005/083345A1
A flexible loop thermosyphon (50) is provided having a flexible, hermetic, outer tube (86) and a flexible, non-hermetic, inner tube, (85) positioned concentrically within the outer tube, forming an annulus between the outer tube and inne...  
WO/2005/081812A2
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...  
WO/2005/081812A3
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...  
WO2004083760A3
An apparatus and method of circulating a heat-absorbing material within a heat exchanger (100) is disclosed. The apparatus comprises a manifold layer (101) coupled to an interface layer (150). The manifold layer (101) comprises an inlet ...  
WO/2005/070159A2
A folded sheet is used as a basis for a fin array to cool laser modules. The folded sheet has flat portions that are connected in thermal contact with the laser module, and fins formed by interconnecting portions. This arrangement is hig...  
WO2004079792B1
A module (18,16) is formed in which semiconductor components are soldered to an electrically conductive heat sink(16).The electrically conductive heat sink(16) is formed so that it will serve as an electrical bus(22) in an electronic dev...  
WO2005005903A3
A capillary structure (25) for a heat transfer device (2), such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound (30) are formed...  
WO2004043291A8
An intervertebral implant for fusing vertebrae is disclosed. The implant has a body with curved, substantially parallel posterior and anterior faces separated by two narrow implant ends, superior and inferior faces having a plurality of ...  
WO2004079792A3
A module (18,16) is formed in which semiconductor components are soldered to an electrically conductive heat sink(16).The electrically conductive heat sink(16) is formed so that it will serve as an electrical bus(22) in an electronic dev...  
WO2005033603A3
The invention relates to a heat exchanger unit, in particular suitable for a motor vehicle air conditioning or for other high pressure applications comprising a heat exchanger body in the form of a shaped hollow body provided with severa...  
WO/2005/038376A1
The invention relates to a heat exchanger, in particular for motor vehicles, for a first gaseous flow medium and a second gaseous flow medium. Said heat exchanger comprises a tube bundle containing a plurality of tubes, a first tube base...  
WO2005006395A3
A capillary structure (25) for a heat transfer device, such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound are formed between ...  
WO/2005/038761A2
A heat spreader (10) for a display device, such as a plasma display panel, a light emitting diode or a liquid crystal display, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater tha...  
WO/2005/033603A2
The invention relates to a heat exchanger unit, in particular suitable for a motor vehicle air conditioning or for other high pressure applications comprising a heat exchanger body in the form of a shaped hollow body provided with severa...  
WO/2005/028980A2
Geometric parameters of the aspect ratio are determined for channels in a micro channel heat exchanger for gaseous fluids in which micro channels have a surface area density greater than 10000 M2/M3 in the alternate situations a) where v...  
WO2004043291A3
An intervertebral implant for fusing vertebrae is disclosed. The implant has a body with curved, substantially parallel posterior and anterior faces separated by two narrow implant ends, superior and inferior faces having a plurality of ...  
WO2003078044A3
A heat exchange reactor (10) including a housing (20), a plurality of tubes (50) mounted in the housing (20) and configured to carry a first fluid, and a baffle (60) having a plurality of holes (62, 64) receiving the tubes (50). The baff...  
WO/2005/005903A2
A capillary structure (25) for a heat transfer device (2), such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound (30) are formed...  
WO/2005/006395A2
A capillary structure (25) for a heat transfer device, such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound are formed between ...  
WO2004070304A3
A mounting assembly (400) comprises a rigid support bracket (402) configured to substantially surround a heat source (404). The rigid support bracket is coupled to a circuit board. The mounting assembly also comprises a removable lid (40...  
WO/2004/097323A1
The invention relates to a method for creating a hydraulic network used for transferring heat and/or material. According to said method, a given transfer area or a given transfer volume is provided with a multibranched hydraulic network....  

Matches 201 - 250 out of 967