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JP2011209015A |
To improve productivity of a semiconductor structure requiring a space around an electronic circuit.The semiconductor structure 1C includes: a semiconductor wafer 11; a wall 23 formed so as to enclose a prescribed region on the semicondu...
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JP2011209002A |
To provide a vibration piece capable of detecting angular velocity of each rotation about a plurality of detection axes, and to provide an angular velocity sensor using the vibration piece, and an electronic apparatus using the angular v...
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JP2011196830A |
To provide a vibrator-type dynamic quantity sensor capable of forming a sensor element including a vibrator having a fixed part and a spindle provided to surround the outer diameter of the fixed part coupled via a plurality of beams in S...
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JP2011198889A |
To solve the problem that four kinds of masks for forming lead frames are also required and a cost is disadvantageous because independent manufacturing processes at four times are required when forming four kinds of the lead frames since...
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JP4779692B2 |
To provide an oscillation circuit with simple configuration for materializing amplitude control in an oscillation loop with high accuracy, thereby decreasing an oscillation start time, and to provide a physical quantity transducer and a ...
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JP4776779B2 |
A monolithically fabricated micromachined structure (52) couples a reference frame (56) to a dynamic plate (58) or second frame for rotation of the plate (58) or second frame with respect to the reference frame (56). Performance of torsi...
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JP2011174914A |
To provide a physical quantity detecting element which includes a double-T-shaped piezoelectric vibrating piece with a thickness in a Z-axis direction and can detect an angular velocity around an X-axis.In the physical quantity detecting...
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JP2011169671A |
To provide an inertia sensor in which the principal plane of a piezoelectric sensor of an oscillation inertia sensor chip and the outside bottom surface of a package housing the same are in parallel with each other so that the principal ...
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JP2011158296A |
To provide a π/2 phase shift circuit having a small variation of characteristics due to process variation, temperature variation, and frequency variation, and also having a small circuit scale.The π/2 phase shift circuit comprises: a c...
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JP2011149789A |
To provide a manufacturing method of a motion sensor and a motion sensor for miniaturizing an outline shape thereof.The manufacturing method of a motion sensor includes the steps of: preparing a plurality of packages 30 each containing a...
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JP2011145080A |
To provide an angular velocity sensor capable of reducing zero-point variation by preventing saturation of a charge/voltage conversion and buffer amplifier while using a simple circuit structure to thereby improve angular velocity measur...
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JP4731473B2 |
A drive component that comprises a drive axis, a pendulous sensor component that comprises a center of mass, and a hinge component that comprises a rotation axis of an electromechanical system. The drive component makes a determination o...
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JP2011141210A |
To provide a method of adjusting an angular velocity detection device capable of compensating a characteristic difference of a weight in a mode uninfluenced by magnitude of a disturbance.The method of adjusting the angular velocity detec...
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JP2011133299A |
To provide a sensor device that can avoid upsizing, a motion sensor using the same, and a motion sensor manufacturing method.A second sensor device 2 includes: connections 12 formed on one surface 11 of a plurality of leads 10; a vibrati...
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JP2011133246A |
To provide an angular velocity sensor and an electronic apparatus capable of being miniaturized or made thin.The angular velocity sensor 1 includes oscillating elements 10x, 10y, 10z' and a support substrate 20 for supporting these eleme...
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JP2011127942A |
To reduce vibrations of first and second mass parts coming outside through a fixed part; to enable also prevention of vibration amplitudes of the first and second mass parts from becoming excessive; and thereby to provide an angular velo...
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JP2011127913A |
To provide a vibration gyro having a plurality of detection axes with sensitivity on an angular velocity around its z-axis kept from lowering while reducing sensitivity in other axial directions, and excelling in mass productivity.This v...
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JP2011127945A |
To provide a precise angular velocity sensor including the rotation of axis within a plane of an oscillator and a small vibration leakage.A piezoelectric vibration element detects a rotary motion using a piezoelectric effect according to...
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JP4705229B2 |
A micromechanical angular-acceleration sensor having a substrate, which has an anchoring device provided on the substrate. The sensor has a ring-shaped inertial mass joined to the anchoring device by a torsion-spring device such that the...
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JP2011112455A |
To provide a MEMS sensor which can satisfy mutually exclusive demands in a balanced way, such as reduction in footprint, increase in the volume, reduction in Brown noise, and increase in the mass of a movable portion and improve the dete...
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JP2011112480A |
To provide a compact physical quantity detector high in impact resistance.A relay board 250 to which a gyro vibration piece 100 is joined is connected and fixed with a conductive adhesive 296 to a first protrusion terminal 234, a second ...
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JP2011110618A |
To provide a MEMS (Micro Electro Mechanical System) sensor preventing foreign matters from entering into a gap between a cap and a substrate, and to provide a method of manufacturing the MEMS sensor.The MEMS sensor is formed by joining a...
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JP4695263B2 |
A method for monitoring or influencing the movement of a vehicle on a path determines a desired path and an actual movement of the vehicle, performs a comparative analysis of the desired path and the actual movement, and transmits by hap...
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JP2011508229A |
A sensor system is provided having a base plate, a sensor module, a damping element and a support frame, the base plate having a main plane of extension and a recess that is perpendicular to the main plane of extension; the support frame...
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JP4643578B2 |
An oscillatory rate sensor is described for sensing rotation about the "z-axis". It is tuning-fork in nature with structural linkages and dynamics such that fundamental anti-phase oscillation of two proof masses is accomplished by virtue...
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JP4631992B2 |
In an angular velocity sensor, driven mass portions are disposed on a surface of a base plate at point-symmetrical locations with respect to a central point O. The driven mass portions are connected to a coupling beam to be interconnecte...
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JP2011503522A |
A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation ...
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JP4605736B2 |
A micromechanical yaw rate sensor having: a substrate having an anchoring device provided on the substrate; and an annular flywheel that is connected, via a flexural spring system, with the anchoring device in such a way that the area of...
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JP2010286477A |
To provide a highly-sensitive gyroscope and a rotation detection method.The gyroscope 10 includes a structure 100 configured to be driven to move about a drive axis 102. The structure is further configured to move about a sense axis 104 ...
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JP2006524345T5 |
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JP2010534823A |
The present invention relates to a force balance control system and a control method using an automatic gain control loop, and performs force balance feedback control of a vibration type angular speedometer using an automatic gain contro...
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JP4579352B2 |
An optical semiconductor component (10) includes a substrate (11) having a surface (12), a photodetector (13) supported by the substrate (11), and a seismic mass (21) overlying the surface (12) of the substrate (11) and overlying a porti...
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JPWO2008149821A1 |
The present invention relates to a small and low profile sensor device. The displacement of the base 1, the mounting body 3 which is arranged at least a part of the base 1 at a distance from the base 1 and can be displaced with respect t...
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JP2010151797A |
To provide a method and system for assisting success in initialization of a resonance micro-electromechanical system (MEMS), especially, a method for overcoming DC offset caused by ESD. A system 20 includes a resonance sensor 24, a drive...
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JP4475548B2 |
In the manufacture of a micromechanical device, a substrate, having a mask thereon, is etched using a flourine-containing etchant gas or vapour in the absence of a plasma through an opening in the mask to a desired depth to form a trench...
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JP4474624B2 |
A monolithic micro or nano electromechanical transducer device includes a pair of substrates (20, 25) respectively mounting one or more elongate electrical conductors (40) and resilient solid state hinge means (30, 32) integral with and ...
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JP3159045U |
To provide an angular velocity sensor capable of increasing the sampling frequency of angular velocity detection around three axes. An angle sensor includes a basic structure, an X-axis direction excitation means, an angular velocity det...
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JP2010101900A |
To provide a packaged microchip with a premolded-type package.A MEMS (micro electro mechanical systems) inertial sensor 10 is secured within a premolded-type package 12 formed from a low moisture permeable molding material. Consequently,...
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JP2010511524A |
Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS str...
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JP4451394B2 |
A method for extracting components from signals in an electronic sensor ( 50 ) having a sensing element ( 52 ). The sensing element ( 52 ) generates a first signal ( 60 ) and a second signal ( 62 ). The method comprises the steps of: rec...
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JP4448845B2 |
An acceleration sensor is composed of a three-layer system. The acceleration sensor and conductor tracks are patterned out of the third layer. The conductor tracks are electrically isolated from other regions of the third layer by recess...
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JP3158583U |
To provide a sensor for detecting both static / dynamic acceleration and angular velocity with a simple structure. An acceleration detection unit 100 is composed of a weight body 110, a surrounding pedestal 130, flexible plate-shaped bri...
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JP2010044061A |
To reduce debris and to improve yield and reliability in the production of MEMS devices.In the improved MEMS device and the production method, channels are formed in a first substrate around a plurality of MEMS device areas previously fo...
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JP2010501831A |
A dual-axis tuning fork gyroscope includes four open-ended tuning forks arranged coplanarly in two opposite pairs, a first pair of open-ended tuning forks being arranged opposite one another along a first axis, a second pair of open-ende...
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JP2009267365A |
To embed a temperature sensor for temperature compensation into a MEMS device.The MEMS device includes a P-N device 116 formed on a silicon pin 108, which is connected to a silicon sub-assembly, and where the P-N device is formed on a si...
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JP2009244263A |
To provide systems and methods for acceleration and rotation determination from an out-of-plane MEMS device.A Micro-Electro-Mechanical Systems (MEMS) inertial sensor systems and methods are operable to determine linear acceleration and r...
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JP2009530603A |
The present invention discloses an improved planar, dual-axis, resonator gyroscope with mechanical coupling of adjacent vibrating members. The primary-mode flexible hinges include a tangential torsion element that largely decouples the o...
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JP2009150863A |
To provide a sensor having a driver electrode independent of a location in a multilayer silicon-on-insulator substrate.A micro electromechanical system (MEMS) includes a housing for demarcating an enclosed cavity, stator teeth extended f...
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JP3150952U |
To easily obtain an angle (angular velocity) from a detected angular velocity (angle) in an angle / angular velocity measuring device for measuring an angle and an angular velocity without separately providing a device for detecting the ...
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JP2009510389A |
A tuning fork gyroscope design where at least one proof mass is supported above a substrate. At least one drive electrode is also supported above the substrate adjacent the proof mass. Typically, the proof mass and the drive electrode in...
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