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Patent Searching and Data


Matches 501 - 550 out of 27,782

Document Document Title
WO/2018/039075A1
Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out ...  
WO/2018/038321A1
According to one aspect of the present invention, provided is an electronic part inspection device for inspecting an electronic part, comprising: a frame having a single opening part formed on the upper surface thereof; one pair of condu...  
WO/2018/035515A1
Systems and methods for testing semiconductor wafers are disclosed herein. In one embodiment, an apparatus for testing dies of a semiconductor wafer includes: a wafer translator having a wafer-side configured to face the wafer, and an in...  
WO/2018/034500A1
The present invention relates to a ground structure of a semiconductor chip test socket, and a semiconductor chip test socket having the same, the ground structure: preventing the ground structure made of a soft material and mounted in a...  
WO/2018/033380A1
The invention relates to a measuring arrangement (12) for measuring an electric current (I) in the high-current range, in particular in the current range of more than 1 kA, having a low-resistance current measuring resistor (1) for measu...  
WO/2018/034096A1
An electric connection device 1 is provided with: a probe substrate 16; a probe 20 including a linear body part 21 having a leading end 20a that comes into contact with an object to be inspected and having a base end 20b that is in conta...  
WO/2018/035054A1
Systems and methods for testing semiconductor wafers are disclosed herein. In one embodiment, an apparatus for testing dies of a semiconductor wafer includes a composite space transformer for contacting the dies. The composite space tran...  
WO/2018/030438A1
Provided is a conduction inspection device member: that has conductive parts that do not readily crack or develop voids; that does not readily experience impairment of conductive performance, even after repeated conduction inspections; a...  
WO/2018/029155A1
It is herein described a contact probe (20) of a testing head of an apparatus for testing electronic devices comprising a probe body (20C) being extended in a longitudinal direction between respective end portions (20A, 20B) adapted to r...  
WO/2018/025683A1
A probe card (100) according to the present invention inspects a work (50) that has a plurality of pads (51). The probe card (100) is provided with: a planar secondary battery (10) that comprises a planar electrode (22) and is arranged s...  
WO/2018/026946A1
A method is provided for performing continuous single insertion semiconductor testing of a group of semiconductors that are divided into a first subgroup and a second subgroup at multiple different temperatures. The single insertion semi...  
WO/2018/021661A1
The present invention relates to a current measuring apparatus using a shunt resistor and, more particularly, to a current measuring apparatus using a shunt resistor, which can reduce the volume and price of a battery module and a batter...  
WO/2018/019866A1
The invention describes a testing head (21) of an apparatus for testing electronic devices comprising a plurality of contact probes (22) inserted into guide holes realized in at least one upper support (23) and one lower support (24), a ...  
WO/2018/021088A1
An electrical connection device 10 comprises a plurality of probes 20, a probe substrate 16 that is connected to a base end 20b of the plurality of probes 20, and a probe support 18 that prevents interference between adjacent probes of t...  
WO/2018/021140A1
This inspection jig, which is for bringing a probe Pr into contact with an inspection point provided on a substrate to be inspected, is provided with: an inspection-side support having a counter plate 51 provided with a facing surface F ...  
WO/2018/019863A1
The invention describes a probe card (20) for a testing equipment of electronic devices comprising at least one testing head (21) with a plurality of contact probes (22) inserted into guide holes being realized in at least one upper guid...  
WO/2018/019501A1
The invention relates to a spacer (128) for electrically insulating an energizable connection bolt (116) of an annular current sensor (108), wherein the spacer (128) has an annular insulating body, which can be arranged in a gap between ...  
WO/2018/019132A1
A chip test fixture comprises a base (100) and a fine adjustment structure (210, 220). The base (100) is provided with an accommodating structure (310, 320). The accommodating structure (310, 320) is used for placing a calibration member...  
WO/2018/021216A1
This inspection jig is provided with: a plurality of substantially bar-shaped probes Pr for bringing leading end portions Pra thereof into contact with a plurality of inspection points of a substrate 100, respectively; a supporting membe...  
WO/2018/021729A1
The present invention relates to a connector pin apparatus for semiconductor chip testing, and a method for manufacturing same, the connector pin apparatus enabling a semiconductor chip to have reliable and stable electrical properties a...  
WO/2018/020043A1
The invention concerns a sensing device comprising: - a voltage sensor, the voltage sensor comprising a reference plate and a sensing plate, the reference plate and the sensing plate being ring-shaped, concentric and arranged at a distan...  
WO/2018/010863A1
The invention relates to a method for determining the internal resistance of battery cells (10) of a battery module (1), wherein for this purpose a cell voltage of a battery cell (10) is determined as a voltage of the respective electroc...  
WO/2018/010996A1
The invention relates to a resistor (1), in particular a low-resistance current-sensing resistor (1), comprising two connection parts (2, 3) made of a conductive material and a resistor element (4) introduced between the connection parts...  
WO/2018/009940A1
Systems and methods for testing semiconductor wafers are disclosed herein. In one embodiment, an apparatus for testing dies on a semiconductor wafer includes a test contactor for contacting the dies. The test contactor has a substrate ha...  
WO/2018/009929A1
A mounting mechanism comprising: a first end and a second end; and a shaft extending from the first end to the second end, the shaft including: a peripheral wall; threading extending along at least a portion of the peripheral wall of the...  
WO/2018/003640A1
The purpose of the present invention is to achieve a coaxial connector for inspection with longer service life. In this coaxial connector for inspection, an outer conductor includes a tubular first and second housing which extend in the ...  
WO/2018/003816A1
[Problem] To form a rotation stopper inexpensively in a contact pin which is disposed in a socket main body and which electrically connects an IC package to a wiring board. [Solution] This contact pin includes a barrel, an upper contacti...  
WO/2018/005007A1
An apparatus for testing a die can comprise a first printed circuit board (PCB), a space transformer, and a plurality of probes. The first PCB can be configured to connect to a second PCB. The space transformer can be attached to the PCB...  
WO/2018/003507A1
[Problem] To provide an electrical contacting device with which stable electrical contact with an electrode pad for a grounding connection can be achieved while reducing a pushing-in load. [Solution] An electrical connecting device accor...  
WO/2018/003639A1
The purpose of the present invention is to provide a coaxial connector for inspection which can suppress transmission of high-frequency signals in the reverse direction, and a center conductor. This coaxial connector for inspection is pr...  
WO/2017/222757A1
A dipole antenna includes a feed line, first and second microstrip probes, a first signal transmission line coupled to the feed line and to the first microstrip probe, and a second signal transmission line coupled to the feed line and to...  
WO/2017/222833A1
Certain aspects relate to systems and usage techniques for modular lateral flow assay reader devices that can receive a number of different modules having a barcode scanning input device and optional network connectivity capabilities. A ...  
WO/2017/222116A1
Provided is a standard sample for calibration of nanoscale analysis equipment, comprising: a glass substrate; a plurality of pad parts arranged on the glass substrate and to which a preset predetermined voltage is applied; a pattern part...  
WO/2017/219707A1
A circuit for eliminating electromotive force of contacts of a relay comprises a capacitor (C) and a double-pole double-throw relay (RL). The double-pole double-throw relay (RL) comprises a first moveable contact (1), a second moveable c...  
WO/2017/217042A1
This probe pin (10) is provided with: an elastic part (20); a first contact part (30) provided with a pair of leg parts (32, 33) which extend along the longitudinal direction from one end of the elastic part (20), and are capable of bend...  
WO/2017/217043A1
This socket (1) is provided with: a pair of housings (10, 10) which are respectively provided with accommodating recesses (20) capable of accommodating and holding contact elements (2) each having a first contact point (4) at one end and...  
WO/2017/217041A1
This probe pin (10) is provided with: an elastic part (20); a first contact part (30) provided with a pair of leg parts (32, 33) which extend along the longitudinal direction from one end of the elastic part (20), and are capable of bend...  
WO/2017/215170A1
A non-contact sensor circuit, the circuit comprising a capacitor C2, a resistor R1, a resistor R2 and an operational amplifier A, wherein one end of the capacitor C2 is connected to an in-phase input end of the operational amplifier A, a...  
WO/2017/218158A1
Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly, in another embodiment, the...  
WO/2017/212814A1
This inspection jig (3) comprises: an electrode (34a); a probe (Pr) having a front end section (P1) and a rear end section (P2), which are adapted to make contact with a bump (BP) of an object (101) to be inspected; and a support member ...  
WO/2017/213387A1
A rubber socket comprises a lower film, an upper film, an electrical connection member, and a rubber layer. The lower film comprises a plurality of lower electrode parts coupled to a synthetic resin film. The upper film is arranged in pa...  
WO/2017/212266A1
An Electrical Clamp An electrical clamp for use with electrical meters, the clamp comprising a pair of opposed body members, a pair of electrical contact elements and a biasing element; wherein each electrical contact element is coupled ...  
WO/2017/209357A1
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method for preparing same. A bidirectional conductive pin, according to the present invention, comprises: an upper contact p...  
WO/2017/208690A1
[Problem] To provide a contact conduction jig and an inspection device which easily improve the ability to absorb variations in height of an object to be in contact with. [Solution] An inspection jig 3 is provided with: a support plate 3...  
WO/2017/210108A1
Apparatus and methods provide burn-in testing for semiconductors. A burn-in test apparatus (1) may include an outer housing forming an aperture with a test socket to receive a tile or wafer. The tile or wafer may include semiconductor de...  
WO/2017/207838A1
The invention relates to an open-centre three-phase current transformer, which comprises three individual current sensors accommodated in the same casing, and which can be separated into two parts, either completely or by rotating said p...  
WO/2017/209356A1
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method for preparing same. A bidirectional conductive pin, according to the present invention, comprises: a pin body formed ...  
WO/2017/209872A1
A probe for identifying and measuring volume fraction constituents of a fluid using time domain analysis and frequency domain analysis to identify individual volume fraction constituents within a pipe on a real time basis and to measure ...  
WO/2017/207258A1
The invention relates to a contacting assembly for circuit boards comprising a compressible electrical conductor and a receiving plate, wherein the conductor has a first end region, a second end region and a bent region, which is designe...  
WO/2017/203876A1
In high-frequency-probe positioning in position calibration carried out in conventional high-frequency characteristic inspection, a prescribed standard pattern for standard alignment is used and probe positions are determined using a mic...  

Matches 501 - 550 out of 27,782