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Patent Searching and Data


Matches 1 - 50 out of 688

Document Document Title
WO/2020/257190A1
A probe chip consisting of multiple probes integrated on a single substrate. The layout of the probes could be designed to match specific features on the device under test. The probes are spring-loaded to allow for reversible deformation...  
WO/2020/235769A1
Disclosed is a contact probe comprising: an upper plunger which is formed by a first processing method, and in which a first tip coming into contact with a terminal of an object to be inspected is formed at one end thereof; a board conta...  
WO/2020/225133A1
The invention relates to a method for manufacturing a short-circuit protection device (2), comprising: - producing a plurality of first electrically conductive segments (22) on a first face (10) of a first substrate (6); - producing a pl...  
WO/2020/218803A1
Disclosed is a probe cleaner for cleaning and decontaminating a probe. The probe cleaner includes a main body including a cleaning surface facing toward a test socket in which probes are arranged; a cleaning member provided in the cleani...  
WO/2020/213899A1
A three-layer MEMS spring pin of the present invention comprises: a lower-layer spring pin, in which a lower-layer wave is connected between a lower-layer top plunger and a lower-layer bottom plunger; an upper-layer spring pin, in which ...  
WO/2020/191295A1
This disclosure relates generally to test equipment, apparatuses, and systems for a device under test, such as, but not limited to, a semiconductor device. More specifically, this disclosure relates to test equipment, apparatuses, and sy...  
WO/2020/145492A1
The purpose of the present invention is to provide: a signal transmission connector capable of being stably connected with a terminal of an electronic component through a structural improvement in response to distortion in the electronic...  
WO/2020/145493A1
The present invention is to provide a signal transmission connector which can be stably connected to terminals of an electronic component through structural improvement that responds to distortion of the electronic component. The signal ...  
WO/2020/145577A1
The purpose of the present invention is to provide a conductor part protection member for a signal transmission connector and a manufacturing method therefor, and a signal transmission connector having same and a manufacturing method the...  
WO/2020/144322A1
The invention relates to a test needle for measurement of electrical contact connection and to a bonding wire for electrical contact connection of a chip, wherein the test needle or bonding wire has been manufactured from a foil for prod...  
WO/2020/141826A1
A contactor block of a self-aligning vertical probe card according to the present invention comprises: at least one vertical contactor array in which a plurality of vertical contactors manufactured by a MEMS process and extending in the ...  
WO/2020/138882A1
Provided is a connector located between a test device and a device to be tested so as to electrically connect the test device with the device to be tested. The connector is stacked in a vertical direction and has first and second conduct...  
WO/2020/080719A1
Disclosed according an embodiment is an inspection connector which is disposed between a device to be inspected and a test apparatus so as to electrically connect the device to be inspected and the test apparatus to each other, the inspe...  
WO/2020/078814A1
The invention relates to a resistance assembly (22) for a battery sensor (10), in particular for a vehicle battery, comprising two conduction portions (12, 16) and a resistance element arranged between the conduction portions. The conduc...  
WO/2020/058094A1
The invention relates to a method for producing a resistor assembly (12) for a battery sensor (10), in particular in a vehicle, said resistor assembly having a battery pole terminal (14) and a cable connection point (16), which are elect...  
WO/2020/061468A1
Platinum-nickel-based ternary or higher alloys include platinum at about 65‒80 wt.%, nickel at about 18‒27 wt.%, and about 2‒8 wt.% of ternary or higher additions that may include one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, and/o...  
WO/2020/050657A1
An inspection connector according to a disclosed embodiment comprises: a sheet of insulating material; and a conductive part extending in the vertical direction in the sheet for enabling an electric current to be applied in the vertical ...  
WO/2020/030340A1
The invention relates to a method for repairing a test contact arrangement (10) in which a test contact (21) arranged with incorrect positioning on a test contact carrier (12) by means of solder material (16) is gripped at an edge (30) o...  
WO/2019/245242A1
A connector for inspection according to a disclosed embodiment includes: a sheet of an insulating material; a plurality of conductive parts which are made of a conductive material, extend in a Z-axis direction, and are spaced apart from ...  
WO/2019/245153A1
The present invention relates to a plate spring-type connecting pin comprising: a support pin having a bent rib portion on the upper part and a base portion on the lower part and length extended in the vertical direction; a plate spring ...  
WO/2019/245244A1
A test connector according to one embodiment comprises: a sheet on XYZ orthogonal coordinates, the sheet being made of an insulating material; and a plurality of conductive units, which are made of a conductive material, extend in the Z-...  
WO/2019/245104A1
The present invention relates to a plate spring-type connecting pin comprising: a support pin having a bent rib portion on the upper part and a base portion on the lower part and length extended in the vertical direction; a plate spring ...  
WO/2019/197267A1
In the cleaning of the tips of needles of needle cards, the tips of the needles are put into effective contact in a cleaning agent in different cleaning positions, in order to remove contaminants from the tips of the needles and to make ...  
WO/2019/197295A1
The testing apparatus for singulated semiconductor dies comprises a nesting frame (1) and a bottom part (2), which form a testing device nest adapted to the size of a semiconductor die (7). A pushing device (4) is provided for an alignme...  
WO/2019/198853A1
The present invention relates to contacts and a socket apparatus for testing a semiconductor device. Each contact according to the present invention is a spring contact integrally formed by punching out and bending a metal plate, and com...  
WO/2019/162194A1
An apparatus (1) for the automated assembly of a probe head for testing electronic devices integrated on a semiconductor wafer, comprises a support (6) adapted to support at least two parallel guides (2), which are provided with a plural...  
WO/2019/140795A1
Provided are a TDS detector and a packaging process therefor. The TDS detector comprises a wire (1), wherein both ends of the wire (1) are arranged with a connector (11) and a probe respectively, the probe comprises two sets of needles (...  
WO/2019/093614A1
Disclosed is a test probe assembly. The test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member co...  
WO/2019/089611A1
Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the...  
WO/2019/066135A1
The present invention relates to a bidirectional conductive module and a method for manufacturing the same. A bidirectional conductive module according to the present invention comprises: an insulative body which is made of an insulative...  
WO/2019/066256A1
The present invention relates to a substrate testing cartridge provided for simultaneously testing multiple substrates for which a substrate treatment process has been finished, and a method for manufacturing same. According to an embodi...  
WO/2019/048299A1
An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a f...  
WO/2019/039628A1
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a method for manufacturing the same. The bidirectional conductive pin according to the present invention comprises: a pin bod...  
WO/2019/022272A1
The present invention relates to a probe pin for a probe card and, more specifically, to a probe pin with reduced flux diffusion, which prevents flux from diffusing along the probe pin when the probe pin is attached to an electrode of a ...  
WO/2019/014132A1
A test fixture (120) includes a mother board (225) that has test signal lines (223) configured to couple (651) to a test station (650). The mother board (225) includes a recessed region with contact pads (428) coupled to the test signal ...  
WO/2019/004663A1
The present invention relates to a probe member for a pogo pin, a manufacturing method therefor and a pogo pin comprising same. One embodiment of the present invention provides a probe member used in a test socket, the probe member compr...  
WO/2019/004661A1
The present invention relates to a probe member for a pogo pin, a manufacturing method therefor and a pogo pin comprising same. One embodiment of the present invention provides a probe member used in a test socket, the probe member compr...  
WO/2018/221834A1
Provided are a wafer probe card that matches in one-to-one correspondence with an LED wafer by implementing a probe system having the same size as the LED wafer, and inspects brightness and wavelength of light emitted from a plurality of...  
WO/2018/206506A1
The invention refers to a method for producing a multi-layer (30) of a probe card (1) for a testing apparatus of electronic devices, comprising the steps of: providing a plurality of dielectric layers (30a-30n) starting from a first diel...  
WO/2018/208604A1
One example includes a device (100) that is comprised of a plurality of printed circuit boards (200), a plurality of vias (110), and a plurality of castellations (130). The plurality of printed circuit boards (200) are laminated together...  
WO/2018/162343A3
A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe (10) comprises a probe body (12), a first cantilever (20a) extending from the probe body. The first cantilever definin...  
WO/2018/182327A1
A semiconductor package test socket and a method for manufacturing the same are disclosed. The test socket of the present invention is manufactured by the steps of: disposing a first film layer on a lower portion of a support plate havin...  
WO/2018/162343A2
A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe comprises a probe body, a first cantilever extending from the probe body. The first cantilever defining a first loop w...  
WO/2017/160090A3
The present invention relates to a device and a method for manufacturing a probe pin and, more particularly, to a device and a method for manufacturing a probe pin by polishing a pointed end of a metal wire. The present invention provide...  
WO/2018/142170A1
The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a s...  
WO/2018/108675A1
A contact probe (20) for a probe head of an apparatus for testing electronic devices comprises a probe body (20C) being essentially extended in a longitudinal direction between respective end portions (20A, 20B) adapted to realize a cont...  
WO/2018/079982A1
The present invention relates to a bidirectional conductive pin using carbon fibers and a bidirectional conductive pattern module using carbon fibers, and a bidirectional conductive socket using the same. The bidirectional conductive pin...  
WO/2018/046896A1
A liquid conductivity measurement pin (10). The pin has a sensor portion (130) and an electrical contact portion (110). The electrical contact portion (110) is spring-loaded such that the electrical contact portion (110) is adapted to ma...  
WO/2018/044014A1
Disclosed is a testing device. The testing device includes a testing socket configured to support a plurality of probes, a testing-circuit substrate which includes a contact point to contact the probe, a slider which makes the testing so...  
WO/2018/035515A1
Systems and methods for testing semiconductor wafers are disclosed herein. In one embodiment, an apparatus for testing dies of a semiconductor wafer includes: a wafer translator having a wafer-side configured to face the wafer, and an in...  

Matches 1 - 50 out of 688