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Patent Searching and Data


Matches 401 - 450 out of 27,128

Document Document Title
WO/2017/117257A1
The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a contr...  
WO/2017/113056A1
A multi-channel interface test device, and the test device comprising: a circuit board (100) comprising a test interface (10) used for electrically connecting with an output interface of a peripheral device, and a breadboard (20) having ...  
WO/2017/111198A1
The present invention relates to a bidirectional contact module for a semiconductor test and a semiconductor test socket using the same. The bidirectional contact module for a semiconductor test according to the present invention compris...  
WO/2017/109837A1
Provided are a probe exchange tool and a probe exchange assistance system, by which a particular probe to be exchanged can be correctly removed from an inspection device by a user. A probe exchange tool 20a is used for probe exchange in ...  
WO/2017/112037A1
Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the ...  
WO/2017/112075A1
Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first so...  
WO/2017/103789A1
The present invention relates to a device for uses in scanning probe microscopy and to a method for manufacturing same. The metallic device comprises a single body (1) with two parts (2) and (3), wherein the second part (3) has a submicr...  
WO/2017/100945A1
There is disclosed herein systems and methods for monitoring connection quality. The system includes at least one first connector member; at least one second connector member adapted to be coupled to the first connector member to form at...  
WO/2017/098358A1
A method for determining the presence of an electrical charge on a surface of an ophthalmic lens mold (1, 10), the method comprising the steps of - exposing a sensor crystal (22) of a sensor element (2) to a surface of an ophthalmic lens...  
WO/2017/092165A1
A backlit meter comprises: a housing (10); a knob (21); a position dial (40); a main board (50); an optically transmissive ring (41) fixed to the housing (10); a light source assembly (44); a light-guiding board (45) disposed between the...  
WO/2017/090385A1
[Problem] To provide an inspection jig, substrate inspection device, and substrate inspection method that make it easy to correctly inspect a substrate even if the substrate expands and contracts. [Solution] The present invention is prov...  
WO/2017/091309A2
A transgenic plant having enhanced photosynthesis and increased assimilate partitioning directed into fruits, seeds, and/or other plant part is disclosed. The transgenic plant comprises a heterologous bicarbonate transporter and is engin...  
WO/2017/091591A1
A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be dispos...  
WO/2017/089228A1
The invention relates to a current sensor comprising an electric conductor (10), through which a first current (I) can flow parallel to a first direction (R1) and which comprises three regions (21, 22, 23) immediately following on from e...  
WO/2017/086948A1
An apparatus comprises a signal generator circuit, a test probe, a signal sensor circuit, and a defect detection circuit. The signal generator circuit is configured to generate an impulse test signal having an impulse waveform and adjust...  
WO/2017/084769A1
A connection assembly (100) for connecting at least two subsea cables (301, 302) to a dual output subsea sensor (220) is provided. The connection assembly (100) comprises an adapter piece (110) configured to be mounted to a rear part of ...  
WO/2017/084768A1
A connection assembly (100) for connecting at least two subsea cables (301, 302) to a dual output subsea sensor (220) is provided. The connection assembly (100) comprises an adapter piece (110) configured to be mounted to a rear part of ...  
WO/2017/083385A1
A medium or high voltage electrical device includes a housing, a central conductor provided within the housing, and a sacrificial cap configured for mounting on the housing. The sacrificial cap includes an outer housing, an insulated bod...  
WO/2017/081096A1
The invention relates to a contact pin (2), in particular a spring contact pin, comprising a jacket sleeve (4), in which a contact plunger (5) is guided in a longitudinally displaceable manner. At least one light source (15) is provided,...  
WO/2017/082510A1
A test socket of the present invention comprises: a first PCB film having a plurality of first pads; a first conductive wire bonded to first surfaces of the first pads; insulation silicone rubber provided on the first PCB film, having a ...  
WO/2017/081348A1
The invention relates to a device for measuring physical magnitudes on electrical conductors, comprising a casing that can be mounted on the outside of the conductor by gripping and fixing means, a metal punch that can be inserted in the...  
WO/2017/081096A9
The invention relates to a contact pin (2), in particular a spring contact pin, comprising a jacket sleeve (4), in which a contact plunger (5) is guided in a longitudinally displaceable manner. At least one light source (15) is provided,...  
WO/2017/078525A1
System for monitoring electric current in a network comprising at least one electrical fuse including a protective body, and at least one interrogating device arranged to interrogate at least one current sensing unit. The invention also ...  
WO/2017/075599A1
In described examples, a probe card (100) includes a mechanical support fixture (105) having an inner aperture (102) with multiple probes secured to the fixture (105) that includes probe tips (103a) that extend into the inner aperture (1...  
WO/2017/075317A1
Methods and apparatus for electrical measurement are disclosed. An example electrical measurement device includes a conductive cable comprising a plurality of conductive filaments on a first end and an electrical connector on a second en...  
WO/2017/075557A1
A high power laser diode test system is disclosed which includes a housing body defining at least one device test module compartment therein, a power supply, the system controller, and thermal control system positioned within the device ...  
WO/2017/067457A1
A test device for a printed circuit board component comprises: a test platform (300) configured to fasten a printed circuit board component under test; and a positioning platform (100) located over the test platform (300) and configured ...  
WO/2017/069136A1
In the present invention, using a mold having a shape in which the center portion of a prescribed region is recessed, the surface shape of a leading end of a three-dimensional structure is pressed into a resin plate to mold the same, and...  
WO/2017/069846A1
An example manipulator for transporting a test head includes: a tower having a base and a track, with the track being vertical relative to the base; an arm to enable support for the test head, with the arm being connected to the track to...  
WO/2017/069028A1
In order to reduce the risk of a drop in the spring property of a probe and improve inspection accuracy in energization inspection by inhibiting an excessive temperature rise of the probe when a high current is impressed during the perfo...  
WO/2017/065539A1
The present invention relates to an LED element inspecting device and, more particularly, to an LED element inspecting device which inspects whether an LED chip mounted on a ceramic plate is a non-defective product. The LED element inspe...  
WO/2017/062735A1
A system and method for detecting dynamic electromagnetic emission of an integrated circuit (IC) chip is provided. One embodiment of the method, includes exciting nitro variance (NV) centers of a diamond slide located in close proximity ...  
WO/2017/060946A1
Provided is an inspection substrate in which the length of a conduction path from a device to be inspected to the inspection substrate can be made shorter. An inspection substrate 1 has a through hole 18 penetrating a substrate portion a...  
WO/2017/061651A1
An embodiment of the present invention may comprise: an inner body which is a first column; an upper contact end which is a second column, an inner surface of the second column covering a circumferential surface of one end of the inner b...  
WO/2017/061739A1
The present invention relates to a cryogenic probe station capable of obtaining continuous data regardless of a temperature sweep by enabling a cabling-type stage, in addition to a conventional probe contact-type stage, to be used. The c...  
WO/2017/061656A1
The present invention relates to a Kelvin test probe, a Kelvin test probe module, and a manufacturing method therefor. The Kelvin test probe according to the present invention comprises: an upper insulating sheet made of a ductile materi...  
WO/2017/056879A1
Provided is a contactor that is easy to produce and can ensure a long stroke. A contactor 1 is provided with: a flexible substrate 10; a plurality of contact sections 20 provided to the flexible substrate 10; a plurality of springs 30 th...  
WO/2017/058325A1
A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor...  
WO/2017/057785A1
The present invention relates to a connection connector and, more specifically, to a connection connector which is disposed between a device to be tested and a testing apparatus and is for electrically connecting a terminal of the device...  
WO/2017/057786A1
The present invention relates to a testing connector and, more specifically, to a testing connector which is disposed between a device to be tested and a testing apparatus and is for electrically connecting a terminal of the device to be...  
WO/2017/057542A1
Provided is a probe card-use laminate wiring substrate that includes a laminate of resin layers, wherein the probe card laminate wiring substrate reduces the occurrence of defects such as lamination deviations and chipping caused by an i...  
WO/2017/051054A1
The invention relates to a system and method for prevention against electric discharges and/or electric arcs for people located close to an electrical installation (20). Specifically, the system comprises an actuator device (200, 200') w...  
WO/2017/051263A2
The present invention pertains to a robotic arm to test the functionality of a touchscreen panel of a computing device. It consists of a stylus which is adapted to move into three dimensional space for emulating various touch based movem...  
WO/2017/053881A1
A system, apparatus, and method for using a magnetic latch to maintain a desired force between a test-probe assembly and a surface of a component. The method includes moving the test-probe assembly into an approach position, the approach...  
WO/2017/053958A1
In an embodiment, a latency measuring head is provided for use in measuring touch-to-response latency in a test device, the test device including a capacitive user interface that responds to touch input. The latency measuring head includ...  
WO/2017/053910A1
In one embodiment, the present invention includes an interface apparatus for semiconductor testing. The interface apparatus includes a housing. The housing includes a lower housing substrate and an upper housing substrate. The lower hous...  
WO/2017/046116A1
The electronic module (1) has connectors (8, 10) for connecting to other (identical or similar) electronic modules. The electronic module (1) by itself as well as a plurality of interconnected electronic modules (1) form a parallel bus-b...  
WO/2017/047495A1
This probe pin comprises a coil spring (50), a first plunger (30), and a second plunger (40). The first plunger (30) includes: a first insertion part (31) positioned inside the coil spring (50); and a first contact part (32) that is expo...  
WO/2017/047362A1
Disclosed is a probe pin (15) comprising an electroconductive plunger part (16), and a coil spring (50) arranged so as to be wound around the plunger part (16). In particular, the plunger part (16) includes: a hook-shaped plunger body (3...  
WO/2017/043879A1
A high frequency (RF) probe socket is disclosed. The disclosed RF probe socket comprises: a conductive noise shield main body for shielding the probe socket from noise by accommodating a plurality of signal probes to be parallel with eac...  

Matches 401 - 450 out of 27,128