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Matches 501 - 550 out of 27,016

Document Document Title
WO/2016/087369A2
It is described a testing head (20) comprising vertical probes including at least one guide (22) provided with guide holes (22A) for housing a plurality of contact probes (21), each of the contact probes (21) having at least one contact ...  
WO/2016/085206A1
Disclosed herein is a test handler. In accordance with an embodiment of the present invention, the test handler comprises: a loading device configured to load electronic components into a test tray; a test chamber including a tester conf...  
WO/2016/085135A1
The present invention relates to a handler for testing an electronic component. The handler for testing an electronic component, according to the present invention, is provided with a cooling pocket in a pushing head of a connection unit...  
WO/2016/082439A1
A probe component and a detection apparatus comprising same. The probe component is configured for detecting a display panel and comprises a first probe area (2) corresponding to leads (13) in the display panel, wherein a probe (1) is ar...  
WO/2016/080670A1
The present invention relates to a test tray for a test handler and an interface board for a tester. According to the present invention, a secondary calibration hole is additionally formed in an insert of a test tray, and a secondary cal...  
WO/2016/076671A1
According to the present invention, provided are a method and an apparatus for testing a flexible element, the method comprising: a step for fixing, to a main body unit, a flexible element to be measured; a step for making an electrical ...  
WO/2016/074907A1
A measuring circuit (1) for measuring and evaluating a voltage (U) to be measured comprises a circuit input (2) designed to feed the voltage (U) to be measured to the measuring circuit (1) as an analog signal (A), a first analog to digit...  
WO/2016/077217A1
An example process places dice that have been cut from a first semiconductor wafer on a second wafer. The example process includes arranging the dice in a pattern on a the second wafer, where the second wafer has a coefficient of thermal...  
WO/2016/073042A1
A solderless test fixture (10), including a conductive base (12), a clamp (14), and a connector (16) is described. The conductive base has at least one cable groove (20) with a cable grounding portion (22). A clamp is mounted on the base...  
WO/2016/072187A1
Provided are a cassette and an inspection unit whereby a coaxial connector for inspection can be fitted to a receptacle, even if there is displacement between the coaxial connector for inspection and the receptacle. This cassette is prov...  
WO/2016/072193A1
The purpose of the present invention is to provide a probe whereby increased density of electronic components, being the measurement target, is possible on a circuit board. The probe (1) is capable of simultaneously measuring a plurality...  
WO/2016/073020A3
The present invention is directed towards a mobile apparatus mounted to a motor vehicle for detecting energized objects. In some embodiments, the mobile apparatus comprising two or more photonic sensors, mounted to the motor vehicle, and...  
WO/2016/073020A2
The present invention is directed towards a mobile apparatus mounted to a motor vehicle for detecting energized objects. In some embodiments, the mobile apparatus comprising two or more photonic sensors, mounted to the motor vehicle, and...  
WO/2016/068541A1
The present invention relates to an electrical connector for electrically connecting a device to be tested with a testing device, and a manufacturing method therefor, wherein the electrical connector improves high-current characteristics...  
WO/2016/065723A1
A high frequency cable testing platform, comprising: a conductive contact (30) and a clamp (2) for pressing a conductor of a cable (4) against the conductive contact (30), and further comprising a wire splitting base (1), the wire splitt...  
WO/2016/055277A1
The invention relates to a device for ascertaining a current strength of an electric current (I) flowing through a conductor track (3) of a printed circuit board (1). At least one section of the at least one conductor track (3) has a res...  
WO/2016/055796A1
A current measurement circuit suitable for measuring the flow of current along a path in an electrical circuit such as a part of an electric power assisted steering system comprises a current measurement resistor that is located in serie...  
WO/2016/053743A1
A system and method of detecting, quantifying, and characterizing corrosion and degradation of an article, includes receiving signals indicative of a stack of images of a surface of the article; determining depth and nature of features i...  
WO/2016/048626A1
Flexible film electrical-test substrates with at least one conductive contact post for integrated circuit (IC) bump(s) electrical testing, and related methods and testing apparatuses are disclosed. The backside structure of an electrical...  
WO/2016/047857A1
The present invention relates to a battery charging/discharging pin preventing a lack of contact or non-uniform contact by being naturally tilted so as to correspond to and fit with the surface of an electrode of a battery even when the ...  
WO/2016/047963A1
Disclosed is a contact probe for a high current, which electrically connect a contact point of an object to be tested and a contact point of a test circuit. The contact probe comprises a first plunger configured to be in contact with the...  
WO/2016/045840A1
The invention is directed to a cable assembly (1) comprising a coaxial cable (2) with an inner conductor (3) and a shield (4) and a dielectric (5) arranged between the inner conductor (3) and the shield (4). The cable assembly (1) furthe...  
WO/2016/043327A1
In this probe unit that houses multiple contact probes for electrically connecting a test object and a signal processing device that outputs test signals, the probe unit is configured so that large current probes (3) electrically connect...  
WO/2016/044786A1
A probe card assembly is disclosed. The probe card assembly includes a probe card plate, a probe core, and an expansion gap defined in the probe card plate, The probe core includes a bonding portion for fixing the probe core to the probe...  
WO/2016/043814A1
A test fixture used to calibrate an electronic device is disclosed. The test fixture includes several modules positioned on a rack. The modules may include either a conductive rubber or light-absorbing material. An actuator connected to ...  
WO/2016/042109A1
The invention relates to a method for calibrating a current sensor (20) in a vehicle (2), said sensor being designed to measure an electric current (6) through a measuring resistor (28) on the basis of a voltage drop (32) across the meas...  
WO/2016/042091A1
The invention relates to a first method for calibrating a current sensor (4) which is configured to determine, in an on-board power system (2) of a vehicle, an electric operating current (12) which flows through a measuring resistor (20)...  
WO/2016/041658A1
The invention relates to a method for calibrating a current sensor (20) in a vehicle (2), said sensor being designed to measure an electric current (6) through a measuring resistor (28) on the basis of a voltage drop (32) across the meas...  
WO/2016/031512A1
In the present invention, an inspection terminal unit is provided with: at least two inspection pins (20) having, at one end, a contact part that comes into contact with an element to be inspected and having, at the other end, a connecti...  
WO/2016/027953A1
Disclosed is a test socket for inspecting an electronic device that is particular about properties. The test socket for inspecting electric properties of a subject includes a plurality of probes configured to be retractable in an inspect...  
WO/2016/026707A1
A test head is provided for contacting at least one electrically conductive region of a contact partner having a housing, the outer contour of which is adapted to the inner contour or the receiving region in order to be inserted into a r...  
WO/2016/028883A1
A probe for automatic test equipment (ATE) includes: an outer shroud including a course alignment feature configured to receive a target device and to guide the target device into an interior of the outer shroud, where the target device ...  
WO/2016/024542A1
 When a first housing 11 and a second housing 13 are placed in a second orientation during a procedure of attachment to an electrical cable, the rotational positions of the first housing 11 and the second housing 13 are prescribed such...  
WO/2016/025727A3
Embodiments of the present invention relate to an apparatus. In an embodiment, the apparatus comprises a sensor comprised of a printed graphene-based circuit. An electronic device is in communication with the sensor. A radio transponder ...  
WO/2016/024534A1
This invention provides a probe card that makes it possible to reduce the repair cost incurred when an unexpectedly large current flows through a power-supply line. Said probe card 1a, which is used when electrically testing a device und...  
WO/2016/021723A1
A contact probe of the present invention is a needle-like conductive connecting terminal that can extend and retract in the longitudinal direction. The connecting terminal is provided with: a first plunger, which has a first leading end ...  
WO/2016/015842A1
The invention relates to a U-shaped resistor (1), in particular a low-resistance current-measuring resistor (1), comprising a first connection part (2) made of a conductive material having a first current contact surface for conducting a...  
WO/2016/014896A1
A sachet includes a first wing made of a flexible material and having a first perimeter region circumscribing a first central region; a second wing made of the flexible material; a hinge connecting the first and second wings along a comm...  
WO/2016/011664A1
A high-temperature test fixture. The fixture comprises at least three noble metal electrodes (11, 12, 13) arranged in parallel, noble metal wires (1, 2, 5) and a thermocouple for measuring the temperature of a material to be tested. The ...  
WO/2016/014906A1
A test instrument for use with a sample having a plurality of electrically conducting contact pads, the instrument including: a controllable, variable force linear actuator; a probe assembly operated by the linear actuator, the probe ass...  
WO/2016/009293A1
A contact probe for a testing head of an apparatus for testing electronic devices is described comprising a body extending between a contact tip and a contact head, that contact probe comprising at least one first section and one second ...  
WO/2016/010928A3
A transformer-less method and system for voltage and current sensing using voltage drops across resistors is disclosed. Using optically coupled isolators, the sensed voltages in the high voltage power lines are optically coupled and elec...  
WO/2016/010383A1
A test socket is configured to be disposed between a test target device and a test apparatus for electrically connecting terminals of the test target device to pads of the test apparatus. The test socket includes: a support sheet formed ...  
WO/2016/008406A1
A self-compensation device and method for a BGO crystal electro-optic coefficient temperature correlation. The device comprises a Faraday collimation rotator, a quartz tube (4), an antireflection film (7), a reflecting film (8), a BGO cr...  
WO/2016/003184A1
The present invention relates to a probe kit for checking whether an LED is good or bad and, more specifically, to an LED probe kit assembly that includes first and second terminals, which are equipped to a body and a probe pin provided ...  
WO/2015/197301A1
The invention provides a method of manufacturing a contactor body having contact tips configured for temporarily contacting respective contact areas of a semiconductor device, the method of manufacturing the contactor body comprising the...  
WO/2015/200724A1
A method for probing a semiconductor device under test (DUT) using a combination of scanning electron microscope (SEM) and nanoprobes, by: obtaining an SEM image of a region of interest (ROI) in the DUT; obtaining a CAD design image of t...  
WO/2015/200719A1
System for performing in-line nanoprobing on semiconductor wafer. A wafer support or vertical wafer positioner is attached to a wafer stage. An SEM column, an optical microscope and a plurality of nanoprobe positioners are all attached t...  
WO/2015/196875A1
A battery test platform (10),comprising a battery rack frame (110), a plurality of battery rack baffles (120) and a controller (130). Each battery rack baffle (120) comprises a plurality of battery test units, each battery test unit comp...  
WO/2015/194882A1
The present invention relates to an indirect contact probing system and a probing method using the same which can stably and quickly test semiconductor device characteristics of through electrodes, integrated circuits or memory devices o...  

Matches 501 - 550 out of 27,016