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JP2001313317A |
To provide a method and device for cleaning a probe which can make process simpler, without giving damages to probes.An ultrasonic vibrating body 22 is installed to a cylindrical body 21 supported to face a probe card 10, on which the pr...
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JP2001521620A |
The invention relates to a process for manufacturing a card with multiple tips, designed in particular for testing semiconductor chips or integrated circuits before encapsulation thereof and comprising an oxidised silicon substrate 10 on...
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JP3206922B2 |
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JP2001228173A |
To stably shorten the measurement waiting time generated due to dielectric absorption and to stably reduce a steady leakage electric current so as to improve the measurement accuracy of minute electric current and minute current fluctuat...
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JP2001208772A |
To ensure equal supporting force for all pins even in the case that a contact surface has imperfect flatness, by ensuring an almost constant supporting force independently of expansion of the end portion of pin.In this connector, a plate...
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JP3188935B2 |
PURPOSE: To provide the inspecting apparatus having a grounded cleaning body constituted of a contact body, e.g. conducting material for cleaning a probe, provided in the inspecting apparatus. CONSTITUTION: A probe part 10 has a contact ...
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JP2001189354A |
To adjust a needle card adjusting device for flattening, in relation to a wafer 8 to be contactedly formed with the needle set 6 of a needle card 1, connected with a substrate 3 which is used as a contact interface to an inspection head ...
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JP2001174482A |
To provide a contact needle for evaluating electric characteristics having a fine pitch capable of dealing with highly integrating semiconductor devices.The contact needle for evaluating semiconductors has a needle core 3 of single cryst...
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JP2001091539A |
To provide a contact structure which is formed by forming a contactor on a semiconductor substrate by a micromachining technique and which is connected electrically to a contact target. A contact substrate and a plurality of contactors w...
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JP2001091544A |
To inspect a plurality of semiconductor devices easily collectively by a plurality of probes by eliminating problems such as the accuracy of the probes in the probes of a semiconductor inspecting device. This method for manufacturing a s...
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JP2001091543A |
To reduce time and effort considerably required for individually highly accurately positioning and fixing probes and to prevent the number of electrode pads and chips that can be tested at a time from being limited in a semiconductor ele...
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JP2001077495A |
To provide a contactor for electronic components by which its manufacturing step can be simplified and which can be connected electrically and surely with electronic components even if the pitch of a semiconductor device becomes narrow. ...
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JP3144672B2 |
To allow automatic and efficient replacement of a polishing body, in a short time, for a disposable polishing plate, for inspection of high reliability, by providing an automatic replacement device, for automatic replacement of polishing...
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JP2001033487A |
To provide a semiconductor integrated circuit testing probe card which simplifies its forming. A probe card 8 is provided with a plurality of probes 9 for inputting/outputting an electric signal for confirming the operation of a semicond...
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JP2001033484A |
To provide a light weight, excellent temperature rising and falling characteristics, no warp even when a probe card is pressed and to effectively prevent a damage or a measuring miss of a silicon wafer by providing a conductor layer at c...
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JP2001013168A |
To increase horizontal strength so as to form a proper alignment by arranging a conductive material inside a pressing part, eliminating an excessive part from a dielectric layer upper face, arranging a flat plane over the whole and elimi...
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JP3123483B2 |
One main surface of a substrate has formed on it an appropriate contact terminal having in one part thereof a protruding part. An end of a lead is mounted via a holding part that is provided between the substrate and a probe, the lead be...
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JP3120793B2 |
To provide a manufacturing method for a contact pin, capable of conducting electrically stable connection to a minute inspection spot, preventing breaking of the contact pin caused by the contact with an inspection pad, im proving reliab...
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JP2000304773A |
To packager and interconnect a contact structure at a low cost, with high reliability and in a high productivity by forming the contact structure on a contact board, and electrically connecting the structure to a probe card or the like t...
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JP2000298142A |
To accurately obtain the relative positions of probe chips when a probe chip and an adjacent probe chip simultaneously come in contact with a contact surface to form an image by obtaining the relative positions of the image center-of-gra...
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JP3099754B2 |
A probe card is used in a testing apparatus for connecting the testing apparatus to electrodes of an integrated circuit device, and has needle-like conductive probes (27) provided on a resilient layer (21c) supported by a ceramic substra...
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JP3096234B2 |
A method for fabrication of a probe, comprising the steps of: (1) forming a structure wherein a contact part formed on one side of an insulating flexible substrate and a conductor formed on either side or inside of said flexible substrat...
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JP3058919B2 |
Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784). In this manner, the electroni...
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JP2000162241A |
To provide a manufacturing method in which a contact structure is formed on the planer surface of a substrate.This manufacturing method comprises the steps of a step (a) in which a sacrificial layer is formed on the surface of a silicon ...
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JP3050519B2 |
To suppress variation in heights by providing a dummy through hole with a conductive circuit exposed inside in the vicinity of a through hole forming a bump contact whose height is to be controlled and performing electrolytic plating. A ...
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JP3050520B2 |
To provide a manufacturing method for a probe which comprises bump contacts which restrain the nonuniformity of their shape and an irregularity in their height even when the bump contacts are formed by an electrolytic plating method. A c...
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JP2000147006A |
To form a recess part so as not to damage the base end part of a probe element. A film shape probe unit 10 is provided with a film-shaped base region 20 and a plurality of probe regions 18, extending in parallel from the base region 20. ...
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JP2000137043A |
To prevent a cross coil type instrument body from being assembled erroneously, with simple constitution. This instrument is provided with a hand spindle 3, plural leg parts 2 are protruded on a diagonal line of a circumferential edge of ...
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JP3022312B2 |
To provide a probe card capable of coming into contact with a semiconductor element on a wafer and improving high frequency characteristics while enhancing the reliability of contact with the electrode on the element. A probe pattern 15 ...
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JP2000502810A |
The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electroni...
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JP3006885B2 |
An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure...
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JPH11326384A |
To prevent the disconnection of a coil by rotating a bobbin in the process of winding the coil on the bobbin so as to wind a winding leader side part of the coil almost in the fixed direction. In a cross coil type indicator, a coil is wo...
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JPH11326379A |
To achieve a lower cost and a higher productivity while enabling connecting of a bump formed by utilizing a wire bonding technique to a terminal of an electronic component used as contact electrode with a higher reliability. In a contact...
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JP2967901B2 |
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JPH11230989A |
To suppress abrasion and deformation at the pointed end part of a probe pin while prolonging the service life. The pointed end part 12 of a probe pin 11 for probe card is immersed into a cleaning liquid 1 of aqueous solution containing c...
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JPH11213106A |
To easily clean a contact for an IC card connector. A body case 1 is provided with a contact cleaning member 2 and the case 1 is attached to detached from an IC card connector 3 so that the member 2 is brought into contact with connector...
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JPH11508407A |
A method of stimulating production of photo-electrons at a cathode element (118) of an EFO system (116) of a wire bonder (100) is disclosed. Said method comprises illuminating the cathode element (118) of the EFO component with ultraviol...
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JPH11160361A |
To accommodate and fix a magnet for resetting to a recessed part, by setting the magnet for resetting to a magnet where a material with flow behavior including a magnetic particle being injected into a recessed part for curing that is pr...
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JPH11133116A |
To simplify cleaning work for a probe needle for a probe card, and to improve work environment by eliminating a process of using organic solvent in the cleaning work for the probe needle. In a cleaning device for a probe needle for a pro...
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JPH1197494A |
To suppress a load variations within a tolerance and simultaneously inspect if probes in a large area are collectively pressed by a method wherein, after a wafer formed with a plurality of elements is probe-inspected and a thermal load i...
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JPH1138041A |
To prevent the deterioration of the reliability of a semiconductor device caused by the inspecting process by providing multiple convexities at the tip section of a probe needle. The tip section of a probe needle is provided with the fir...
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JPH116863A |
To surely remove a contaminant sticking to the tip portion of a contact pin of a probe for electrical inspection of a base by one cleaning operation by utilizing a moving motion of the probe. A conveying device 51 which conveys a base to...
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JPH116864A |
To ensure that an elastic sheet used at the time of surely removing a contaminant sticking to the tip portion of a contact pin of a probe for electrical inspection of a base by one cleaning operation by utilizing a moving motion of the p...
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JPH10311848A |
To provide a method for assembling an indicating instrument, in which, even if the end of a pointer shaft extending out of a drive through a painter scale plate has deviated when the boss of a pointer is pressed in, the pointer scale pla...
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JPH10256709A |
To perform surely with only one cleaning work the cleaning of the contamination matters stuck on the end portion of the contact pin of a probe for inspecting electrically boards which is used in an equipment for board testings including ...
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JP2796070B2 |
Bumps to be connected to inspection electrodes of semiconductor chips are formed on a surface of a flexible substrate. A plating layer is formed which is made of a harder material than the bumps formed on the flexible substrate and which...
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JPH10144750A |
To maintain the structural completion of the contact point of a device, which is brought into contact with chip pads on a wafer, by electrically connecting a burn-in base material with a wafer level contact sheet through a conductive Z-a...
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JPH1082826A |
To efficiently clean an IC socket by moving a head having abrasive sections kept in contact with the contact pins of the socket in the facing direction to the IC socket on a board. This cleaning head 2 has cleaning pins 3 arrangedcorresp...
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JPH1048258A |
To obtain a cross coil instrument in which first and second cross coils can be wound up to a range where a pair of coils could not be wound conventionally by employing a chuck having such shape as blocking intrusion of a chuck jig into t...
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JP2710544B2 |
PURPOSE: To provide a probe structure having a precise pitch by arranging plural cavities whose positions are adjusted to a contact point pad on a device when the probe structure is contacted with a semiconductor device of an inspec tion...
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