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Patent Searching and Data


Matches 851 - 900 out of 27,268

Document Document Title
WO/2013/171300A1
The invention relates to a spring contact structure for contacting an electronic assembly and at least one contact element of an electric or electronic component, wherein the contact element is a projecting metallically conducting elemen...  
WO/2013/168921A1
The method for manufacturing the lower contact terminal of a probe pin according to the present invention is a method for manufacturing the lower contact terminal of a probe pin used for electronic component meter-reading that comprises:...  
WO/2013/169608A1
A contact probe comprises conductively coupled plungers and a coil spring. The plungers have coupling means which enable them to be slidably and non-rotatably engaged. The spring is attached to the plungers in a manner that prevents rota...  
WO/2013/169783A1
A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins ...  
WO/2013/165174A1
The present invention relates to a test probe and a manufacturing method for the test probe and, more specifically, to a test probe and a manufacturing method for the test probe, wherein the test probe which is used to electrically conne...  
WO/2013/160118A1
The invention relates to a measuring device (100, 200) for detecting and displaying electric variables, in particular for detecting and displaying voltage, current, and/or resistance values. The measuring device (100, 200) has (a) a hous...  
WO/2013/161068A1
This battery monitoring device, which monitors a cell group comprising multiple single cells connected in series, is provided with a reference voltage generating circuit for generating a variable reference voltage, a switching circuit wh...  
WO/2013/159235A1
There is described a system to measure the electrical consumption of a household. This system consists of a network of measuring devices that are attached to wires between electrical appliances and circuit breakers and of a communication...  
WO/2013/155677A1
A voltage application device (300) of a liquid crystal substrate comprises a base (320), a probe platform (340), and multiple probes (360). The base (320) comprises a first sliding rail (325); the probe platform (340) is movably arranged...  
WO/2013/157033A1
[Problem] To provide a Kelvin contact probe and a Kelvin inspection fixture provided with same capable of coping with the narrowing of electrode spacing regardless of the shape of the electrode of the unit to be inspected, and capable of...  
WO/2013/154738A1
A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a ...  
WO/2013/151316A1
The present invention relates to a test socket having a high-density conductive unit, and to a method for manufacturing same, and more particularly, to a test socket interposed between a device to be tested and a test device so as to ele...  
WO/2013/143768A1
The present invention relates to an electronic battery sensor for detecting the state of a battery, having a shunt resistor and a printed circuit board (100) with a measuring circuit, wherein the shunt resistor is in the form of a measur...  
WO/2013/140699A1
Disclosed are: an electric contact (14), which has improved durability by preventing a terminal (2a) of an electric component and the electric contact (14) from sticking to each other after continuity test; and a socket (10) for electron...  
WO/2013/142806A1
A method for testing a semiconductor device. The method comprises moving a probe in a vertical direction towards an electrical structure on a semiconductor device to position the probe alongside the electrical structure. A tip of the pro...  
WO/2013/142662A2
Radio-frequency (RF) integrated circuit (RFIC) chip(s) allow for the integration of multiple electronic circuits on a chip to provide distributed antenna system functionalities. RFIC chips are employed in central unit and remote unit com...  
WO/2013/139547A1
The present invention relates to an electronic battery sensor for detecting the state of a battery, having a shunt resistor (220) and a printed circuit board (200) having a measuring circuit, wherein the shunt resistor (220) is formed as...  
WO/2013/142036A1
Calibrating automatic test systems for testing electronic components using Kelvin probes is taught. A nominal contact resistance of a Kelvin probe is measured using a test slug to replace an electronic component to be measured on the tes...  
WO/2013/134993A1
The present invention relates to a laser pointer-type ammeter structure comprising an ammeter housing. A curved scale line is provided on an inner-end face of the ammeter housing. A deflection mechanism is arranged directly beneath a cen...  
WO/2013/134564A1
Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) ...  
WO/2013/131665A1
The invention relates to an electronic battery sensor (100) for status recognition of a battery having a shunt resistor (110) and a circuit board (112) having a measuring circuit, wherein the shunt resistor (110) has a recess (115) and c...  
WO/2013/133809A1
An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. ...  
WO/2013/134568A1
Shielded probe array. In accordance with a first embodiment, an article of manufacture includes a plurality of rows of electronic probes. Each row of probes is substantially in a plane. Each probe includes a metal signal layer and a grou...  
WO/2013/131651A1
The present invention relates to a device for measuring electronic components having a plurality of conductors applied to a dielectric cable carrier, which conductors are each connected both to a contact finger and to a connection contac...  
WO/2013/134561A1
Fine pitch probe array from bulk material. In accordance with a first method embodiment, an article of manufacture includes an array of probes. Each probe includes a probe tip, suitable for contacting an integrated circuit test point. Ea...  
WO/2013/134422A1
A probe assembly includes plural capacitive contacts that are separate from each other and a conductive depletion gate disposed between and separating the contacts from each other. The depletion gate is configured to receive a direct ele...  
WO/2013/130736A1
A variable pressure probe pin device, including: a housing with a channel having a first longitudinal axis; a probe at least partially disposed in the channel and including a plurality of probe pins configured to measure a property of a ...  
WO/2013/126016A1
The present invention provides a test socket adaptable for testing different Integrated Circuit (IC) pad size during an IC testing. The test socket comprising a molded socket having an inner space and a plurality of through-apertures dis...  
WO/2013/124002A1
The invention relates to an adapter for a differential signal measuring scanning head, consisting of two electrically conductive measuring contact elements (5), each for the detection of a partial signal of the differential signal, which...  
WO/2013/119014A1
Disclosed is an electrode pattern test apparatus capable of performing an electrical test on an electrode pattern formed on a high resolution glass panel in a stable and quick manner. The electrode pattern test apparatus performs an elec...  
WO/2013/117265A1
A nest (1) comprising, a fix part (3), and a movable part (5), wherein the fix (part 3) and movable part (5) are configured to cooperate so as to define a (pocket 7) which can receive at least a part of an electrical component (25), wher...  
WO/2013/116077A1
A contact probe and method of forming the same are provided, where the contact probe can include a shell including a body having a shell cavity. The contact probe can also include at least one plunger slidably received in the shell cavit...  
WO/2013/108759A1
Provided are: a space transformer that has a coefficient of thermal expansion close to silicon, and that has a simple structure and is suitable for large diameters; and a probe card equipped with said space transformer. Enstatite and bor...  
WO/2013/077746A3
Device (11) for monitoring power lines, which device (11) includes a housing (12), which has a mainly elongated tubular shape, and which device (11) is provided with means for measuring electrical and/or mechanical properties of a power ...  
WO/2013/049147A3
An electrically conductive probe can comprise a post to which a beam structure is attached. The beam structure can comprise a cantilevered portion that extends away from the post to a free end to which a contact structure can be attached...  
WO/2013/082422A8
A system for measuring electrical properties of a power line comprising a first wire and a second wire. The system comprises a sensor unit configured for connection to the first wire; and an elongated resistive element comprising a first...  
WO/2013/103681A1
The elongated body of an electrically conductive contact probe can be disposed in a guide hole and can include a patterned region for engaging and riding on a contact region of an inner sidewall of the guide hole as the elongated body mo...  
WO/2013/101226A1
An apparatus comprising a robot; an end effector coupled to the robot and configured to grasp or transfer a probe of a size for use in a probe card; and instructions stored on a machine readable medium coupled to the robot, the instructi...  
WO/2013/100064A1
Provided is an electrical contact that enables reliable contact between a plunger and a contact spring and ensures smooth operation (up and down action)of a plunger. By means of this electrical contact, electrical tests of electrical par...  
WO/2013/101238A1
The formation of test probe structures is described. One test probe structure includes a tip portion and a handle portion spaced a distance away from the tip portion. The test probe structure also includes a body bend portion positioned ...  
WO/2013/100560A1
The present invention relates to an electrical contactor and a method for manufacturing the electrical contactor. More particularly, the present invention relates to an electrical contactor for electrically connecting a terminal of a blo...  
WO/2013/102115A2
A method and program for minimizing objectionable currents while still providing neutral-to-ground voltage measurements by controlling a switch to determine when the neutral-to-ground impedance is placed in an electrical circuit.  
WO/2013/101240A1
Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other e...  
WO/2013/087342A1
A current measuring circuit for redundantly measuring electrical current using a measuring resistor (16), a magnetic field sensor (20) and an evaluation circuit on an evaluation circuit board (18) is proposed, wherein the evaluation circ...  
WO/2013/086729A1
Disclosed is a test system, comprising a thin-film transistor substrate; the thin-film transistor substrate comprises a plurality of thin-film transistors and a plurality of bond pads; each thin-film transistor comprises a first electrod...  
WO/2013/037807A3
The invention relates to a method for a temporary electrical contact of a component arrangement (9) comprising a plurality of contact surfaces (93, 94). A connection board (1) having a plurality of connection surfaces (11, 12), on which ...  
WO/2013/038176A3
The present invention relates to current measurement apparatus (100). The current measurement apparatus (100) comprises a measurement arrangement (110, 114) which is configured to be disposed in relation to a load (108) which draws a cur...  
WO/2013/084874A1
Provided is a probe card for wafer bulk tests. In wafer tests, the probe card stably contacts electrode pads of a wafer at low contact pressure. The probe card comprises the following: a frame plate (1) that has a plurality of through ho...  
WO/2013/083933A1
The invention relates to a device (11) for checking electronic cards (14) comprising a base (12) in which conductive nails (13) are arranged pointing (17) upwards, and a cover (15), also fitted with nails (13) pointing (17) downwards in ...  
WO/2013/046985A9
A method for manufacturing a contact probe (10) is provided with the following steps: a lithography step for obtaining a resin mold by forming, in a resist formed on a conductive substrate, the pattern of a contact probe (10), the patter...  

Matches 851 - 900 out of 27,268