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Matches 1 - 50 out of 646

Document Document Title
WO/2018/182327A1
A semiconductor package test socket and a method for manufacturing the same are disclosed. The test socket of the present invention is manufactured by the steps of: disposing a first film layer on a lower portion of a support plate havin...  
WO/2018/162343A2
A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe comprises a probe body, a first cantilever extending from the probe body. The first cantilever defining a first loop w...  
WO/2018/142170A1
The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a s...  
WO/2018/108675A1
A contact probe (20) for a probe head of an apparatus for testing electronic devices comprises a probe body (20C) being essentially extended in a longitudinal direction between respective end portions (20A, 20B) adapted to realize a cont...  
WO/2018/079982A1
The present invention relates to a bidirectional conductive pin using carbon fibers and a bidirectional conductive pattern module using carbon fibers, and a bidirectional conductive socket using the same. The bidirectional conductive pin...  
WO/2018/046896A1
A liquid conductivity measurement pin (10). The pin has a sensor portion (130) and an electrical contact portion (110). The electrical contact portion (110) is spring-loaded such that the electrical contact portion (110) is adapted to ma...  
WO/2018/044014A1
Disclosed is a testing device. The testing device includes a testing socket configured to support a plurality of probes, a testing-circuit substrate which includes a contact point to contact the probe, a slider which makes the testing so...  
WO/2018/035515A1
Systems and methods for testing semiconductor wafers are disclosed herein. In one embodiment, an apparatus for testing dies of a semiconductor wafer includes: a wafer translator having a wafer-side configured to face the wafer, and an in...  
WO/2018/035054A1
Systems and methods for testing semiconductor wafers are disclosed herein. In one embodiment, an apparatus for testing dies of a semiconductor wafer includes a composite space transformer for contacting the dies. The composite space tran...  
WO/2018/019866A1
The invention describes a testing head (21) of an apparatus for testing electronic devices comprising a plurality of contact probes (22) inserted into guide holes realized in at least one upper support (23) and one lower support (24), a ...  
WO/2018/019863A1
The invention describes a probe card (20) for a testing equipment of electronic devices comprising at least one testing head (21) with a plurality of contact probes (22) inserted into guide holes being realized in at least one upper guid...  
WO/2017/213387A1
A rubber socket comprises a lower film, an upper film, an electrical connection member, and a rubber layer. The lower film comprises a plurality of lower electrode parts coupled to a synthetic resin film. The upper film is arranged in pa...  
WO/2017/209357A1
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method for preparing same. A bidirectional conductive pin, according to the present invention, comprises: an upper contact p...  
WO/2017/209356A1
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method for preparing same. A bidirectional conductive pin, according to the present invention, comprises: a pin body formed ...  
WO/2017/200146A1
The present invention relates to a case for semiconductor probe pins and to a case which can accommodate and maintain probe pins having been subjected to ultraprecision micromachining so as to be mounted to a probe used for semiconductor...  
WO/2017/196092A1
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...  
WO/2017/196093A1
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...  
WO/2017/196094A1
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...  
WO/2017/189898A1
Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a stan...  
WO/2017/183757A1
The present invention relates to a contact pin for testing an electrical terminal mounted on a printed circuit board, etc. The present invention provides a contact pin comprising: a substrate, which is made of a single material, and whic...  
WO/2017/183788A1
An embodiment of the present invention provides a test socket for a semiconductor device, comprising: a base layer having a first surface and a second surface opposite to the first surface, and having, on the second surface, an external ...  
WO/2017/179836A1
The present invention relates to a CIS probe card which prevents light projected for CIS inspection from being interfered with by lead-in wires and to a method for producing the CIS probe card. The CIS probe card comprises: a plurality o...  
WO/2017/160090A3
The present invention relates to a device and a method for manufacturing a probe pin and, more particularly, to a device and a method for manufacturing a probe pin by polishing a pointed end of a metal wire. The present invention provide...  
WO/2017/160090A2
The present invention relates to a device and a method for manufacturing a probe pin and, more particularly, to a device and a method for manufacturing a probe pin by polishing a pointed end of a metal wire. The present invention provide...  
WO/2017/155155A1
A bidirectional conductive module for testing a semiconductor device, according to one embodiment of the present invention, comprises: a substrate part having a structure bent such that one surface thereof faces the semiconductor device ...  
WO/2017/129999A1
A transmission line arrangement having a first end and a second end, the transmission line arrangement being configured to transmit a signal between the first end and the second end, the transmission line arrangement comprising a signal ...  
WO/2017/126877A1
The present invention relates to an electric characteristic inspection pin and, more particularly, to an electric characteristic inspection pin capable of performing stable electric characteristic inspection and an inspection unit having...  
WO/2017/126782A1
The present invention relates to a bidirectional conductive pattern module for testing a semiconductor, a semiconductor test socket using the same, and a manufacturing method for the bidirectional conductive pattern module for testing a ...  
WO/2017/107189A1
A sensor and a signal processing method. The sensor comprises: an input vector generating module (101), a sampling module (102), and an output module (103), wherein the input vector generating module (101) is configured to convert a wave...  
WO/2017/080340A1
Provided are a nanowire giant piezo-resistive property measurement device and a manufacturing method therefor. The measurement device comprises: a nanowire (6); a platinum resistance temperature sensor (1); an electrothermal actuator (2)...  
WO/2017/082510A1
A test socket of the present invention comprises: a first PCB film having a plurality of first pads; a first conductive wire bonded to first surfaces of the first pads; insulation silicone rubber provided on the first PCB film, having a ...  
WO/2017/061656A1
The present invention relates to a Kelvin test probe, a Kelvin test probe module, and a manufacturing method therefor. The Kelvin test probe according to the present invention comprises: an upper insulating sheet made of a ductile materi...  
WO/2017/053910A1
In one embodiment, the present invention includes an interface apparatus for semiconductor testing. The interface apparatus includes a housing. The housing includes a lower housing substrate and an upper housing substrate. The lower hous...  
WO/2017/032532A1
The invention relates to a device for positioning and contacting a test contact (5) of a test contact arrangement that is arranged on a contact carrier (19), wherein the device comprises a contact head (10) having at least one transmissi...  
WO/2017/023130A1
The present invention relates to a probe pin bonding apparatus and, more particularly, to a probe pin bonding apparatus for automatically bonding a probe pin to a probe card. One embodiment of the present invention provides a probe pin b...  
WO/2017/011339A1
Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a stan...  
WO/2017/007200A2
A test socket manufacturing method comprises the steps of: preparing a PCB, which is provided with a bonding pad; bonding a conductive wire on the bonding pad; mounting a space, which exposes the bonding pad, on the upper surface of the ...  
WO/2017/007200A3
A test socket manufacturing method comprises the steps of: preparing a PCB, which is provided with a bonding pad; bonding a conductive wire on the bonding pad; mounting a space, which exposes the bonding pad, on the upper surface of the ...  
WO/2016/195251A1
The present invention relates to a rubber socket for a semiconductor test that can be manufactured with a low cost and can prevent an electric shock from being applied to a semiconductor package in a process of testing the semiconductor ...  
WO/2016/176469A1
Multiple pin probes and methods for controlling such multiple pin probes to support parallel measurements are disclosed. The method may include: establishing electrical contact between a multiple pin probe and a subject of measurement; s...  
WO/2016/155936A3
The invention relates to a method for producing at least one spring contact pin (9) acting as an electrical contact, or a spring contact pin arrangement (25) comprising at least one such spring contact pin (9). The following steps are pr...  
WO/2016/155937A1
The invention relates to a method for producing a contact spacing converter (4) (space transformer) which has electrical contacts (9) that form electrical paths (10) and in which a first contact spacing of the contacts (9) is converted i...  
WO/2016/107859A1
It is described a manufacturing method of contact probes (10) for a testing head (18) comprising the steps of: providing a substrate (11) made of a conductive material; and - defining at least one contact probe (10) by laser cutting the ...  
WO/2016/107756A1
It is described a manufacturing method of a semi-finished product (15) comprising a plurality of contact probes (10) for a testing head of electronic devices, the method comprising the steps of: - providing a substrate (11) made of a con...  
WO/2016/068541A1
The present invention relates to an electrical connector for electrically connecting a device to be tested with a testing device, and a manufacturing method therefor, wherein the electrical connector improves high-current characteristics...  
WO/2016/045614A1
Provided are a single-chip differential free layer push-pull magnetic field sensor bridge and preparation method, the magnetic field sensor bridge comprising: a substrate (4), a staggered soft magnetic flux concentrator array (11, 12), a...  
WO/2015/156653A1
The present invention relates to a method for manufacturing a test sheet, the test sheet being arranged between a terminal of a device to be tested and a pad of a test device so as to electrically connect the terminal and the pad to each...  
WO/2015/153063A1
This disclosure provides for an electrical probe, which can include a shell extending along a longitudinal axis and defining an internal cavity with an opening at a first end, where the shell can include a neck portion defined by a hollo...  
WO/2015/144073A1
A single-chip three-axis magnetic field sensor and a preparation method therefor. The sensor comprises an X-axis sensor (3), a Y-axis sensor (4) and a Z-axis sensor (5) which are integratedly arranged on the same substrate (1), wherein t...  
WO/2015/006625A2
The test system provides an array of test probes having a cross beam. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. The probes ar...  

Matches 1 - 50 out of 646