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Matches 1 - 50 out of 18,952

Document Document Title
WO/2018/007179A1
The invention relates to a differential pressure sensor for determining a pressure measurement signal, comprising the following: a differential pressure measuring cell which substantially has a semiconductor material, to which a first an...  
WO/2017/221223A1
A pressure monitoring apparatus (1) for monitoring pressure of a liquid (4) in a vessel (2) comprises a housing (3) within which an airtight gas chamber (6) is formed. A pressure sensor (8) is located in the housing (3) monitors the pres...  
WO/2017/215254A1
Provided are a dual-cavity pressure gauge chip (31) and a manufacturing method thereof. A pressure gauge has a cavity (33) and a chip (31) disposed in the cavity (31). The chip (31) is uniformly compressed in the cavity (31) when acted u...  
WO/2017/217150A1
The shape of an upper surface of an inner wall surface of a supporting portion (15), in other words the shape of a diaphragm (14) formed by a recessed portion (13), is made to be a polygonal shape having four or more sides, for example a...  
WO/2017/217097A1
To provide an inexpensive and highly accurate thermal fluid-flow-rate sensor, a flow rate detection unit and pressure detection unit are provided on a semiconductor substrate, the flow rate detection unit is provided with a first diaphra...  
WO/2017/211095A1
Disclosed are a capacitive-type pressure sensor and a preparation method therefor. The capacitive-type pressure sensor comprises: a first substrate (11) and a second substrate (12); a first electrode layer (13) provided on the first subs...  
WO/2017/209239A1
This pressure detection device is provided with: a piezoelectric element; a hollow body that is provided with an input chamber having the piezoelectric element as a part of the wall surface thereof; and an introducing section, which is p...  
WO/2017/210184A1
A pressure sensor includes a piezoelectric substrate having a generally planar structure and an anchor location fixing the piezoelectric substrate at the periphery of the planar structure of the piezoelectric substrate. The planar struct...  
WO/2017/204514A1
Disclosed in an embodiment is a pressure detection sensor comprising: an elastic layer including a hole; and an electrode layer including a plurality of electrodes arranged on the elastic layer so as to be spaced apart, wherein the elast...  
WO/2017/203878A1
Provided is a physical quantity measurement device which allows reduction, to a temperature that does not affect operations of a semiconductor chip, in the bonding temperature of a bonding layer, and ensures insulation between the semico...  
WO/2017/204261A1
[Problem] To provide a pressure detection device in which it is possible to reduce the number of components and achieve a reduction in size, and an electromotive hydraulic pump in which the pressure detection device is stored. [Solution]...  
WO/2017/202611A1
The invention relates to a micromechanical component for a pressure sensor device comprising a diaphragm (16) which isolates a reference pressure (pr) from an external pressure (p), at least one first stator electrode (28a), at least one...  
WO/2017/201721A1
A curvature radius measurer (100), an electronic device and a manufacturing method for the curvature radius measurer (100). The curvature radius measurer (100) is adhered to a required panel (200); when the panel (200) is pressed, the pa...  
WO/2017/196573A1
A pressure sensor includes a pressure sensing element in fluid communication with a port and an oil separator in the port. The oil separator is configured to reduce an amount of oil-vapor residue that reaches the pressure sensing element...  
WO/2017/197344A1
A system includes a safety system having one or more valves configured to block a flow of fluid from a source to a destination, a non-invasive pressure measurement system having a plurality of non-invasive pressure sensors configured to ...  
WO/2017/182959A1
A pressure-sensor device (1) comprises: - a pressure-sensitive component (5, 5a, 6), having a sensor body (5) that includes an elastically deformable membrane part (5a) and at least one detection element (6) suitable for detecting a defo...  
WO/2017/183994A1
The invention relates to a measurement device (100) for detecting and measuring pain, distress, or other discomfort of a user. The measurement device (100) comprises: i) an external housing (110) having at least partially flexible walls ...  
WO/2017/182962A1
A pressure-sensor device (1) comprises: - a pressure- sensitive component (5, 5a, 6), having a sensor body (5) that includes an elastically deformable membrane part (5a) and at least one detection element (6) suitable for detecting a def...  
WO/2017/183492A1
This pressure sensor is provided with: a tubular body (10) at least part of which is formed from a magnetostrictive material, and which deforms under the pressure of a fluid flowing through said tubular body (10); a magnetic flux generat...  
WO/2017/183922A1
A pressure detecting sensor according to an embodiment of the present invention comprises: a first electrode layer including a plurality of signal electrodes arranged in a first region and a plurality of wiring electrodes arranged in a s...  
WO/2017/180670A2
Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or e...  
WO/2017/177618A1
A sensor and a manufacturing method therefor, and an electronic device. The sensor (100) comprises: a base substrate (101); a thin film transistor (102) disposed on the base substrate and comprising a source (1025); a first insulating la...  
WO/2017/180670A3
Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or e...  
WO/2017/170748A1
A stress sensor of the present invention is provided with: a diaphragm; an intermediate layer disposed on a surface of the diaphragm; a sensitive membrane disposed on the intermediate layer; and a piezoresistive element positioned in a r...  
WO/2017/170456A1
Provided are a pressure sensor and a method for producing the same. The pressure sensor is provided with a silicon substrate 24 having a cavity 23, a diaphragm 21 that comprises metallic glass and is under tensile stress in a range such ...  
WO/2017/162588A1
The invention relates to a method for the manufacturing of a carrying device, a carrying device, a system for detection and a method for detection of at least one physical parameter and/or chemical composition. A method for the manufactu...  
WO/2017/160014A1
Provided in the present invention are an ion channel pressure sensor and a method for manufacturing same. The ion channel pressure sensor comprises: a lower storing portion including a lower accommodating space for accommodating an elect...  
WO/2017/160426A1
A pressure sensor (100) includes an elongate body (202) which deforms in response to an applied pressure having a cavity (204) formed therein. An isolation diaphragm (214) seals the cavity (204) from a process fluid and is configured to ...  
WO/2017/155117A1
This adhesive for semiconductor sensor chip mounting can reduce noise sensing and can improve heat resistance and thermal cycle resistance characteristics. This adhesive for semiconductor sensor chip mounting is used in semiconductor sen...  
WO/2017/156237A1
An electronic pressure sensor includes a housing having a distal end configured to be exposed to a flow of a fluid media, the distal end opposite a proximal end, wherein the proximal end is configured not to be exposed to the fluid media...  
WO/2017/154627A1
A pressure detecting device which detects the combustion pressure in an internal-combustion engine includes: a piezoelectric element 10 which outputs a charge signal corresponding to the pressure in a combustion chamber; and a mounting b...  
WO/2017/155116A1
An adhesive for semiconductor mounting is provided which can achieve high-precision gap control and can improve heat resistance when mounting a semiconductor. This adhesive for semiconductor mounting is used in semiconductor mounting, an...  
WO/2017/155736A1
A blood clot retraction assay device and methods of measuring whole-blood clot retractive forces during coagulation are described. When placed in proximity to a micro-beam, a blood droplet attaches thereto, applying a force to the micro-...  
WO/2017/153908A1
In some embodiments, the present application provides a swallowable capsule comprising pseudo conductive high-electron-mobility transistors (PC-HEMTs), and its use in an intestinal and gut diagnostics and gut motility monitoring.  
WO/2017/150343A1
This semiconductor device is provided with: a first substrate (10) wherein a plurality of connection parts (19-21) are formed on a surface (10a) side; a second substrate (30) that is bonded with the first substrate (10) and is provided w...  
WO/2017/148660A1
The invention relates to a pressure sensor (1) comprising a monolithic main part (2) which has an annular region (3) and a membrane region (4). The annular region (3) encloses a cavity (6) in the circumferential direction (5), and the me...  
WO/2017/148847A1
The present invention provides a pressure transducer (1) and a method for fabricating a pressure transducer. The pressure transducer is for use in a gas pressure gauge and uses a squeeze-film. The pressure transducer comprises a first wa...  
WO/2017/145966A1
Provided is a pressure sensor which is capable of inhibiting reduction in accuracy of pressure measurement while being capable of measuring the temperature of an object to be measured. The present invention is characterized by including:...  
WO/2017/144766A1
The method for determining the diameter (Ds) of a nozzle seat (6) of a fuel injector that comprises a noz- zle body (1), a nozzle seat (6) arranged in the nozzle body (1) and an injector needle (5) comprising a seal- ing surface (8) coop...  
WO/2017/147234A1
A flip chip pressure sensor assembly. The flip chip pressure sensor assembly comprises a substrate; a pressure sensor die comprising a sensing diaphragm, the die having a top side and a bottom side that is reverse to the top side, where ...  
WO/2017/144101A1
The invention relates to a capacitive vacuum measuring cell having a first housing body (1) with a membrane (2) which is arranged at a distance therefrom so as to form a seal in the edge region (3) in such a way that a reference vacuum s...  
WO/2017/142824A1
A battery powered device (200) includes a battery (212) and a motor controller (202) that is coupled to the battery (212). A motor (204) is operably coupled to the motor controller (202). The motor controller (202) is configured to detec...  
WO/2017/141460A1
This pressure sensor 1 is provided with the following: a laminated piezoelectric element 2 that includes a laminate 23 in which a piezoelectric body layer 21 and an internal electrode 22 are alternately laminated; and a case 3 that surro...  
WO/2017/142921A1
Methods, apparatus, and systems are provided for sensing pressure. One example apparatus includes a housing having a first port, a chamber disposed in the housing and having a second port, wherein the second port is coupled to the first ...  
WO/2017/138647A1
A pressure detection device (100) has: a base board (10) that is provided with a first main surface, a second main surface positioned on the reverse side of the first main surface, and a through hole, which penetrates the base board from...  
WO/2017/134329A1
The pressure monitoring arrangement for monitoring cylinder pressure of a piston engine (1) comprises a linear encoder (3) comprising a read head (3a) and a scale (3b) and being configured to monitor displacement or deformation of a comp...  
WO/2017/136719A1
A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphr...  
WO/2017/133017A1
Provided are a pressure sensor (100), an electronic device, and a method for manufacturing the pressure sensor (100). The pressure sensor (100) comprises a substrate assembly (10) having a first mounting surface (11a) and a second mounti...  
WO/2017/122496A1
This pressure sensor (100) is characterized by having: a diaphragm (3); a semiconductor chip (1) having a square shape in a plan view and having a plurality of resistors (R1-R4) constituting a strain gauge; four first structures (2a-2d) ...  
WO/2017/118032A1
A piezoelectric element (100), comprising: a piezoelectric component (101); a first substrate (102) and a second substrate (103) located on both sides of the piezoelectric component (101), respectively; and a first electrode layer (104) ...  

Matches 1 - 50 out of 18,952