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Matches 451 - 500 out of 27,052

Document Document Title
WO/2016/209087A1
A Kelvin probe system (100) for analyzing a sample for testing (134), the Kelvin probe system comprising: a drive (102) controlled and powered by a drive control/power (103) for rotating an object (106, 120) around a rotational axis; a K...  
WO/2016/210287A1
A technique for an AMR-based sensing circuit allows current measurements over a wide frequency range. This is accomplished by folding the current carrying trace around the AMR sensor to concentrate and normalize the magnetic field genera...  
WO/2016/204369A1
The present invention relates to a semiconductor chip test socket and, more specifically, to a semiconductor chip test socket readily transferring, to a latch system, force in accordance with the movement of a cover so as to reduce the w...  
WO/2016/202535A1
The invention relates to a measuring system (200) for measuring equalising current at at least one electrically-conductive current collector unit (20) of an electrical energy store (10), comprising a measurement device (210) for electric...  
WO/2016/203360A1
Device for measuring the electric power drawn by a railway vehicle from a high-voltage electric supply line including a current sensor connected to the supply line, a resistive voltage divider connected between the line and earth, first ...  
WO/2016/204878A1
A method for measuring a position of an object, the method includes probing a sensing mark arranged in a first plane on a substrate to determine the position of the object, a portion of the substrate connecting the sensing mark to the ob...  
WO/2016/198377A1
The invention relates to an electrical circuit, comprising a first power converter unit (12; 70), at least a second power converter unit (14; 76), an intermediate circuit (16; 72), which connects the power converter units (12, 14; 70, 76...  
WO/2016/195251A1
The present invention relates to a rubber socket for a semiconductor test that can be manufactured with a low cost and can prevent an electric shock from being applied to a semiconductor package in a process of testing the semiconductor ...  
WO/2016/188873A1
Current sensor arrangement which is designed for attachment to a battery terminal or is integrated into the battery terminal, wherein the current sensor arrangement comprises a shunt and a signal processing device which is connected and ...  
WO/2016/190601A1
An embodiment provides a film contactor for electrically connecting a terminal of a device to be tested and a pad of a testing device, the contactor comprising: an insulation sheet having the shape of a porous mesh; an electrode formed i...  
WO/2016/183174A1
Disclosed herein are a monitoring system and a method for monitoring and reporting an aggregate system status of a DC subsystem and a battery charger. The monitoring system comprises at least one monitoring-enabled module; an aggregator ...  
WO/2016/182289A1
The present invention relates to a test socket adapter, and more specifically to a test socket adapter for guiding the loading of an element on a test socket. The present invention, which is a test socket adapter (200), disposed on a tes...  
WO/2016/177493A1
A measurement apparatus for measuring at least one property of an electron bunch or other group of charged particles travelling through a cavity (310), comprises a plurality of electrodes (302-308) arranged around the cavity, a plurality...  
WO/2016/177850A1
A testing head (20) having vertical probes for testing the working of a device under test (24) is described, such a testing head comprising a plurality of contact probes (21), each contact probe (21) having a rod-like body of a predeterm...  
WO/2016/176469A1
Multiple pin probes and methods for controlling such multiple pin probes to support parallel measurements are disclosed. The method may include: establishing electrical contact between a multiple pin probe and a subject of measurement; s...  
WO/2016/172242A1
A pin mechanism and a method for reducing backside particle induced out-of-plane distortions in semiconductor wafers involving such pin mechanisms. Geometric parameters of the pin are optimized so as to maximize the height of a particle ...  
WO/2016/171596A1
A probing apparatus (100) for detection of an electric signal generated by a device-under-test (102). The probing apparatus (100) comprises a rigid support structure (100a) having a contact surface (100e) adapted for sliding contact with...  
WO/2016/167669A1
A computer-implemented method of determining that an electric fence is energised is disclosed, the method comprising, receiving data representative of the strength of a signal detected in the vicinity of the electric fence over a time pe...  
WO/2016/165137A1
A radio frequency test base and test probe. The radio frequency test base comprises an input pin (101), a flexible metal piece (102), an output pin (103), a housing (104) and a metal platform surface (105). The flexible metal piece (102)...  
WO/2016/166564A1
The invention relates to a tester for inspecting or testing microelectronic components (27), which comprises a holding device (26) for the component (27), at least one probe (28), and a magnifying optical instrument (23, 23'). In order t...  
WO/2016/161522A1
A test switch for use in electrical power distribution networks is provided. The test switch facilitates the connection between the power distribution networks' equipment and test equipment used to effect tests on the power distribution ...  
WO/2016/162460A1
The invention relates to an electrical subassembly (1) having a printed circuit board (2) and having an electrical resistor element (3), particularly in the style of a shunt for current measurement. The resistor element (3) is electrical...  
WO/2016/159316A1
This alloy material has copper (Cu) as the main component thereof and has added thereto 10-30 wt% silver (Ag) and 0.5-10 wt% nickel (Ni). As a result, an alloy material having no coating and having excellent Sn-corrosion resistance, a co...  
WO/2016/155936A3
The invention relates to a method for producing at least one spring contact pin (9) acting as an electrical contact, or a spring contact pin arrangement (25) comprising at least one such spring contact pin (9). The following steps are pr...  
WO/2016/155937A1
The invention relates to a method for producing a contact spacing converter (4) (space transformer) which has electrical contacts (9) that form electrical paths (10) and in which a first contact spacing of the contacts (9) is converted i...  
WO/2016/159315A1
This alloy material has a composition of 20-30wt% of silver (Ag), 35-55 wt% vanadium (Pd), and 20-40wt% copper (Cu) in a compositional range for a ternary alloy of Ag, Pd, and Cu, uses said composition as a base, and has added to said ba...  
WO/2016/159548A1
Disclosed is a test socket in which a floating member for accommodating a test object at a test is prevented from separating from a socket main body. The separation preventer of the test socket includes hooking projections which protrude...  
WO/2016/160730A1
A laminated heater socket useful in association with an integrated circuit (IC) device tester is having a socket with an embedded integrated heater. This laminated heater socket configuration allows for good thermal conductivity and bett...  
WO/2016/156002A9
It is described a vertical contact probe (21) for a testing head for a testing apparatus of electronic devices comprising a probe body (20C) extended in a longitudinal direction between respective end portions (24, 25) adapted to contact...  
WO/2016/156003A1
It is described a contact probe (21) for a testing head for a testing apparatus of electronic devices, the probe comprising a probe body (20C) extended in a longitudinal direction between respective end portions (24, 25) adapted to conta...  
WO/2016/158567A1
[Problem] To provide a socket for electrical components which is capable of greatly reducing the contact pressure exerted on electrodes of electrical components by electrical contacts. [Solution] In this electrical component socket, a fi...  
WO/2016/157964A1
[Problem] To provide an inspection jig and a substrate inspection apparatus capable of improving the contact stability of a probe with respect to an inspection point. [Solution] A facing plate 51 and a support plate 61 are provided. On t...  
WO/2016/160009A1
An integrated circuit test socket includes a highly conductive compliant material that is cut and installed into the test socket. The conductive material draws electrical charge away from the test socket, leading to more accurate testing...  
WO/2016/156002A1
It is described a vertical contact probe (21) for a testing head for a testing apparatus of electronic devices comprising a probe body (20C) extended in a longitudinal direction between respective end portions (24, 25) adapted to contact...  
WO/2016/156248A1
A probe card (20) for a testing apparatus of electronic devices is described, the probe card (20) comprising at least one testing head (21) housing a plurality of contact probes (22), each contact probe (22) having at least one contact t...  
WO/2016/155936A2
The invention relates to a method for producing at least one spring contact pin (9) acting as an electrical contact, or a spring contact pin arrangement (25) comprising at least one such spring contact pin (9). The following steps are pr...  
WO/2016/146451A1
A contact probe (10) for a testing head of a testing apparatus of electronic devices is described, the contact probe (10) comprising a body essentially extended in a longitudinal direction between respective end portions adapted to conta...  
WO/2016/146499A1
A testing head (20) with vertical probes for the functionality testing of a device under test (28), the testing head (20) comprising at least one couple of plate-like supports (22, 23) separated from each other by a suitable gap (29) and...  
WO/2016/149600A1
A testing device including a housing having an indicator, a first test probe configured to be inserted into an alternating-current (AC) receptacle, a second test probe configured to be inserted into a universal serial bus (USB) receptacl...  
WO/2016/146476A1
It is described a testing head (20) with vertical contact probes for the functionality testing of a device under test (26), the testing head comprising a plurality of vertical contact probes (21), each vertical contact probe (21) having ...  
WO/2016/147691A1
A probe pin (2) is provided with: a coil spring (30) extending and contracting along the center axis; an electrically conductive first plunger (10) having a gripped section (11) inserted along the center axis into the coiled spring (30) ...  
WO/2016/140377A1
An apparatus for inspecting defects of a multi-junction semiconductor according to an embodiment of the present invention is disclosed, the apparatus characterized by comprising: a light source; a slit antenna probe; a parallel light rad...  
WO/2016/140505A1
Disclosed is a test device for testing electric characteristics of a test object having a test contact point. The test device includes an insert which accommodates the test object; a socket which supports a plurality of probes having one...  
WO/2016/133240A1
Disclosed is a probe block for a display panel test device. A probe block according to the present invention comprises: a pressing protrusion for pressing a contact pad formed on the display panel; and a buffer member disposed at a tip e...  
WO/2016/128226A1
The invention relates to a method for assembling a component which has a sleeve (2), a piston (7) with a piston head (11), and a spring (6). The spring (6) is first inserted into the sleeve (2), and a first piston region (8) of the pisto...  
WO/2016/125028A8
A system for monitoring electrical properties of a power line includes a current sensor with a gapped core and a conductive winding, The system further includes output control circuitry coupled with the current sensor, and including volt...  
WO/2016/126411A1
Electrode foil (6) comprising a) an electrode layer (60) comprising - a sensing electrode portion (100), operable as an electrode of a sensing capacitor for sensing a voltage of an inner conductor (20) of a medium or high voltage power c...  
WO/2016/125028A3
A system for monitoring electrical properties of a power line includes a current sensor with a gapped core and a conductive winding, The system further includes output control circuitry coupled with the current sensor, and including volt...  
WO/2016/124969A2
All-printed paper-based substrate memory devices are described. In an embodiment, a paper-based memory device is prepared by coating one or more areas of a paper substrate with a conductor material such as a carbon paste, to form a first...  
WO/2016/126024A1
The purpose of the present invention is to provide a test socket, which: provides a conduction unit having conductive particles easily coupled by dot, line, and surface contact, and thus, when a semiconductor device is tested, has a lowe...  

Matches 451 - 500 out of 27,052