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Patent Searching and Data


Matches 151 - 200 out of 22,311

Document Document Title
WO/2023/189160A1
The purpose of the present invention is to provide an alloy material for probe pins that makes it possible to suppress diffusion of components of a probe material and solder at a circuit connection part which is to be tested when a probe...  
WO/2023/188999A1
This probe pin (20) is constituted from a low-resistance member (L) comprising an electroconductive first metal, and a high-resistance member (H) comprising an electroconductive second metal that has a resistivity lower than that of the ...  
WO/2023/190832A1
A rhenium-tungsten alloy wire according to an embodiment is formed of a tungsten alloy containing rhenium, in which, in an arbitrary measurement area in which a unit area on the wire surface is 50 µm in diameter, a ratio W/Re between an...  
WO/2023/182722A1
The present invention relates to a test socket that is used to measure electrical characteristics of an electric element. The present invention provides a test socket for preventing signal loss, the test socket being disposed between fac...  
WO/2023/181754A1
This probe has a distal-end part, an arm part, a support part, and a guide part. The distal-end part has a contact section that comes into contact with a body to be inspected. The arm part is a cantilever structure having a connecting ar...  
WO/2023/182023A1
This probe comprises: a plunger; and a barrel provided with an opening through which at least a part of the plunger protrudes. The inner surface of the opening is substantially parallel to the axial direction of the plunger.  
WO/2023/181906A1
Provided is a spring connector capable of facilitating stabilized lateral pressure for pressing a pin toward a tube inner wall. This spring connector comprises: a conductive tube; a conductive pin freely slidable in the conductive tube...  
WO/2023/180392A1
The invention relates to a high-frequency test pin device (5) for releasably contacting a contact partner (1), in particular a board-to-board connector, said test pin device comprising: an outer housing (6); an inner housing (10) that is...  
WO/2023/175800A1
[Problem] The purpose of the present invention is to facilitate the insertion of a probe into two or more guide plates. [Solution] The present invention is provided with: a probe body 600 accommodated in a guide unit 30 for a probe card ...  
WO/2023/173304A1
A device for performing electrical measurements according to the present disclosure includes a first input post that is electrically conducting, a second input post that is electrically conducting, and a sleeve that is electrically insul...  
WO/2023/172046A1
The present invention provides a metal molded article, a manufacturing method therefor, and an inspection device having same, enabling having high reliability and degree of freedom in shape, improving inspection reliability for an inspec...  
WO/2023/171995A1
The present invention provides an anodized film structure and an inspection device comprising same, the structure protecting perforated holes through protective layers, thereby improving the mechanical and/or electrical characteristics o...  
WO/2023/170384A1
A probe for use with a sample chamber, the probe comprising a probing element mounted on an arm, the arm insertable or inserted into the sample chamber to locate the probing element within the sample chamber, a drive mechanism for moving...  
WO/2023/166327A1
The invention relates in various aspects to an electric field generating device, an electric field detecting device, and an electric field detection assembly. In some illustrative embodiments of an aspect, the electric field generating d...  
WO/2023/167479A1
The present invention provides: an electrically conductive contact pin having improved inspection reliability with respect to an inspection target; an alignment plate; and an inspection apparatus. In addition, in the alignment plate, on ...  
WO/2023/164267A1
A system and method for determining fiber orientation within a layered composite using an eddy current probe is discussed. The eddy current probe includes an array of coils that are excited such that an effective pole of the end effector...  
WO/2023/159666A1
A waveform-programmable ultra-high-speed pulse current generation apparatus, which belongs to the technical field of pulse signal generators. The apparatus comprises: a pulse waveform control module (1), a pulse amplitude control module ...  
WO/2023/163271A1
The present invention relates to a probe head for testing semiconductor elements, the central technical feature being a low-friction probe head comprising: a probe; a block provided with a receiving hole in which the probe is received; a...  
WO/2023/163513A1
The invention provides an electrically conductive contact pin that improves test reliability for a test object and prevents separation in a side opening direction of a guide hole due to a lower catch portion.  
WO/2023/163447A1
The present invention provides: an electrically conductive contact pin that enhances inspection reliability for an inspection object; and an inspection device including same. In addition, the present invention provides: an electrically c...  
WO/2023/163493A1
The present invention provides an electrically conductive contact pin which improves the reliability of a test for an object, and of which the amount of compression is limited by a stopper unit.  
WO/2023/157900A1
This probe unit (20) comprises a first probe (30) and a second probe (40) having elastic restorative force, a probe securing member (24) to which the first probe (30) and the second probe (40) are secured, and a probe penetration member ...  
WO/2023/156271A1
Apparatuses and test cards for testing photonic integrated circuits, corresponding systems, and photonic integrated circuits are provided. In this case, a test card (24) is imaged by way of an optical unit (20) onto a photonic integrated...  
WO/2023/154488A1
A test fixture for coupling a Device Under Test (DUT) to a measurement instrument includes a device interface board, which may be a solderless, press-fit board, for electrically connecting to one or more DUTs, a power delivery section el...  
WO/2023/154684A1
Detecting power at a detachable case of a mobile device may include identifying a first electrical connection at the detachable case. The first electrical connection may include the detachable case receiving power from a wireless chargin...  
WO/2023/154329A1
A probe array having decoupled electrical and mechanical design constraints on the probes is provided. Each probe is a two-part structure with the two parts able to stay in electrical contact with each other as the parts slide up and dow...  
WO/2023/153556A1
The present invention relates to a probe head for testing semiconductor elements, the central technical feature being a preload-type probe head comprising: a probe having a stopper; and a block having a coupling hole into which the probe...  
WO/2023/153703A1
The present invention relates to an electrically conductive contact pin comprising: a first connection part; a second connection part; a support part extending in the longitudinal direction; an elastic part, which is connected to at leas...  
WO/2023/150615A2
A spring probe assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The assembly includes a force spring probe and a sense spring probe. Each of the force spring probe and the sense spring probe inclu...  
WO/2023/149913A1
A burn-in board for testing the operational integrity of memory devices includes local heating elements for each memory device under test. Each socket on the burn-in board may include a pair of opposed latch heads which move between open...  
WO/2023/143013A1
A sampling apparatus (100), a battery, and an electrical device. The sampling apparatus (100) comprises a sampling circuit board (110), the sampling circuit board (110) has a first sampling line (111) and a second sampling line (112), an...  
WO/2023/140655A1
The present invention provides an electrically conductive contact pin which improves the reliability of a test for a subject, and is prevented from departure from a guide plate.  
WO/2023/139953A1
This probe comprises a main body portion and a spring portion having a larger electrical resistivity and modulus of elasticity than the main body portion, the main body portion and the spring portion being connected in parallel. The main...  
WO/2023/140617A1
The present invention provides an electro-conductive contact pin and an inspection device having improved inspection reliability with respect to an object to be inspected. In addition, the present invention provides an electro-conductive...  
WO/2023/141051A1
An example probe for a test system includes a conductor to carry direct current (DC) signals between a DC testing resource and a signal trace on the test system, where the signal trace is for carrying the DC signals and alternating curre...  
WO/2023/140648A1
A pogo pin according to the present invention is a pogo pin which establishes an electrical connection by means of a first probe and a second probe and is variable in length with compressive elasticity. In the first probe (10), a cylinde...  
WO/2023/139478A1
A flexible printed circuit flex-PCB sensor (100, 100') comprising: - a sheet of electronically printable flexible material (102); - a plurality of sensor cells (14, 16,..., 18) printed on said sheet (102) and each comprising at least one...  
WO/2023/135889A1
This probe card comprises: a probe guide that holds a probe; and a probe substrate laminated on the probe guide. The probe substrate has a first surface facing a tester head, and a second surface facing the probe guide, and is provided w...  
WO/2023/136439A1
The present invention relates to a test pin for inspecting the presence of an electrical defect in a semiconductor and a camera module, the test pin comprising: a top plunger which is in contact with an object to be inspected to transmit...  
WO/2023/137100A1
The invention is a test system for testing silicon wafers or packaged devices. The system includes a tester having multiple testing stacks that each hold a vertical stack of test engines, data buffers, pin drivers, and other resources, w...  
WO/2023/131025A1
A battery test assembly (10), a battery (20), a charging assembly (60) and an electric device (70). The battery test assembly (10) comprises: a positive electrode probe (11), wherein a first end (11a) of the positive electrode probe (11)...  
WO/2023/128428A1
The present invention relates to a test socket used to measure electrical characteristics of an electrical device. The present invention provides a test socket for signal loss protection, wherein the test socket is disposed between facin...  
WO/2023/127394A1
This method for producing an electrocast tube includes a core material preparation step (S1), an electroconductive layer formation step (S3), a support layer formation step (S5), a support-layer-equipped core material cutting step (S7), ...  
WO/2023/126239A1
It is herein described a contact probe (20) having a first end portion (20A) which ends with a contact tip (21A) configured to abut onto a contact pad (51A) of a device under test (51) and a second end portion (20B) which ends with a con...  
WO/2023/118856A1
Apparatus is described including a DC electrical meter (62). The DC electrical meter (62) includes a current sensor (1), or the DC electrical meter (62) is connected to the current sensor (1). The current sensor (1) includes a busbar con...  
WO/2023/117084A1
A microwave antenna probe (100) is presented for controlling an antenna patch (142) connected to a microwave transmission line (141) which are attached on a printed circuit board (140). The microwave antenna probe comprises: a metal body...  
WO/2023/117251A1
The invention relates to a method for analysing the state of an electrical operating means (2) of a system (1) for supplying energy, wherein the electrical operating means (2) has a housing (3) comprising an insulating liquid (4), and th...  
WO/2023/117188A1
An electronics test bench system (100) comprising: a frame (101) and a top plate (102) removably coupled to the frame (101) with a hinged connection (103), the top plate (102) configured to receive a device under test, DUT, thereon and t...  
WO/2023/118894A1
The invention provides a signal conditioning stage for a photonic current or voltage transducer (1) which comprises a number of burden resistors and a number of switches in parallel with the burden resistors, the switches operable to sho...  
WO/2023/115379A1
An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal....  

Matches 151 - 200 out of 22,311