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JP2003322663A |
To make oxidation difficult to occur in the surface of metal by preventing the formation of pinholes in the surface of the metal as much as possible and to suppress the occurrence of solder transcription by reducing a contact resistance ...
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JP2003315361A |
To provide a manufacturing method of a probe capable of securing sure conduction with a conductive pad.This method has a process for applying photoresists 500 on both the surface and the back on a plate raw material 400 having conductivi...
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JP2003531495A |
An interconnection element and a method of fabricating and using an interconnect element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformab...
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JP2003287553A |
To provide a probe card for reducing manufacturing costs.The probe card 1 is provided with a probe card substrate 2, a flexible substrate 3, and a contact probe 4. The contact probe 4 is a flexible substrate made of a polyimide resin. A ...
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JP3449559B2 |
A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of pro...
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JP2003524749A |
An improved wear resistant bump contact is produced by the inclusion of small particles of hard materials in the conductive material of the contact bump, preferably by co-deposition at the time of electroplating of the bump bulk material...
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JP3434400B2 |
To distribute the electric signal between electric elements containing the polymer having a plurality of electric circuits by using the prescribed thermosetting dielectric foamed polymer. A test probe includes a probe head 10 having a pl...
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JP2003215161A |
To solve such a problem that a probe is required to be manufactured using a photo-mask conforming to each array pattern in the probe in every time when preparing a different kind of a probe card, and a problem that the plurality of photo...
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JP3429995B2 |
To provide a cleaning mechanism and its method for cleaning all the probe terminals and removing the attached materials completely, without enlarging the installation space of a prober. A cleaning mechanism 30 cleans a probe needle 21A o...
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JP3415035B2 |
To provide a substrate inspection device and its method capable of inspecting bad circuit substrate with high resolution in wide range. In this production method of a sensor probe for substrate inspection, an electrode layer consisting o...
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JP3401014B2 |
A method and apparatus for testing unpackaged semiconductor dice includes a mother board (10) and a plurality of interconnects (12) mounted on the mother board (10) and adapted to establish a temporary electrical connection with the dice...
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JP2003097617A |
To provide effective method which manufactures elastic structure depositing a passive and conducting coat on the elastic structure after releasing.An elastic metallic layer is formed on a releasing layer by forming it on a substrate. An ...
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JP2003506686A |
(57) [Summary] Several embodiments of integrated circuit probe card assemblies are disclosed in which these spring probe structural forms can be used in the testing of one or more integrated circuits, which are involved in the mechanical...
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JP2003506667A |
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are f...
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JP2003043066A |
To provide a contact probe member and the like resolving the problem of a reflection at the end of a transmission line. The contact probe member at least has a plurality of electrodes provided on an insulation board corresponding to each...
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JP2003505871A |
A substrate (200), preferably constructed of a ductile material and a tool (210) having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is prefer...
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JP2003022850A |
To provide a manufacturing method of a feedthrough, formed with a plurality of minute diameter conductor parts on a substrate at minute pitches.An SiO2 thermal oxide film 12 is formed on one face of the Si substrate 10 (a stopper film fo...
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JP3366239B2 |
To provide a cleaning device for a probe card which can eliminate foreign matter such as metallic powder or so on which adheres to bumps on a probe card. A device main unit 30 is provided with a brush 31, which brushes off foreign substa...
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JP2002365340A |
To provide a substrate inspection device, capable of performing a central inspection extending over a wide range substrate surfaces, even under different temperature environments by adjusting the space between probe needles according to ...
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JP2002350465A |
To provide a probe card having a probe pin having a fine desired shape. This manufacturing method of the probe card is characterized by having a step of forming a plurality of amorphous alloy layers having a supercooled liquid temperatur...
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JP2002350467A |
To provide a method of manufacturing a probe for electrical inspection which has excellent mass productivity, for realizing conductor patterns with high density and accuracy. This method comprises a step for molding polymeric material 11...
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JP2002326169A |
To provide a cleaning sheet for simultaneously cleaning a tip and side surfaces of a contact, a method for manufacturing the same, and a method for cleaning a contact.This cleaning sheet 10 is composed of a base sheet 11, an abrasive gra...
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JP3343540B2 |
To test many semiconductor parts concurrently in parallel by providing a conductive layer made of a conductive material on an insulating layer formed on a silicon base with a slant support section and protruded from the slant support sec...
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JP2002311052A |
To provide a blade-like connecting needle for measuring a semiconductor wafer capable of greatly improving measuring capacity of a minute electric current, and having stable characteristics.The blade shaped connecting needle 1 for measur...
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JP2002307316A |
To provide an instrument for cleaning a tip and a side face of a contact by one cleaning instrument and having an easy and simple configuration.This cleaning instrument 10 is composed of a substrate 11, at least two kinds of intermediate...
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JP2002296296A |
To sharpen the tip part of a contact probe to allow point contact.This contact probe manufacturing method includes a plating process for conducting plating to fill up a clearance of a resist film 22, so as to form a metal layer 26, using...
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JP2002286758A |
To provide a probe capable of efficiently inspecting continuity characteristics of a highly integrated electronic component, preventing the damage of wiring or a terminal in inspection, preventing the coming-off of a projection of the pr...
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JP2002286755A |
To manufacture a probe unit appropriately supported in a substrate without damaging a lead or an elastic beam in the fabrication of the probe unit having the elastic beam projecting from the substrate, and appropriately keeping a pitch e...
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JP2002531915A |
A method of forming an interconnection, including a spring contact element, by lithographic techniques. The method comprises successively patterning a first and a second layer of masking material (125, 140) over a substrate (105), each l...
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JP3304334B2 |
To provide a picking/placing mechanism for assembling a large number of contactors on a contactor substrate. This picking/placing mechanism is constituted of a first area for positioning an intermediate plate with a plurality of contacto...
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JP2002196019A |
To provide a contact structure for providing an electric connection with a contact target.This contact structure is composed of a contact substrate and a plurality of contactors. A contactor is composed of a tip forming a point of contac...
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JP2002181846A |
To mount and re-work a probe needle assembly to a probe card using a build wafer composed of a build target and a scrub target pattern.Each build target comprises a hard material strong to scrub by a probe needle, and it is deflected for...
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JP2002162415A |
To improve a bare-wire structured probe made of a palladium alloy for a probe card and a bare-wire structured probe, made of a beryllium-copper alloy for a probe card, so that they can be applied to a probe card used for inspecting an IC...
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JP2002156408A |
To provide a kit and a method for cleaning socket connecting terminals, and an electronic part tester whereby the socket connecting terminals can be simply cleaned without being damaged.A thickness of a part of a rubbing member 110 to be...
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JP2002158264A |
To joint a pad probe with appropriate strength in a probe card for collectively inspecting a wafer where part of the probe can be repaired.The probe card for testing a plurality of semiconductor integrated circuits formed on a semiconduc...
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JP2002098727A |
To provide an inspection unit capable of suppressing core deflection of a probe, positioning the probe and other constitutional elements highly precisely, and arranging these members closer.This unit is equipped with the probe 14a in con...
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JP2002090388A |
To provide a contact structure for lead easily forming a contact structure using suitable metal for each of a lead and a bump, and having the bump and the lead connected soundly electrically and in strength.This contact structure of lead...
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JP2002090390A |
To provide an inspection device for semiconductor capable of making the size small with necessary strength held in a beam and forming many probes.Wiring 5b is formed on one surface of the beam 11 at a specified width over the whole lengt...
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JP2002509604A |
Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring c...
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JP3261723B2 |
PURPOSE: To obtain a method by which the breakage of a bonding pad in a pellet 4 caused by an unnecessary pressure applied to the pad can be prevented at the setting-up time at the time of performing 100% inspection on pellet products on...
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JP3262531B2 |
To provide a process for bonding wires to an electronic circuit device, attached one end of each wire onto a surface of the device and extend the other end in the direction opposite to the surface of the device. This process includes a s...
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JP2002062313A |
To provide an electrical inspection jig which is highly finer than a conventional electric inspection jig and to provide its manufacturing method.Two retainer plates 21a and 21b, in which through-holes 22 formed at prescribed positions a...
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JP2002043194A |
To provide a work-inspecting device for keeping and improving inspection accuracy with no increase in the contact resistance at a measurement electrode part.A work inspecting device 10 comprises a base 20 and a turn table 11, which is ho...
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JP2002026090A |
To provide a wafer mounting apparatus of a wafer probing inspection- equipment wherein its probe needles are cleaned by jetting a three-phase raw material without carrying them out of a production line.The wafer mounting apparatus of the...
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JP2002025729A |
To provide contact terminals which enable the stable measurement of various electrical characteristics of a semiconductor apparatus, and to provide a manufacturing method therefor.An upper side metal mold and a lower side metal mold are ...
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JP2002501177A |
A method for removing deposits from a probing feature of a probe card. The method includes the step of exposing the probing feature of a probe card to a composition that chemically reacts with the deposits on the probing feature to remov...
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JP2002005960A |
To repair a faulty probe without removing all the probes from a board in a probe card for wafer batch inspection.This probe card is used to test a plurality of semiconductor integrated circuits formed on a semiconductor wafer, and equipp...
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JP2001526833A |
To provide a technology for performing a wafer-level burn-in and test. The invention includes a test substrate 108 having active electronic components 106a to 106d, and metallic spring contact elements 110 effecting interconnections with...
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JP3239937B2 |
To provide a manufacturing method of a contact pin which is highly flexible with a higher electric conductivity to allow adaptation to even a fine wired pad used in electrical inspection of a high-density printed wiring board. In the met...
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JP2001313317A |
To provide a method and device for cleaning a probe which can make process simpler, without giving damages to probes.An ultrasonic vibrating body 22 is installed to a cylindrical body 21 supported to face a probe card 10, on which the pr...
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