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WO/2022/008436A1 |
The present invention relates primarily to a method of fabrication of one or more free-standing micromachined parts. The method includes performing reactive ion etching of photoresist and tungsten-based layers supported on a carrier subs...
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WO/2022/005085A1 |
Disclosed is a test socket supporting a probe. The test socket includes a socket block of an insulating material, provided with a probe hole to accommodate the probe, and a coating portion comprising an external film of a conductive mate...
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WO/2021/246719A1 |
Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a condu...
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WO/2021/235842A1 |
The disclosure relates to a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a coupling block by joining an insulating member of a...
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WO/2021/235844A1 |
The disclosure relates to a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a probe hole for accommodating the probe in a base me...
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WO/2021/235843A1 |
The disclosure relates to a method of fabricating a test socket including forming a plate-shaped first coupling block by joining a first base member made of a conductive material and a first insulating member made of an insulating materi...
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WO/2021/231948A1 |
The present disclosure relates to carbon based biosensors and biosensor systems. The disclosure further relates to methods of rapidly detecting a target material in a biological sample using the biosensor and biosensor systems described ...
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WO/2021/214211A1 |
The invention relates to a method for manufacturing an electric component, comprising: an armature (1) formed from a polymeric plastic material and an organometallic additive and comprising a support arm (4), with a winding (2) formed di...
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WO/2021/201485A1 |
The present invention provides a jig for manufacturing a probe card for testing a semiconductor, a probe alignment system comprising same, and a probe card manufactured thereby.
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WO/2021/180421A1 |
The invention relates to a wire (1) or strip for production of test needles or slide contacts, the wire (1) or strip including a material or consisting of a material, the material having a matrix composed of copper, palladium, rhodium, o...
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WO/2021/146125A1 |
A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed ...
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WO/2021/137379A1 |
A spring-loaded pin according to the present invention comprises: a compression spring (30); an integrated upper probe (10) having an upper probe portion (11) and two upper probe side wall portions (12) to be integrated, wherein the uppe...
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WO/2021/133560A1 |
A probe card in an automated test equipment (ATE) is disclosed. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins, with vertical vias in the circuit board ...
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WO/2021/133561A1 |
A probe card in an automated test equipment (ATE) is disclosed. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins, with vertical vias in the circuit board ...
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WO/2021/077204A1 |
In a general aspect, a method of manufacturing a vapor cell is presented. The method includes obtaining a dielectric body having a surface that defines an opening to a cavity in the dielectric body. The method also includes obtaining an ...
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WO/2021/074362A1 |
The invention relates to a mounting system (1) for a contact pin (2) for contacting an electric/electronic test object, comprising a mounting sleeve (6) which can be secured to a contact head and which is designed to receive and hold the...
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WO/2021/069566A1 |
The invention concerns a measurement probe (6) for on-wafer testing of semiconductor devices, comprising a plurality of contact fingers at a distal end for contacting landing pads of the wafer. The measurement probe (6) comprises a centr...
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WO/2021/060727A1 |
The present invention relates to a foreign substance cleaning sheet for a test socket and, more specifically, to a foreign substance cleaning sheet for a test socket, the foreign substance cleaning sheet being used in a test socket in or...
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WO/2021/045502A1 |
Disclosed is a test probe for testing a device to be tested. The test probe includes a line contact portion comprising a first contact line set and a second contact line set each comprising two contact lines linearly extending to be spac...
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WO/2021/033824A1 |
The present invention relates to a test socket with a replaceable portion, comprising: a first socket module comprising a first insulating main body made of an insulation material, and a plurality of first conductive patterns formed to b...
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WO/2021/023744A1 |
A manufacturing method for manufacturing at least one contact probe (10) for a probe head of a test equipment of electronic devices, comprising a step of submicrometric 3D printing of said contact probe (10) with at least one printing ma...
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WO/2021/010583A1 |
A technical idea of the present invention provides an interface which enables a test object to be tested reliably and quickly, an interface assembly and a test socket including same interface, and a method of manufacturing same interface...
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WO/2020/257190A1 |
A probe chip consisting of multiple probes integrated on a single substrate. The layout of the probes could be designed to match specific features on the device under test. The probes are spring-loaded to allow for reversible deformation...
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WO/2020/235769A1 |
Disclosed is a contact probe comprising: an upper plunger which is formed by a first processing method, and in which a first tip coming into contact with a terminal of an object to be inspected is formed at one end thereof; a board conta...
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WO/2020/225133A1 |
The invention relates to a method for manufacturing a short-circuit protection device (2), comprising: - producing a plurality of first electrically conductive segments (22) on a first face (10) of a first substrate (6); - producing a pl...
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WO/2020/218803A1 |
Disclosed is a probe cleaner for cleaning and decontaminating a probe. The probe cleaner includes a main body including a cleaning surface facing toward a test socket in which probes are arranged; a cleaning member provided in the cleani...
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WO/2020/213899A1 |
A three-layer MEMS spring pin of the present invention comprises: a lower-layer spring pin, in which a lower-layer wave is connected between a lower-layer top plunger and a lower-layer bottom plunger; an upper-layer spring pin, in which ...
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WO/2020/191295A1 |
This disclosure relates generally to test equipment, apparatuses, and systems for a device under test, such as, but not limited to, a semiconductor device. More specifically, this disclosure relates to test equipment, apparatuses, and sy...
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WO/2020/145492A1 |
The purpose of the present invention is to provide: a signal transmission connector capable of being stably connected with a terminal of an electronic component through a structural improvement in response to distortion in the electronic...
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WO/2020/145493A1 |
The present invention is to provide a signal transmission connector which can be stably connected to terminals of an electronic component through structural improvement that responds to distortion of the electronic component. The signal ...
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WO/2020/145577A1 |
The purpose of the present invention is to provide a conductor part protection member for a signal transmission connector and a manufacturing method therefor, and a signal transmission connector having same and a manufacturing method the...
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WO/2020/144322A1 |
The invention relates to a test needle for measurement of electrical contact connection and to a bonding wire for electrical contact connection of a chip, wherein the test needle or bonding wire has been manufactured from a foil for prod...
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WO/2020/141826A1 |
A contactor block of a self-aligning vertical probe card according to the present invention comprises: at least one vertical contactor array in which a plurality of vertical contactors manufactured by a MEMS process and extending in the ...
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WO/2020/138882A1 |
Provided is a connector located between a test device and a device to be tested so as to electrically connect the test device with the device to be tested. The connector is stacked in a vertical direction and has first and second conduct...
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WO/2020/080719A1 |
Disclosed according an embodiment is an inspection connector which is disposed between a device to be inspected and a test apparatus so as to electrically connect the device to be inspected and the test apparatus to each other, the inspe...
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WO/2020/078814A1 |
The invention relates to a resistance assembly (22) for a battery sensor (10), in particular for a vehicle battery, comprising two conduction portions (12, 16) and a resistance element arranged between the conduction portions. The conduc...
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WO/2020/058094A1 |
The invention relates to a method for producing a resistor assembly (12) for a battery sensor (10), in particular in a vehicle, said resistor assembly having a battery pole terminal (14) and a cable connection point (16), which are elect...
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WO/2020/061468A1 |
Platinum-nickel-based ternary or higher alloys include platinum at about 65‒80 wt.%, nickel at about 18‒27 wt.%, and about 2‒8 wt.% of ternary or higher additions that may include one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, and/o...
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WO/2020/050657A1 |
An inspection connector according to a disclosed embodiment comprises: a sheet of insulating material; and a conductive part extending in the vertical direction in the sheet for enabling an electric current to be applied in the vertical ...
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WO/2020/030340A1 |
The invention relates to a method for repairing a test contact arrangement (10) in which a test contact (21) arranged with incorrect positioning on a test contact carrier (12) by means of solder material (16) is gripped at an edge (30) o...
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WO/2019/245242A1 |
A connector for inspection according to a disclosed embodiment includes: a sheet of an insulating material; a plurality of conductive parts which are made of a conductive material, extend in a Z-axis direction, and are spaced apart from ...
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WO/2019/245153A1 |
The present invention relates to a plate spring-type connecting pin comprising: a support pin having a bent rib portion on the upper part and a base portion on the lower part and length extended in the vertical direction; a plate spring ...
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WO/2019/245244A1 |
A test connector according to one embodiment comprises: a sheet on XYZ orthogonal coordinates, the sheet being made of an insulating material; and a plurality of conductive units, which are made of a conductive material, extend in the Z-...
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WO/2019/245104A1 |
The present invention relates to a plate spring-type connecting pin comprising: a support pin having a bent rib portion on the upper part and a base portion on the lower part and length extended in the vertical direction; a plate spring ...
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WO/2019/197267A1 |
In the cleaning of the tips of needles of needle cards, the tips of the needles are put into effective contact in a cleaning agent in different cleaning positions, in order to remove contaminants from the tips of the needles and to make ...
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WO/2019/197295A1 |
The testing apparatus for singulated semiconductor dies comprises a nesting frame (1) and a bottom part (2), which form a testing device nest adapted to the size of a semiconductor die (7). A pushing device (4) is provided for an alignme...
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WO/2019/198853A1 |
The present invention relates to contacts and a socket apparatus for testing a semiconductor device. Each contact according to the present invention is a spring contact integrally formed by punching out and bending a metal plate, and com...
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WO/2019/162194A1 |
An apparatus (1) for the automated assembly of a probe head for testing electronic devices integrated on a semiconductor wafer, comprises a support (6) adapted to support at least two parallel guides (2), which are provided with a plural...
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WO/2019/140795A1 |
Provided are a TDS detector and a packaging process therefor. The TDS detector comprises a wire (1), wherein both ends of the wire (1) are arranged with a connector (11) and a probe respectively, the probe comprises two sets of needles (...
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WO/2019/093614A1 |
Disclosed is a test probe assembly. The test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member co...
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