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Patent Searching and Data


Matches 701 - 750 out of 26,928

Document Document Title
WO/2014/009980A1
An interface board (50) of a testing head (31) for a test equipment of electronic devices is described, such a testing head (31) comprising a plurality of contact probes (34), each contact probe (34) having at least one contact tip suita...  
WO/2014/010410A1
A shunt resistance type current sensor(1 ) includes a bus bar(10) that has an approximately flat plate shape, a circuit board(20) that is installed to the bus bar, a pair of connecting terminal portions (40)that electrically connects the...  
WO/2014/009542A2
For a device for producing and/or processing a workpiece, in particular circuit boards (1), in a work station (2), in particular for printing on a corresponding blank or for checking finished circuit boards (1), at least one mark (15) is...  
WO/2014/009980A8
An interface board (50) of a testing head (31) for a test equipment of electronic devices is described, such a testing head (31) comprising a plurality of contact probes (34), each contact probe (34) having at least one contact tip suita...  
WO/2014/001528A1
A solution for testing a set of one or more electronic device (105) is disclosed. A corresponding test board (100) comprises a support substrate (205), a set of one of more sockets (210) being mounted on the support substrate each one fo...  
WO/2014/003003A1
The present invention extends the life and reduces the cost of an electrical test contact, which is used for a conduction test of a device under test, such as an integrated chip (IC), in a high temperature environment. The electrical tes...  
WO/2014/000854A1
The invention relates to a resistor, in particular a low-resistance current-measuring resistor, comprising a first connection part (1) that consists of a conductor material for introducing an electrical current (I), a second connection p...  
WO/2013/192322A2
A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). The elastomer is pre...  
WO/2013/190844A1
Provided are a probe card-securing device, a probe inspection device, a probe inspection method, and a probe card, in which fluctuations in the distal end position of the probe needle caused by thermal expansion of the probe card and the...  
WO/2013/191432A1
The present invention relates to a test socket that is disposed between a blood test device and a test apparatus to electrically connect a terminal of the blood test device and a pad of the test apparatus with each other. Conduction unit...  
WO/2013/190025A1
A multipoint probe for establishing an electrical connection between a test apparatus and a test sample, the multipoint probe comprising a base defining a top surface and a plurality of traces provided on the top surface, each trace indi...  
WO/2013/192322A3
A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). The elastomer is pre...  
WO/2013/190952A1
Provided is an inspection device capable of uniformly supplying an antioxidant gas to the tips of a large number of probe needles disposed across a wide area. An inspection device for performing an electrical inspection of an inspection ...  
WO/2013/192374A2
A disassociated split sensor coil manufactured from hemi-toroidal cores. The cores each include a surface channel extending from end to end, with wire sections being wound about core to form helical sensor coils electrically connected to...  
WO/2013/187611A1
Disclosed are a test probe and a machining method of a test probe, the test probe including a plunger end part contacting a tested contact point, the plunger end part including a plurality of tips protruding toward the tested contact poi...  
WO/2013/182317A8
Herein described is a probe card for an apparatus for testing electronic devices, of the type comprising at least one probe head (21) which houses a plurality of contact probes (22), each contact probe (22) having at least one contact ti...  
WO/2013/183484A1
[Problem] An electrical contactor which is prevented from adhering to a terminal of an electrical part after a continuity test and thus exhibits improved durability; and a socket for an electrical part, using the electrical contactor. [S...  
WO/2013/182317A1
Herein described is a probe card for an apparatus for testing electronic devices, of the type comprising at least one probe head (21) which houses a plurality of contact probes (22), each contact probe (22) having at least one contact ti...  
WO/2013/176445A1
A probe card for inspecting semiconductor devices on a wafer comprises: a probe substrate on which a plurality of probes for inspecting the semiconductor devices are mounted; a printed circuit board which is arranged on the upper part of...  
WO/2013/176446A1
The present invention relates to a probe card for inspecting semiconductor devices. The probe card includes: a probe substrate having a bottom surface on which probes are mounted and a through hole respectively corresponding to the probe...  
WO/2013/171300A1
The invention relates to a spring contact structure for contacting an electronic assembly and at least one contact element of an electric or electronic component, wherein the contact element is a projecting metallically conducting elemen...  
WO/2013/168921A1
The method for manufacturing the lower contact terminal of a probe pin according to the present invention is a method for manufacturing the lower contact terminal of a probe pin used for electronic component meter-reading that comprises:...  
WO/2013/169608A1
A contact probe comprises conductively coupled plungers and a coil spring. The plungers have coupling means which enable them to be slidably and non-rotatably engaged. The spring is attached to the plungers in a manner that prevents rota...  
WO/2013/169783A1
A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins ...  
WO/2013/165174A1
The present invention relates to a test probe and a manufacturing method for the test probe and, more specifically, to a test probe and a manufacturing method for the test probe, wherein the test probe which is used to electrically conne...  
WO/2013/160118A1
The invention relates to a measuring device (100, 200) for detecting and displaying electric variables, in particular for detecting and displaying voltage, current, and/or resistance values. The measuring device (100, 200) has (a) a hous...  
WO/2013/161068A1
This battery monitoring device, which monitors a cell group comprising multiple single cells connected in series, is provided with a reference voltage generating circuit for generating a variable reference voltage, a switching circuit wh...  
WO/2013/159235A1
There is described a system to measure the electrical consumption of a household. This system consists of a network of measuring devices that are attached to wires between electrical appliances and circuit breakers and of a communication...  
WO/2013/155677A1
A voltage application device (300) of a liquid crystal substrate comprises a base (320), a probe platform (340), and multiple probes (360). The base (320) comprises a first sliding rail (325); the probe platform (340) is movably arranged...  
WO/2013/157033A1
[Problem] To provide a Kelvin contact probe and a Kelvin inspection fixture provided with same capable of coping with the narrowing of electrode spacing regardless of the shape of the electrode of the unit to be inspected, and capable of...  
WO/2013/154738A1
A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a ...  
WO/2013/151316A1
The present invention relates to a test socket having a high-density conductive unit, and to a method for manufacturing same, and more particularly, to a test socket interposed between a device to be tested and a test device so as to ele...  
WO/2013/143768A1
The present invention relates to an electronic battery sensor for detecting the state of a battery, having a shunt resistor and a printed circuit board (100) with a measuring circuit, wherein the shunt resistor is in the form of a measur...  
WO/2013/140699A1
Disclosed are: an electric contact (14), which has improved durability by preventing a terminal (2a) of an electric component and the electric contact (14) from sticking to each other after continuity test; and a socket (10) for electron...  
WO/2013/142806A1
A method for testing a semiconductor device. The method comprises moving a probe in a vertical direction towards an electrical structure on a semiconductor device to position the probe alongside the electrical structure. A tip of the pro...  
WO/2013/142662A2
Radio-frequency (RF) integrated circuit (RFIC) chip(s) allow for the integration of multiple electronic circuits on a chip to provide distributed antenna system functionalities. RFIC chips are employed in central unit and remote unit com...  
WO/2013/139547A1
The present invention relates to an electronic battery sensor for detecting the state of a battery, having a shunt resistor (220) and a printed circuit board (200) having a measuring circuit, wherein the shunt resistor (220) is formed as...  
WO/2013/142036A1
Calibrating automatic test systems for testing electronic components using Kelvin probes is taught. A nominal contact resistance of a Kelvin probe is measured using a test slug to replace an electronic component to be measured on the tes...  
WO/2013/134993A1
The present invention relates to a laser pointer-type ammeter structure comprising an ammeter housing. A curved scale line is provided on an inner-end face of the ammeter housing. A deflection mechanism is arranged directly beneath a cen...  
WO/2013/134564A1
Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) ...  
WO/2013/131665A1
The invention relates to an electronic battery sensor (100) for status recognition of a battery having a shunt resistor (110) and a circuit board (112) having a measuring circuit, wherein the shunt resistor (110) has a recess (115) and c...  
WO/2013/133809A1
An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. ...  
WO/2013/134568A1
Shielded probe array. In accordance with a first embodiment, an article of manufacture includes a plurality of rows of electronic probes. Each row of probes is substantially in a plane. Each probe includes a metal signal layer and a grou...  
WO/2013/131651A1
The present invention relates to a device for measuring electronic components having a plurality of conductors applied to a dielectric cable carrier, which conductors are each connected both to a contact finger and to a connection contac...  
WO/2013/134561A1
Fine pitch probe array from bulk material. In accordance with a first method embodiment, an article of manufacture includes an array of probes. Each probe includes a probe tip, suitable for contacting an integrated circuit test point. Ea...  
WO/2013/134422A1
A probe assembly includes plural capacitive contacts that are separate from each other and a conductive depletion gate disposed between and separating the contacts from each other. The depletion gate is configured to receive a direct ele...  
WO/2013/130736A1
A variable pressure probe pin device, including: a housing with a channel having a first longitudinal axis; a probe at least partially disposed in the channel and including a plurality of probe pins configured to measure a property of a ...  
WO/2013/126016A1
The present invention provides a test socket adaptable for testing different Integrated Circuit (IC) pad size during an IC testing. The test socket comprising a molded socket having an inner space and a plurality of through-apertures dis...  
WO/2013/124002A1
The invention relates to an adapter for a differential signal measuring scanning head, consisting of two electrically conductive measuring contact elements (5), each for the detection of a partial signal of the differential signal, which...  
WO/2013/119014A1
Disclosed is an electrode pattern test apparatus capable of performing an electrical test on an electrode pattern formed on a high resolution glass panel in a stable and quick manner. The electrode pattern test apparatus performs an elec...  

Matches 701 - 750 out of 26,928