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WO/2011/129557 |
The present invention provides a probe sheet. The probe sheet comprises: a first wiring region having a plurality of first wiring sets arranged thereon, with each wiring set being composed of a preset number of wires, the first wiring re...
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WO/2011/129557 |
The present invention provides a probe sheet. The probe sheet comprises: a first wiring region having a plurality of first wiring sets arranged thereon, with each wiring set being composed of a preset number of wires, the first wiring re...
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WO/2011/072076 |
A wafer test probe (312) for testing integrated circuitry (320) on a die (318) is disclosed. The wafer test probe includes a membrane core (314). The wafer test probe also includes circuitry (316) within the membrane core. The circuitry ...
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WO/2011/034280 |
The present invention relates to a superconducting quantum interference device (SQUID) sensor and to a method for manufacturing same. The SQUID sensor of the present invention comprises a wound detection coil for detecting a fine magneti...
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WO/2011/034280 |
The present invention relates to a superconducting quantum interference device (SQUID) sensor and to a method for manufacturing same. The SQUID sensor of the present invention comprises a wound detection coil for detecting a fine magneti...
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WO/2011/019160 |
The present invention relates to a probe to be used in a semiconductor test or a flat panel display device test, and to a method for manufacturing same. The probe comprises: a plurality of probe beams which are equidistantly spaced apart...
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WO/2011/019160 |
The present invention relates to a probe to be used in a semiconductor test or a flat panel display device test, and to a method for manufacturing same. The probe comprises: a plurality of probe beams which are equidistantly spaced apart...
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WO/2011/015659 |
The invention concerns a base part for a medication delivery device. The base part is during use fastened to a patient's skin and connected to a cannula part which cannula part is positioned at least partly subcutaneous. The base part is...
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WO/2010/077744 |
A system is provided for cleaning of probe contacts. The system includes a base plate comprising three mounting means for receiving each an adjustable attachment means, and means for connecting the base plate to a probe machine; and a cl...
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WO/2010/043196 |
The invention relates to a device for positioning and contacting test contacts (20) on a contact carrier for producing a test contact arrangement, comprising at least one contact head having at least one transmission channel (24) for tra...
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WO/2010/023344 |
The invention describes an ultrasonic device that is useful for the emission of acoustic waves in air in the ultrasonic range, which comprises, amongst other elements, a resonant cavity (5) with one or more apertures (7) for generating s...
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WO/2010/000689 |
An embodiment of the invention refers to a method for manufacturing a sensor device (5) suitable for measuring an electric field (E). In the method, a nanotube (35) capable of oscillating is disposed between a primary electrode (20) and ...
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WO/2009/105222 |
An interposer (2) with a conductive housing (18) is disclosed. Conductive members (10) pass through insulators (14) positioned in openings in the conductive housing. The conductive housing may be grounded, providing a closely spaced grou...
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WO/2009/105222 |
An interposer (2) with a conductive housing (18) is disclosed. Conductive members (10) pass through insulators (14) positioned in openings in the conductive housing. The conductive housing may be grounded, providing a closely spaced grou...
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WO/2008/127242 |
Provided is a dual arcuate blade probe tip (100) for probing a node, such as a node hole (1800), on a circuit. The probe has a shaft (104) made from an electrically conductive material, concentric to a longitudinal probe axis (102), and ...
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WO/2008/127241 |
Provided is a pronged fork probe tip (100) for probing a node, such as a through-hole node (1900), on a circuit. The probe tip (100) has a shaft (104) made from an electrically conductive material, concentric to a longitudinal probe axis...
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WO/2008/008232 |
A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical' testing. The contacting tip has a certain width an...
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WO/2008/008232 |
A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical' testing. The contacting tip has a certain width an...
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WO/2007/100761 |
The use of a superconducting resonator with continuous-wave (CW) excitation allows low-noise quadrupole resonance (QR) detection without the need for a lock-in amplifier. This allows detection times to be greatly reduced. Hence, for the ...
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WO/2007/100761 |
The use of a superconducting resonator with continuous-wave (CW) excitation allows low-noise quadrupole resonance (QR) detection without the need for a lock-in amplifier. This allows detection times to be greatly reduced. Hence, for the ...
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WO/2007/100713 |
An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments o...
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WO/2007/100713 |
An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments o...
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WO/2007/098290 |
An approach is provided for fabricating probe elements for probe card assemblies. Embodiments of the invention include using a reusable substrate, a reusable substrate with layered probe elements and a reusable substrate with a passive l...
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WO/2007/098290 |
An approach is provided for fabricating probe elements for probe card assemblies. Embodiments of the invention include using a reusable substrate, a reusable substrate with layered probe elements and a reusable substrate with a passive l...
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WO/2007/098291 |
A method for fabricating beams for a probe card includes dividing a large beam panel (106) into smaller sub-panels (108) before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of bea...
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WO/2007/098291 |
A method for fabricating beams for a probe card includes dividing a large beam panel (106) into smaller sub-panels (108) before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of bea...
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WO/2007/092592 |
A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location (500) for a probe is compared with the actual horizontal position (502) for the probe to determine (504) a h...
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WO/2007/092593 |
A method for repairing a probe on a probe card is provided. A plurality of beams (222', 224' ) is formed on a beam panel (250"). The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the ...
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WO/2007/092594 |
An approach for fabricating cantilever probes for a probe card assembly includes forming posts (108) on conductive traces (106) on a substrate (100). A beam panel (150) having beam elements (152) formed therein is aligned to the substrat...
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WO/2007/092594 |
An approach for fabricating cantilever probes for a probe card assembly includes forming posts (108) on conductive traces (106) on a substrate (100). A beam panel (150) having beam elements (152) formed therein is aligned to the substrat...
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WO/2007/092593 |
A method for repairing a probe on a probe card is provided. A plurality of beams (222', 224' ) is formed on a beam panel (250"). The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the ...
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WO/2007/092592 |
A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location (500) for a probe is compared with the actual horizontal position (502) for the probe to determine (504) a h...
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WO/2007/078493 |
A probe card assembly (300) has a probe contactor substrate (310) having a plurality of probe contactor tips (395) thereon and a probe card wiring board (330) with an interposer (340) disposed between the two. Support posts (320) contact...
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WO/2007/016599 |
A cleaning device for use in a semiconductor processing. The device comprises a substrate supporter for supporting a substrate to be cleaned, a scrub pad mounting plate, and a chuck coupling to the substrate supporter and the scrub pad m...
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WO/2007/015713 |
The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The leng...
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WO/2006/026346 |
A probe (10) for a probe card assembly is provided. The probe includes a beam element (12) having a tip end portion. The probe also includes a tip structure (18) on the tip end portion of the beam element. The tip structure includes a pl...
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WO/2006/023380 |
A probe has a cantilever arm coupled to a base via an anchor. A surface of the arm facing the base or a surface of the base facing the arm has steps with contact points that contact the base when the arm is depressed. Alternatively, the ...
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WO/2006/014894 |
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circu...
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WO/2006/014635 |
A probe card assembly is provided. The probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the subs...
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WO/2005/124371 |
A method for providing alignment of a probe relative to a supporting substrate, comprises the steps of providing the supporting substrate defining a planar surface and an edge, the substrate further defining a first crystal plane, provid...
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WO/2005/122240 |
Disclosed herein are a silicon wafer for probe bonding and a probe bonding method using the same.The silicon wafer for probe bonding is improved in structure to facilitate probe bonding on a probe substrate. The probe bonding method invo...
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WO/2005/103731 |
[PROBLEMS] To provide a sheet-shaped probe and a manufacturing method thereof, by which stable connecting conditions are attained even in a microcircuit device of a fine pitch, an electrode structure does not drop from an insulating film...
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WO/2005/103732 |
[PROBLEMS] To provide a sheet-shaped probe and a manufacturing method thereof, by which stable connecting conditions are attained even in a microcircuit device of a fine pitch, an electrode structure does not drop from an insulating laye...
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WO/2005/103730 |
A sheet-like probe has a porous film, and in the sheet-like probe, a contact film is penetratingly supported at each position of through-holes formed in the porous film, and a peripheral edge of the contact film and the porous film are i...
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WO/2005/103733 |
A sheet-like probe in which electrode structure bodies are each composed of a front surface electrode section exposed to the front surface of an insulation layer, projecting from the front surface of the insulation layer, and having a sh...
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WO/2005/103734 |
[PROBLEMS] A sheet-like probe and a method of producing the probe, where the probe can achieve stable connection even for a circuit device having small electrodes with fine intervals, where electrode structure bodies do not come out from...
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WO/2005/103735 |
A sheet-shaped probe, a method for manufacturing the probe and application of the probe are provided, by which a small-diameter surface electrode part can be formed, a stable connecting status can be attained even for a circuit device ha...
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WO/2005/076832 |
A method for fabricating assembled structures. The method includes providing a tip structure, which has a first end, a second end, and a length defined between the first end and the second end. The second end is a free end. The method in...
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WO/2005/076832 |
A method for fabricating assembled structures. The method includes providing a tip structure, which has a first end, a second end, and a length defined between the first end and the second end. The second end is a free end. The method in...
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WO/2005/076024 |
An interconnect assembly (1) includes a number of interconnects combined in a preferably planar dielectric carrier frame (4) having resilient portions acting as spring members in conjunction with their respective interconnect's rotationa...
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