Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 19,448

Document Document Title
WO/2019/096998A1
A semiconductor package includes a die attached to a support by adhesive on a backside of the die. The adhesive covers only part of the backside of the die and can be formed as stripe-shaped or other non-contiguous regions on the backsid...  
WO/2019/096560A1
The invention relates to a micromechanical pressure sensor device, and to a corresponding production method. The micromechanical pressure sensor device is provided with a sensor substrate (SE) having a front side (VS) and a back side (RS...  
WO/2019/099821A1
Described herein is a force attenuator for a force sensor. The force attenuator can linearly attenuate the force applied on the force sensor and therefore significantly extend the maximum sensing range of the force sensor. The area ratio...  
WO/2019/096995A1
A semiconductor device includes an integrated circuit, and a capacitive pressure sensor disposed over and electrically connected to the integrated circuit. The capacitive pressure sensor includes a first electrode, a cavity over the firs...  
WO/2019/098014A1
Peeling apart of a flexible substrate and a hard substrate is suppressed. A capacitance-type pressure sensor provided with: a flexible substrate including a first electrode, the flexible substrate being flexible; a hard substrate includi...  
WO/2019/099414A1
A sensor device includes a substrate having a front surface and an opposing back surface. The back surface defines an indented region having an indented surface. The substrate defines a bottom port extending between the front surface and...  
WO/2019/063714A3
Disclosed is a pressure sensor for measuring relative or absolute pressure. Said sensor is equipped with an additional heating element (H, A-F) in order to eliminate impeding media.  
WO/2019/093218A1
One embodiment of the present invention is a pressure sensor which is provided with: a pressure detection element; a substrate on which the pressure detection element is mounted; a pad electrode which is provided on the substrate and is ...  
WO/2019/092035A1
The invention relates to a pressure sensor system (1) having protection against a freezing medium, which pressure sensor system comprises a pressure sensor element (10) with a flexible plate (11) and a carrier element (20), on which the ...  
WO/2019/089250A1
Disclosed is a micro pressure sensor including a plurality of modules that are operative over different ranges of pressure. The modules include a stack of at least two module layers, each module layer including a module body having walls...  
WO/2019/085602A1
Provided is a pressure detection device (100) used for a cooking utensil. The pressure detection device comprises: a shell (11), the shell (11) having a first air hole (1112) and a second air hole (1122); a flexible sealing member (12), ...  
WO/2019/090057A1
An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate,...  
WO/2019/080657A1
A pressure and temperature processing circuit and a pressure thermometer. The pressure and temperature processing circuit comprises: a pressure and temperature measurement unit for measuring pressure and temperature signals; a pressure a...  
WO/2019/082646A1
Provided is a sensor element which can be manufactured without needing to use hydrofluoric acid or a hot phosphoric acid solution. A sensor element 100 provided with a base member 10 and a semiconductor chip 20 bonded to the base member ...  
WO/2019/081436A1
A device comprising: a stack of layers defining an array of transistors, wherein the stack of layers includes a surface conductor pattern defining (i) an array of gate conductors each providing the gate electrodes for a respective column...  
WO/2019/073582A1
A pressure sensor 100 is provided with: a diaphragm 2 that is displaced when pressure is applied thereto; a first pressure receiving section 3 that generates strain when pressed by the diaphragm 2; a second pressure receiving section 4, ...  
WO/2019/063714A2
Disclosed is a pressure sensor for measuring relative or absolute pressure. Said sensor is equipped with an additional heating element (H, A-F) in order to eliminate impeding media.  
WO/2019/063404A1
The invention relates to a method for producing a pressure sensor chip (11). First, a first wafer is provided as a sensor plate (01), in which a pressure chamber (15) of the pressure sensor chip should be formed. A desired thickness of a...  
WO/2019/063717A1
Disclosed is a pressure sensor for measuring relative or absolute pressure. Said sensor is equipped with an additional heating element (H, A-F) in order to eliminate impeding media.  
WO/2019/054403A1
A pressure measurement device 1 according to the present invention measures, by tonometry, an internal pressure in an object to be measured that is provided with an internal space filled with fluid and a surface layer having a curved sur...  
WO/2019/052784A1
The ceramic pressure sensor (1) comprises a ceramic body (2) and an electronic circuit (3a, 3b, 3c) supported by the ceramic body (2), the ceramic body (2) comprising a flexible membrane (4) made of ceramic material capable of being defo...  
WO/2019/053763A1
This plunger pump is provided with, independently of a pump head, a pressure detection device that independently has a sensor for detecting fluid pressure, wherein the pump head and the pressure detection device are detachably attached i...  
WO/2019/048579A1
Differential sampling circuits may be adversely affected by changes in common mode voltage. Changes in the common mode voltage may alter the on resistance of transistor switches which it turn may mean that small signal changes are not co...  
WO/2019/043887A1
[Problem] To improve measurement of hydraulic pressure in a working fluid chamber of a hydraulic clamp device in such a way that the measurement can be performed without requiring the replacement of a battery or the connection of a lead,...  
WO/2019/043206A1
The disclosed device comprises a thin film layer (4) of a phase transition material disposed over a substrate (2), and a confinement layer (3) adjacent to the thin film layer. The thin film layer has first and second in-plane lattice par...  
WO/2019/038328A1
The invention discloses a threshold sensor sensing a threshold resistance value by a physical property, whereas the sensor has RFID communication ability. The object of the invention to provide a sensor that can reliably and accurately d...  
WO/2019/036812A1
A sensor and method for use in measuring a physical characteristic of a fluid in a microfluidic system is provided. A microfluidic chip has a thin deformable membrane that separates a microfluidic channel from a microwave resonator senso...  
WO/2019/034674A1
The invention relates to a measuring device (1) for measuring a measurement variable of a fluid, in particular a sensor, such as a pressure sensor, a relative pressure sensor, a differential pressure sensor, a travel sensor or the like, ...  
WO/2019/028488A1
The invention relates to a piezoelectric device having at least one piezoelectric element (2), which has a support plane (4) oriented to a force introduction element (3), wherein in the event of a thermal loading of the piezoelectric dev...  
WO/2019/030121A1
The invention relates to a measuring device for measuring the pressure of a medium in a receptacle. Said measuring device comprises: a capacitive pressure-measuring cell (10); and a metallic, rotationally symmetrical process connection (...  
WO/2019/028945A1
A pressure sensor, comprising: a displacement sensor (40), an elbow pipe (30) and a base (32); a first end of the elbow pipe (30) is fixed on the base (32), the displacement sensor (40) comprises a first reflection member (50) and a seco...  
WO/2019/025211A1
The invention relates to a micromechanical pressure sensor device, and to a corresponding production method. The micromechanical pressure sensor device has a first membrane (3) and an adjoining first cavern (4); a deformation detecting u...  
WO/2019/027771A1
A module for measuring and monitoring an inlet and outlet pressure is described herein. The module includes an inlet pressure port for fluid communication to a fluid line before a filter and the inlet pressure port comprising a first pre...  
WO/2019/021073A1
An electromechanical pressure sensor includes an electromechanical resonator having a driving electrode, a sensing electrode, and a beam resonator arranged between the driving and sensing electrodes. The beam resonator includes a resonat...  
WO/2019/020409A1
The invention relates to a micromechanical device (1a; 1b; 1c), comprising: a carrier substrate (2); a sensor apparatus (3), which is arranged on the carrier substrate (2) by means of spring elements (9) in such a way that the sensor app...  
WO/2019/019783A1
Disclosed are a wide-range high-precision double-film-integrated capacitive pressure sensor and a preparation method therefor. The pressure sensor comprises a glass substrate (8), wherein a first shallow groove (80) and a second shallow ...  
WO/2019/019843A1
The present disclosure relates to the technical field of pressure sensors, in particular to a double-film capacitive pressure sensor and a manufacturing method. The pressure sensor comprises a glass substrate (7). A shallow groove (70) i...  
WO/2019/011385A1
Method of controlling the injection of hydraulic fluid into a high pressure diaphragm compressor comprising a hydraulic system, the method comprising: measuring a representation of pressure in a high- pressure part of the hydraulic syste...  
WO/2019/010868A1
A direct current glow discharge plasma principle-based high-frequency response pressure sensor, comprising: discharging electrodes (1) comprising a cathode and an anode and used for generating a plasma between the cathode and the anode u...  
WO/2019/011386A1
The invention relates to a pressure sensor comprising a housing connected to a compressor head, the housing comprising a piston movably mounted in a cylinder, the cylinder is fluidly connected to a high-pressure part of a hydraulic syste...  
WO/2019/014243A1
Aspects of various embodiments are directed to sensor apparatuses and methods thereof. An example sensor apparatus includes a capacitor and sensor circuitry. The capacitor includes a first substrate having a first electrode, a second sub...  
WO/2019/005253A1
A pressure sensor assembly (100) for use in sensing a pressure of a process fluid in a high temperature environment includes an elongate sensor housing (120) configured to be exposed to the process fluid and having a cavity (124) formed ...  
WO/2018/234233A1
The invention relates to a film resistor comprising a piezoresistive layer, the piezoresistive layer containing a first transition metal carbide. Further disclosed is a thin-film sensor comprising the film resistor.  
WO/2018/235087A1
A sensor device is disclosed comprising at least one deformable substrate, at least one transducer element formed in or on a surface area of a first side of the deformable substrate, at least one other transducer element formed in or on ...  
WO/2018/235882A1
Provided is a sensor chip junction structure, wherein, in the case where the travel distances of the tip of a pressing jig (56) are, for example, 50 μm and 30 μm, a load (shear force) (N) acting on an adhesive layer (50) formed on a gl...  
WO/2018/235415A1
This physical quantity sensor detects a physical quantity. The physical quantity sensor comprises: a first substrate; an electrode formed on the first substrate; a diaphragm formed of a semiconductor material; a second substrate fixed to...  
WO/2018/236082A1
An electronic device is provided. The electronic device includes a barometer sensor configured to measure a barometric pressure of the electronic device, a motion sensor configured to detect a motion of the electronic device, and a proce...  
WO/2018/230219A1
This semiconductor device is provided with a first substrate (11), a second substrate (12), an oxide film (13), and a protection film (14). The first substrate has a first surface (11c). The second substrate has a second surface (12b), a...  
WO/2018/231808A1
By combining at least two strain sensors in a symmetric configuration, a dual use sensor may be realized. This may reduce the foot prints, cost, and complexity of employing two different sensors. It may also improve the accuracy of the m...  
WO/2018/225853A1
A diaphragm vacuum gauge (100) is provided with a temperature difference calculating unit (14) and an abnormality determining unit (15). The temperature difference calculating unit (14) obtains a temperature difference Δt between a temp...  

Matches 1 - 50 out of 19,448